WO2023226611A1 - Panneau de lampe et son procédé de préparation, et module de rétroéclairage - Google Patents

Panneau de lampe et son procédé de préparation, et module de rétroéclairage Download PDF

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Publication number
WO2023226611A1
WO2023226611A1 PCT/CN2023/088114 CN2023088114W WO2023226611A1 WO 2023226611 A1 WO2023226611 A1 WO 2023226611A1 CN 2023088114 W CN2023088114 W CN 2023088114W WO 2023226611 A1 WO2023226611 A1 WO 2023226611A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
reflector
electrode pad
via hole
negative electrode
Prior art date
Application number
PCT/CN2023/088114
Other languages
English (en)
Chinese (zh)
Inventor
李沛
姚黎晓
王代青
李健林
Original Assignee
深圳Tcl新技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳Tcl新技术有限公司 filed Critical 深圳Tcl新技术有限公司
Publication of WO2023226611A1 publication Critical patent/WO2023226611A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/002—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips making direct electrical contact, e.g. by piercing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/05—Optical design plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/10—Construction
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present application relates to the field of display technology, and specifically to a lamp panel, a preparation method thereof, and a backlight module.
  • the core component of the backlight module is the light board, and the main structure of the light board includes a carrier substrate, conductive traces, white ink, and LEDs.
  • silver glue printing, pre-baking, ink printing/reflective lamination, crystal solidification and final baking need to be carried out in sequence.
  • the silver glue is covered with a reflective sheet or ink during the final baking and curing, , will cause the silver glue curing solvent to be less volatile, causing the reflective sheet or ink to break.
  • This application provides a lamp panel, a preparation method thereof, and a backlight module, aiming to solve the current technical problem of rupture of the reflective sheet or ink caused by the solidification of silver glue on the lamp panel.
  • this application provides a light panel.
  • the light panel has a light emitting side and a backlight side.
  • the light panel includes:
  • each light-emitting device has a positive electrode connection part and a negative electrode connection part;
  • the reflector has multiple sets of electrical connections on one side of the reflector located on the light-emitting side.
  • Each set of electrical connections includes a positive electrode pad and a negative electrode pad.
  • the positive electrode pad is electrically connected to the positive electrode connection part, and the negative electrode pad is electrically connected to the negative electrode connection part. connect;
  • the reflector is provided with via holes penetrating both sides of the reflector.
  • the side of the reflector located on the backlight side is provided with a connection circuit.
  • the positive electrode pad and the negative electrode pad are electrically connected to the connection circuit through the via holes.
  • this application provides a method for preparing a lamp panel, including;
  • a via hole is opened on the reflector, and the via hole penetrates both sides of the reflector;
  • connection circuit is formed on one side of the reflector, and multiple sets of electrical connection parts are formed on the other side.
  • the electrical connection part includes a positive electrode pad and a negative electrode pad, and the connection circuit is electrically connected to the positive electrode pad and the negative electrode pad through via holes;
  • the light-emitting device is installed on the side of the reflector provided with the electrical connection part.
  • the positive connection part of the light-emitting device is connected to the positive electrode pad, and the negative connection part is connected to the negative electrode pad.
  • the present application provides a backlight module, including the light panel as described in the first aspect.
  • the electrical connection part and the connection circuit are respectively provided on both sides of the reflector, and the electrical connection part and the connection circuit are electrically connected through the via hole.
  • the light-emitting device can be directly installed on the positive electrode pad and the negative electrode pad. Since the positive electrode pad and the negative electrode pad are located on the surface of the reflector.
  • the silver glue is not covered by the reflective sheet or ink, so the phenomenon of rupture of the reflective sheet or ink due to the solidification of the silver glue is avoided; at the same time, since the circuit will be connected It is arranged on the backlight side of the reflector, and only the positive electrode pad and the negative electrode pad used for solid crystal are exposed on the light exit side of the reflector, which can avoid the influence of the connecting circuit on the reflectivity of the reflector.
  • Figure 1 is a schematic structural diagram of a light panel provided in an embodiment of the present application.
  • Figure 2 is another structural schematic diagram of the light panel provided in the embodiment of the present application.
