CN114811467A - Lamp panel, preparation method thereof and backlight module - Google Patents

Lamp panel, preparation method thereof and backlight module Download PDF

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Publication number
CN114811467A
CN114811467A CN202210580307.8A CN202210580307A CN114811467A CN 114811467 A CN114811467 A CN 114811467A CN 202210580307 A CN202210580307 A CN 202210580307A CN 114811467 A CN114811467 A CN 114811467A
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CN
China
Prior art keywords
reflector
light
circuit
bonding pad
lamp panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210580307.8A
Other languages
Chinese (zh)
Inventor
姚黎晓
王代青
李健林
其他发明人请求不公开姓名
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen TCL New Technology Co Ltd
Original Assignee
Shenzhen TCL New Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen TCL New Technology Co Ltd filed Critical Shenzhen TCL New Technology Co Ltd
Priority to CN202210580307.8A priority Critical patent/CN114811467A/en
Publication of CN114811467A publication Critical patent/CN114811467A/en
Priority to PCT/CN2023/088114 priority patent/WO2023226611A1/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/002—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips making direct electrical contact, e.g. by piercing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/05—Optical design plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/10—Construction
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The application provides a lamp panel, a preparation method thereof and a backlight module, wherein the lamp panel is provided with a light emitting side and a backlight side and comprises a light emitting device, and the light emitting device is provided with a positive electrode connecting part and a negative electrode connecting part; the reflector is provided with a plurality of groups of electric connection parts on one surface of the reflector on the light emergent side, each group of electric connection parts comprises an anode bonding pad and a cathode bonding pad, the anode connection part is electrically connected with the anode bonding pad, and the cathode connection part is electrically connected with the cathode bonding pad; the reflector is provided with a through hole penetrating through two surfaces of the reflector, one surface of the reflector, which is positioned on the backlight side, is provided with a connecting circuit, and the positive electrode bonding pad and the negative electrode bonding pad are electrically connected with the connecting circuit through the through hole. This application is glued when carrying out light emitting device fixed silver and is not covered by reflector plate or printing ink, can avoid the gluey solidification of silver and lead to the phenomenon that reflector plate or printing ink broke.

Description

Lamp panel, preparation method thereof and backlight module
Technical Field
The application relates to the technical field of display, in particular to a lamp panel, a preparation method thereof and a backlight module.
Background
At present, with the development of the display industry, the direct type miniLED backlight module has the advantages of good display effect, divisionally controllable and the like, and gradually occupies most market share in a high-end market. Wherein, backlight unit's nuclear core part is the lamp plate, and the lamp plate mainly constructs including the carrier substrate, electrically conductive line, white printing ink and LED, at the in-process of preparation lamp plate, need carry out in proper order the silver glue printing, bake in advance, printing ink printing/reflection laminating, solid brilliant and roast processes such as finally, nevertheless owing to top covers when the silver glue is baked the solidification finally has reflector plate or printing ink, can lead to the difficult volatile problem of silver glue solidification solvent to cause reflector plate or the cracked phenomenon of printing ink.
Disclosure of Invention
The application provides a lamp panel, a preparation method thereof and a backlight module, and aims to solve the technical problem that a reflector plate or printing ink is cracked due to curing of silver paste of the existing lamp panel.
First aspect, this application provides a lamp plate, and the lamp plate has light-emitting side and the side of being shaded, and the lamp plate includes:
a light emitting device having a positive electrode connection part and a negative electrode connection part;
the reflector is provided with a plurality of groups of electric connection parts on one surface of the reflector on the light emergent side, each group of electric connection parts comprises an anode bonding pad and a cathode bonding pad, the anode bonding pad is electrically connected with the anode connection part, and the cathode bonding pad is electrically connected with the cathode connection part;
the reflector is provided with a through hole penetrating through two surfaces of the reflector, one surface of the reflector, which is positioned on the backlight side, is provided with a connecting circuit, and the positive electrode bonding pad and the negative electrode bonding pad are electrically connected with the connecting circuit through the through hole.
In some embodiments, the reflector comprises a reflective sheet;
the electric connection part is arranged on one surface of the reflector plate positioned on the light-emitting side, and the connection circuit is arranged on one surface of the reflector plate positioned on the backlight side.
In some embodiments, the reflector comprises a flexible substrate and a reflective sheet bonded to each other;
the electric connection part is arranged on one surface of the reflector plate, which deviates from the flexible substrate, the connection circuit is arranged on one surface of the flexible substrate, which deviates from the reflector plate, and the via hole penetrates through the flexible substrate and the reflector plate.
In some embodiments, the connecting circuit includes a plurality of sections of circuit traces;
one end of the circuit wire is electrically connected with the positive electrode bonding pad of one group of electric connection parts, and the other end of the circuit wire is electrically connected with the negative electrode bonding pad of the other group of electric connection parts.
