WO2023226611A1

WO2023226611A1 - Lamp panel and preparation method therefor, and backlight module

Info

Publication number: WO2023226611A1
Application number: PCT/CN2023/088114
Authority: WO
Inventors: 李沛; 姚黎晓; 王代青; 李健林
Original assignee: 深圳Tcl新技术有限公司
Priority date: 2022-05-25
Filing date: 2023-04-13
Publication date: 2023-11-30
Also published as: CN114811467A

Abstract

A lamp panel (100) and a preparation method therefor, and a backlight module. The lamp panel (100) is provided with a light-emitting side and a backlight side. The lamp panel (100) comprises a light-emitting device (20), wherein the light-emitting device (20) is provided with a positive electrode connecting portion (21) and a negative electrode connecting portion (22); and a reflector (10), wherein the side of the reflector (10) located on the light-emitting side is provided with a plurality of electrical connecting portions (110), each electrical connecting portion (110) comprises a positive electrode pad (111) and a negative electrode pad (112), the positive electrode connecting portion (21) is electrically connected to the positive electrode pad (111), the negative electrode connecting portion (22) is electrically connected to the negative electrode pad (112), the reflector (10) is provided with a via hole (11) penetrating two sides of the reflector (10), the side of the reflector (10) located on the backlight side is provided with a connecting circuit (120), and the positive electrode pad (111) and the negative electrode pad (112) are electrically connected to the connecting circuit (120) by means of the via hole (11). When the light-emitting device (20) is fixed, silver gel is not covered by a reflector plate or ink, so that the phenomenon of cracking of the reflector plate or the ink caused by curing of the silver gel can be avoided.

Description

Lamp panel and preparation method thereof, backlight module

This application claims priority to the Chinese patent application submitted to the China Patent Office on May 25, 2022, with the application number 202210580307.8 and the invention name "Lamp Panel and Preparation Method and Backlight Module", the entire content of which is incorporated by reference in in this application.

Technical field

The present application relates to the field of display technology, and specifically to a lamp panel, a preparation method thereof, and a backlight module.

Background technique

At present, with the development of the display industry, direct-type mini LED backlight modules have gradually occupied the majority of the market share in the high-end display market due to their advantages such as good display effects and partitionable control. The core component of the backlight module is the light board, and the main structure of the light board includes a carrier substrate, conductive traces, white ink, and LEDs. In the process of preparing the lamp panel, silver glue printing, pre-baking, ink printing/reflective lamination, crystal solidification and final baking need to be carried out in sequence. However, since the silver glue is covered with a reflective sheet or ink during the final baking and curing, , will cause the silver glue curing solvent to be less volatile, causing the reflective sheet or ink to break.

technical problem

This application provides a lamp panel, a preparation method thereof, and a backlight module, aiming to solve the current technical problem of rupture of the reflective sheet or ink caused by the solidification of silver glue on the lamp panel.

Contents of the invention

In a first aspect, this application provides a light panel. The light panel has a light emitting side and a backlight side. The light panel includes:

A plurality of light-emitting devices, each light-emitting device has a positive electrode connection part and a negative electrode connection part;

The reflector has multiple sets of electrical connections on one side of the reflector located on the light-emitting side. Each set of electrical connections includes a positive electrode pad and a negative electrode pad. The positive electrode pad is electrically connected to the positive electrode connection part, and the negative electrode pad is electrically connected to the negative electrode connection part. connect;

The reflector is provided with via holes penetrating both sides of the reflector. The side of the reflector located on the backlight side is provided with a connection circuit. The positive electrode pad and the negative electrode pad are electrically connected to the connection circuit through the via holes.

In a second aspect, this application provides a method for preparing a lamp panel, including;

Provide a reflector;

A via hole is opened on the reflector, and the via hole penetrates both sides of the reflector;

A connection circuit is formed on one side of the reflector, and multiple sets of electrical connection parts are formed on the other side. The electrical connection part includes a positive electrode pad and a negative electrode pad, and the connection circuit is electrically connected to the positive electrode pad and the negative electrode pad through via holes;

The light-emitting device is installed on the side of the reflector provided with the electrical connection part. The positive connection part of the light-emitting device is connected to the positive electrode pad, and the negative connection part is connected to the negative electrode pad.

In a third aspect, the present application provides a backlight module, including the light panel as described in the first aspect.

