WO2008074218A1 - Baguette électroluminescente à puces del - Google Patents

Baguette électroluminescente à puces del Download PDF

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Publication number
WO2008074218A1
WO2008074218A1 PCT/CN2007/003641 CN2007003641W WO2008074218A1 WO 2008074218 A1 WO2008074218 A1 WO 2008074218A1 CN 2007003641 W CN2007003641 W CN 2007003641W WO 2008074218 A1 WO2008074218 A1 WO 2008074218A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
frame
circuit board
emitting diode
led chips
Prior art date
Application number
PCT/CN2007/003641
Other languages
English (en)
Chinese (zh)
Inventor
Hujun Huang
Original Assignee
Hujun Huang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hujun Huang filed Critical Hujun Huang
Publication of WO2008074218A1 publication Critical patent/WO2008074218A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Definitions

  • the present invention relates to the field of optoelectronic technology, and relates to a light-emitting bar, and more particularly to a light-emitting bar composed of a light-emitting diode, which can be used as a liquid crystal backlight or a projection light source, and can also be used for illumination.
  • BACKGROUND OF THE INVENTION Backlights commonly used in computers and television LCD screens include cold cathode fluorescent lamps, electroluminescence, and light bars.
  • the structure of the existing light bar is: a plurality of light emitting diodes are arranged at intervals on the strip circuit board, each light emitting diode is composed of a casing and an LED chip packaged in the casing, and the positive and negative of the LED chip
  • the end wire is connected to the pin at both ends of the housing, the pin is soldered to the circuit board, and the aluminum substrate for heat dissipation is disposed under the circuit board.
  • the heat dissipation area is small: heat is dissipated by an aluminum substrate under the circuit board, and the heat of the LED is mainly generated by the negative terminal. The heat is first transmitted through the circuit board to the aluminum substrate, and the circuit board itself hinders heat. Conduction, poor heat dissipation.
  • Each LED can be regarded as a point source.
  • the light emitted by it includes side-emitting and scattered light. It cannot converge and reduces the brightness of the illuminating rod. It must be compensated by increasing the number of LEDs. Insufficient brightness.
  • the length is short: only supported by a sheet-like aluminum substrate, the structural strength is poor, easy to bend and deform, the luminous rod can not be done very long, it is difficult to industrialize mass production.
  • the positive and negative ends of the LED chip are connected to the pins at both ends of the housing.
  • the positive and negative ends are very thin gold wires with low thermal resistance, and the pins support the housing. It is a thick aluminum strip.
  • the pins are soldered on the circuit board. The solder joints are large. The thermal impedance of the joint between the pins and the solder joints is high, which is easy to generate heat and adversely affects the glow sticks.
  • an object of the present invention is to provide a light-emitting rod having a light-emitting diode chip, the upper portion of the frame having a groove, and the inner wall of the groove forming a reflection wall, which can be buried in the vertical
  • the light emitted from each of the LED chips in the hole is concentrated into near-parallel light, thereby increasing the height and uniformity of the light, and the surface of the frame is coated with a heat-conductive coating, and the heat-dissipating area is large.
  • a light-emitting bar having a light-emitting diode chip, comprising a frame, a circuit board, and a plurality of light-emitting diode chips, the light-emitting diode chips being spaced apart on the circuit board, wherein: the frame In the shape of a long rod, the upper portion of the frame has lateral grooves extending through the front and rear, and the lower portion of the frame has a plurality of vertical holes for accommodating the LED chips, and the top of each vertical hole communicates with the bottom of the groove, A negative electrode bonding plate is disposed on the upper surface of the circuit board, and the negative electrode plate has a plurality of through holes.
  • the position of the through hole corresponds to the position of the vertical hole
  • the circuit board has a plurality of positive electrode pads, and each positive electrode pad is respectively The through hole of the negative electrode bonding plate is exposed, the bottom surface of the frame is fixed on the negative electrode bonding plate, and the LED chips are respectively embedded in the vertical holes in the lower part of the frame, and the positive end bonding wires of the LED chips are respectively One-to-one correspondence with the positive electrode pads of the circuit board, and the negative end bonding wires of the respective LED chips are soldered to the negative electrode bonding plates of the circuit board.
  • the bottom surface of the frame is sprayed with a tin coating, and the bottom surface of the frame is pressure-welded together with the negative electrode bonding plate, and a heat conductive coating is applied to both sides and the upper surface of the frame.
  • the inner wall surface of the groove is a curved surface.
  • the negative electrode bonding plate is composed of a thin aluminum sheet, and the surface of the thin aluminum sheet is plated with a gold film.
  • the positive electrode pad is composed of a thin aluminum plate whose surface is plated with a gold film.
  • the vertical hole of the frame is filled with transparent silica gel, and the transparent silica gel covers the LED chip.
  • Each of the LED chips of the present invention is embedded in the vertical hole of the frame in a built-in manner, and each LED chip does not have a separate housing. All the LED chips use the frame as a housing, so that it is not necessary to use a thick tube. The foot also eliminates the need for pin welding.
  • the upper part of the frame is provided with a groove, and the inner wall of the groove constitutes a reflection wall, which can refract side-emitting light and scattered light of the LED chip to emit near-parallel light, thereby increasing brightness and uniformity. Thereby reducing the number of LED chips.
  • the negative pole of the circuit board is composed of a whole piece of thin aluminum sheet, and the heat dissipation area is large.
  • the heat conduction coating is applied on both sides and the upper surface of the frame, so that the heat dissipation area is increased by more than three times, and the heat dissipation effect is good.
  • circuit board and frame of this product are combined into a rectangular parallelepiped column shape, which is stable in structure, difficult to bend and deform, and convenient for industrial mass production.
  • This product directly presses the LED chip directly into the vertical hole of the lower part of the frame. The process is simplified.
  • the production line does not need to purchase automatic placement machine and pin welding equipment, which can greatly reduce the investment cost and increase the production speed by more than 30%.
  • Fig. 1 is a schematic view showing the structure of a conventional light-emitting rod.
  • Figure 2 is a partial enlarged view of Figure 1.
  • Figure 3 is an enlarged exploded view of one of the light emitting diodes of Figure 2.