  • FIG. 3 is another structural schematic diagram of the light panel provided in the embodiment of the present application.
  • Figure 4 is a schematic structural diagram of the light exit side of the reflector provided in the embodiment of the present application.
  • Figure 5 is a schematic structural diagram of the backlight side of the reflector provided in the embodiment of the present application.
  • Figure 6 is another structural schematic diagram of the light panel provided in the embodiment of the present application.
  • Figure 7 is another structural schematic diagram of the light panel provided in the embodiment of the present application.
  • Figure 8 is another structural schematic diagram of the light panel provided in the embodiment of the present application.
  • FIG. 9 is a schematic flow chart of the lamp panel preparation method provided in the embodiment of the present application.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features.
  • features defined as “first” and “second” may explicitly or implicitly include one or more of the described features.
  • “plurality” means two or more than two, unless otherwise explicitly and specifically limited.
  • the embodiments of the present application provide a lamp panel, a preparation method thereof, and a backlight module, which are described in detail below.
  • Figure 1 shows a schematic structural diagram of the light panel 100 in the embodiment of the present application, wherein the light panel 100 includes:
  • each light-emitting device 20 has a positive electrode connection part 21 and a negative electrode connection part 22;
  • Each set of electrical connection parts 110 includes a positive electrode pad 111 and a negative electrode pad 112.
  • the positive electrode pad 111 is electrically connected to the positive electrode connection part 21.
  • the negative electrode pad 112 is electrically connected to the negative electrode connection part 22;
  • the reflector 10 is provided with via holes 11 penetrating both sides of the reflector 10 , and a connection circuit 120 is provided on one side of the reflector 10 on the backlight side.
  • the positive electrode pad 111 and the negative electrode pad 112 are electrically connected to the connection circuit 120 through the via hole 11 .
  • the light-emitting side usually refers to the side of the light panel 100 that emits light and propagates light
  • the backlight side refers to the side of the light panel 100 that is opposite to the light-emitting side.
  • the side of the reflector 10 on which the light-emitting device 20 is installed is the light-emitting side of the lamp panel 100
  • the side of the reflector 10 opposite to the light-emitting device 20 is the backlight side of the lamp panel 100.
  • the light-emitting side refers to the upper side of the reflector 10
  • the backlight side refers to the lower side of the reflector 10 .
  • the light-emitting side of the light-emitting device 20 can emit white light or colored light (such as red light, green light or blue light, etc.).
  • the light-emitting device 20 can be an inorganic light-emitting diode, such as a Mini LED or a Micro LED, or the light-emitting device 20 can also be an inorganic light-emitting diode, a quantum dot light-emitting device, etc.
  • the reflector 10 can reflect the light emitted by the light-emitting device 20 toward the backlight side to improve the light utilization efficiency of the light-emitting device 20 .
  • the reflector 10 is provided with multiple sets of electrical connection portions 110 on the light-emitting side.
  • Each set of electrical connection portions 110 includes a positive electrode pad 111 and a negative electrode pad 112.
  • the positive electrode pad 111 is electrically connected to the positive electrode connection portion 21, and the negative electrode
  • the pad 112 is electrically connected to the negative electrode connection part 22 .
  • the positive electrode pad 111 and the negative electrode pad 112 that are close to each other are the same set of electrical connection parts 110.
  • the light-emitting device 20 corresponds to the electrical connection part 110 one-to-one.
  • the positive electrode connection part 21 of the same light-emitting device 20 and the negative electrode connection part 22 are electrically connected to the same electrical connection part 110 , that is to say, in the same set of electrical connection parts 110 , the positive electrode pad 111 and the negative electrode pad 112 are respectively connected to the positive electrode connection part of the same light-emitting device 20 21 is electrically connected to the negative electrode connection part 22, so that the light emitting device 20 is connected to the electrical connection part 110 correspondingly.
  • the positive electrode pad 111 and the negative electrode pad 112 separated by a certain distance can also be used as the same group of electrical connection portions 110, and the light-emitting device 20 can be connected thereto through electrical connection lines; or the light-emitting device can also be connected.