In this application, the electrical connection part and the connection circuit are respectively provided on both sides of the reflector, and the electrical connection part and the connection circuit are electrically connected through the via hole. The light-emitting device can be directly installed on the positive electrode pad and the negative electrode pad. Since the positive electrode pad and the negative electrode pad are located on the surface of the reflector. When the light-emitting device is solidified, the silver glue is not covered by the reflective sheet or ink, so the phenomenon of rupture of the reflective sheet or ink due to the solidification of the silver glue is avoided; at the same time, since the circuit will be connected It is arranged on the backlight side of the reflector, and only the positive electrode pad and the negative electrode pad used for solid crystal are exposed on the light exit side of the reflector, which can avoid the influence of the connecting circuit on the reflectivity of the reflector.

Description of the drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without exerting creative efforts.

Figure 1 is a schematic structural diagram of a light panel provided in an embodiment of the present application;

Figure 2 is another structural schematic diagram of the light panel provided in the embodiment of the present application;

Figure 3 is another structural schematic diagram of the light panel provided in the embodiment of the present application;

Figure 4 is a schematic structural diagram of the light exit side of the reflector provided in the embodiment of the present application;

Figure 5 is a schematic structural diagram of the backlight side of the reflector provided in the embodiment of the present application;

Figure 6 is another structural schematic diagram of the light panel provided in the embodiment of the present application;

Figure 7 is another structural schematic diagram of the light panel provided in the embodiment of the present application;

Figure 8 is another structural schematic diagram of the light panel provided in the embodiment of the present application;

FIG. 9 is a schematic flow chart of the lamp panel preparation method provided in the embodiment of the present application.

Among them, 100 light board, 10 reflector, 110 electrical connection part, 111 positive electrode pad, 112 negative electrode pad, 120 connection circuit, 121 circuit wiring, 130 conductor, 131 first conductor, 132 second conductor, 11 via hole, 101 first via hole, 102 second via hole, 12 reflective sheet, 13 flexible substrate, 14 first groove, 15 second groove, 20 light emitting device, 21 positive electrode connection part, 22 negative electrode connection part, 30 layers of protection.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of this application.

In the description of this application, it needs to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " The directions or positional relationships indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions shown in the accompanying drawings or positional relationship is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined as “first” and “second” may explicitly or implicitly include one or more of the described features. In the description of this application, "plurality" means two or more than two, unless otherwise explicitly and specifically limited.

In this application, the word "exemplary" is used to mean "serving as an example, illustration, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the present application. In the following description, details are set forth for the purpose of explanation. It will be understood that one of ordinary skill in the art will recognize that the present application may be practiced without these specific details. In other instances, well-known structures and processes have not been described in detail to avoid obscuring the description of the application with unnecessary detail. Thus, this application is not intended to be limited to the embodiments shown but is to be accorded the widest scope consistent with the principles and features disclosed herein.

The embodiments of the present application provide a lamp panel, a preparation method thereof, and a backlight module, which are described in detail below.

First, refer to Figure 1, which shows a schematic structural diagram of the light panel 100 in the embodiment of the present application, wherein the light panel 100 includes:

A plurality of light-emitting devices 20, each light-emitting device 20 has a positive electrode connection part 21 and a negative electrode connection part 22;

Reflector 10. The surface of the reflector 10 located on the light-emitting side is provided with multiple sets of electrical connection parts 110. Each set of electrical connection parts 110 includes a positive electrode pad 111 and a negative electrode pad 112. The positive electrode pad 111 is electrically connected to the positive electrode connection part 21. The negative electrode pad 112 is electrically connected to the negative electrode connection part 22;

The reflector 10 is provided with via holes 11 penetrating both sides of the reflector 10 , and a connection circuit 120 is provided on one side of the reflector 10 on the backlight side. The positive electrode pad 111 and the negative electrode pad 112 are electrically connected to the connection circuit 120 through the via hole 11 .

Specifically, the light-emitting side usually refers to the side of the light panel 100 that emits light and propagates light, and the backlight side refers to the side of the light panel 100 that is opposite to the light-emitting side. In some embodiments of the present application, the side of the reflector 10 on which the light-emitting device 20 is installed is the light-emitting side of the lamp panel 100, and the side of the reflector 10 opposite to the light-emitting device 20 is the backlight side of the lamp panel 100. Taking FIG. 1 as an example, the light-emitting side refers to the upper side of the reflector 10 , and the backlight side refers to the lower side of the reflector 10 .

