WO2016029808A1 - Structure électroluminescente et de dissipation de chaleur de source de lumière à del, et procédé électroluminescent et de dissipation de chaleur s'y rapportant - Google Patents

Structure électroluminescente et de dissipation de chaleur de source de lumière à del, et procédé électroluminescent et de dissipation de chaleur s'y rapportant Download PDF

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Publication number
WO2016029808A1
WO2016029808A1 PCT/CN2015/087461 CN2015087461W WO2016029808A1 WO 2016029808 A1 WO2016029808 A1 WO 2016029808A1 CN 2015087461 W CN2015087461 W CN 2015087461W WO 2016029808 A1 WO2016029808 A1 WO 2016029808A1
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Prior art keywords
heat
heat dissipation
dissipating
led
emitting chip
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PCT/CN2015/087461
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English (en)
Chinese (zh)
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蔡鸿
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蔡鸿
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Publication of WO2016029808A1 publication Critical patent/WO2016029808A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems

Definitions

  • the invention relates to a light-emitting heat dissipation structure and a light-emitting and heat-dissipating method thereof, in particular to a light-emitting heat dissipation structure for an LED light source and a light-emitting and heat-dissipating method thereof.
  • PCT International Application No. PCT/CN2011/000756 discloses an LED light source and a method of manufacturing the same, which describes an LED component. It can emit light through two sides, thereby avoiding heat accumulation on the bonding surface and the substrate of the conventional LED light source, and the LED elements and the two fluorescent elements are directly connected in a sandwich manner, thereby forming one or more passage openings to thereby pass through.
  • the channel port directs the heat transfer of the LED elements.
  • the structure mainly includes one or more LED light source groups, wherein each of the LED light source groups includes: at least one LED element, wherein the LED element has a first light emitting surface and a second light emitting surface on the reverse side, wherein the The LED element is adapted to provide illumination at an angle greater than 180° by electroluminescence on each of the first illuminating surface and the second illuminating surface; two fluorescent elements, the two fluorescent elements being respectively located at the first of the LED elements a light emitting surface and the second light emitting surface portion to maintain the LED elements in position such that illumination generated by the LEDs respectively passes from the light emitting surface through the two fluorescent elements; and an electronic component, the electrons An element is coupled to the LED element to electrically connect the LED element to a power source.
  • the LED element is sandwiched by the two fluorescent elements to maintain the LED element in position such that the first light emitting surface and the second light emitting surface are directly pressed against the fluorescent element to obtain Supporting and directing heat transfer away from the LED elements, and the LED elements are held within an LED receiving cavity of the gap between the fluorescent elements.
  • the above-mentioned technology is applied to a specific product, and the product has a small volume and good light-emitting effect, and can simultaneously emit light simultaneously in all directions by using one LED light source, but in a specific implementation, since it is only faced by the first light-emitting surface and the second light-emitting surface LED components for heat dissipation, although the idea is better, but in the specific implementation of the heat dissipation effect is not ideal, the heat dissipation is slow and cause the LED components to overheat, in more serious cases will burn the entire LED light source, and this is The main drawbacks of traditional technology.
  • the invention provides an LED light source heat-dissipating structure and a light-emitting and heat-dissipating method thereof, which have good heat dissipation effect, excellent luminescence performance, and can greatly reduce the working temperature of the light source, and this is the main object of the invention.
  • the technical solution adopted by the present invention is: an LED light source emitting heat dissipation structure, the LED light source is an LED double-sided light emitting chip, and the LED double-sided light emitting chip is disposed on a transparent heat dissipation plate, and the transparent heat dissipation plate comprises a transparent heat dissipation substrate and a heat-dissipating conductive film layer, wherein the heat-dissipating conductive film layer is adhered to an outer surface of the transparent heat-dissipating substrate, the transparent heat-dissipating substrate is made of a light-transmitting heat-dissipating material, and the heat-dissipating conductive film layer is made of a heat-dissipating heat-dissipating conductive material
  • the conductive film layer includes a full portion and a window portion.
  • the full portion and the window portion are spaced apart.
