JP4794481B2 - バックライトユニット - Google Patents
バックライトユニット Download PDFInfo
- Publication number
- JP4794481B2 JP4794481B2 JP2007055384A JP2007055384A JP4794481B2 JP 4794481 B2 JP4794481 B2 JP 4794481B2 JP 2007055384 A JP2007055384 A JP 2007055384A JP 2007055384 A JP2007055384 A JP 2007055384A JP 4794481 B2 JP4794481 B2 JP 4794481B2
- Authority
- JP
- Japan
- Prior art keywords
- diffusion plate
- backlight unit
- insulating substrate
- heat diffusion
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Liquid Crystal (AREA)
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
110 基板
111、112 回路パターン
113 絶縁薄膜
114 上部熱拡散板
115 貫通孔
116 下部熱拡散板
130 LEDパッケージ
131 LEDチップ
132、133 LED電極
134 プラスチックモールディングケース
135 レンズ
150 シャーシ
Claims (5)
- 一面に所定の回路パターンが形成された絶縁基板と、
前記回路パターンと電気的に接続され、前記絶縁基板に実装された多数のLEDパッケージと、
前記回路パターンと直接接触するように前記絶縁基板に形成され、前記LEDパッケージから発生する熱を放出する上部熱拡散板と、
前記絶縁基板の他面に形成され、前記上部熱拡散板によって伝達される熱を外部へ伝達する下部熱拡散板とを含み、
前記絶縁基板は、前記下部熱拡散板を覆うように形成された絶縁薄膜を備え、
前記上部熱拡散板と前記下部熱拡散板との間は、前記絶縁基板を貫通して内壁のみがメッキ処理された少なくとも一つの貫通孔によって連結され、前記少なくとも一つの貫通孔と前記上部熱拡散板は、所定の面積比となるように形成されていることを特徴とするバックライトユニット。 - 前記上部熱拡散板と前記下部熱拡散板は、銅材質で製作され、約0.35μmの厚さであることを特徴とする請求項1に記載のバックライトユニット。
- 前記少なくとも一つの貫通孔と前記上部熱拡散板との面積比は、1:10〜1:300であることを特徴とする請求項1または請求項2に記載のバックライトユニット。
- 前記絶縁薄膜はスパッタリング法またはスプレー法によってコート処理されて形成されることを特徴とする請求項1に記載のバックライトユニット。
- 前記絶縁薄膜は、約0.35μmの厚さであることを特徴とする請求項4に記載のバックライトユニット。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0021010 | 2006-03-06 | ||
KR1020060021010A KR100752009B1 (ko) | 2006-03-06 | 2006-03-06 | Led가 구비된 백라이트유닛 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010016653A Division JP4856767B2 (ja) | 2006-03-06 | 2010-01-28 | バックライトユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007242617A JP2007242617A (ja) | 2007-09-20 |
JP4794481B2 true JP4794481B2 (ja) | 2011-10-19 |
Family
ID=38179643
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007055384A Active JP4794481B2 (ja) | 2006-03-06 | 2007-03-06 | バックライトユニット |
JP2010016653A Active JP4856767B2 (ja) | 2006-03-06 | 2010-01-28 | バックライトユニット |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010016653A Active JP4856767B2 (ja) | 2006-03-06 | 2010-01-28 | バックライトユニット |
Country Status (6)
Country | Link |
---|---|
US (2) | US7795635B2 (ja) |
EP (2) | EP2170024B1 (ja) |
JP (2) | JP4794481B2 (ja) |
KR (1) | KR100752009B1 (ja) |
CN (1) | CN100517025C (ja) |
DE (1) | DE202007019142U1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100855065B1 (ko) * | 2007-04-24 | 2008-08-29 | 삼성전기주식회사 | 발광 다이오드 패키지 |
JP5033688B2 (ja) * | 2008-03-18 | 2012-09-26 | 株式会社リコー | 光源装置、光走査装置及び画像形成装置 |
JP5391767B2 (ja) * | 2008-05-30 | 2014-01-15 | 東芝ライテック株式会社 | 発光装置及び照明器具 |
KR101476422B1 (ko) * | 2008-06-30 | 2014-12-26 | 서울반도체 주식회사 | 인쇄회로기판 및 그를 이용한 led 모듈 |