When the positive connection part 21 and the negative connection part 22 of the light-emitting device 20 are connected to the power supply, the light-emitting side of the light-emitting device 20 can emit white light or colored light (such as red light, green light or blue light, etc.). For example, the light-emitting device 20 can be an inorganic light-emitting diode, such as a Mini LED or a Micro LED, or the light-emitting device 20 can also be an inorganic light-emitting diode, a quantum dot light-emitting device, etc.

The reflector 10 can reflect the light emitted by the light-emitting device 20 toward the backlight side to improve the light utilization efficiency of the light-emitting device 20 . Among them, the reflector 10 is provided with multiple sets of electrical connection portions 110 on the light-emitting side. Each set of electrical connection portions 110 includes a positive electrode pad 111 and a negative electrode pad 112. The positive electrode pad 111 is electrically connected to the positive electrode connection portion 21, and the negative electrode The pad 112 is electrically connected to the negative electrode connection part 22 .

In some embodiments of the present application, the positive electrode pad 111 and the negative electrode pad 112 that are close to each other are the same set of electrical connection parts 110. The light-emitting device 20 corresponds to the electrical connection part 110 one-to-one. The positive electrode connection part 21 of the same light-emitting device 20 and the negative electrode connection part 22 are electrically connected to the same electrical connection part 110 , that is to say, in the same set of electrical connection parts 110 , the positive electrode pad 111 and the negative electrode pad 112 are respectively connected to the positive electrode connection part of the same light-emitting device 20 21 is electrically connected to the negative electrode connection part 22, so that the light emitting device 20 is connected to the electrical connection part 110 correspondingly.

It can be understood that the positive electrode pad 111 and the negative electrode pad 112 separated by a certain distance (for example, 10 cm) can also be used as the same group of electrical connection portions 110, and the light-emitting device 20 can be connected thereto through electrical connection lines; or the light-emitting device can also be connected. The positive electrode connecting part 21 of 20 is electrically connected to the positive electrode pad 111 of one set of electrical connecting parts 110, and the negative electrode connecting part 22 is electrically connected to the negative electrode pad 112 of another set of electrical connecting parts 110.

In some embodiments of the present application, referring to FIG. 1 , the reflector 10 can be a reflective sheet. Since the reflective sheet has the characteristics of light reflectivity and flexibility, while reflecting the light emitted from the light-emitting device 20 to the backlight side, the reflective sheet 12 The main body of the light panel 100 is also flexible. Therefore, the light panel 100 can also be used with a flexible screen to achieve curved display.

In other embodiments of the present application, refer to FIG. 2 , which shows another structural schematic diagram of the light panel 100 in the embodiment of the present application, in which the reflector 10 includes a flexible substrate 13 and a reflective sheet that are bonded to each other. 12. For example, the flexible substrate 13 can be PET or PI. Since the reflective sheet 12 and the flexible substrate 13 are both flexible, the light panel 100 with the reflective sheet 12 and the flexible substrate 13 as the main body is also flexible, so it can also be used with a flexible screen. The combination realizes curved display; at the same time, because the reflective sheet 12 is bonded to the flexible substrate 13, the strength of the light panel 100 with the reflective sheet 12 and the flexible substrate 13 as the main body is improved, which can enhance the overall toughness and reliability of the light panel 100.

It can be understood that the reflector 10 can also refer to other substrates with reflective functions. For example, white ink is applied on the surface of the flexible substrate 13 to form a reflective layer, thereby preparing the reflector 10 with reflective functions and flexibility.

In the embodiment of the present application, the electrical connection part 110 and the connection circuit 120 are respectively provided on both sides of the reflector 10, and the electrical connection part 110 and the connection circuit 120 are electrically connected through the via hole 11. The light-emitting device 20 can be directly installed on the positive electrode pad. 111 and the negative electrode pad 112, because the positive electrode pad 111 and the negative electrode pad 112 are located on the surface of the reflector 10, the silver glue is not covered by the reflective sheet 12 or ink when the light emitting device 20 is solidified, so the solidification of the silver glue is avoided. This may cause the reflective sheet 12 or the ink to break; at the same time, since the connection circuit 120 is arranged on the backlight side of the reflector 10, only the positive electrode pad 111 and the negative electrode pad 112 for solid crystal are exposed on the light exit side of the reflector 10. It can also avoid the phenomenon that the connecting circuit 120 blocks the surface of the reflector 10 and causes the reflectivity to decrease.

