CN210694460U - Integrated flexible printed circuit board - Google Patents
Integrated flexible printed circuit board Download PDFInfo
- Publication number
- CN210694460U CN210694460U CN201921011060.8U CN201921011060U CN210694460U CN 210694460 U CN210694460 U CN 210694460U CN 201921011060 U CN201921011060 U CN 201921011060U CN 210694460 U CN210694460 U CN 210694460U
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- CN
- China
- Prior art keywords
- copper
- circuit board
- layer
- clad plate
- synthetic resin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an integrated flexible printed circuit board, including the copper-clad plate, the copper-clad plate includes base plate and copper foil, copper-clad plate upper surface and lower surface all bond through the adhesive layer and have the synthetic resin fibrous layer, a side that the copper-clad plate was kept away from on the synthetic resin fibrous layer bonds through the adhesive layer has the strengthening layer, a side that the synthetic resin fibrous layer was kept away from to the strengthening layer bonds and has the inoxidizing coating, the through-hole has been seted up on the copper-clad plate, the through-hole runs through synthetic resin fibrous layer and strengthening layer, install the electrically conductive copper ring in the through-hole. The utility model discloses a simple structure, the flexibility ratio is high, and the copper-clad plate includes base plate and copper foil, and the base plate is the polyimide layer for the circuit board has higher tensile strength, makes the circuit board have flexibility, and the flexibility ratio is higher, and high temperature resistant has the fire resistance, has strengthened mechanical strength when having guaranteed to have higher flexibility, makes the circuit board more durable, and is not fragile, can prevent that the condition of electrically conductive bad from taking place.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is an integrated flexible printed circuit board.
Background
The flexible printed circuit board is a special printed circuit board and has the characteristics of light weight, thin thickness, flexibility and the like. The method is widely applied to products such as mobile phones, notebook computers, PDAs, digital cameras, liquid crystal display screens and the like. The existing integrated flexible printed circuit board can not only ensure the flexibility of the circuit board but also ensure the mechanical strength of the circuit board, so that the service life of the circuit board is shorter. To this end, we propose an integrated flexible printed circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an integrated flexible printed circuit board to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an integrated flexible printed circuit board, includes the copper-clad plate, the copper-clad plate includes base plate and copper foil, copper-clad plate upper surface and lower surface all bond through the adhesive layer and have the synthetic resin fibrous layer, a side that the copper-clad plate was kept away from on the synthetic resin fibrous layer bonds through the adhesive layer has the strengthening layer, a side that the synthetic resin fibrous layer was kept away from on the strengthening layer bonds and has the inoxidizing coating, the through-hole has been seted up on the copper-clad plate, the through-hole runs through synthetic resin fibrous layer and strengthening layer, install electrically conductive copper ring in the.
Preferably, the copper foil is bonded to the upper and lower surfaces of the substrate by an adhesive layer.
Preferably, the substrate is a polyimide layer.
Preferably, the adhesive layer is an epoxy resin adhesive.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a simple structure, the flexibility ratio is high, has strengthened mechanical strength when having guaranteed to have higher flexibility for the circuit board is more durable, and is not fragile, can prevent that the condition of electrically conductive bad from taking place. The copper-clad plate includes base plate and copper foil, the base plate is the polyimide layer, make the circuit board have higher tensile strength, make the circuit board have flexibility, the flexibility ratio is higher, and high temperature resistant has the fire resistance, setting through synthetic resin fiber layer is in the intensity of reinforcing line board, make the flexibility of circuit board stronger, setting through the strengthening layer, strengthen the mechanical strength of circuit board, setting through the inoxidizing coating, protect the circuit board outside, avoid the external environment to cause the damage to the circuit board, through the electric conductivity of electrically conductive copper ring reinforcing circuit board, avoid the condition of electrically conductive bad to take place.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic diagram of the copper clad plate structure of the present invention.