In some embodiments, the vias include a first via and a second via;
the positive bonding pad covers one end of the first via hole, which is located on the light emitting side, the negative bonding pad covers one end of the second via hole, which is located on the light emitting side, the positive bonding pad is electrically connected with the circuit wiring through the first via hole, and the negative bonding pad is electrically connected with the circuit wiring through the second via hole.
In some embodiments, one end of the circuit trace covers one end of the first via hole located at the backlight side, and the other end covers one end of the second via hole located at the backlight side;
a first conductor for connecting the circuit wiring and the positive bonding pad is arranged in the first via hole, and a second conductor for connecting the circuit wiring and the negative bonding pad is arranged in the second via hole.
In some embodiments, the orthographic projection of the light emitting device on the reflector does not overlap the via.
In some embodiments, the cross-sectional area of the via hole gradually increases from the backlight side to the light-emitting side; or
The cross-sectional area of the via hole is gradually reduced from the backlight side to the light-emitting side.
In some embodiments, a first groove is formed in one surface of the reflector, which is located on the light emitting side, and the electric connection part is arranged in the first groove; and/or
One surface of the reflector, which is positioned at the backlight side, is provided with a second groove, and the connecting circuit is arranged in the second groove.
In some embodiments, the light emitting devices are in one-to-one correspondence with the electrical connections, and the positive connection portion and the negative connection portion of the same light emitting device are electrically connected to the same electrical connection portion.
In some embodiments, the material of the positive and negative electrode pads comprises a conductive silver paste or copper foil; and/or
The material of the connecting circuit comprises conductive silver paste or copper foil.
In some embodiments, the backlight module further comprises a protective layer covering a side of the reflector on the backlight side.
In a second aspect, the present application provides a method for manufacturing a lamp panel, including;
providing a reflector;
a through hole is formed in the reflector and penetrates through two surfaces of the reflector;
a connecting circuit is formed on one surface of the reflector, a plurality of groups of electric connection parts are formed on the other surface of the reflector, each electric connection part comprises a positive electrode bonding pad and a negative electrode bonding pad, and the connecting circuit is electrically connected with the positive electrode bonding pad and the negative electrode bonding pad through via holes;
and the light-emitting device is arranged on one surface of the reflector provided with the electric connection part, the positive electrode connection part of the light-emitting device is connected with the positive electrode bonding pad, and the negative electrode connection part of the light-emitting device is connected with the negative electrode bonding pad.
In some embodiments, the method further comprises:
the surface of the reflector on the backlight side is covered with a protective layer.
In a third aspect, the present application provides a backlight module, including a lamp panel as described in the first aspect.
According to the LED chip, the electric connection part and the connection circuit are respectively arranged on two sides of the reflector, the electric connection part is electrically connected with the connection circuit through the through hole, the light-emitting device can be directly installed on the positive electrode bonding pad and the negative electrode bonding pad, and the silver adhesive is not covered by the reflector plate or ink when the light-emitting device is subjected to die bonding because the positive electrode bonding pad and the negative electrode bonding pad are located on the surface of the reflector, so that the phenomenon that the reflector plate or the ink is broken due to solidification of the silver adhesive is avoided; meanwhile, the connecting circuit is arranged on the backlight side of the reflector, and only the positive electrode bonding pad and the negative electrode bonding pad for die bonding are exposed on the light emergent side of the reflector, so that the influence of the connecting circuit on the reflectivity of the reflector can be avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a lamp panel provided in an embodiment of the present application;
fig. 2 is another schematic structural diagram of the lamp panel provided in the embodiment of the present application;
fig. 3 is another schematic structural diagram of the lamp panel provided in the embodiment of the present application;
FIG. 4 is a schematic diagram of a reflector with a light-emitting side according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of a reflector backlight side provided in an embodiment of the present application;
fig. 6 is another schematic structural diagram of the lamp panel provided in the embodiment of the present application;
fig. 7 is another schematic structural diagram of the lamp panel provided in the embodiment of the present application;
fig. 8 is another schematic structural diagram of the lamp panel provided in an embodiment of the present application;
fig. 9 is a schematic flowchart of a lamp panel preparation method provided in an embodiment of the present application.
The LED lamp comprises a lamp panel 100, a reflector 10, an electric connection part 110, a positive electrode pad 111, a negative electrode pad 112, a connection circuit 120, a circuit trace 121, a conductor 130, a first conductor 131, a second conductor 132, a via hole 11, a first via hole 101, a second via hole 102, a reflector 12, a flexible substrate 13, a first groove 14, a second groove 15, a light emitting device 20, a positive electrode connection part 21, a negative electrode connection part 22 and a protective layer 30.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
The embodiment of the application provides a lamp panel, a preparation method thereof and a backlight module, which are described in detail below.