  • the LED double-sided light emitting chip is horizontally disposed at the position of the window portion. At this moment, the outer side of the LED double-sided light emitting chip is generated. The light is directly emitted into the external environment, and the light generated by the inner side of the LED double-sided light-emitting chip passes through the window portion and transmits the transparent heat-dissipating substrate to the external environment.
  • the transparent heat-dissipating substrate is glass, and the heat-dissipating conductive film layer is a silver-plated layer.
  • the heat-dissipating conductive film layer is a silver-plated layer
  • the silver-plated layer has a function of light reflection while radiating heat and electricity.
  • a plurality of heat-conducting support wires are disposed on the outer surface of the transparent heat-dissipating substrate and in the window portion, the heat-conducting support wires are the same as the heat-dissipating conductive film layer, each of the strips Both ends of the heat-conducting support wire are connected to the full-filled portion, and the heat-conducting support wire is disposed on a bottom surface of the LED double-sided light-emitting chip, and heat generated by the operation of the LED double-sided light-emitting chip is conducted through the heat-conductive support wire.
  • the transparent heat dissipating substrate and the heat dissipating conductive film layer are simultaneously radiated, and the light emitted by the bottom surface of the LED double-sided light emitting chip passes through a gap between the heat conducting support lines and transmits through the transparent heat dissipating substrate. Go to the external environment.
  • the electrodes on both sides of the bottom surface of the LED double-sided light-emitting chip are electrically connected to the top surface of the full-side portion on both sides of the window portion, and the LED double-sided light-emitting chip working place
  • the generated heat is directly transmitted to the transparent heat dissipating substrate, and the heat is radiated simultaneously.
  • the light emitted from the bottom surface of the LED double-sided light emitting chip passes through the window portion and transmits the transparent heat dissipating substrate to the external environment.
  • the transparent heat dissipation plate is mounted on the heat dissipation frame, and the heat dissipation heat dissipation plate further heats the transparent heat dissipation plate to reduce the operating temperature of the LED double-sided light-emitting chip.
  • the LED light source is a light source of an LED lamp
  • the LED lamp comprises a lamp holder and a lamp cover, wherein the lamp cover is connected to the lamp holder, the transparent heat dissipation plate is annular, and the heat dissipation frame comprises a heat dissipation fixing tube and a heat dissipation plug pipe.
  • the heat dissipating tube is inserted into the lamp holder, and the heat dissipating tube is inserted at the other end of the heat dissipating tube.
  • the transparent heat dissipating plate is interposed between the heat dissipating tube and the heat dissipating tube.
  • the transparent heat sink further dissipates heat through the heat dissipation frame.
  • the heat-dissipating fixed tube is provided with a socket, and the socket extends horizontally to form a first clamping ring
  • the heat-dissipating plug tube includes a cannula and a second horizontal clamping plate, wherein the insertion tube is inserted into the socket of the heat-dissipating fixed tube
  • the transparent heat dissipation plate is sandwiched between the first clamping ring and the second horizontal clamping plate, and the LED double-sided light emitting chip ring is disposed around the transparent heat dissipation plate.
  • the LED light source is a light source of an LED lamp
  • the LED lamp includes a lamp holder and a lamp cover, wherein the lamp cover is connected to the lamp holder, the transparent heat dissipation plate is in a plate shape, and the heat dissipation frame is sandwiched on both sides of the transparent heat dissipation plate A plurality of the heat dissipation racks are simultaneously inserted on the lamp holder.
  • the LED light source is a light source of an LED lamp
  • the LED lamp includes a lamp holder and a lamp cover, wherein the lamp cover is connected to the lamp holder, the transparent heat dissipation plate is annular, and the heat dissipation frame is connected in the lamp holder, the LED
  • the double-sided light-emitting chip ring is disposed around the transparent heat-dissipating plate, and the LED double-sided light-emitting chip is covered with a silica gel layer, and the lamp cover is filled with a heat-conducting gas, and the heat-dissipating efficiency of the LED double-sided light-emitting chip can be improved by the heat-conducting gas .