  • the positive electrode connecting part 21 of 20 is electrically connected to the positive electrode pad 111 of one set of electrical connecting parts 110, and the negative electrode connecting part 22 is electrically connected to the negative electrode pad 112 of another set of electrical connecting parts 110.
  • the reflector 10 can be a reflective sheet. Since the reflective sheet has the characteristics of light reflectivity and flexibility, while reflecting the light emitted from the light-emitting device 20 to the backlight side, the reflective sheet 12 The main body of the light panel 100 is also flexible. Therefore, the light panel 100 can also be used with a flexible screen to achieve curved display.
  • FIG. 2 shows another structural schematic diagram of the light panel 100 in the embodiment of the present application, in which the reflector 10 includes a flexible substrate 13 and a reflective sheet that are bonded to each other.
  • the flexible substrate 13 can be PET or PI. Since the reflective sheet 12 and the flexible substrate 13 are both flexible, the light panel 100 with the reflective sheet 12 and the flexible substrate 13 as the main body is also flexible, so it can also be used with a flexible screen. The combination realizes curved display; at the same time, because the reflective sheet 12 is bonded to the flexible substrate 13, the strength of the light panel 100 with the reflective sheet 12 and the flexible substrate 13 as the main body is improved, which can enhance the overall toughness and reliability of the light panel 100.
  • the reflector 10 can also refer to other substrates with reflective functions.
  • white ink is applied on the surface of the flexible substrate 13 to form a reflective layer, thereby preparing the reflector 10 with reflective functions and flexibility.
  • the electrical connection part 110 and the connection circuit 120 are respectively provided on both sides of the reflector 10, and the electrical connection part 110 and the connection circuit 120 are electrically connected through the via hole 11.
  • the light-emitting device 20 can be directly installed on the positive electrode pad. 111 and the negative electrode pad 112, because the positive electrode pad 111 and the negative electrode pad 112 are located on the surface of the reflector 10, the silver glue is not covered by the reflective sheet 12 or ink when the light emitting device 20 is solidified, so the solidification of the silver glue is avoided.
  • connection circuit 120 is arranged on the backlight side of the reflector 10, only the positive electrode pad 111 and the negative electrode pad 112 for solid crystal are exposed on the light exit side of the reflector 10. It can also avoid the phenomenon that the connecting circuit 120 blocks the surface of the reflector 10 and causes the reflectivity to decrease.
  • the electrical connection part 110 is provided on the side of the reflective sheet 12 on the light-emitting side
  • the connection circuit 120 is provided on the side of the reflective sheet 12 on the backlight side. That is to say, the positive electrode pad 111 and the negative electrode are directly prepared on both sides of the reflective sheet 12.
  • the pad 112 and the corresponding connection circuit 120 when the light-emitting device 20 emits light, the light directed to the backlight side is reflected back to the light-emitting side by the reflective sheet 12, thus improving the light utilization rate of the light-emitting device 20; at the same time, due to the electrical connection part 110 and the connecting circuit 120 are two sides of the reflective sheet 12 respectively. Therefore, the connecting circuit 120 will not block the light-emitting side surface of the reflective sheet 12, thereby avoiding the impact on the light reflectivity of the reflective sheet 12.
  • the electrical connection portion 110 is provided on the side of the reflective sheet 12 facing away from the flexible substrate 13 .
  • the connection circuit 120 is provided on the side of the flexible substrate 13 away from the reflective sheet 12, the via hole 11 penetrates the flexible substrate 13 and the reflective sheet 12, and the electrical connection part 110 is connected to the connection circuit 120 through the via hole 11 that penetrates the flexible substrate 13 and the reflective sheet 12.
  • the reflective sheet 12 is located on the light-emitting side and can reflect the light directed to the backlight side.
  • the electrical connection part 110 and the connecting circuit 120 are respectively provided on the side opposite to the reflective sheet 12 and the flexible substrate 13, the connecting circuit 120 also does not interfere with the light emitting side.
  • the reflectivity of the reflective sheet 12 has an impact.
  • connection circuit 120 and the electrical connection part 110 can also have other arrangements.
