CN112996239A - PCB with SMT bonding pads on side edges and manufacturing method - Google Patents
PCB with SMT bonding pads on side edges and manufacturing method Download PDFInfo
- Publication number
- CN112996239A CN112996239A CN202110241094.1A CN202110241094A CN112996239A CN 112996239 A CN112996239 A CN 112996239A CN 202110241094 A CN202110241094 A CN 202110241094A CN 112996239 A CN112996239 A CN 112996239A
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- Prior art keywords
- pcb
- smt
- pcb board
- copper
- electroplating
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to the technical field of PCBs (printed circuit boards) with SMT (surface mount technology) pads on side edges, in particular to a PCB with SMT pads on side edges and a preparation method thereof. A PCB board with SMT welding pads on the side edge is provided, wherein the welding pads are uniformly arranged on the side edge of the PCB board at intervals, and the side edge of each welding pad is parallel to the side edge of the PCB board 1; a preparation method of a PCB with SMT bonding pads on the side edges comprises the steps of pressing, blackening, laser, hole filling and electroplating, pre-routing and the like. By using CO2Laser irradiates a through-hole-shaped pit area on a multilayer PCB, which is substantially a square blind hole, then a copper layer is electroplated, and finally an unnecessary part of the PCB is milled along the side line of the PCB (refer to figure 1), so that the copper electroplated during hole filling electroplating is exposed from the side edge of the PCB, a bonding pad of the parallel surface of the side edge of the PCB is formed,and the SMT side surface mounting requirement is met.
Description
Technical Field
The invention relates to the technical field of PCBs (printed circuit boards) with SMT (surface mount technology) pads on side edges, in particular to a PCB with SMT pads on side edges and a preparation method thereof.
Background
PCB side area SMT pad design mainly is applied to perspective LED display screen at present. The present PCB board side of customer end can welded design, mainly is modularization half orifice plate, and it is downthehole to participate in from the joint welding of components and parts, plays the effect of fixed components and parts, and this PCB side pad half orifice design, the flow is simple, mainly is: drilling- > copper plate deposition electricity- > figure electricity dry film- > figure electroplating- > routing at one time (routing the other half of the unnecessary holes) - > outer layer circuit etching.
However, the prior preparation method has the following technical problems:
1. the side pad of the PCB board of prior art preparation can only be done plug-in components hole design, and mainly be applied to non-functional fixed components and parts and use, because the copper face of the side pad of current PCB board is the design of recessing, can not do SMT and paste a pad, to having the side of needs and paste a demand (LED lamp plate class), this type of design is not suitable for.
2. Meanwhile, the side bonding pads of the PCB manufactured by the prior art can only be made into all layers to be conducted simultaneously, and cannot be made into segmented bonding pads of the upper part and the lower part, because in the drilling step, the PTH holes are drilled out at one time, all the layers (PTH conducting holes) above and below the PCB are drilled through, and after the copper-plated plate is electrically connected, all the layers are conducted simultaneously, and a through hole cannot be divided into the upper end and the lower end.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a PCB with SMT bonding pads on the side edges and a preparation method thereof, wherein CO is utilized2Laser is used for laser forming a square blind hole-shaped pit area on the multilayer PCB, the pit area is substantially a square electroplating blind hole, then a copper layer is electroplated, and finally an unnecessary part of the PCB is milled along a side line (refer to figure 1) of the PCB, so that copper electroplated during hole filling electroplating is exposed on the side of the PCB, a bonding pad of a parallel surface of the side of the PCB is formed, the SMT side surface mounting requirement is met, and insufficient soldering cannot be caused; meanwhile, by using the preparation method, the bonding pads which are respectively isolated from the upper part, the lower part, the left part and the right part can be manufactured on the bonding pads at the side edge of the PCB, the requirements of SMT (surface mount technology) parts are met, the electrical property and the functional effect are realized, and the side edge mounting can be realizedLED lamp pearl.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a PCB with SMT welding pads on the side edges, wherein the welding pads are uniformly arranged on the side edges of the PCB at intervals, and the side edges of the welding pads are parallel to the side edges of the PCB.
As a further improvement of the above technical solution, the pad is an SMT pad.
The invention also provides a preparation method of the PCB with the SMT pad on the side edge, which comprises the following steps:
and (3) laminating: pressing and bonding the multilayer PCB into a whole;
blackening: etching the copper surface of the PCB by using blackening liquid medicine to blacken the copper on the surface;
laser: using laser light to laser out a pit area on the side of the PCB;
and (3) copper plate deposition: metallizing a layer of copper in the pit
Transferring an outer layer pattern electric dry film pattern: transferring the pattern to the PCB surface by dry film exposure and development according to the design of the customer
Pattern electroplating: electroplating the thickened copper layer on the area, which is not covered by the dry film, on the surface of the PCB, and electroplating the thickened copper layer in the laser pit area until the pit is filled;
pre-routing: and routing along a center line of the pit area parallel to the side edge of the PCB board, dividing the pit area into two parts, leaving a required part, routing away an unnecessary part, exposing copper electroplated during hole filling electroplating on the side edge of the PCB board, and forming a side edge bonding pad of the PCB board.