  • the full-charged portion includes a plurality of conductive heat-dissipating portions, and the plurality of conductive heat-dissipating portions are disposed independently of each other, and the plurality of conductive heat-dissipating portions are simultaneously attached to an outer surface of the transparent heat-dissipating substrate, and the illuminating body is disposed at any adjacent two of the conductive heat-dissipating portions Between the portions, the adjacent electrical connecting lines of the illuminants are electrically connected to the conductive heat dissipating portion, so that a plurality of the illuminants are connected in series and connected.
  • the heat-dissipating conductive film layer is further connected to the external heat-dissipating portion, and the heat-dissipating heat-dissipating portion further assists heat dissipation of the heat-dissipating conductive film layer.
  • An LED light source emitting and dissipating method wherein a plurality of the LED double-sided light emitting chips are disposed on a transparent heat dissipating plate, wherein the transparent heat dissipating plate comprises a transparent heat dissipating substrate and a heat dissipating conductive film layer, wherein the heat dissipating conductive film layer is adhered to the transparent heat dissipating substrate
  • the transparent heat dissipation substrate is made of a light-transmissive heat-dissipating material
  • the heat-dissipating conductive film layer is made of a heat-dissipating heat-dissipating conductive material
  • the heat-dissipating conductive film layer is divided into a full-filled portion and a window portion, the full-fill portion and The window is partially spaced, and the LED double-sided light emitting chip is horizontally disposed at the position of the window portion.
  • the light generated by the outer side of the LED double-sided light emitting chip Directly emitted into the external environment, the light generated by the inner side of the LED double-sided light-emitting chip passes through the window portion and transmits through the transparent heat-dissipating substrate to the external environment.
  • the present invention has the beneficial effects that the present invention provides a plurality of the LED double-sided light-emitting chips on a transparent heat-dissipating plate, the heat-dissipating conductive film layer including a full portion and a window portion, and the full-fill portion and the window portion are spaced apart.
  • the LED double-sided light emitting chip is horizontally disposed at the position of the window portion. At this moment, the light generated by the outer side of the LED double-sided light emitting chip is directly emitted into the external environment, and the light generated by the inner side of the LED double-sided light emitting chip passes through.
  • the window portion is transmitted through the transparent heat dissipation substrate to the external environment.
  • the purpose of setting the window portion is also to fully utilize the characteristics of the double-sided illumination of the LED double-sided light-emitting chip, so that the light energy is lost as little as possible.
  • the purpose of providing the heat-dissipating conductive film layer is mainly to utilize the material properties to maximize the heat dissipation of the LED double-sided light-emitting chip, thereby minimizing the operating temperature thereof.
  • FIG. 1 is a schematic structural view of a positive-loading chip of the present invention.
  • FIG. 2 is a schematic structural view of a flip chip according to the present invention.
  • Figure 3 is a schematic view showing the structure of the present invention applied to a luminaire.
  • FIG. 4 is a front view of the light-emitting and heat-dissipating structure of the LED light source of the lamp of FIG.
  • 5, 7, 8, 9, and 10 are schematic structural views of the present invention applied to a luminaire.
  • FIG. 6 is a top view of the LED light source emitting heat dissipation structure of the lamp of FIG. 5.
  • FIG. 11 is a schematic structural view of the LED double-sided light emitting chip of FIG. 10 disposed on a transparent heat dissipation plate.
  • FIG. 12 is a schematic structural view showing the connection of the external heat dissipating portion of the heat dissipating conductive film layer of the present invention.
  • an LED light source illuminating heat-dissipating structure the LED light source is an LED double-sided light-emitting chip, and the applicant of the present invention discloses an LED light source and the PCT International Application No. PCT/CN2011/000756.
  • a technique for manufacturing the same which describes an LED element capable of emitting light through both sides, thereby preventing heat from being concentrated on a bonding surface and a substrate of a conventional LED light source, and directly connecting the LED elements and the two fluorescent elements in a sandwich manner Thereby forming one or more passage openings to thereby achieve heat transfer through the passage openings for guiding the LED elements.