JP5286206B2 (ja) * | 2009-09-11 | 2013-09-11 | 日立コンシューマエレクトロニクス株式会社 | 液晶表示装置 |
WO2011148694A1 (ja) * | 2010-05-25 | 2011-12-01 | シャープ株式会社 | 照明装置、表示装置、及びテレビ受信装置 |
KR101136316B1 (ko) * | 2010-07-09 | 2012-04-19 | 율촌화학 주식회사 | Led 백라이트 유닛 |
KR101775671B1 (ko) * | 2010-09-29 | 2017-09-20 | 삼성디스플레이 주식회사 | 발광다이오드 패키지를 갖는 백라이트 어셈블리 및 이를 갖는 표시장치 |
CN102734654A (zh) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | 一种高功率led日光灯及散热方法 |
DE102011112081A1 (de) | 2011-05-11 | 2015-08-20 | Entex Rust & Mitschke Gmbh | Verfahren zur Verarbeitung von Elasten |
CN104736317B (zh) | 2012-10-11 | 2017-09-22 | 恩特克斯拉斯特及米施克有限责任公司 | 用于加工易粘接的塑料的挤压机 |
KR102108214B1 (ko) * | 2013-06-12 | 2020-05-07 | 엘지디스플레이 주식회사 | 발광다이오드어셈블리 및 그를 포함한 액정표시장치 |
DE102017001093A1 (de) | 2016-04-07 | 2017-10-26 | Entex Rust & Mitschke Gmbh | Entgasen bei der Extrusion von Kunststoffen mit Filterscheiben aus Sintermetall |
DE102015001167A1 (de) | 2015-02-02 | 2016-08-04 | Entex Rust & Mitschke Gmbh | Entgasen bei der Extrusion von Kunststoffen |
DE102016002143A1 (de) | 2016-02-25 | 2017-08-31 | Entex Rust & Mitschke Gmbh | Füllteilmodul in Planetwalzenextruderbauweise |
KR20180046418A (ko) * | 2016-10-27 | 2018-05-09 | 엘지디스플레이 주식회사 | 표시장치 및 그 제조방법 |
DE102017006638A1 (de) | 2017-07-13 | 2019-01-17 | Entex Rust & Mitschke Gmbh | Füllteilmodul in Planetwalzenextruderbauweise |
WO2019166125A1 (de) | 2018-02-28 | 2019-09-06 | Entex Rust & Mitschke Gmbh | Verfahren zur herstellung und verarbeitung von polymeren und polymermischungen in einem modular aufgebauten planetwalzenextruder |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS62257786A (ja) * | 1986-05-02 | 1987-11-10 | 株式会社日立製作所 | プリント配線基板 |
US5189261A (en) * | 1990-10-09 | 1993-02-23 | Ibm Corporation | Electrical and/or thermal interconnections and methods for obtaining such |
DE19528632A1 (de) * | 1995-08-04 | 1997-02-06 | Bosch Gmbh Robert | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
JP3506547B2 (ja) * | 1995-10-20 | 2004-03-15 | シチズン時計株式会社 | 半導体装置 |
JPH09214077A (ja) * | 1996-02-02 | 1997-08-15 | Toshiba Electric Appliance Co Ltd | プリント回路基板の製造方法及びその放熱構造 |
JPH1140901A (ja) * | 1997-07-23 | 1999-02-12 | Sharp Corp | 回路基板 |
JPH11233891A (ja) * | 1998-02-12 | 1999-08-27 | Oki Electric Ind Co Ltd | 半導体発光装置およびその製造方法 |
JP2000164774A (ja) * | 1998-11-26 | 2000-06-16 | Sony Corp | 半導体装置及びその製造方法 |
US6065823A (en) * | 1999-04-16 | 2000-05-23 | Hewlett-Packard Company | Heat spreader for ink-jet printhead |
JP2002026206A (ja) * | 2000-07-12 | 2002-01-25 | Matsushita Electric Ind Co Ltd | 放熱装置 |
DE10214363A1 (de) * | 2002-03-30 | 2003-10-16 | Bosch Gmbh Robert | Kühlanordnung und Elektrogerät mit einer Kühlanordnung |