In some embodiments of the present application, for example, for the embodiment in which the reflector 10 is a reflective sheet 12, see As shown in Figure 1, the electrical connection part 110 is provided on the side of the reflective sheet 12 on the light-emitting side, and the connection circuit 120 is provided on the side of the reflective sheet 12 on the backlight side. That is to say, the positive electrode pad 111 and the negative electrode are directly prepared on both sides of the reflective sheet 12. The pad 112 and the corresponding connection circuit 120, when the light-emitting device 20 emits light, the light directed to the backlight side is reflected back to the light-emitting side by the reflective sheet 12, thus improving the light utilization rate of the light-emitting device 20; at the same time, due to the electrical connection part 110 and the connecting circuit 120 are two sides of the reflective sheet 12 respectively. Therefore, the connecting circuit 120 will not block the light-emitting side surface of the reflective sheet 12, thereby avoiding the impact on the light reflectivity of the reflective sheet 12.

In other embodiments of the present application, for example, for an embodiment in which the reflector 10 includes a flexible substrate 13 and a reflective sheet 12 bonded to each other, see FIG. 2 , the electrical connection portion 110 is provided on the side of the reflective sheet 12 facing away from the flexible substrate 13 . , the connection circuit 120 is provided on the side of the flexible substrate 13 away from the reflective sheet 12, the via hole 11 penetrates the flexible substrate 13 and the reflective sheet 12, and the electrical connection part 110 is connected to the connection circuit 120 through the via hole 11 that penetrates the flexible substrate 13 and the reflective sheet 12. The reflective sheet 12 is located on the light-emitting side and can reflect the light directed to the backlight side. At the same time, since the electrical connection part 110 and the connecting circuit 120 are respectively provided on the side opposite to the reflective sheet 12 and the flexible substrate 13, the connecting circuit 120 also does not interfere with the light emitting side. The reflectivity of the reflective sheet 12 has an impact.

It can be understood that the connection circuit 120 and the electrical connection part 110 can also have other arrangements. For example, refer to FIG. 3 , which shows another structural schematic diagram of the light panel 100 in the embodiment of the present application. The connection circuit 120 is located on the flexible substrate. Between 13 and the reflective sheet 12, the flexible substrate 13 and the reflective sheet 12 jointly protect the connecting circuit 120 and avoid the risk of the connecting circuit 120 being exposed.

As an exemplary embodiment, refer to FIG. 4 and FIG. 5 . FIG. 4 shows a schematic structural diagram of the light-emitting side of the reflector 10 in the embodiment of the present application. FIG. 5 shows the backlight side of the reflector 10 in the embodiment of the present application. Schematic structural diagram, in which the connection circuit 120 includes multiple sections of circuit traces 121. One end of the circuit traces 121 is electrically connected to the positive electrode pads 111 of one set of electrical connection parts 110, and the other end is connected to the negative electrode pad 112 of another set of electrical connection parts 110. Electrical connection, that is, the connection circuit 120 connects the two sets of electrical connection parts 110 in series through the circuit wiring 121, thereby forming a series circuit structure.

In some embodiments of the present application, the connection circuit 120 may connect all electrical connection parts 110 in series through multiple sections of circuit traces 121 . It can be understood that the connection circuit 120 can also connect multiple sets of electrical connection portions 110 in parallel or in a combination of series and parallel through multiple sections of circuit wiring 121 .

In some embodiments of the present application, continuing to refer to Figures 1, 4 and 5, the via 11 includes It includes a first via hole 101 and a second via hole 102. The positive electrode pad 111 covers the end of the first via hole 101 on the light exit side. The negative electrode pad 112 covers the end of the second via hole 102 on the light exit side. The positive electrode pad 111 passes through The first via hole 101 is electrically connected to the circuit trace 121, and the negative electrode pad 112 is electrically connected to the circuit trace 121 through the second via hole 102. Since the positive electrode pad 111 covers the first via hole 101 and the negative electrode pad 112 covers the second The via hole 102 can prevent the first via hole 101 and the second via hole 102 from being exposed on the surface of the light exit side of the reflector 10, causing the light from the light emitting device 20 to enter the first via hole 101 and the second via hole 102. , which is beneficial to improving the light reflectivity of the reflector 10 .