  • the structure mainly includes one or more LED light source groups, wherein each of the LED light source groups includes: at least one LED element, wherein the LED element has a first light emitting surface and a second light emitting surface on the reverse side, wherein the The LED element is adapted to provide illumination at an angle greater than 180° by electroluminescence on each of the first illuminating surface and the second illuminating surface; two fluorescent elements, the two fluorescent elements being respectively located at the first of the LED elements a light emitting surface and the second light emitting surface portion to maintain the LED elements in position such that illumination generated by the LEDs respectively passes from the light emitting surface through the two fluorescent elements; and an electronic component, the electrons An element is coupled to the LED element to electrically connect the LED element to a power source.
  • the LED element is sandwiched by the two fluorescent elements to maintain the LED element in position such that the first light emitting surface and the second light emitting surface are directly pressed against the fluorescent element to obtain Supporting and directing heat transfer away from the LED elements, and the LED elements are held within an LED receiving cavity of the gap between the fluorescent elements.
  • PCT/CN2011/000756 has a small volume and good illumination effect on the product of the invention, and can simultaneously emit light simultaneously in all directions by using one LED light source, but in the specific implementation, since it only passes through the first light emitting surface and the first
  • the second light-emitting device faces the LED element for heat dissipation, but the idea is good, but in the specific implementation, the heat dissipation effect is not ideal, and the heat dissipation is slow, which causes the LED element to overheat.
  • the inventor of the present invention combines the technical features of PCT/CN2011/000756 to improve its heat dissipation mode and apply it to the backlight product of the present invention, so that the backlight product of the present invention has a luminous effect and an operating temperature. All have reached the ideal state, as described below.
  • the LED double-sided light emitting chip has an upper light emitting surface and a lower light emitting surface.
  • the LED double-sided light-emitting chip has six light-emitting surfaces, and includes a plurality of layers which are sequentially overlapped and arranged.
  • the LED double-sided light-emitting chips sequentially overlap and arrange a rigid and transparent base layer, a light-emitting layer and a current dispersion.
  • the flip-chip structure of the LED double-sided light-emitting chip has a simple structure and can define the upper light-emitting surface and the lower light-emitting surface.
  • the specific structure of the LED double-sided light-emitting chip is already in the previous case PCT/CN2011/000756. The disclosure here is no longer exhaustive.
  • the transparent heat-dissipating plate 100 includes a transparent heat-dissipating substrate 110 and a heat-dissipating conductive film layer 120.
  • the heat-dissipating conductive film layer 120 is attached to the transparent heat-dissipating substrate 110. On the surface.
  • the transparent heat dissipation substrate 110 is made of a light-transmitting heat dissipation material such as glass, sapphire or the like.
  • the heat-dissipating conductive film layer 120 is made of a heat-conductive heat-dissipating conductive material such as silver paste.
  • the outer surface of the transparent heat-dissipating substrate 110 needs to be first etched and roughened, and then the heat-dissipating conductive film layer 120 is attached.
  • the method has strong adhesion and good product quality.
  • the heat-dissipating conductive film layer 120 includes a full portion 121 and a window portion 122, and the full portion 121 and the window portion 122 are spaced apart.
  • the LED double-sided light emitting chip is horizontally disposed at the position of the window portion 122. At this moment, the light generated by the outer side of the LED double-sided light emitting chip is directly emitted into the external environment, and the light generated by the inner side of the LED double-sided light emitting chip After passing through the window portion 122 and passing through the transparent heat dissipation substrate 110, it is transmitted to the external environment.
  • the purpose of setting the window portion 122 is also to fully utilize the characteristics of the double-sided illumination of the LED double-sided light-emitting chip, so that the light energy is lost as little as possible.
  • the purpose of providing the heat-dissipating conductive film layer 120 is mainly to utilize the material properties to maximize the heat dissipation of the LED double-sided light-emitting chip, thereby minimizing the operating temperature thereof.
  • the thickness is preferably such that the glass layer is 0.6 mm thick and the silver paste layer is 10 ⁇ m thick.
  • the heat-dissipating conductive film layer 120 is a silver paste
  • the silver paste layer also has a function of light reflection while radiating heat, thereby reflecting light to the direction of the diffusion plate 10 as much as possible.
  • the LED double-sided light-emitting chip can be horizontally disposed at the position of the window portion 122 in both a front and a flip-chip manner.
  • a plurality of heat-conducting support lines 123 are disposed on the outer surface of the transparent heat-dissipating substrate 110 and in the window portion 122.
