JP2009522804A - 発光ダイオードパッケージ、その製造方法及び、これを具備するバックライトユニット - Google Patents
発光ダイオードパッケージ、その製造方法及び、これを具備するバックライトユニット Download PDFInfo
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C9/00—Special pavings; Pavings for special parts of roads or airfields
- E01C9/004—Pavings specially adapted for allowing vegetation
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C13/00—Pavings or foundations specially adapted for playgrounds or sports grounds; Drainage, irrigation or heating of sports grounds
- E01C13/08—Surfaces simulating grass ; Grass-grown sports grounds
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C2201/00—Paving elements
- E01C2201/16—Elements joined together
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
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Abstract
【選択図】図2
Description
Claims (20)
- 発光ダイオードと、
前記発光ダイオードを駆動する回路パターンが形成され、前記発光ダイオードが実装される領域に貫通ホールが形成された印刷回路基板と、
前記貫通ホールに形成され、前記発光ダイオードの下面に接触される放熱体が含まれて構成されることを特徴とする発光ダイオードパッケージ。 - 前記放熱体は、金属または金属ペーストであることを特徴とする請求項1記載の発光ダイオードパッケージ。
- 前記発光ダイオードの底面と前記放熱体との間には熱伝導性接着剤が形成されることを特徴とする請求項1記載の発光ダイオードパッケージ。
- 前記放熱体は、接着剤により前記印刷回路基板の貫通ホールに付着されることを特徴とする請求項1記載の発光ダイオードパッケージ。
- 前記発光ダイオードは、発光ダイオードチップと、前記発光ダイオードチップを支持し、リードフレームが形成されたチップ支持部材と、前記発光ダイオードチップを封入するモールディング部が含まれて構成されることを特徴とする請求項1記載の発光ダイオードパッケージ。
- 前記リードフレームは、前記チップ支持部材の上面、側面、及び下面に連結されて形成されることを特徴とする請求項5記載の発光ダイオードパッケージ。
- 前記リードフレームは、前記貫通ホールと離隔した回路パターンと電気的に連結されることを特徴とする請求項5記載の発光ダイオードパッケージ。
- 前記放熱体は、前記発光ダイオードのチップ支持部材の下面に接触されることを特徴とする請求項5記載の発光ダイオードパッケージ。
- 発光ダイオードと、前記発光ダイオードを駆動する回路パターンが形成され、前記発光ダイオードが実装される領域に貫通ホールが形成された印刷回路基板と、前記貫通ホールに形成され、前記発光ダイオードの下面に接触される放熱体が含まれる発光ダイオードパッケージと、
前記発光ダイオードパッケージを支持する前記放熱体から伝えられた熱を外部に放出させるフレームと、
前記発光ダイオードパッケージから放出された光を処理する光学シートと、
が含まれて構成されることを特徴とするバックライトユニット。 - 前記放熱体は、金属または金属ペーストであることを特徴とする請求項9記載のバックライトユニット。
- 前記発光ダイオードの底面と前記放熱体との間には熱伝導性接着剤が形成されることを特徴とする請求項9記載のバックライトユニット。
- 前記放熱体は、接着剤により前記印刷回路基板の貫通ホールに付着されることを特徴とする請求項9記載のバックライトユニット。
- 前記発光ダイオードは、発光ダイオードチップと、前記発光ダイオードチップを支持し、リードフレームが形成されたチップ支持部材と、前記発光ダイオードチップを封入するモールディング部が含まれて構成されることを特徴とする請求項9記載のバックライトユニット。
- 前記リードフレームは、前記チップ支持部材の上面、側面、及び下面に連結されて形成されることを特徴とする請求項13記載のバックライトユニット。
- 前記リードフレームは、前記貫通ホールと離隔した回路パターンと電気的に連結されることを特徴とする請求項13記載のバックライトユニット。
- 前記放熱体は、前記発光ダイオードのチップ支持部材の下面に接触されることを特徴とする請求項13記載のバックライトユニット。
- 回路パターンが形成された印刷回路基板の発光ダイオード実装領域に貫通ホールを形成するステップと、
発光ダイオードを前記発光ダイオード実装領域に実装するステップと、
前記発光ダイオードの下面と接触されるように、前記印刷回路基板の貫通ホールに放熱体を挿入するステップと、
が含まれて構成されることを特徴とする発光ダイオードパッケージ製造方法。 - 前記放熱体、前記貫通ホールの内面、及び前記発光ダイオードの下面のうち、少なくともどれか一つに接着剤を塗布するステップが含まれることを特徴とする請求項17記載の発光ダイオードパッケージ製造方法。
- 前記発光ダイオードは、発光ダイオードチップと、前記発光ダイオードチップを支持し、リードフレームが形成されたチップ支持部材と、前記発光ダイオードチップを封入するモールディング部が含まれ、
前記発光ダイオードのリードフレームと前記印刷回路基板の回路パターンが電気的に連結されるように前記発光ダイオードを実装することを特徴とする請求項17記載の発光ダイオードパッケージ製造方法。 - 前記リードフレームは、前記チップ支持部材の上面、側面、及び下面に連結されて形成され、
前記チップ支持部材の下面に位置するリードフレームが前記印刷回路基板の回路パターンと電気的に連結されることを特徴とする請求項19記載の発光ダイオードパッケージ製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060001534A KR101305884B1 (ko) | 2006-01-06 | 2006-01-06 | 발광 다이오드 패키지, 이의 제조 방법 및 이를 구비하는백라이트 유닛 |
PCT/KR2006/005808 WO2007078103A1 (en) | 2006-01-06 | 2006-12-28 | Led package, method of fabricating the same, and backlight unit having the same |
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Publication Number | Publication Date |
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JP2009522804A true JP2009522804A (ja) | 2009-06-11 |
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JP2008549412A Pending JP2009522804A (ja) | 2006-01-06 | 2006-12-28 | 発光ダイオードパッケージ、その製造方法及び、これを具備するバックライトユニット |
Country Status (5)
Country | Link |
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US (1) | US8445926B2 (ja) |
EP (1) | EP1913436B1 (ja) |
JP (1) | JP2009522804A (ja) |
KR (1) | KR101305884B1 (ja) |
WO (1) | WO2007078103A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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Also Published As
Publication number | Publication date |
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EP1913436A1 (en) | 2008-04-23 |
KR20070074008A (ko) | 2007-07-12 |
US8445926B2 (en) | 2013-05-21 |
KR101305884B1 (ko) | 2013-09-06 |
US20080191231A1 (en) | 2008-08-14 |
EP1913436B1 (en) | 2016-04-13 |
WO2007078103A1 (en) | 2007-07-12 |
EP1913436A4 (en) | 2010-01-13 |
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