In some embodiments of the present application, for example, for an embodiment in which the via hole 11 includes a first via hole 101 and a second via hole 102, referring to FIG. 2, one end of the circuit trace 121 covers the first via hole 101 on the backlight side. One end and the other end cover the end of the second via hole 102 on the backlight side. The first via hole 101 is provided with a first conductor 131 that connects the wiring of the circuit 120 and the anode pad 111. The second via hole 102 is provided with a connection The circuit trace 120 and the second conductor 132 of the negative electrode pad 112, that is to say, both ends of the first via hole 101 are covered by the positive electrode pad 111 and the circuit trace 121 respectively, and the two ends of the second via hole 102 are respectively Covered by the negative electrode pad 112 and the circuit trace 121, the first via hole 101 and the second via hole 102 are sealed to prevent impurities from entering the first via hole 101 and the second via hole 102 and affecting the first conductor 131 and The electrical conductivity of the second electrical conductor 132 .

In some embodiments of the present application, the materials of the first conductor 131 and the second conductor 132 include copper or silver. Preferably, the material of the first conductor 131 and the second conductor 132 is conductive silver paste.

In some embodiments of the present application, the material of the positive electrode pad 111 and the negative electrode pad 112 is conductive silver paste.

In some embodiments of the present application, the positive electrode pad 111 , the negative electrode pad 112 , the first conductor 131 , the second conductor 132 and the circuit trace 121 are all conductive silver paste, and the conductive silver paste is applied to the reflector 10 While the electrical connection portion 110 and the circuit trace 121 are prepared on both sides, the conductive silver paste will be filled into the via hole 11 to form the first conductor 131 and the second conductor 132 , which is beneficial to reducing the electrical connection portion 110 and 121 on the reflector 10 . It is difficult to prepare the circuit wiring 121, the first conductor 131 and the second conductor 132; at the same time, the positive electrode pad 111 and the negative electrode pad 112 formed by using conductive silver paste have certain light reflection properties, which can further improve the luminescence. The light utilization efficiency of the device 20.

It can be understood that the positive electrode pad 111, the negative electrode pad 112, the first conductor 131, and the second conductor 132 And the circuit traces 121 can also be formed of other conductive materials, such as copper foil, silver foil, etc.

In some embodiments of the present application, referring to FIG. 1 , the orthographic projection of the light-emitting device 20 on the reflector 10 does not overlap with the via hole 11 . When the light-emitting device 20 is fixed, the positive electrode connecting portion 21 of the light-emitting device 20 is connected to the negative electrode. The portion 22 can avoid being connected around the via hole 11 , thereby ensuring the reliability of the light-emitting device 20 being fixed on the reflector 10 . At the same time, for some embodiments of the present application, for example, for embodiments in which the positive electrode pad 111 and the negative electrode pad 112 are cured conductive silver paste, the portion of the conductive silver paste exposed outside the light-emitting device 20 and overlapping the via hole 11 is also the same. It has light reflectivity, so the portions of the positive electrode pad 111 and the negative electrode pad 112 located outside the light-emitting device 20 will not affect the light reflectivity of the reflector 10 .

In some embodiments of the present application, refer to FIG. 1 , in which the cross-sectional area of the via hole 11 gradually increases in the direction from the backlight side to the light emitting side. When preparing the electrical connection portion 110 and the connection circuit 120 on the reflector 10, the connection circuit 120 can first be prepared on the side of the reflector 10 located on the backlight side. Since the cross-sectional area of the via hole 11 is smaller along the direction from the backlight side to the light emitting side. Gradually increasing, the conductive silver paste can more easily enter the via hole 11 to form the conductor 130 when preparing the connection circuit 120 , thereby reducing the difficulty of preparing the conductor 130 in the via hole 11 .

In other embodiments of the present application, continue to refer to FIG. 6 . FIG. 6 shows another structural schematic diagram of the light panel 100 in the embodiment of the present application. In the direction from the backlight side to the light emitting side, the through hole 11 The cross-sectional area gradually decreases. When preparing the electrical connection portion 110 and the connection circuit 120 on the reflector 10, you can first prepare the electrical connection portion 110 on the side of the reflector 10 located on the light exit side. Similarly, since the via hole 11 is formed along the direction from the backlight side to the light exit side, The cross-sectional area gradually decreases, and when preparing the electrical connection part 110, the conductive silver paste can more easily enter the via hole 11 to form the conductor 130, thereby reducing the difficulty of preparing the conductor 130 in the via hole 11.