  • the material of the heat dissipation conductive film layer 120 is the same.
  • Both ends of each of the heat conduction support lines 123 are connected to the full attachment portion 121.
  • the heat-conducting support line 123 is mounted on the bottom surface of the LED double-sided light-emitting chip, and the heat generated by the operation of the LED double-sided light-emitting chip is conducted to the transparent heat-dissipating substrate 110 and the heat-dissipating conductive film layer 120 through the heat-conducting support line 123. And heat dissipation simultaneously.
  • the light emitted from the bottom surface of the LED double-sided light-emitting chip passes through the gap between the plurality of heat-conductive support lines 123 and transmits through the transparent heat-dissipating substrate 110 to be transmitted to the external environment.
  • the width of the thermally conductive support line 123 is preferably five microns.
  • the electrodes on both sides of the bottom surface of the LED double-sided light emitting chip are electrically connected to the top surface of the full portion 121 on both sides of the window portion 122.
  • the heat generated by the operation of the LED double-sided light-emitting chip is directly transmitted to the transparent heat-dissipating substrate 110, and the heat is simultaneously radiated.
  • Light emitted from the bottom surface of the LED double-sided light-emitting chip passes through the window portion 122 and transmits through the transparent heat-dissipating substrate 110 to be transmitted to the external environment.
  • the technology of the present invention can be applied to a wide range of fields, and the LED light source body produced by the technology of the present invention can replace the light source of all LED lamps, and has the advantages of good luminous effect, small volume and low working temperature. ,
  • the transparent heat dissipation plate 100 may be designed in a circular shape, a strip shape or other shapes.
  • the transparent heat dissipation plate 100 is mounted on the heat dissipation frame 200, and further through the heat dissipation frame 200.
  • the transparent heat dissipation plate 100 performs heat conduction to reduce the operating temperature of the LED double-sided light-emitting chip.
  • the heat dissipation frame 200 may be made of metal copper or other heat-dissipating metal.
  • the LED light source is a light source of an LED lamp.
  • the LED lamp includes a lamp holder and a lamp cover.
  • the lamp cover is connected to the lamp holder.
  • the transparent heat dissipation plate 100 is annular.
  • the heat dissipation frame 200 includes a heat dissipation fixing tube 210 and heat dissipation.
  • the insertion tube 220 wherein one end of the heat dissipation fixing tube 210 is inserted into the socket, the heat dissipation socket 220 is inserted at the other end of the heat dissipation fixing tube 210, and the transparent heat dissipation plate 100 is sandwiched between the heat dissipation fixing tube
  • the transparent heat dissipation plate 100 is further dissipated by the heat dissipation frame 200 between the 210 and the heat dissipation socket 220.
  • the heat-dissipating fixed tube 210 is provided with a socket at one end thereof, and the socket extends horizontally to form a first clamping ring 211.
  • the heat-dissipating plug tube 220 includes a cannula 221 and a second horizontal clamping plate 222, wherein the cannula The 221 is inserted in the socket of the heat dissipation fixing tube 210.
  • the transparent heat dissipation plate 100 is interposed between the first clamping ring 211 and the second horizontal clamping plate 222.
  • the LED double-sided light emitting chip ring is disposed on the transparent The heat sink 100 is surrounded.
  • the LED light source is a light source of an LED lamp.
  • the LED lamp includes a lamp holder and a lamp cover.
  • the lamp cover is connected to the lamp holder.
  • the transparent heat dissipation plate 100 has a plate shape, and the heat dissipation frame 200 is sandwiched between the transparent heat dissipation plate. On both sides of the 100, a plurality of the heat dissipation frames 200 are simultaneously inserted on the lamp holder.
  • the LED light source is a light source of an LED lamp.
  • the LED lamp includes a lamp holder and a lamp cover.
  • the lamp cover is connected to the lamp holder.
  • the transparent heat dissipation plate 100 is annular, and the heat dissipation frame 200 is connected.
  • the LED double-sided light emitting chip ring is disposed around the transparent heat dissipation plate 100.