  • FIG. 3 shows another structural schematic diagram of the light panel 100 in the embodiment of the present application.
  • the connection circuit 120 is located on the flexible substrate. Between 13 and the reflective sheet 12, the flexible substrate 13 and the reflective sheet 12 jointly protect the connecting circuit 120 and avoid the risk of the connecting circuit 120 being exposed.
  • FIG. 4 shows a schematic structural diagram of the light-emitting side of the reflector 10 in the embodiment of the present application.
  • FIG. 5 shows the backlight side of the reflector 10 in the embodiment of the present application.
  • connection circuit 120 may connect all electrical connection parts 110 in series through multiple sections of circuit traces 121 . It can be understood that the connection circuit 120 can also connect multiple sets of electrical connection portions 110 in parallel or in a combination of series and parallel through multiple sections of circuit wiring 121 .
  • the via 11 includes It includes a first via hole 101 and a second via hole 102.
  • the positive electrode pad 111 covers the end of the first via hole 101 on the light exit side.
  • the negative electrode pad 112 covers the end of the second via hole 102 on the light exit side.
  • the positive electrode pad 111 passes through
  • the first via hole 101 is electrically connected to the circuit trace 121
  • the negative electrode pad 112 is electrically connected to the circuit trace 121 through the second via hole 102.
  • the via hole 102 can prevent the first via hole 101 and the second via hole 102 from being exposed on the surface of the light exit side of the reflector 10, causing the light from the light emitting device 20 to enter the first via hole 101 and the second via hole 102. , which is beneficial to improving the light reflectivity of the reflector 10 .
  • the via hole 11 includes a first via hole 101 and a second via hole 102
  • one end of the circuit trace 121 covers the first via hole 101 on the backlight side.
  • One end and the other end cover the end of the second via hole 102 on the backlight side.
  • the first via hole 101 is provided with a first conductor 131 that connects the wiring of the circuit 120 and the anode pad 111.
  • the second via hole 102 is provided with a connection The circuit trace 120 and the second conductor 132 of the negative electrode pad 112, that is to say, both ends of the first via hole 101 are covered by the positive electrode pad 111 and the circuit trace 121 respectively, and the two ends of the second via hole 102 are respectively Covered by the negative electrode pad 112 and the circuit trace 121, the first via hole 101 and the second via hole 102 are sealed to prevent impurities from entering the first via hole 101 and the second via hole 102 and affecting the first conductor 131 and The electrical conductivity of the second electrical conductor 132 .
  • the materials of the first conductor 131 and the second conductor 132 include copper or silver.
  • the material of the first conductor 131 and the second conductor 132 is conductive silver paste.
  • the material of the positive electrode pad 111 and the negative electrode pad 112 is conductive silver paste.
  • the positive electrode pad 111 , the negative electrode pad 112 , the first conductor 131 , the second conductor 132 and the circuit trace 121 are all conductive silver paste, and the conductive silver paste is applied to the reflector 10 While the electrical connection portion 110 and the circuit trace 121 are prepared on both sides, the conductive silver paste will be filled into the via hole 11 to form the first conductor 131 and the second conductor 132 , which is beneficial to reducing the electrical connection portion 110 and 121 on the reflector 10 .
  • the positive electrode pad 111 and the negative electrode pad 112 formed by using conductive silver paste have certain light reflection properties, which can further improve the luminescence.
  • the light utilization efficiency of the device 20 is difficult to prepare the circuit wiring 121, the first conductor 131 and the second conductor 132; at the same time, the positive electrode pad 111 and the negative electrode pad 112 formed by using conductive silver paste have certain light reflection properties, which can further improve the luminescence. The light utilization efficiency of the device 20.
  • the positive electrode pad 111, the negative electrode pad 112, the first conductor 131, and the second conductor 132 And the circuit traces 121 can also be formed of other conductive materials, such as copper foil, silver foil, etc.
  • the orthographic projection of the light-emitting device 20 on the reflector 10 does not overlap with the via hole 11 .
  • the positive electrode connecting portion 21 of the light-emitting device 20 is connected to the negative electrode.