As a further improvement of the above technical solution, in the step of laser, the laser light used is CO2And (5) laser.
As a further improvement of the above technical solution, in the step of hole filling electroplating, the copper electroplated in the pit area is a copper layer with a thickness of about 30 um.
As a further improvement of the above technical solution, in the step of hole filling electroplating, the copper electroplated in the pit area is a copper layer filling the pit area.
As a further improvement of the above technical solution, the recessed area is a substantially square plated blind hole.
The invention has the beneficial effects that: 1. by using CO2Radium-shine laser goes out square blind hole form pit area on multilayer PCB board radium-shine, and the essence is square electroplating blind hole, and the copper layer is electroplated again, and at last along PCB board side limit (refer to fig. 1) gong falls the PCB plate part that does not need to make PCB board side expose the copper of electroplating when filling the hole and electroplating, form the pad of PCB board side parallel surface, satisfy SMT side subsides dress requirement, can not lead to the rosin joint.
2. By the manufacturing method, the bonding pads which are respectively isolated from the upper side, the lower side, the left side and the right side can be manufactured on the bonding pads on the side edge of the PCB, the requirements of SMT (surface mount technology) parts are met, the LED lamp beads can be pasted on the side edge, and the manufacturing method has electrical performance and functional effects.
Drawings
Fig. 1 is a schematic processing diagram of a PCB pre-routing step in this embodiment.
Fig. 2 is a side view of the PCB board of the present embodiment.
Fig. 3 is a front view of the PCB of the present embodiment.
Wherein the above reference numerals are: 1. PCB board, 2, pad.
Detailed Description
The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which presently preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for completeness and fully convey the scope of the invention to the skilled person.
As shown in fig. 2-3, the present embodiment provides a PCB with SMT pads on its side, where pads 2 are uniformly spaced on the side of the PCB 1, and the side of the pads 2 is parallel to the side of the PCB 1.
Further, the pad 2 is an SMT pad.
The embodiment also provides a preparation method of the PCB with the SMT pad on the side edge, which comprises the following steps:
and (3) laminating: pressing and bonding the multilayer PCB into a whole;
blackening: etching the copper surface of the PCB by using blackening liquid medicine to blacken the copper on the surface;
laser: using laser light to laser out a pit area on the side of the PCB;
hole filling and electroplating: electroplating a layer of copper in the pit area subjected to laser;
pre-routing: routing along a center line of the pit area parallel to the side of the PCB board (refer to fig. 1), dividing the pit area into two parts, leaving a required part, routing off an unnecessary part, exposing copper electroplated during hole filling electroplating on the side of the PCB board, and forming a side pad of the PCB board.
Further, in the step laser, the laser light used is CO2And (5) laser.
Further, in the step of hole filling electroplating, the copper electroplated in the pit area is a copper layer of about 30 um.
Further, in the step of hole filling electroplating, the copper electroplated in the pit area is a copper layer filling the pit area.
Further, the pit area is a substantially square plated blind hole.
Detailed description of the above steps:
in the step blackening, the purpose of blackening is to prepare the laser for CO2, so that the laser energy of CO2 laser can be absorbed by the copper surface of the PCB.
In the hole filling electroplating step, two electroplating schemes are provided, wherein the first scheme is to fill the pits during electroplating, and after the pits are electroplated and filled in the holes, the top surfaces of the pits are kept flush with the side surfaces of the PCB board; in the other design, the electroplating pits are half-filled, and only a layer of copper with the thickness of about 30 mu m is electroplated on the outer surface (five surfaces) of each pit; in the first scheme, the side wall bonding pad and the board surface keep the same plane, which is beneficial to improving the SMT yield of a client, but has high cost and is selected by a high-end client; the second scheme has low cost, but has high requirements on the SMT process capability of the client, and is beneficial to batch use of customers. Thereby adapting to different markets and improving the sales volume of products.
In general, by the present preparation method, CO is utilized2Laser is used for laser forming a square blind hole-shaped pit area on the multilayer PCB, the pit area is substantially a square electroplating blind hole, then a copper layer is electroplated, and finally an unnecessary part of the PCB is milled along a side line (refer to figure 1) of the PCB, so that copper electroplated during hole filling electroplating is exposed on the side of the PCB, a bonding pad of a parallel surface of the side of the PCB is formed, the SMT side surface mounting requirement is met, and insufficient soldering cannot be caused; meanwhile, the preparation method can be used for manufacturing the bonding pads which are respectively isolated from the upper side, the lower side, the left side and the right side on the bonding pads at the side edge of the PCB, meets the requirements of SMT (surface mount technology) parts, has electrical performance and functional effects, and can be used for laterally mounting the LED lamp beads.
The above examples are merely representative of preferred embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, various changes, modifications and substitutions can be made without departing from the spirit of the present invention, and these are all within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. The utility model provides a PCB board of side tape SMT pad which characterized in that:
the side of PCB board evenly spaced is provided with the pad, the side of pad with the side of PCB board is parallel.