In some embodiments of the present application, refer to FIG. 7 , which shows another structural schematic diagram of the light panel 100 in the embodiment of the present application, in which a first groove 14 is provided on a side of the reflector 10 located on the light-emitting side. , the electrical connection part 110 is disposed in the first groove 14, and the surface of the electrical connection part 110 is substantially flush with the surface of the reflector 10. For some embodiments of the present application, for example, the positive electrode pad 111 and the negative electrode pad 112 are The embodiment of the cured conductive silver paste can make the surface of the reflector 10 on the light exit side flat, and the electrical connection portion 110 located in the first groove 14 can also reflect light, thereby avoiding the uneven surface of the reflector 10 The resulting phenomenon of irregular light reflection is beneficial to improving the uniformity of light output from the lamp panel 100 sex.

In some embodiments of the present application, continue to refer to FIG. 8 , which shows another structural schematic diagram of the light panel 100 in the embodiment of the present application, in which a second groove is provided on one side of the reflector 10 on the backlight side. 15. The connecting circuit 120 is disposed in the second groove 15. For some embodiments of the present application, for example, for embodiments in which the connecting circuit 120 is cured conductive silver paste, when preparing the connecting circuit 120, liquid conductive silver is used. The paste is directly filled in the second groove 15 and baked and solidified to form the connection circuit 120. Since the conductive silver paste is restricted by the second groove 15, the liquid conductive silver paste before curing can be prevented from being affected by machine vibration and other factors. It flows freely due to the influence, eventually leading to short circuit or open circuit in the circuit structure after curing.

In some embodiments of the present application, continuing to refer to FIG. 1 , the light panel 100 further includes a protective layer 30 , the protective layer 30 covers the side of the reflector 10 on the backlight side, and the connection circuit 120 is located between the protective layer 30 and the reflector 10 . The protective layer 30 has insulating properties, thereby avoiding the risk of circuit exposure. For example, the protective layer 30 may be glass fiber, basalt fiber, polyvinyl alcohol or polyethylene naphthalene glycol ester with flexible and insulating properties.

It is worth noting that the above content about the lamp panel 100 is intended to clearly explain the implementation process of the present application. Based on the present application, those skilled in the art can also make equivalent modified designs, such as the positive electrode pad 111 and the negative electrode welding pad. The disk 112 is formed from copper foil, and the connecting circuit 120 is formed from a conductive silver paste that is baked and solidified.

Furthermore, in order to better implement the light panel 100 in the present application, based on the light panel 100, the present application also provides a method for preparing the light panel 100. Refer to Figure 9. Figure 9 shows a method for preparing the light panel 100 in the embodiment of the present application. A schematic flow chart of a method for manufacturing the lamp panel 100, wherein the method for manufacturing the lamp panel 100 includes:

Step S901, provide a reflector 10;

Specifically, the reflector 10 can reflect the light emitted by the light-emitting device 20 toward the backlight side to improve the light utilization efficiency of the light-emitting device 20 . In some embodiments of the present application, the reflector 10 may be a reflective sheet 12 . In other embodiments of the present application, the reflector 10 includes a flexible substrate 13 and a reflective sheet 12 bonded to each other. It can be understood that the reflector 10 can also refer to other substrates with reflective functions. For example, white ink is applied on the surface of the flexible substrate 13 to form a reflective layer, thereby preparing the reflector 10 with reflective functions and flexibility.

Step S902, open a via hole 11 on the reflector 10, and the via hole 11 penetrates both sides of the reflector 10;

In some embodiments of the present application, the cross-sectional area of the via hole 11 gradually increases in the direction from the backlight side to the light emitting side. In other embodiments of the present application, the cross-sectional area of the via hole 11 gradually decreases in the direction from the backlight side to the light emitting side. In some embodiments, the via hole 11 may be a circular hole, a tapered hole, a square hole, etc.

Specifically, the via hole 11 can be formed by physical or chemical means. For example, the via hole 11 is formed on the reflector 10 by mechanical drilling equipment; for example, the via hole 11 is formed on the reflector 10 by laser drilling. ; For another example, a chemical agent is used to corrode the reflector 10 to form the via hole 11 .

Step S903, forming a connection circuit 120 on one side of the reflector 10, and forming multiple sets of electrical connection portions 110 on the other side. The electrical connection portion 110 includes a positive electrode pad 111 and a negative electrode pad 112. The connection circuit 120 connects to the positive electrode pad through the via hole 11. 111 is electrically connected to the negative electrode pad 112;

In some embodiments of the present application, the connection circuit 120 and the electrical connection portion 110 can be formed by baking the conductive silver paste and solidifying it. For example, first apply the conductive silver paste on the side of the reflector 10 located on the backlight side, and make it conductive. The silver paste fills the via hole 11, and after baking, a connection circuit 120 is formed on the side of the reflector 10 on the backlight side. Then, conductive silver paste is applied on the side of the reflector 10 on the light emitting side, and the conductive silver paste is solidified in the via hole. 11, so that the connection circuit 120 is connected to the electrical connection portion 110 through the via hole 11.