  • Figure 4 is a rear elevational view of Figure 3.
  • Figure 5 is a schematic view of the structure of the present invention.
  • Figure 6 is a partial enlarged cross-sectional view of Figure 5.
  • Figure 7 is an exploded view of Figure 6.
  • Figure 8 is an enlarged view of a portion A of Figure 7.
  • FIG. 9 is a schematic structural view of the circuit board and the negative electrode bonding board of FIG.
  • Figure 10 is an enlarged view of a portion B of Figure 9.
  • Figure 11 is an enlarged view of a portion C of Figure 9.
  • Fig. 12 is a partially enlarged cross-sectional view of Fig. 5;
  • Figure 13 is an enlarged cross-sectional view taken along line D-D of Figure 12 .
  • FIG 14 is a schematic illustration of the working principle of the present invention. Embodiment of the invention
  • Circuit board Light-emitting diode 201. Upper cover 202. Base
  • Circuit board Light-emitting diode chip 901. Negative-end bonding wire 902. Positive-end bonding wire 11. Negative electrode bonding plate 111. Through-hole 12. Positive electrode disk 13. Transparent silica gel for better understanding of the essential features of the present invention
  • the structure of the existing light bar is: A plurality of light emitting diodes 2 are arranged spaced apart on the circuit board 1 each, and each of the light emitting diodes 2 is composed of a housing and an LED chip 3 housed in the housing, and the housing is composed of an upper cover 201 and a base 202.
  • the ends of the casing have pins 4, 5, and the negative and positive ends of the LED chips 3 are connected to the pins 4, 5 at both ends of the casing, and the pins 4, 5 are connected to the circuit board by tin.
  • the circuit board 1 In the upper part of the circuit board 1, there is an aluminum substrate 6 for dissipating heat.
  • the pins 4 and 5 are made of thick aluminum strips. After soldering, the solder joints 401 and 501 are large, and the thermal impedance of the joints of the pins 4 and 5 and the solder joints 401 and 501 is high. It is easy to heat and has an adverse effect on the glow stick.
  • the present invention is a light-emitting bar having a light-emitting diode chip, comprising a frame 7, a circuit board 8, and a plurality of light-emitting diode chips 9.
  • the LED chips 9 are arranged on the circuit board 8 at intervals.
  • the frame 7 has an elongated rod shape.
  • the upper portion of the frame 7 has lateral grooves 701 penetrating therethrough.
  • the lower portion of the frame 7 has a plurality of LED chips 9 for accommodating the LED chips.
  • the vertical holes 702, the top of each vertical hole 702 is in communication with the bottom of the groove 701.
  • the positive terminal bonding wire 902 and the negative terminal bonding wire 901 of the LED chip 9 are both fine gold wires.
  • the upper surface of the circuit board 8 is coated with a negative electrode bonding plate 11, and the negative electrode bonding plate 11 is composed of a thin aluminum plate.
  • the surface of the aluminum sheet is plated with a gold film, which is the same material as the negative-end bonding wire 901. After being welded and fixed together by a wire bonding machine, the thermal resistance is low, the welded portion is firm, and the tensile strength is large, and the negative electrode bonding plate 11 is opened.
  • the plurality of through holes 111 have a position corresponding to the position of the vertical holes 702.
  • the circuit board 8 has a plurality of positive electrode pads 12, and each of the positive electrode pads 12 is exposed by a through hole 111 on the negative electrode pad 11. Referring to FIG. 8, there is a certain gap between the outer edge of the positive electrode pad 12 and the inner edge of the through hole 111 to be insulated from each other.
  • the bottom surface of the frame 7 is sprayed with a tin layer, the bottom surface of the frame 7 is pressed together with the negative electrode bonding plate 11, and the LED chips 9 are respectively embedded in the vertical holes 702 of the frame 7, and the positive end bonding wires of each of the LED chips 9 are respectively 902 is soldered to a positive electrode pad 12 of the circuit board, and the negative terminal bonding wire 901 of each of the light emitting diode chips 9 is soldered to the negative electrode bonding plate 11.
  • the positive electrode pad 12 is composed of a thin aluminum plate which is plated with a gold film on the surface, which is the same material as the positive terminal wire 902.
  • Each of the LED chips 9 is in parallel relationship with each other.
  • the positive end turns 902 and the negative end turns 901 of the LED chip 9 are very thin gold wires, and the thermal resistivity is low, and is soldered and fixed by a wire bonding machine.
  • the junction of the positive terminal bond wire 902 of each LED chip 9 and the positive electrode pad 12 of the circuit board is an extremely small golden defect.
  • the joint portion of the negative electrode bonding wire 901 and the negative electrode bonding plate 11 of each of the light-emitting diode chips 9 is an extremely small gold solder joint. Low thermal resistance, soldering The joint is firm and the tensile strength is high.
  • the heat of the LED chip 9 is mainly generated by the negative end thereof.
  • the negative electrode of the circuit board of the present invention is composed of a single negative electrode bonding plate 11 having a large area for conducting heat, and the negative electrode bonding plate 11 is in close contact with the bottom surface of the frame 7, the frame A thermally conductive coating is applied to both sides and the upper surface of 7.
  • the thermally conductive coating may be a chrome-plated coating, and the edge of the thermal conductive coating is joined to the edge of the tin layer on the bottom surface of the frame 7, so that the heat generated by the negative electrode plate 11 can be transmitted upward, and the heat generated at the negative end of each of the LED chips 9 is subjected to the negative electrode welding.
  • the plate 11 is conducted to both sides and the upper surface of the frame 7, and is radiated by the heat conductive coating, so that the product has a good heat dissipation effect.
  • each vertical hole 702 of the frame 7 is filled with a transparent silica gel 13, which covers the LED chip 9.
  • the transparent silica gel 13 has a function of waterproof sealing.
  • the transparent silica gel 13 is doped with an additive, and the additive may be a trichromatic nitride or a fluorescent powder, and the additive has the function of brightening and changing the color of the transmitted light. After the light emitted by the LED chip passes through the transparent silica gel 13, the light is affected by the trichromatic nitride or the phosphor, the brightness is enhanced, and the color is changed accordingly, thereby more in line with actual needs.
  • the upper portion of the frame 7 is provided with a recess 701, and the inner wall surface of the recess 701 is a curved surface.
  • the inner wall of the recess 701 constitutes a reflective wall. Referring to FIG. 14, after the light emitted from the LED chip 9 passes through the transparent silica gel 13, the side-emitting or scattered light M, N is refracted by the inner wall of the recess 701, and is close to Parallel light is emitted, which increases the brightness and uniformity of the glow stick.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