  • the portion 22 can avoid being connected around the via hole 11 , thereby ensuring the reliability of the light-emitting device 20 being fixed on the reflector 10 .
  • the portion of the conductive silver paste exposed outside the light-emitting device 20 and overlapping the via hole 11 is also the same. It has light reflectivity, so the portions of the positive electrode pad 111 and the negative electrode pad 112 located outside the light-emitting device 20 will not affect the light reflectivity of the reflector 10 .
  • the connection circuit 120 can first be prepared on the side of the reflector 10 located on the backlight side. Since the cross-sectional area of the via hole 11 is smaller along the direction from the backlight side to the light emitting side. Gradually increasing, the conductive silver paste can more easily enter the via hole 11 to form the conductor 130 when preparing the connection circuit 120 , thereby reducing the difficulty of preparing the conductor 130 in the via hole 11 .
  • FIG. 6 shows another structural schematic diagram of the light panel 100 in the embodiment of the present application.
  • the cross-sectional area gradually decreases.
  • the cross-sectional area gradually decreases, and when preparing the electrical connection part 110, the conductive silver paste can more easily enter the via hole 11 to form the conductor 130, thereby reducing the difficulty of preparing the conductor 130 in the via hole 11.
  • FIG. 7 shows another structural schematic diagram of the light panel 100 in the embodiment of the present application, in which a first groove 14 is provided on a side of the reflector 10 located on the light-emitting side. , the electrical connection part 110 is disposed in the first groove 14, and the surface of the electrical connection part 110 is substantially flush with the surface of the reflector 10.
  • the positive electrode pad 111 and the negative electrode pad 112 are The embodiment of the cured conductive silver paste can make the surface of the reflector 10 on the light exit side flat, and the electrical connection portion 110 located in the first groove 14 can also reflect light, thereby avoiding the uneven surface of the reflector 10 The resulting phenomenon of irregular light reflection is beneficial to improving the uniformity of light output from the lamp panel 100 sex.
  • FIG. 8 shows another structural schematic diagram of the light panel 100 in the embodiment of the present application, in which a second groove is provided on one side of the reflector 10 on the backlight side. 15.
  • the connecting circuit 120 is disposed in the second groove 15.
  • the connecting circuit 120 is cured conductive silver paste
  • liquid conductive silver is used.
  • the paste is directly filled in the second groove 15 and baked and solidified to form the connection circuit 120. Since the conductive silver paste is restricted by the second groove 15, the liquid conductive silver paste before curing can be prevented from being affected by machine vibration and other factors. It flows freely due to the influence, eventually leading to short circuit or open circuit in the circuit structure after curing.
  • the light panel 100 further includes a protective layer 30 , the protective layer 30 covers the side of the reflector 10 on the backlight side, and the connection circuit 120 is located between the protective layer 30 and the reflector 10 .
  • the protective layer 30 has insulating properties, thereby avoiding the risk of circuit exposure.
  • the protective layer 30 may be glass fiber, basalt fiber, polyvinyl alcohol or polyethylene naphthalene glycol ester with flexible and insulating properties.
  • the disk 112 is formed from copper foil, and the connecting circuit 120 is formed from a conductive silver paste that is baked and solidified.
  • Figure 9 shows a method for preparing the light panel 100 in the embodiment of the present application.
  • a schematic flow chart of a method for manufacturing the lamp panel 100, wherein the method for manufacturing the lamp panel 100 includes:
  • Step S901 provide a reflector 10
  • the reflector 10 can reflect the light emitted by the light-emitting device 20 toward the backlight side to improve the light utilization efficiency of the light-emitting device 20 .
  • the reflector 10 may be a reflective sheet 12 .
  • the reflector 10 includes a flexible substrate 13 and a reflective sheet 12 bonded to each other. It can be understood that the reflector 10 can also refer to other substrates with reflective functions. For example, white ink is applied on the surface of the flexible substrate 13 to form a reflective layer, thereby preparing the reflector 10 with reflective functions and flexibility.