It can be understood that the connection circuit 120 and the electrical connection portion 110 can also be formed by bonding metal foil (such as copper foil, silver foil, etc.) on both sides of the reflector 10 .

In step S904, the light-emitting device 20 is installed on the side of the reflector 10 provided with the electrical connection portion 110. The positive electrode connection portion 21 of the light-emitting device 20 is connected to the positive electrode pad 111, and the negative electrode connection portion 22 is connected to the negative electrode pad 112.

In some embodiments of the present application, the light-emitting device 20 is installed on the side of the reflector 10 on the light-emitting side through soldering, so that the positive connection portion 21 of the light-emitting device 20 is connected to the positive electrode pad 111 and the negative connection portion 22 is soldered to the negative electrode. Disk 112 is connected. In some other embodiments of the present application, the light-emitting device 20 is bonded and installed on the side of the reflector 10 located on the light-emitting side through glue with conductive properties (such as silver glue). Those skilled in the art can understand that the light-emitting device 20 can also be installed on the reflector 10 through other welding or glue bonding methods, which will not be described again here.

In the embodiment of the present application, the electrical connection part 110 and the connection circuit 120 are respectively provided on both sides of the reflector 10, and the electrical connection part 110 and the connection circuit 120 are electrically connected through the via hole 11. The light-emitting device 20 can be directly It is directly installed on the positive electrode pad 111 and the negative electrode pad 112. Since the positive electrode pad 111 and the negative electrode pad 112 are located on the surface of the reflector 10, the silver glue is not covered by the reflective sheet 12 or ink when the light emitting device 20 is solidified. This avoids the phenomenon of cracking of the reflective sheet 12 or the ink caused by the solidification of the silver glue; at the same time, since the connection circuit 120 is arranged on the backlight side of the reflector 10, only the positive electrode pad 111 and the positive electrode pad 111 for solid crystal are exposed on the light exit side of the reflector 10. The negative electrode pad 112 can also prevent the connection circuit 120 from blocking the surface of the reflector 10 and thereby reducing its reflectivity.

In some embodiments of the present application, in order to better protect the protective layer 30 located on the backlight side of the reflector 10, the lamp panel 100 preparation method further includes covering the protective layer 30 on the side of the reflector 10 located on the backlight side. For example, the protective layer 30 can be fixed on the side of the reflector 10 on the backlight side by applying adhesive glue on the side of the protective layer 30 facing the reflector 10 , and then bonding the protective layer 30 to the reflector 10 for baking. superior. In some embodiments of the present application, the protective layer 30 can be made of flexible and insulating glass fiber, basalt fiber, polyvinyl alcohol or polyethylene naphthalene glycol, etc. After covering the protective layer 30 , the circuit 120 is connected. It is located between the protective layer 30 and the reflector 10. Since the protective layer 30 has insulating properties, the risk of leakage of the connecting circuit 120 can be avoided.

It can be understood that the sequence of the above steps can be adjusted according to actual needs. For example, after the connection circuit 120 is formed on the backlight side of the reflector 10, the protective layer 30 is then covered on the side of the reflector 10 on the backlight side to protect the connection circuit 120 in time.

Furthermore, in order to better implement the light panel 100 of the present application, based on the light panel 100, the present application also provides a backlight module. The backlight module includes the light panel 100 of any of the above embodiments. Since the backlight module in the embodiment of the present application includes the lamp panel 100 in the above embodiment, it has all the beneficial effects of the lamp panel 100 in the above embodiment, which will not be described again here.

In the above embodiments, each embodiment is described with its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the above detailed descriptions of other embodiments and will not be described again here.

The basic concepts have been described above. It is obvious to those skilled in the art that the above detailed disclosure is only an example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. At the same time, it should be noted that the usage scenarios of the light panels in the embodiments of the present application include but are not limited to fields such as backlight modules for liquid crystal display devices, Mimi LED direct display, Micro LED direct display, etc.

The above is a detailed introduction to a lamp panel, its preparation method, and a backlight module provided by the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only for reference. To help understand the method and core ideas of this application; at the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of this application. In summary, the content of this specification It should not be construed as a limitation on this application.