In the figure: the copper-clad plate comprises a copper-clad plate 1, a base plate 101, a copper foil 102, a synthetic resin fiber layer 2, a reinforcing layer 3, a protective layer 4, a through hole 5 and a conductive copper ring 6.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides an integrated flexible printed circuit board, includes copper-clad plate 1, copper-clad plate 1 includes base plate 101 and copper foil 102, 1 upper surface of copper-clad plate and lower surface all bond through the adhesive layer and have synthetic resin fibrous layer 2, synthetic resin fibrous layer 2 is kept away from a side of copper-clad plate 1 and is bonded through the adhesive layer and have strengthening layer 3, strengthening layer 3 is kept away from a side that has synthetic resin fibrous layer 2 and is bonded and have inoxidizing coating 4, through-hole 5 has been seted up on copper-clad plate 1, through-hole 5 runs through synthetic resin fibrous layer 2 and strengthening layer 3, install electrically conductive copper ring 6 in the through-hole 5.
Specifically, the copper foil 102 is bonded to the upper surface and the lower surface of the substrate 101 by an adhesive layer.
Specifically, the substrate 101 is a polyimide layer, and has high tensile strength, so that the circuit board has flexibility, high temperature resistance and flame retardancy.
Specifically, the adhesive layer is epoxy resin adhesive and has strong adhesive force.
Specifically, during the use, copper-clad plate 1 includes base plate 101 and copper foil 102, base plate 101 is the polyimide layer, make the circuit board have higher tensile strength, make the circuit board have flexibility, the flexibility ratio is higher, and high temperature resistant has the fire resistance, setting through synthetic resin fibrous layer 2 is in the intensity of reinforced circuit board, make the flexibility of circuit board stronger, setting through strengthening layer 3, the mechanical strength of reinforced circuit board, setting through inoxidizing coating 4, protect the circuit board outside, avoid external environment to cause the damage to the circuit board, through the electric conductivity of the 6 reinforced circuit boards of electrically conductive copper ring, avoid the bad condition of electrically conducting to take place. The utility model discloses a simple structure, the flexibility ratio is high, has strengthened mechanical strength when having guaranteed to have higher flexibility for the circuit board is more durable, and is not fragile, can prevent that the condition of electrically conductive bad from taking place.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides an integrated flexible printed circuit board, includes copper-clad plate (1), its characterized in that: copper-clad plate (1) includes base plate (101) and copper foil (102), copper-clad plate (1) upper surface and lower surface all bond through the adhesive layer and have synthetic resin fibrous layer (2), a side that copper-clad plate (1) was kept away from in synthetic resin fibrous layer (2) has strengthening layer (3) through the adhesive layer bonding, a side that synthetic resin fibrous layer (2) were kept away from in strengthening layer (3) bonds and has inoxidizing coating (4), through-hole (5) have been seted up on copper-clad plate (1), through-hole (5) run through synthetic resin fibrous layer (2) and strengthening layer (3), install electrically conductive copper ring (6) in through-hole (5).
2. An integrated flexible printed circuit board according to claim 1, wherein: the copper foil (102) is bonded to the upper surface and the lower surface of the substrate (101) through adhesive layers.
3. An integrated flexible printed circuit board according to claim 1, wherein: the substrate (101) is a polyimide layer.
4. An integrated flexible printed circuit board according to claim 1, wherein: the adhesive layer is epoxy resin adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921011060.8U CN210694460U (en) | 2019-07-02 | 2019-07-02 | Integrated flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921011060.8U CN210694460U (en) | 2019-07-02 | 2019-07-02 | Integrated flexible printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210694460U true CN210694460U (en) | 2020-06-05 |
Family
ID=70887048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921011060.8U Expired - Fee Related CN210694460U (en) | 2019-07-02 | 2019-07-02 | Integrated flexible printed circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN210694460U (en) |
-
2019
- 2019-07-02 CN CN201921011060.8U patent/CN210694460U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200605 |