First, referring to fig. 1, fig. 1 shows a schematic structural diagram of a lamp panel 100 in an embodiment of the present application, where the lamp panel 100 includes:
a light emitting device 20, the light emitting device 20 having a positive electrode connection portion 21 and a negative electrode connection portion 22;
the reflector 10, one side of the reflector 10 on the light-emitting side is provided with a plurality of groups of electric connection parts 110, each group of electric connection parts 110 comprises a positive electrode pad 111 and a negative electrode pad 112, the positive electrode pad 111 is electrically connected with the positive electrode connection part 21, and the negative electrode pad 112 is electrically connected with the negative electrode connection part 22;
the reflector 10 is provided with a via hole 11 penetrating through both surfaces thereof, one surface of the reflector 10 on the backlight side is provided with a connection circuit 120, and the positive electrode pad 111 and the negative electrode pad 112 are electrically connected with the connection circuit 120 through the via hole 11.
Specifically, the light emitting side generally refers to a side of the lamp panel 100 emitting light and transmitting the light, and the backlight side refers to a side of the lamp panel 100 opposite to the light emitting side. In some embodiments of the present application, a side of the reflector 10 where the light emitting device 20 is mounted is a light emergent side of the lamp panel 100, and a side of the reflector 10 opposite to the light emitting device 20 is a backlight side of the lamp panel 100, taking fig. 1 as an example, the light emitting side is above the reflector 10, and the backlight side is below the reflector 10.
When the anode connection part 21 and the cathode connection part 22 of the light emitting device 20 are connected to a power source, the light emitting device 20 may emit white light or colored light (e.g., red light, green light, blue light, etc.) from the light emitting side. Illustratively, the light emitting device 20 may be an inorganic light emitting diode, such as a Mini LED or a Micro LED, or the like, or the light emitting device 20 may also be an inorganic light emitting diode, a quantum dot light emitting device, or the like.
The reflector 10 may reflect light emitted from the light emitting device 20 to the backlight side to improve the light utilization efficiency of the light emitting device 20. The reflector 10 is provided with a plurality of sets of electrical connection portions 110 on one surface of the light exit side, each set of electrical connection portions 110 includes a positive electrode pad 111 and a negative electrode pad 112, the positive electrode pad 111 is electrically connected with the positive electrode connection portion 21, and the negative electrode pad 112 is electrically connected with the negative electrode connection portion 22.
In some embodiments of the present application, the positive electrode pad 111 and the negative electrode pad 112 close to each other are the same set of electrical connection portions 110, the light emitting devices 20 correspond to the electrical connection portions 110 one to one, and the positive electrode connection portion 21 and the negative electrode connection portion 22 of the same light emitting device 20 are electrically connected to the same electrical connection portion 110, that is, in the same set of electrical connection portions 110, the positive electrode pad 111 and the negative electrode pad 112 are electrically connected to the positive electrode connection portion 21 and the negative electrode connection portion 22 of the same light emitting device 20, respectively, so that the light emitting devices 20 are connected to the electrical connection portions 110 correspondingly.
It is understood that it is also possible to use the positive electrode pad 111 and the negative electrode pad 112, which are separated by a certain distance (for example, 10cm), as the same set of electrical connection portions 110, and connect the light emitting device 20 thereto through an electrical connection line; or the positive electrode connection part 21 of the light emitting device 20 may be electrically connected to the positive electrode pad 111 of one set of electrical connection parts 110, and the negative electrode connection part 22 thereof may be electrically connected to the negative electrode pad 112 of another set of electrical connection parts 110.
In some embodiments of the present application, referring to fig. 1, the reflector 10 may be a reflector plate, and since the reflector plate has characteristics of light reflectivity and flexibility, the lamp panel 100 with the reflector plate 12 as a main body has flexibility while reflecting light emitted from the light emitting device 20 to the backlight side, so that the lamp panel 100 may also be matched with a flexible screen to implement a curved television.
In some other embodiments of the present application, referring to fig. 2, fig. 2 shows another structural schematic diagram of the lamp panel 100 in the embodiment of the present application, wherein the reflector 10 includes a flexible substrate 13 and a reflective sheet 12 adhered to each other. Exemplarily, the flexible substrate 13 may be PET or PI, and since both the reflector plate 12 and the flexible substrate 13 have flexibility, the lamp panel 100 mainly including the reflector plate 12 and the flexible substrate 13 also has flexibility, and thus, the flexible substrate can be used in combination with a flexible screen to realize a curved television; meanwhile, because the reflector plate 12 is adhered to the flexible substrate 13, the strength of the lamp panel 100 with the reflector plate 12 and the flexible substrate 13 as main bodies is improved, and the overall toughness and reliability of the lamp panel 100 can be enhanced.