  • Step S902 open a via hole 11 on the reflector 10, and the via hole 11 penetrates both sides of the reflector 10;
  • the cross-sectional area of the via hole 11 gradually increases in the direction from the backlight side to the light emitting side. In other embodiments of the present application, the cross-sectional area of the via hole 11 gradually decreases in the direction from the backlight side to the light emitting side.
  • the via hole 11 may be a circular hole, a tapered hole, a square hole, etc.
  • the via hole 11 can be formed by physical or chemical means.
  • the via hole 11 is formed on the reflector 10 by mechanical drilling equipment; for example, the via hole 11 is formed on the reflector 10 by laser drilling. ;
  • a chemical agent is used to corrode the reflector 10 to form the via hole 11 .
  • Step S903 forming a connection circuit 120 on one side of the reflector 10, and forming multiple sets of electrical connection portions 110 on the other side.
  • the electrical connection portion 110 includes a positive electrode pad 111 and a negative electrode pad 112.
  • the connection circuit 120 connects to the positive electrode pad through the via hole 11. 111 is electrically connected to the negative electrode pad 112;
  • connection circuit 120 and the electrical connection portion 110 can be formed by baking the conductive silver paste and solidifying it. For example, first apply the conductive silver paste on the side of the reflector 10 located on the backlight side, and make it conductive. The silver paste fills the via hole 11, and after baking, a connection circuit 120 is formed on the side of the reflector 10 on the backlight side. Then, conductive silver paste is applied on the side of the reflector 10 on the light emitting side, and the conductive silver paste is solidified in the via hole. 11, so that the connection circuit 120 is connected to the electrical connection portion 110 through the via hole 11.
  • connection circuit 120 and the electrical connection portion 110 can also be formed by bonding metal foil (such as copper foil, silver foil, etc.) on both sides of the reflector 10 .
  • step S904 the light-emitting device 20 is installed on the side of the reflector 10 provided with the electrical connection portion 110.
  • the positive electrode connection portion 21 of the light-emitting device 20 is connected to the positive electrode pad 111, and the negative electrode connection portion 22 is connected to the negative electrode pad 112.
  • the light-emitting device 20 is installed on the side of the reflector 10 on the light-emitting side through soldering, so that the positive connection portion 21 of the light-emitting device 20 is connected to the positive electrode pad 111 and the negative connection portion 22 is soldered to the negative electrode. Disk 112 is connected.
  • the light-emitting device 20 is bonded and installed on the side of the reflector 10 located on the light-emitting side through glue with conductive properties (such as silver glue).
  • glue such as silver glue
  • the electrical connection part 110 and the connection circuit 120 are respectively provided on both sides of the reflector 10, and the electrical connection part 110 and the connection circuit 120 are electrically connected through the via hole 11.
  • the light-emitting device 20 can be directly It is directly installed on the positive electrode pad 111 and the negative electrode pad 112. Since the positive electrode pad 111 and the negative electrode pad 112 are located on the surface of the reflector 10, the silver glue is not covered by the reflective sheet 12 or ink when the light emitting device 20 is solidified.
  • connection circuit 120 is arranged on the backlight side of the reflector 10, only the positive electrode pad 111 and the positive electrode pad 111 for solid crystal are exposed on the light exit side of the reflector 10.
  • the negative electrode pad 112 can also prevent the connection circuit 120 from blocking the surface of the reflector 10 and thereby reducing its reflectivity.
  • the lamp panel 100 preparation method further includes covering the protective layer 30 on the side of the reflector 10 located on the backlight side.
  • the protective layer 30 can be fixed on the side of the reflector 10 on the backlight side by applying adhesive glue on the side of the protective layer 30 facing the reflector 10 , and then bonding the protective layer 30 to the reflector 10 for baking. superior.
  • the protective layer 30 can be made of flexible and insulating glass fiber, basalt fiber, polyvinyl alcohol or polyethylene naphthalene glycol, etc. After covering the protective layer 30 , the circuit 120 is connected. It is located between the protective layer 30 and the reflector 10. Since the protective layer 30 has insulating properties, the risk of leakage of the connecting circuit 120 can be avoided.
  • connection circuit 120 is formed on the backlight side of the reflector 10
  • the protective layer 30 is then covered on the side of the reflector 10 on the backlight side to protect the connection circuit 120 in time.