2. A PCB board with SMT pads on its side edges as recited in claim 1, wherein:
the bonding pad is an SMT bonding pad.
3. A preparation method of a PCB board with SMT welding pads on the side edge is characterized by comprising the following steps:
and (3) laminating: pressing and bonding the multilayer PCB into a whole;
blackening: etching the copper surface of the PCB by using blackening liquid medicine to blacken the copper on the surface;
laser: using laser light to laser out a pit area on the side of the PCB;
and (3) copper plate deposition: metallizing a layer of copper in the pit
Transferring an outer layer pattern electric dry film pattern: transferring the pattern to the PCB surface by dry film exposure and development according to the design of the customer
Pattern electroplating: electroplating the thickened copper layer on the area, which is not covered by the dry film, on the surface of the PCB, and electroplating the thickened copper layer in the laser pit area until the pit is filled;
pre-routing: and routing along a center line of the pit area parallel to the side edge of the PCB board, dividing the pit area into two parts, leaving a required part, routing away an unnecessary part, exposing copper electroplated during hole filling electroplating on the side edge of the PCB board, and forming a side edge bonding pad of the PCB board.
4. The method for manufacturing a PCB board with SMT pads on the side edges according to claim 3, wherein:
in the step of laser, the laser light used is CO2And (5) laser.
5. The method for manufacturing a PCB board with SMT pads on the side edges according to claim 3, wherein:
in the step of hole filling electroplating, the copper electroplated in the pit area is a copper layer with a thickness of about 30 um.
6. The method for manufacturing a PCB board with SMT pads on the side edges according to claim 3, wherein:
in the step of hole filling electroplating, the copper electroplated in the pit area is a copper layer filling the pit area.
7. The method for manufacturing a PCB board with SMT pads on the side edges according to claim 3, wherein:
the pit area is a substantially square plated blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110241094.1A CN112996239A (en) | 2021-03-04 | 2021-03-04 | PCB with SMT bonding pads on side edges and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110241094.1A CN112996239A (en) | 2021-03-04 | 2021-03-04 | PCB with SMT bonding pads on side edges and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112996239A true CN112996239A (en) | 2021-06-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110241094.1A Pending CN112996239A (en) | 2021-03-04 | 2021-03-04 | PCB with SMT bonding pads on side edges and manufacturing method |
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| Country | Link |
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| CN (1) | CN112996239A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113950203A (en) * | 2021-12-20 | 2022-01-18 | 广东科翔电子科技股份有限公司 | Method for manufacturing hole-in-hole disc of high-precision Mini-LED PCB |
| CN117500155A (en) * | 2023-12-26 | 2024-02-02 | 荣耀终端有限公司 | Frame plate, circuit board assembly, terminal device and manufacturing method of frame plate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5488765A (en) * | 1992-07-27 | 1996-02-06 | Murata Manufacturing Co., Ltd. | Method of measuring characteristics of a multilayer electronic component |
| CN103065560A (en) * | 2013-01-11 | 2013-04-24 | 林谊 | LED display screen display unit and production method thereof |
| CN105007683A (en) * | 2015-07-03 | 2015-10-28 | 深圳市景旺电子股份有限公司 | Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization |
| CN110121239A (en) * | 2019-04-10 | 2019-08-13 | 江门崇达电路技术有限公司 | A kind of production method of mechanical blind hole half bore |
| US10791632B1 (en) * | 2019-09-20 | 2020-09-29 | Raytheon Company | Extremely low profile electrical interconnect for printed wiring board |
-
2021
- 2021-03-04 CN CN202110241094.1A patent/CN112996239A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5488765A (en) * | 1992-07-27 | 1996-02-06 | Murata Manufacturing Co., Ltd. | Method of measuring characteristics of a multilayer electronic component |
| CN103065560A (en) * | 2013-01-11 | 2013-04-24 | 林谊 | LED display screen display unit and production method thereof |
| CN105007683A (en) * | 2015-07-03 | 2015-10-28 | 深圳市景旺电子股份有限公司 | Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization |
| CN110121239A (en) * | 2019-04-10 | 2019-08-13 | 江门崇达电路技术有限公司 | A kind of production method of mechanical blind hole half bore |
| US10791632B1 (en) * | 2019-09-20 | 2020-09-29 | Raytheon Company | Extremely low profile electrical interconnect for printed wiring board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113950203A (en) * | 2021-12-20 | 2022-01-18 | 广东科翔电子科技股份有限公司 | Method for manufacturing hole-in-hole disc of high-precision Mini-LED PCB |
| CN113950203B (en) * | 2021-12-20 | 2022-03-11 | 广东科翔电子科技股份有限公司 | Method for manufacturing hole-in-hole disc of high-precision Mini-LED PCB |
| CN117500155A (en) * | 2023-12-26 | 2024-02-02 | 荣耀终端有限公司 | Frame plate, circuit board assembly, terminal device and manufacturing method of frame plate |
| CN117500155B (en) * | 2023-12-26 | 2024-05-24 | 荣耀终端有限公司 | Frame plate, circuit board assembly, terminal device and manufacturing method of frame plate |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20210618 |