It is understood that the reflector 10 may also refer to other substrates having a reflective function, for example, a reflective layer is formed by applying white ink on the surface of the flexible substrate 13, so as to prepare the reflector 10 having a reflective function and a flexible characteristic.
In the embodiment of the application, the two sides of the reflector 10 are respectively provided with the electric connection part 110 and the connection circuit 120, and the electric connection part 110 is electrically connected with the connection circuit 120 through the via hole 11, the light-emitting device 20 can be directly installed on the positive electrode pad 111 and the negative electrode pad 112, and as the positive electrode pad 111 and the negative electrode pad 112 are located on the surface of the reflector 10, the silver adhesive is not covered by the reflector plate 12 or the ink when the light-emitting device 20 is subjected to die bonding, so that the phenomenon that the reflector plate 12 or the ink is cracked due to the solidification of the silver adhesive is avoided; meanwhile, since the connection circuit 120 is disposed on the backlight side of the reflector 10, only the positive electrode pad 111 and the negative electrode pad 112 for die bonding are exposed on the light-emitting side of the reflector 10, and the phenomenon that the connection circuit 120 shields the surface of the reflector 10 to reduce the reflectivity can be avoided.
In some embodiments of the present application, for example, for the embodiment in which the reflector 10 is the reflector 12, referring to fig. 1, the electrical connection portion 110 is disposed on one surface of the reflector 12 on the light-emitting side, and the connection circuit 120 is disposed on one surface of the reflector 12 on the backlight side, that is, the positive electrode pad 111, the negative electrode pad 112 and the corresponding connection circuit 120 are directly prepared on two surfaces of the reflector 12, respectively, after the light emitting device 20 emits light, the light emitted to the backlight side is reflected by the reflector 12 back to the light-emitting side, thereby improving the light utilization rate of the light emitting device 20; meanwhile, since the electrical connection portion 110 and the connection circuit 120 are two sides of the reflection sheet 12, the connection circuit 120 does not block the surface of the light emitting side of the reflection sheet 12, thereby avoiding the influence on the light reflectivity of the reflection sheet 12.
In other embodiments of the present application, for example, for an embodiment in which the reflector 10 includes a flexible substrate 13 and a reflective sheet 12 adhered to each other, referring to fig. 2, the electrical connection portion 110 is disposed on a side of the reflective sheet 12 facing away from the flexible substrate 13, the connection circuit 120 is disposed on a side of the flexible substrate 13 facing away from the reflective sheet 12, the via hole 11 penetrates through the flexible substrate 13 and the reflective sheet 12, the electrical connection portion 110 is connected to the connection circuit 120 through the via hole 11 penetrating through the flexible substrate 13 and the reflective sheet 12, the reflective sheet 12 is located on a light-emitting side and can reflect light emitted to a backlight side, and meanwhile, since the electrical connection portion 110 and the connection circuit 120 are respectively disposed on opposite sides of the reflective sheet 12 and the flexible substrate 13, the connection circuit 120 does not affect the reflectivity of the reflective sheet 12.
It can be understood that the connection circuit 120 and the electrical connection portion 110 may also have other configurations, for example, referring to fig. 3, fig. 3 shows another structural schematic diagram of the lamp panel 100 in the embodiment of the present application, the connection circuit 120 is located between the flexible substrate 13 and the reflective sheet 12, and the flexible substrate 13 and the reflective sheet 12 jointly protect the connection circuit 120, so as to avoid the risk of exposing the connection circuit 120.
As an exemplary embodiment, referring to fig. 4 and fig. 5, fig. 4 shows a schematic structural diagram of a light-emitting side of the reflector 10 in the embodiment of the present application, and fig. 5 shows a schematic structural diagram of a backlight side of the reflector 10 in the embodiment of the present application, wherein the connection circuit 120 includes a plurality of circuit traces 121, one end of the circuit trace 121 is electrically connected to the positive electrode pad 111 of one set of electrical connection portion 110, and the other end of the circuit trace 121 is electrically connected to the negative electrode pad 112 of the other set of electrical connection portion 110, that is, the connection circuit 120 connects two sets of electrical connection portions 110 in series through the circuit trace 121, so as to form a series circuit structure.
In some embodiments of the present application, the connection circuit 120 can connect all of the electrical connections 110 in series through multiple lengths of circuit traces 121. It is understood that the connection circuit 120 can also connect multiple sets of electrical connections 110 in parallel or in a combination of series and parallel via multiple lengths of circuit traces 121.