US6977396B2 (en) * | 2003-02-19 | 2005-12-20 | Lumileds Lighting U.S., Llc | High-powered light emitting device with improved thermal properties |
US20040184272A1 (en) * | 2003-03-20 | 2004-09-23 | Wright Steven A. | Substrate for light-emitting diode (LED) mounting including heat dissipation structures, and lighting assembly including same |
US6920046B2 (en) * | 2003-06-25 | 2005-07-19 | Eaton Corporation | Dissipating heat in an array of circuit components |
WO2005001943A1 (en) * | 2003-06-30 | 2005-01-06 | Koninklijke Philips Electronics N.V. | Light-emitting diode thermal management system |
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JP4160881B2 (ja) * | 2003-08-28 | 2008-10-08 | 松下電器産業株式会社 | 半導体発光装置、発光モジュール、照明装置、および半導体発光装置の製造方法 |
US7816863B2 (en) * | 2003-09-12 | 2010-10-19 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method for manufacturing the same |
KR100586944B1 (ko) * | 2003-12-26 | 2006-06-07 | 삼성전기주식회사 | 고출력 발광다이오드 패키지 및 제조방법 |
JP2005283852A (ja) | 2004-03-29 | 2005-10-13 | Kyocera Corp | 液晶表示装置 |
US7456499B2 (en) * | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
KR100623024B1 (ko) * | 2004-06-10 | 2006-09-19 | 엘지전자 주식회사 | 고출력 led 패키지 |
US7241030B2 (en) * | 2004-07-30 | 2007-07-10 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Illumination apparatus and method |
KR100624090B1 (ko) | 2004-09-02 | 2006-09-20 | (주)트윈 세이버 | 통풍 가능한 베개 |
-
2006
- 2006-03-06 KR KR1020060021010A patent/KR100752009B1/ko active IP Right Grant
-
2007
- 2007-03-02 DE DE202007019142U patent/DE202007019142U1/de not_active Expired - Lifetime
- 2007-03-02 EP EP09178293.8A patent/EP2170024B1/en active Active
- 2007-03-02 EP EP07103453A patent/EP1833101A3/en not_active Withdrawn
- 2007-03-06 US US11/714,193 patent/US7795635B2/en active Active
- 2007-03-06 JP JP2007055384A patent/JP4794481B2/ja active Active
- 2007-03-06 CN CNB2007100867098A patent/CN100517025C/zh active Active
-
2010
- 2010-01-26 US US12/693,994 patent/US8053804B2/en active Active
- 2010-01-28 JP JP2010016653A patent/JP4856767B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20100127281A1 (en) | 2010-05-27 |
JP4856767B2 (ja) | 2012-01-18 |
US7795635B2 (en) | 2010-09-14 |
EP2170024A2 (en) | 2010-03-31 |
US8053804B2 (en) | 2011-11-08 |
KR100752009B1 (ko) | 2007-08-28 |
JP2010103126A (ja) | 2010-05-06 |
EP2170024B1 (en) | 2017-08-09 |
JP2007242617A (ja) | 2007-09-20 |
US20070221941A1 (en) | 2007-09-27 |
CN100517025C (zh) | 2009-07-22 |
DE202007019142U1 (de) | 2010-09-23 |
CN101034233A (zh) | 2007-09-12 |
EP1833101A2 (en) | 2007-09-12 |
EP1833101A3 (en) | 2011-03-09 |
EP2170024A3 (en) | 2011-03-09 |
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