CN213403647U - Circuit board pad with firm bearing structure - Google Patents
Circuit board pad with firm bearing structure Download PDFInfo
- Publication number
- CN213403647U CN213403647U CN202022320858.XU CN202022320858U CN213403647U CN 213403647 U CN213403647 U CN 213403647U CN 202022320858 U CN202022320858 U CN 202022320858U CN 213403647 U CN213403647 U CN 213403647U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pad
- circuit
- insulating layer
- welding disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000003466 welding Methods 0.000 claims abstract description 35
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 238000005476 soldering Methods 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 2
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000428 dust Substances 0.000 abstract description 4
- 239000012535 impurity Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 30
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model discloses a circuit board pad with firm bearing structure, including the circuit board body, the circuit board body includes the circuit board base plate, circuit layer has been glued above the bonding, insulating layer upper surface coats and has scaling powder, be provided with a plurality of soldering pan subassemblies in the insulating layer upper surface, simple structure, the structure is clear and understandable, multilayer printed circuit board body includes the circuit board base plate, circuit layer and insulating layer have been glued above the circuit board base plate in proper order, be provided with a plurality of soldering pan subassemblies in the insulating layer upper surface, the support intensity of pad can be strengthened in the setting of fixing base and insulating block, the structure is firm, avoid the slope of pad in the welding process, influence the welding effect, the setting of sealing washer can avoid impurity such as powder dust to get into logical inslot, influence the circuit break-make of circuit, has obvious effect and is worth popularizing.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a circuit board pad with firm bearing structure.
Background
The printed circuit board is developed from a single layer to a double-sided board, a multilayer board and a flexible board, and is continuously developed towards high precision, high density and high reliability, so that the size is continuously reduced, the cost is reduced, and the performance is improved. The development trend of the production and manufacturing technology of the printed circuit board is to develop the printed circuit board in the directions of high density, high precision, fine aperture, fine lead, small space, high reliability, multilayering, high-speed transmission, light weight and thin type in performance. The wires of the single panel are only arranged on one side, the double panels are the extension of the single panel, and the wires between the two layers can be conducted through the through holes to form the required network connection. At present, in the common multilayer printed circuit board, from last to being the pad down usually in proper order, circuit layer and insulating layer, wherein the pad is located the upper surface on circuit layer, the insulating layer is formed with the through-hole, sometimes, the position of pad can be corresponding to the position of through-hole, some or all fall in the through-hole, can make pad processing unreliable under this condition, appear easily because of the pad unevenness, the rosin joint that brings sinks, lead to printed circuit board's electric connection reliability bad, bearing structure of pad below can cause glue because of the leakproofness is not enough sometimes, china ink, dust etc. get into in it, and be not convenient for clear up, influence circuit board circuit, therefore, need a circuit board pad that has firm bearing structure.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a circuit board pad with firm bearing structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a circuit board pad with bearing structure stabilizes, includes the circuit board body, the circuit board body includes the circuit board base plate, circuit board base plate top bonding has the circuit layer, circuit layer top bonding has the insulating layer, the insulating layer upper surface coating has the scaling powder, be provided with a plurality of pad subassemblies in the insulating layer upper surface.
Preferably, the welding disc assembly comprises a welding disc, a welding disc groove is formed in the upper end face of the insulating layer, the welding disc is arranged in the welding disc groove, a through groove is formed in the bottom of the welding disc groove, and conducting strips are connected between the left side and the right side of the bottom end face of the welding disc and the circuit layer.
Preferably, the bottom in the through groove is connected with a fixed seat, and an insulating block is connected between the upper end of the fixed seat and the bonding pad.
Preferably, the insulating block is a rubber block, a cavity is arranged in the insulating block, and a plurality of reinforcing support rods are connected between the upper side wall and the lower side wall in the cavity.
Preferably, the fixing seat is a conductive metal block, and the circuit layer is a conductive copper foil.
Preferably, an annular sealing ring is connected between the inner side wall of the pad groove and the outer surface of the pad, and the annular sealing ring is a metal ring.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses simple structure, the structure is clear and understandable, multilayer printed circuit board body includes the circuit board base plate, circuit board base plate top bonds in proper order has circuit layer and insulating layer, be provided with a plurality of pad subassemblies in the insulating layer upper surface, the holding strength of pad can be strengthened in the setting of fixing base and collets, the structure is firm, avoid the slope of welding process in the pad, influence welding effect, impurity such as powder dust can be avoided getting into logical inslot in the setting of sealing washer, influence the circuit break-make of circuit board, the effect is obvious, be worth promoting.
Drawings
FIG. 1 is a schematic diagram of a circuit board interface structure with a circuit board pad having a stable support structure;
fig. 2 is a schematic diagram of a pad assembly of a circuit board pad having a stable support structure.
In the figure: 1-circuit board substrate, 2-circuit layer, 3-insulating layer, 4-circuit board body, 5-welding disc component, 6-welding disc, 7-welding disc groove, 8-sealing ring, 9-through groove, 10-conducting strip, 11-fixing seat, 12-insulating block and 13-reinforcing support rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a circuit board pad with bearing structure stabilizes, includes circuit board body 4, circuit board body 4 includes circuit board base plate 1, 1 top bonding of circuit board base plate has circuit layer 2, 2 tops bonding of circuit layer have insulating layer 3, 3 upper surface coatings on insulating layer have the scaling powder, be provided with a plurality of soldering lug subassemblies 5 in the 3 upper surfaces of insulating layer.