  • the LED double-sided light-emitting chip is covered with a silica gel layer, and the lamp cover is filled with a heat-conducting gas, and the heat-dissipating efficiency of the LED double-sided light-emitting chip can be improved by the heat-conducting gas.
  • the traditional LED lamp is close to the white candle, the heat cannot be dissipated immediately because the chip is wrapped with silica gel.
  • the original light performance of the original chip can reach 180 lm or more due to the high working temperature, which can only reach 120 lm.
  • the invention overcomes the shortcomings of the conventional technology, and utilizes the above structure to dissipate heat by directly contacting the heat-dissipating silicone coating surface with the heat-conducting gas.
  • the chip of the invention is connected by a silver layer, and the heat generated by the chip PN junction can be first. Time is exported by the silver layer.
  • the heat-dissipating conductive film layer 120 is also coated with a high heat radiation material to enhance the heat dissipation effect.
  • the full-side portion 121 includes a plurality of conductive heat-dissipating portions 124 , and the plurality of conductive heat-dissipating portions 124 are disposed independently of each other, and the plurality of conductive heat-dissipating portions 124 are simultaneously attached to the transparent heat-dissipating substrate 110 .
  • the outer surface On the outer surface.
  • the illuminant 31 is disposed between any two adjacent conductive heat dissipating portions 124.
  • the electrical connection lines of the adjacent illuminants 31 are electrically connected to the conductive heat dissipating portion 124, respectively, so that a plurality of the illuminants 31 are connected in series. Connection relationship. That is to say, when a plurality of the conductive heat dissipating portions 124 are used for heat dissipation and at the same time they are connected to the conductive connection, the structure can be used for the modules of various lamps without additional heat sinks.
  • the heat-dissipating conductive film layer 120 is further connected to the external heat-dissipating portion 125, and the heat-dissipating heat-dissipating portion 125 further assists the heat-dissipating conductive film layer to dissipate heat.
  • a high-thermal bonding or soldering method may be employed, and a soldering method is preferred.
  • the LED lamp described above may also be a lamp of various forms as shown in FIGS. 5 to 9.
  • a method for illuminating and dissipating heat of an LED light source a plurality of the LED double-sided light-emitting chips are disposed on a transparent heat-dissipating plate 100, wherein the transparent heat-dissipating plate 100 includes a transparent heat-dissipating substrate 110 and a heat-dissipating conductive film layer 120, wherein The heat dissipation conductive film layer 120 is attached to the outer surface of the transparent heat dissipation substrate 110.
  • the transparent heat dissipation substrate 110 is made of a light-transmitting heat dissipation material such as glass, sapphire or the like.
  • the heat-dissipating conductive film layer 120 is made of a heat-conductive heat-dissipating conductive material such as silver paste.
  • the outer surface of the transparent heat-dissipating substrate 110 needs to be first etched and roughened, and then the heat-dissipating conductive film layer 120 is attached.
  • the method has strong adhesion and good product quality.
  • the heat dissipation conductive film layer 120 is divided into a full portion 121 and a window portion 122, and the full portion 121 and the window portion 122 are spaced apart.
  • the LED double-sided light emitting chip is horizontally disposed at the position of the window portion 122. At this moment, the light generated by the outer side of the LED double-sided light emitting chip is directly emitted into the external environment, and the inner side of the LED double-sided light emitting chip is generated. Light passes through the window portion 122 and passes through the transparent heat dissipation substrate 110 and is transmitted to the external environment.
  • the purpose of setting the window portion 122 is also to fully utilize the characteristics of the double-sided illumination of the LED double-sided light-emitting chip, so that the light energy is lost as little as possible.
  • the purpose of providing the heat-dissipating conductive film layer 120 is mainly to utilize the material properties to maximize the heat dissipation of the LED double-sided light-emitting chip, thereby minimizing the operating temperature thereof.
  • the thickness is preferably such that the glass layer is 0.6 mm thick and the silver paste layer is 10 ⁇ m thick.
  • the heat-dissipating conductive film layer 120 is a silver paste
  • the silver paste layer also has a function of light reflection while radiating heat, thereby reflecting light to the direction of the diffusion plate 10 as much as possible.
  • the LED double-sided light-emitting chip can be horizontally disposed at the position of the window portion 122 in both a front and a flip-chip manner.