L'invention concerne une baguette électroluminescente à puces DEL (9), qui comprend un cadre en forme de bande (7), une carte de circuit imprimé (8) et plusieurs puces DEL (9). La partie supérieure du cadre présente une rainure (701), et la partie inférieure plusieurs trous verticaux (702). Le haut de chaque trou vertical (702) et le fond de la rainure (701) sont traversants. Une plaque polaire négative (11) est placée sur la surface supérieure de la carte de circuit imprimé (8) et présente plusieurs trous de passage (111). L'emplacement des trous de passage (111) correspond à celui des trous verticaux (702). La carte de circuit imprimé (8) présente plusieurs plots polaires positifs (12) qui sont exposés depuis les trous de passage (111) sur la plaque polaire négative (11), respectivement. La surface inférieure du cadre (7) est liée à la plaque polaire négative (11). Les puces DEL (9) sont intégrées dans les trous verticaux (702) du cadre, respectivement. Les câbles terminaux positifs (902) des puces DEL (9) sont connectés un à un aux câbles terminaux positifs (902) du plot polaire positif (12), et les câbles terminaux négatifs (901) desdites puces DEL (9) sont connectés un à un à la plaque polaire négative (11) de la carte de circuit imprimé (8). Les parois internes de la rainure (701) forment des parois réfléchissantes.
PCT/CN2007/003641 2006-12-20 2007-12-18 Baguette électroluminescente à puces del WO2008074218A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNB2006101677429A CN100423257C (zh) 2006-12-20 2006-12-20 具有发光二极管晶片的发光棒
CN200610167742.9 2006-12-20