In some embodiments of the present application, with continuing reference to fig. 1, fig. 4, and fig. 5, the via hole 11 includes a first via hole 101 and a second via hole 102, the positive pad 111 covers one end of the first via hole 101 on the light-emitting side, the negative pad 112 covers one end of the second via hole 102 on the light-emitting side, the positive pad 111 is electrically connected to the circuit trace 121 through the first via hole 101, and the negative pad 112 is electrically connected to the circuit trace 121 through the second via hole 102, because the positive pad 111 covers the first via hole 101 and the negative pad 112 covers the second via hole 102, the phenomenon that the first via hole 101 and the second via hole 102 are exposed on the surface of the light-emitting side of the reflector 10, and the light of the light emitting device 20 is incident into the first via hole 101 and the second via hole 102, so as to improve the light reflectivity of the reflector 10.
In some embodiments of the present application, for example, for the embodiment where the via 11 includes the first via 101 and the second via 102, referring to fig. 2, one end of the circuit trace 121 covers one end of the first via 101 on the backlight side, the other end covers the end of the second via hole 102 on the backlight side, a first conductor 131 connecting the circuit 120 trace and the positive pad 111 is arranged in the first via hole 101, and a second conductor 132 connecting the circuit 120 trace and the negative pad 112 is arranged in the second via hole 102, that is, two ends of the first via hole 101 are respectively covered by the positive pad 111 and the circuit trace 121, two ends of the second via hole 102 are respectively covered by the negative pad 112 and the circuit trace 121, therefore, the first via hole 101 and the second via hole 102 are sealed, and impurities are prevented from entering the first via hole 101 and the second via hole 102 to affect the conductivity of the first conductor 131 and the second conductor 132.
In some embodiments of the present application, the positive electrode pad 111, the negative electrode pad 112, the first conductor 131, the second conductor 132, and the circuit trace 121 are all conductive silver paste, and when the electrical connection portion 110 and the circuit trace 121 are respectively prepared on two sides of the reflector 10 by using the conductive silver paste, the conductive silver paste can be filled into the via hole 11 to form the first conductor 131 and the second conductor 132, which is beneficial to reducing the preparation difficulty of the electrical connection portion 110, the circuit trace 121, the first conductor 131, and the second conductor 132 on the reflector 10; meanwhile, the positive electrode bonding pad 111 and the negative electrode bonding pad 112 formed by the conductive silver paste have certain light reflection performance, and the light utilization rate of the light-emitting device 20 can be further improved.
It is understood that the positive electrode pad 111, the negative electrode pad 112, the first conductor 131, the second conductor 132 and the circuit trace 121 can also be formed of other conductive materials, such as copper foil, silver foil, etc.
In some embodiments of the present application, referring to fig. 1, the orthographic projection of the light emitting device 20 on the reflector 10 does not overlap the via hole 11, and the positive electrode connection portion 21 and the negative electrode connection portion 22 of the light emitting device 20 can avoid being connected around the via hole 11 when the light emitting device 20 is fixed, thereby ensuring the reliability of fixing the light emitting device 20 on the reflector 10. Meanwhile, for some embodiments of the present application, for example, for the embodiment in which the positive electrode pad 111 and the negative electrode pad 112 are cured conductive silver paste, a portion of the conductive silver paste exposed outside the light emitting device 20 and overlapping the via 11 also has light reflectivity, and thus the portion of the positive electrode pad 111 and the negative electrode pad 112 outside the light emitting device 20 does not affect the light reflectivity of the reflector 10.
In some embodiments of the present application, referring to fig. 1, wherein the cross-sectional area of the via hole 11 gradually increases in a direction from the backlight side to the light exit side. When the electrical connection portion 110 and the connection circuit 120 are prepared on the reflector 10, the connection circuit 120 may be prepared on one surface of the reflector 10 on the backlight side, and since the cross-sectional area of the via hole 11 is gradually increased along the direction from the backlight side to the light exit side, the conductive silver paste is more likely to enter the via hole 11 to form the conductor 130 when the connection circuit 120 is prepared, thereby reducing the difficulty in preparing the conductor 130 in the via hole 11.
In other embodiments of the present application, with continuing reference to fig. 6, fig. 6 shows another schematic structural diagram of the lamp panel 100 in the embodiment of the present application, wherein the cross-sectional area of the via hole 11 gradually decreases from the backlight side to the light exit side. When the electrical connection portion 110 and the connection circuit 120 are prepared on the reflector 10, the electrical connection portion 110 can be prepared on one surface of the reflector 10 on the light emergent side, similarly, since the cross-sectional area of the via hole 11 is gradually reduced along the direction pointing to the light emergent side from the backlight side, the conductive silver paste is more easily introduced into the via hole 11 to form the conductor 130 during the preparation of the electrical connection portion 110, and thus the difficulty in preparing the conductor 130 in the via hole 11 is reduced.