  • a plurality of heat-conducting support lines 123 are disposed on the outer surface of the transparent heat-dissipating substrate 110 and in the window portion 122, and the heat-conductive support lines 123 and the heat-dissipating conductive film layer 120 are disposed.
  • the materials are the same. Both ends of each of the heat conduction support lines 123 are connected to the full attachment portion 121.
  • the heat-conducting support line 123 is mounted on the bottom surface of the LED double-sided light-emitting chip, and the heat generated by the operation of the LED double-sided light-emitting chip is conducted to the transparent heat-dissipating substrate 110 and the heat-dissipating conductive film layer 120 through the heat-conducting support line 123. And heat dissipation simultaneously.
  • the light emitted from the bottom surface of the LED double-sided light-emitting chip passes through the gap between the plurality of heat-conductive support lines 123 and transmits through the transparent heat-dissipating substrate 110 to be transmitted to the external environment.
  • the width of the thermally conductive support line 123 is preferably five microns.
  • the electrodes on both sides of the bottom surface of the LED double-sided light emitting chip are electrically connected to the top surface of the full portion 121 on both sides of the window portion 122.
  • the heat generated by the operation of the LED double-sided light-emitting chip is directly transmitted to the transparent heat-dissipating substrate 110, and the heat is simultaneously radiated.
  • Light emitted from the bottom surface of the LED double-sided light-emitting chip passes through the window portion 122 and transmits through the transparent heat-dissipating substrate 110 to be transmitted to the external environment.
  • the transparent heat dissipation plate 100 may be designed in a circular shape, a strip shape or other shapes.
  • the transparent heat dissipation plate 100 is mounted on the heat dissipation frame 200, and further through the heat dissipation frame 200.
  • the transparent heat dissipation plate 100 performs heat conduction to reduce the operating temperature of the LED double-sided light-emitting chip.
  • the heat dissipation frame 200 may be made of metal copper or other heat-dissipating metal.

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  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

L'invention concerne une structure électroluminescente et de dissipation de chaleur d'une source de lumière à diodes électroluminescentes (DEL), et un procédé électroluminescent et de dissipation de chaleur s'y rapportant. La source de lumière à DEL est constituée de puces DEL double face (A). Plusieurs puces DEL double face (A) sont agencées sur une plaque de dissipation de chaleur transparente (100). La plaque de dissipation de chaleur transparente (100) comprend un substrat de dissipation de chaleur transparent (110) et une couche de film mince de dissipation de chaleur électroconductrice (120). La couche de film mince de dissipation de chaleur électroconductrice (120) est fixée sur la surface extérieure du substrat de dissipation de chaleur transparent (110). La couche de film mince de dissipation de chaleur électroconductrice (120) comprend des parties complètement fixées (121) et des parties fenêtre (122). Les parties complètement fixées (121) et les parties fenêtre (122) sont séparées par des espaces. Les puces DEL double face (A) sont agencées horizontalement à l'endroit où les parties fenêtre (122) sont situées. De la lumière produite au niveau des faces latérales extérieures des puces DEL double face (A) est émise directement dans l'environnement externe. De la lumière produite au niveau des faces latérales intérieures des puces DEL double face est transmise à l'environnement externe par l'intermédiaire des parties fenêtre (122) et ensuite à travers le substrat de dissipation de chaleur transparent (110).
PCT/CN2015/087461 2014-08-26 2015-08-18 Structure électroluminescente et de dissipation de chaleur de source de lumière à del, et procédé électroluminescent et de dissipation de chaleur s'y rapportant WO2016029808A1 (fr)

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Application Number Priority Date Filing Date Title
CN201410422826.7A CN105444036B (zh) 2014-08-26 2014-08-26 一种led光源发光散热结构
CN201410422826.7 2014-08-26

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WO2016029808A1 true WO2016029808A1 (fr) 2016-03-03

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109488918A (zh) * 2018-11-30 2019-03-19 深圳拓邦股份有限公司 一种led线形灯

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105371161B (zh) * 2014-08-26 2018-08-28 蔡鸿 一种led直下式背光源及其发光方法

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