  • the present application also provides a backlight module.
  • the backlight module includes the light panel 100 of any of the above embodiments. Since the backlight module in the embodiment of the present application includes the lamp panel 100 in the above embodiment, it has all the beneficial effects of the lamp panel 100 in the above embodiment, which will not be described again here.
  • the usage scenarios of the light panels in the embodiments of the present application include but are not limited to fields such as backlight modules for liquid crystal display devices, Mimi LED direct display, Micro LED direct display, etc.

Abstract

La présente invention concerne un panneau de lampe (100) et son procédé de préparation, et un module de rétroéclairage. Le panneau de lampe (100) est pourvu d'un côté électroluminescent et d'un côté de rétroéclairage. Le panneau de lampe (100) comprend un dispositif électroluminescent (20), le dispositif électroluminescent (20) étant pourvu d'une partie de connexion d'électrode positive (21) et d'une partie de connexion d'électrode négative (22) ; et un réflecteur (10), le côté du réflecteur (10) situé sur le côté électroluminescent étant pourvu d'une pluralité de parties de connexion électrique (110), chaque partie de connexion électrique (110) comprenant une pastille d'électrode positive (111) et une pastille d'électrode négative (112), la partie de connexion d'électrode positive (21) étant électriquement connectée à la pastille d'électrode positive (111), la partie de connexion d'électrode négative (22) étant électriquement connectée à la pastille d'électrode négative (112), le réflecteur (10) étant pourvu d'un trou d'interconnexion (11) pénétrant deux côtés du réflecteur (10), le côté du réflecteur (10) situé sur le côté de rétroéclairage étant pourvu d'un circuit de connexion (120), et la pastille d'électrode positive (111) et la pastille d'électrode négative (112) étant électriquement connectées au circuit de connexion (120) au moyen du trou d'interconnexion (11). Lorsque le dispositif électroluminescent (20) est fixé, le gel d'argent n'est pas recouvert par une plaque réfléchissante ou une encre, de telle sorte que le phénomène de fissuration de la plaque réfléchissante ou de l'encre provoquée par le durcissement du gel d'argent peut être évité.
PCT/CN2023/088114 2022-05-25 2023-04-13 Panneau de lampe et son procédé de préparation, et module de rétroéclairage WO2023226611A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117766669A (zh) * 2024-02-20 2024-03-26 瀚思科技发展(北京)有限公司 一种微型led焊盘修复方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114811467A (zh) * 2022-05-25 2022-07-29 深圳Tcl新技术有限公司 灯板及其制备方法、背光模组

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003195306A (ja) * 2001-12-28 2003-07-09 Optrex Corp 液晶表示素子用バックライト装置
CN103545436A (zh) * 2013-09-29 2014-01-29 苏州东山精密制造股份有限公司 蓝宝石基led封装结构及其封装方法
CN109888079A (zh) * 2019-01-22 2019-06-14 圆融光电科技股份有限公司 一种深紫外发光二极管封装
CN216434600U (zh) * 2021-11-15 2022-05-03 惠州视维新技术有限公司 背光模块以及显示装置
CN114811467A (zh) * 2022-05-25 2022-07-29 深圳Tcl新技术有限公司 灯板及其制备方法、背光模组

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003195306A (ja) * 2001-12-28 2003-07-09 Optrex Corp 液晶表示素子用バックライト装置
CN103545436A (zh) * 2013-09-29 2014-01-29 苏州东山精密制造股份有限公司 蓝宝石基led封装结构及其封装方法
CN109888079A (zh) * 2019-01-22 2019-06-14 圆融光电科技股份有限公司 一种深紫外发光二极管封装
CN216434600U (zh) * 2021-11-15 2022-05-03 惠州视维新技术有限公司 背光模块以及显示装置
CN114811467A (zh) * 2022-05-25 2022-07-29 深圳Tcl新技术有限公司 灯板及其制备方法、背光模组

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117766669A (zh) * 2024-02-20 2024-03-26 瀚思科技发展(北京)有限公司 一种微型led焊盘修复方法

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