In some embodiments of the present application, referring to fig. 7, fig. 7 shows another schematic structural diagram of the lamp panel 100 in the embodiment of the present application, wherein a first groove 14 is formed in a surface of the reflector 10 on the light exit side, the electrical connection portion 110 is disposed in the first groove 14, and a surface of the electrical connection portion 110 is substantially flush with a surface of the reflector 10.
In some embodiments of the present application, with continuing reference to fig. 8, fig. 8 shows another schematic structural diagram of the lamp panel 100 in the embodiment of the present application, wherein a second groove 15 is disposed on a surface of the reflector 10 located on the backlight side, and the connection circuit 120 is disposed in the second groove 15, for some embodiments of the present application, for example, for an embodiment in which the connection circuit 120 is a cured conductive silver paste, when the connection circuit 120 is prepared, the liquid conductive silver paste is directly filled in the second groove 15, and the connection circuit 120 can be formed by baking and curing, because the conductive silver paste is limited by the second groove 15, the liquid conductive silver paste before curing can be prevented from flowing randomly due to influences of factors such as machine vibration, and finally, a short circuit or an open circuit phenomenon occurs in the circuit structure after curing.
In some embodiments of the present application, with continued reference to fig. 1, the lamp panel 100 further includes a protective layer 30, the protective layer 30 covers a surface of the reflector 10 on the backlight side, and the connection circuit 120 is located between the protective layer 30 and the reflector 10. Wherein the protective layer 30 has insulating properties so that the risk of exposing the circuit can be avoided. Illustratively, the protective layer 30 may be glass fiber, basalt fiber, polyvinyl alcohol, or polyethylene naphthalate, etc., which have flexibility as well as insulating properties.
It should be noted that the above contents related to the lamp panel 100 are intended to clearly illustrate the implementation process of the present application, and those skilled in the art can also make equivalent modified designs based on the present application, for example, the positive electrode pad 111 and the negative electrode pad 112 are formed by copper foil, and the connection circuit 120 is formed by baking and curing conductive silver paste.
Further, in order to better implement the lamp panel 100 in the present application, on the basis of the lamp panel 100, the present application further provides a method for manufacturing the lamp panel 100, referring to fig. 9, fig. 9 shows a schematic flow diagram of the method for manufacturing the lamp panel 100 in the embodiment of the present application, where the method for manufacturing the lamp panel 100 includes:
step S901, providing a reflector 10;
specifically, the reflector 10 may reflect the light emitted from the light emitting device 20 to the backlight side to improve the light utilization efficiency of the light emitting device 20. In some embodiments of the present application, the reflector 10 may be a reflector sheet 12. In other embodiments of the present application, the reflector 10 includes a flexible substrate 13 and a reflective sheet 12 bonded to each other. It is understood that the reflector 10 may also refer to other substrates having a reflective function, for example, a reflective layer is formed by applying white ink on the surface of the flexible substrate 13, so as to prepare the reflector 10 having a reflective function and a flexible characteristic.
Step S902, forming a via hole 11 on the reflector 10, wherein the via hole 11 penetrates through two surfaces of the reflector 10;
in some embodiments of the present application, the cross-sectional area of the via hole 11 gradually increases in a direction from the backlight side to the light exit side. In other embodiments of the present application, the cross-sectional area of the via hole 11 gradually decreases from the backlight side to the light exit side. In some embodiments, the via hole 11 may be a circular hole, a tapered hole, a square hole, or the like.
Specifically, the via hole 11 may be formed by physical or chemical means, for example, by forming the via hole 11 on the reflector 10 by a mechanical drilling device; as another example, the via hole 11 is formed on the reflector 10 by means of laser drilling; as another example, the reflector 10 is etched using a chemical to form the via hole 11.
Step S903, forming a connecting circuit 120 on one surface of the reflector 10, and forming a plurality of groups of electric connection parts 110 on the other surface, wherein the electric connection parts 110 comprise positive electrode pads 111 and negative electrode pads 112, and the connecting circuit 120 is electrically connected with the positive electrode pads 111 and the negative electrode pads 112 through via holes 11;
in some embodiments of the present application, the connecting circuit 120 and the electrical connection portion 110 may be formed by baking and curing a conductive silver paste, for example, first applying a conductive silver paste on a surface of the reflector 10 on the backlight side, filling the via hole 11 with the conductive silver paste, forming the connecting circuit 120 on the surface of the reflector 10 on the backlight side after baking, then applying a conductive silver paste on a surface of the reflector 10 on the light-emitting side, and curing the conductive silver paste around the via hole 11, so that the connecting circuit 120 is connected to the electrical connection portion 110 through the via hole 11.
It is understood that the connection circuit 120 and the electrical connection portion 110 may be formed by bonding metal foils (e.g., copper foil, silver foil, etc.) to both sides of the reflector 10.