The utility model provides a multilayer printed circuit board body 4 includes circuit board base plate 1, and 1 top of circuit board base plate bonds in proper order has circuit layer 2 and insulating layer 3, is provided with a plurality of soldering pad subassemblies 5 in the 3 upper surfaces of insulating layer.
The welding disk assembly 5 comprises a welding disk 6, a welding disk groove 7 is formed in the upper end face of the insulating layer 3, the welding disk 6 is arranged in the welding disk groove 7, a through groove 9 is formed in the bottom of the welding disk groove 7, and conducting strips 10 are connected between the left side and the right side of the bottom end face of the welding disk 6 and the circuit layer 2.
The conductive connection is realized between the bonding pad 6 and the circuit layer 2, and the conductive connection is used for circuit connection after welding.
The bottom is connected with fixing base 11 in leading to groove 9, be connected with insulating block 12 between fixing base 11 upper end and the pad 6, insulating block 12 is the rubber block setting, be provided with the cavity in the insulating block 12, be connected with a plurality of enhancement bracing pieces 13 between the wall of both sides about in the cavity, fixing base 11 is the conductive metal piece, circuit layer 2 is conductive copper foil.
The support intensity of pad can be strengthened in the setting of fixing base 11 and insulating block 12, and the structure is firm, avoids the slope of welding process in pad 6, influences the welding effect.
An annular sealing ring 8 is connected between the inner side wall of the welding disc groove 7 and the outer surface of the welding disc 6, and the annular sealing ring 8 is a metal ring.
The setting of sealing washer 8 can avoid impurity such as powder dust to get into logical 9 insides, influences the circuit break-make of circuit board.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A circuit board pad with a stable support structure, comprising a circuit board body (4), characterized in that: the circuit board comprises a circuit board substrate (1), wherein a circuit layer (2) is bonded on the circuit board substrate (1), an insulating layer (3) is bonded on the circuit layer (2), soldering flux is coated on the upper surface of the insulating layer (3), and a plurality of soldering pad assemblies (5) are arranged in the upper surface of the insulating layer (3).
2. A circuit board pad with a stable support structure according to claim 1, characterized in that: the welding disc assembly (5) comprises a welding disc (6), a welding disc groove (7) is formed in the upper end face of the insulating layer (3), the welding disc (6) is arranged in the welding disc groove (7), a through groove (9) is formed in the bottom of the welding disc groove (7), and a conducting strip (10) is connected between the left side and the right side of the bottom end face of the welding disc (6) and the circuit layer (2).
3. A circuit board pad with a stable support structure according to claim 2, characterized in that: the bottom in the through groove (9) is connected with a fixed seat (11), and an insulating block (12) is connected between the upper end of the fixed seat (11) and the bonding pad (6).
4. A circuit board pad with a stable support structure according to claim 3, characterized in that: the insulation block (12) is arranged as a rubber block, a cavity is arranged in the insulation block (12), and a plurality of reinforcing support rods (13) are connected between the upper side wall and the lower side wall in the cavity.
5. The circuit board pad with stabilized support structure of claim 4, wherein: the fixing seat (11) is a conductive metal block, and the circuit layer (2) is a conductive copper foil.
6. The circuit board pad with stabilized support structure of claim 5, wherein: and an annular sealing ring (8) is connected between the inner side wall of the welding disc groove (7) and the outer surface of the welding disc (6), and the annular sealing ring (8) is a metal ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022320858.XU CN213403647U (en) | 2020-10-19 | 2020-10-19 | Circuit board pad with firm bearing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022320858.XU CN213403647U (en) | 2020-10-19 | 2020-10-19 | Circuit board pad with firm bearing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213403647U true CN213403647U (en) | 2021-06-08 |
Family
ID=76188449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022320858.XU Active CN213403647U (en) | 2020-10-19 | 2020-10-19 | Circuit board pad with firm bearing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213403647U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114340151A (en) * | 2022-03-14 | 2022-04-12 | 潍坊学院 | Printed circuit board pad structure |
| CN114364123A (en) * | 2022-03-15 | 2022-04-15 | 潍坊学院 | Printing pad supporting framework |
-
2020
- 2020-10-19 CN CN202022320858.XU patent/CN213403647U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114340151A (en) * | 2022-03-14 | 2022-04-12 | 潍坊学院 | Printed circuit board pad structure |
| CN114340151B (en) * | 2022-03-14 | 2022-05-06 | 潍坊学院 | Printed circuit board pad structure |
| CN114364123A (en) * | 2022-03-15 | 2022-04-15 | 潍坊学院 | Printing pad supporting framework |
| CN114364123B (en) * | 2022-03-15 | 2022-06-07 | 潍坊学院 | Printing pad supporting framework |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211222 Address after: Room 5-2, building 4, No. 55, weitingting East Road, Suzhou Industrial Park, Jiangsu 215000 Patentee after: Suzhou youkezhiqu Electronics Co.,Ltd. Address before: Room 2218, 368 Zhujiang South Road, Mudu Town, Wuzhong District, Suzhou City, Jiangsu Province 215000 Patentee before: Suzhou Ruijun Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240718 Address after: 226000 Shuntong Road No.1, Dayu Town, Rudong County, Nantong City, Jiangsu Province (Bingfang Industrial Park) Patentee after: Nantong Zhongbo utensils Co.,Ltd. Country or region after: China Address before: Room 5-2, building 4, No. 55, weitingting East Road, Suzhou Industrial Park, Jiangsu 215000 Patentee before: Suzhou youkezhiqu Electronics Co.,Ltd. Country or region before: China |