Claims

A light panel, wherein the light panel has a light output side and a backlight side, and the light panel includes:

A plurality of light-emitting devices, each of the light-emitting devices has a positive electrode connection part and a negative electrode connection part;

Reflector, the surface of the reflector located on the light-emitting side is provided with multiple sets of electrical connection parts, each set of the electrical connection parts includes a positive electrode pad and a negative electrode pad, the positive electrode pad is electrically connected to the positive electrode connection part, The negative electrode pad is electrically connected to the negative electrode connection part;

The reflector is provided with via holes penetrating both sides of the reflector. The side of the reflector located on the backlight side is provided with a connection circuit. The positive electrode pad and the negative electrode pad are electrically connected to the connection circuit through the via hole. .
The light panel of claim 1, wherein the reflector includes a reflective sheet;

The electrical connection portion is provided on a side of the reflective sheet located on the light-emitting side, and the connection circuit is provided on a side of the reflective sheet located on the backlight side.
The light panel according to claim 1, wherein the reflector includes a flexible substrate and a reflective sheet bonded to each other;

The electrical connection part is provided on a side of the reflective sheet facing away from the flexible substrate, the connection circuit is provided on a side of the flexible substrate facing away from the reflective sheet, and the via hole penetrates the flexible substrate and the reflective sheet. piece.
The light panel of claim 1, wherein the reflector includes a flexible substrate, and a side of the flexible substrate located on the light-emitting side has a reflective layer.
The light panel of claim 1, wherein the connection circuit includes multiple sections of circuit traces;

One end of the circuit trace is electrically connected to the positive electrode pad of one set of electrical connection parts, and the other end is electrically connected to the negative electrode pad of another set of electrical connection parts.
The light panel of claim 5, wherein the via hole includes a first via hole and a second via hole;

The positive electrode pad covers one end of the first via hole on the light exit side, the negative electrode pad covers one end of the second via hole on the light exit side, and the anode pad connects to the first via hole through the first via hole. The circuit traces are electrically connected, and the negative electrode pad is electrically connected to the circuit traces through the second via hole.
The light panel of claim 6, wherein one end of the circuit trace covers the end of the first via hole on the backlight side, and the other end covers the end of the second via hole on the backlight side;

The first via hole is provided with a first conductor connecting the circuit trace and the positive electrode pad, and the second via hole is provided with a third conductor connecting the circuit trace and the negative electrode pad. Two conductors.
The light panel of claim 7, wherein the first conductor and the second conductor are made of copper or silver.
The lamp panel of claim 7, wherein the first conductor and the second conductor are made of conductive silver paste.
The lamp panel according to claim 1, wherein the material of the positive electrode pad and the negative electrode pad is conductive silver paste.
The light panel of claim 1, wherein an orthographic projection of the light-emitting device on the reflector does not overlap with the via hole.
The light panel of claim 1, wherein the cross-sectional area of the via hole gradually decreases in a direction from the backlight side to the light exit side.
The light panel according to claim 1, wherein the cross-sectional area of the via hole gradually increases in a direction from the backlight side to the light emitting side.
The lamp panel according to claim 1, wherein a first groove is provided on a surface of the reflector on the light emitting side, and the electrical connection part is disposed in the first groove.
The lamp panel according to claim 1, wherein a second groove is provided on a side of the reflector on the backlight side, and the connection circuit is disposed in the second groove.
The lamp panel according to claim 1, wherein the light-emitting device corresponds to the electrical connection part one-to-one, and the positive connection part and the negative connection part of the same light-emitting device are in the same electrical connection part. Electrical connection.
The light panel according to any one of claims 1 to 16, further comprising a protective layer covering the side of the reflector located on the backlight side.
A method for preparing a lamp panel, which includes;

Provide a reflector;

A via hole is provided on the reflector, and the via hole penetrates both sides of the reflector;

A connection circuit is formed on one side of the reflector, and multiple sets of electrical connection parts are formed on the other side. The electrical connection parts include a positive electrode pad and a negative electrode pad. The connection circuit connects to the positive electrode pad and the negative electrode pad through the via hole. The negative electrode pad is electrically connected;

Mount the light-emitting device on the side of the reflector provided with the electrical connection part, and the positive electrode of the light-emitting device The connecting part is connected to the positive electrode pad, and the negative electrode connecting part is connected to the negative electrode pad.
The lamp panel preparation method according to claim 18, wherein the method further includes:

The side of the reflector located on the backlight side is covered with a protective layer.
A backlight module, comprising the light panel according to any one of claims 1 to 17.