In step S904, the light emitting device 20 is mounted on the surface of the reflector 10 on which the electrical connection portion 110 is provided, the positive electrode connection portion 21 of the light emitting device 20 is connected to the positive electrode pad 111, and the negative electrode connection portion 22 is connected to the negative electrode pad 112.
In some embodiments of the present application, the light emitting device 20 is mounted on a face of the reflector 10 on the light exit side by soldering so that the positive electrode connection portion 21 of the light emitting device 20 is connected to the positive electrode pad 111 and the negative electrode connection portion 22 is connected to the negative electrode pad 112. In other embodiments of the present application, the light emitting device 20 is adhesively mounted on the side of the reflector 10 on the light emitting side by means of a glue (e.g. silver glue) having electrically conductive properties. It will be appreciated by those skilled in the art that the light emitting device 20 may be mounted on the reflector 10 by other means of soldering or gluing, which will not be described in detail herein.
In the embodiment of the application, the two sides of the reflector 10 are respectively provided with the electric connection part 110 and the connection circuit 120, and the electric connection part 110 is electrically connected with the connection circuit 120 through the via hole 11, the light-emitting device 20 can be directly installed on the positive electrode pad 111 and the negative electrode pad 112, and as the positive electrode pad 111 and the negative electrode pad 112 are located on the surface of the reflector 10, the silver adhesive is not covered by the reflector plate 12 or the ink when the light-emitting device 20 is subjected to die bonding, so that the phenomenon that the reflector plate 12 or the ink is cracked due to the solidification of the silver adhesive is avoided; meanwhile, since the connection circuit 120 is disposed on the backlight side of the reflector 10, only the positive electrode pad 111 and the negative electrode pad 112 for die bonding are exposed on the light-emitting side of the reflector 10, and the phenomenon that the connection circuit 120 shields the surface of the reflector 10 to reduce the reflectivity can be avoided.
In some embodiments of the present application, in order to better protect the protective layer 30 on the backlight side of the reflector 10, the method for manufacturing the lamp panel 100 further includes covering the protective layer 30 on the backlight side of the reflector 10. For example, the protective layer 30 may be fixed on the backlight side of the reflector 10 by applying an adhesive glue on the surface of the protective layer 30 facing the reflector 10 and then adhering the protective layer 30 to the reflector 10 for baking. In some embodiments of the present application, the protective layer 30 may be glass fiber, basalt fiber, polyvinyl alcohol, or polyethylene naphthalate, etc. with flexibility and insulating property, and after covering the protective layer 30, the connection circuit 120 is located between the protective layer 30 and the reflector 10, because the protective layer 30 has insulating property, the risk of the exposed current leakage of the connection circuit 120 may be avoided.
It will be understood that the sequence of the above steps can be adjusted according to actual requirements, for example, after the connection circuit 120 is formed on the backlight side of the reflector 10, the protection layer 30 is covered on the backlight side of the reflector 10, and the connection circuit 120 is protected.
Further, for the better lamp plate 100 of implementing this application, on the basis of lamp plate 100, this application still provides a backlight unit, and backlight unit includes lamp plate 100 of any above-mentioned embodiment. Since the backlight module in the embodiment of the present application includes the lamp panel 100 in the above embodiment, all the beneficial effects of the lamp panel 100 in the above embodiment are achieved, and are not described herein again.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, and are not described herein again.
Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be considered merely illustrative and not restrictive of the broad application. Various modifications, improvements and adaptations to the present application may occur to those skilled in the art, although not explicitly described herein. Meanwhile, it should be noted that the lamp panel usage scenarios in the embodiment of the present application include, but are not limited to, the fields of backlight modules, Mimi LED direct displays, Micro LED direct displays, and the like as liquid crystal display devices.
The lamp panel, the preparation method thereof and the backlight module provided by the embodiment of the application are described in detail, a specific example is applied in the description to explain the principle and the implementation mode of the invention, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (15)

1. The utility model provides a lamp plate, its characterized in that, the lamp plate has light-emitting side and side in a poor light, the lamp plate includes:
a light emitting device having a positive electrode connection part and a negative electrode connection part;
the reflector is provided with a plurality of groups of electric connection parts on one surface of the reflector on the light emergent side, each group of electric connection parts comprises an anode pad and a cathode pad, the anode pad is electrically connected with the anode connection part, and the cathode pad is electrically connected with the cathode connection part;
the reflector is provided with a through hole penetrating through two surfaces of the reflector, one surface of the reflector, which is positioned on the backlight side, is provided with a connecting circuit, and the positive electrode bonding pad and the negative electrode bonding pad are electrically connected with the connecting circuit through the through hole.
2. The light panel of claim 1, wherein the reflector includes a reflector sheet;
the electric connection part is arranged on one surface of the reflector plate on the light emergent side, and the connection circuit is arranged on one surface of the reflector plate on the backlight side.