Publications (1)

Publication Number Publication Date
WO2008074218A1 true WO2008074218A1 (fr) 2008-06-26

Family

ID=38112617

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2007/003641 WO2008074218A1 (fr) 2006-12-20 2007-12-18 Baguette électroluminescente à puces del

Country Status (2)

Country Link
CN (1) CN100423257C (fr)
WO (1) WO2008074218A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100423257C (zh) * 2006-12-20 2008-10-01 黄虎钧 具有发光二极管晶片的发光棒
CN102062323A (zh) * 2010-11-05 2011-05-18 深圳市聚飞光电股份有限公司 Led灯条和led灯的制造方法
CN103855147A (zh) * 2014-01-13 2014-06-11 深圳市瑞丰光电子股份有限公司 一种led灯丝及灯具

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CN1525579A (zh) * 2003-02-28 2004-09-01 ŵ��ʿ�ֻ���ʽ���� 发光二极管光源组件
US20040223339A1 (en) * 2003-05-06 2004-11-11 Ji-Mei Tsuei Light source device
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JP2006295085A (ja) * 2005-04-14 2006-10-26 Citizen Electronics Co Ltd 発光ダイオード光源ユニット
CN1971906A (zh) * 2006-12-20 2007-05-30 黄虎钧 具有发光二极管晶片的发光棒
CN200996570Y (zh) * 2006-12-20 2007-12-26 黄虎钧 具有发光二极管晶片的发光棒

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CN2613048Y (zh) * 2003-04-07 2004-04-21 熊麒 点矩阵发光二极管的组合结构
CN1333469C (zh) * 2003-10-31 2007-08-22 百容电子股份有限公司 发光二极管高效能散热的支持装置
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JP2006011242A (ja) * 2004-06-29 2006-01-12 Kyocera Corp 液晶表示装置
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Publication number Priority date Publication date Assignee Title
CN1525579A (zh) * 2003-02-28 2004-09-01 ŵ��ʿ�ֻ���ʽ���� 发光二极管光源组件
US20040223339A1 (en) * 2003-05-06 2004-11-11 Ji-Mei Tsuei Light source device
JP2005285874A (ja) * 2004-03-26 2005-10-13 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
US20060049475A1 (en) * 2004-09-07 2006-03-09 Opto Tech Corporation High power LED array
JP2006295085A (ja) * 2005-04-14 2006-10-26 Citizen Electronics Co Ltd 発光ダイオード光源ユニット
CN1971906A (zh) * 2006-12-20 2007-05-30 黄虎钧 具有发光二极管晶片的发光棒
CN200996570Y (zh) * 2006-12-20 2007-12-26 黄虎钧 具有发光二极管晶片的发光棒

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CN1971906A (zh) 2007-05-30
CN100423257C (zh) 2008-10-01

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