3. The light panel of claim 1, wherein the reflector includes a flexible substrate and a reflective sheet bonded to each other;
the electric connection portion is arranged on one side, deviating from the reflector plate, of the flexible substrate, the connection circuit is arranged on one side, deviating from the reflector plate, of the flexible substrate, and the through hole penetrates through the flexible substrate and the reflector plate.
4. The lamp panel of claim 1, wherein the connection circuit includes a plurality of sections of circuit traces;
one end of the circuit wire is electrically connected with the positive electrode bonding pad of one group of electric connection parts, and the other end of the circuit wire is electrically connected with the negative electrode bonding pad of the other group of electric connection parts.
5. The lamp panel of claim 4, wherein the via includes a first via and a second via;
the positive bonding pad covers one end, located on the light emitting side, of the first via hole, the negative bonding pad covers one end, located on the light emitting side, of the second via hole, the positive bonding pad is electrically connected with the circuit wiring through the first via hole, and the negative bonding pad is electrically connected with the circuit wiring through the second via hole.
6. The lamp panel of claim 5, wherein one end of the circuit trace covers one end of the first via hole on the backlight side, and the other end covers one end of the second via hole on the backlight side;
the first through hole is internally provided with a first electric conductor which is connected with the circuit wire and the positive bonding pad, and the second through hole is internally provided with a second electric conductor which is connected with the circuit wire and the negative bonding pad.
7. The lamp panel of claim 1, wherein an orthographic projection of the light emitting device on the reflector does not overlap with the via.
8. The lamp panel of claim 1, wherein the cross-sectional area of the via hole gradually increases from the backlight side to the light exit side; or
And the cross sectional area of the through hole is gradually reduced from the backlight side to the light emergent side.
9. The lamp panel of claim 1, wherein a first groove is formed in a surface of the reflector on the light emitting side, and the electrical connection portion is disposed in the first groove; and/or
One surface of the reflector, which is positioned on the backlight side, is provided with a second groove, and the connecting circuit is arranged in the second groove.
10. The lamp panel of claim 1, wherein the material of the positive electrode pad and the negative electrode pad includes conductive silver paste or copper foil; and/or
The material of the connecting circuit comprises conductive silver paste or copper foil.
11. The lamp panel of claim 1, wherein the light emitting devices correspond to the electrical connection portions one to one, and the positive connection portion and the negative connection portion of the same light emitting device are electrically connected to the same electrical connection portion.
12. A light panel as claimed in any one of claims 1 to 11, further comprising a protective layer covering a side of the reflector on the backlight side.
13. A lamp panel preparation method is characterized by comprising the following steps of;
providing a reflector;
a through hole is formed in the reflector and penetrates through two surfaces of the reflector;
forming a connecting circuit on one surface of the reflector, and forming a plurality of groups of electric connection parts on the other surface of the reflector, wherein the electric connection parts comprise positive electrode bonding pads and negative electrode bonding pads, and the connecting circuit is electrically connected with the positive electrode bonding pads and the negative electrode bonding pads through the through holes;
and installing a light-emitting device on the surface of the reflector, which is provided with an electric connection part, wherein the positive electrode connection part of the light-emitting device is connected with the positive electrode bonding pad, and the negative electrode connection part of the light-emitting device is connected with the negative electrode bonding pad.
14. The method for preparing a lamp panel according to claim 13, wherein the method further comprises:
and covering a protective layer on one surface of the reflector on the backlight side.
15. A backlight module characterized by comprising the lamp panel of any one of claims 1 to 12.
CN202210580307.8A 2022-05-25 2022-05-25 Lamp panel, preparation method thereof and backlight module Pending CN114811467A (en)

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PCT/CN2023/088114 WO2023226611A1 (en) 2022-05-25 2023-04-13 Lamp panel and preparation method therefor, and backlight module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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WO2023226611A1 (en) * 2022-05-25 2023-11-30 深圳Tcl新技术有限公司 Lamp panel and preparation method therefor, and backlight module

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CN117766669A (en) * 2024-02-20 2024-03-26 瀚思科技发展(北京)有限公司 Miniature LED bonding pad repairing method

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CN103545436B (en) * 2013-09-29 2016-01-13 苏州东山精密制造股份有限公司 Process for sapphire-based LED encapsulation structure and method for packing thereof
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CN216434600U (en) * 2021-11-15 2022-05-03 惠州视维新技术有限公司 Backlight module and display device
CN114811467A (en) * 2022-05-25 2022-07-29 深圳Tcl新技术有限公司 Lamp panel, preparation method thereof and backlight module

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WO2023226611A1 (en) * 2022-05-25 2023-11-30 深圳Tcl新技术有限公司 Lamp panel and preparation method therefor, and backlight module

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