WO2014201774A1 - Lampe à ampoule à del pouvant émettre des lumières dans toutes les directions - Google Patents

Lampe à ampoule à del pouvant émettre des lumières dans toutes les directions Download PDF

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Publication number
WO2014201774A1
WO2014201774A1 PCT/CN2013/083662 CN2013083662W WO2014201774A1 WO 2014201774 A1 WO2014201774 A1 WO 2014201774A1 CN 2013083662 W CN2013083662 W CN 2013083662W WO 2014201774 A1 WO2014201774 A1 WO 2014201774A1
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WO
WIPO (PCT)
Prior art keywords
light
transparent
led
chip
emitting
Prior art date
Application number
PCT/CN2013/083662
Other languages
English (en)
Chinese (zh)
Inventor
何文铭
唐春生
唐秋熙
童庆峰
申小飞
Original Assignee
福建省万邦光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 福建省万邦光电科技有限公司 filed Critical 福建省万邦光电科技有限公司
Publication of WO2014201774A1 publication Critical patent/WO2014201774A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to the field of semiconductor illumination, in particular to an LED bulb with omnidirectional light output.
  • LEDs are known as the fourth generation of light sources after incandescent, fluorescent and high-pressure discharge lamps.
  • MOCVD metal organic chemical vapor deposition
  • LEDs are III-V compound semiconductors (such as GaAs, GaP or GaN)
  • the material is a substrate.
  • half of the III group is doped to form a P-type material, and the other half is doped with a V group to form an N-type material.
  • the electrons diffuse from the N region to the P region, and the holes are separated by P.
  • the region diffuses toward the N region, forming a PN junction at the boundary between the two halves, and simultaneously generates a barrier to prevent further diffusion of electrons and holes to reach an equilibrium state.
  • PN junction When a PN junction is applied with a forward bias voltage, PN The junction barrier is lowered, the N region electrons are injected into the P region, and the electrons and holes are in the PN.
  • the junction meets and recombines and the excess energy is released as photons.
  • the frequency of the emitted photons is determined by the semiconductor band gap. Therefore, LEDs made of materials with different forbidden band widths emit different wavelengths of light, LED The emitted light is narrow-band monochromatic light, so a single LED chip cannot obtain white light.
  • white light that can be seen by human eyes can be made up of two or more types of monochromatic light. Based on this principle, there are three ways to get white LEDs, the first one is in blue LEDs.
  • the chip is coated with a yellow phosphor that can be excited by blue light.
  • the blue light emitted by the chip complements the yellow light emitted by the phosphor to form white light; the second is in the blue LED.
  • the chip is coated with green and red phosphors, and the blue light emitted by the chip is combined with the green and red light emitted by the phosphor to obtain white light; the third is in violet or ultraviolet LED Applying phosphors of three primary colors or multiple colors on the chip, using the long-wave ultraviolet light (370nm - 380nm) or violet light (380nm - 410nm) emitted by the chip ) to excite the phosphor to achieve white light emission.
  • the prior art white LEDs are mostly composed of blue LED chips and phosphors.
  • the principle is LED
  • the blue light emitted by the chip excites the phosphor to produce yellow light, which is mixed with yellow light to produce white light.
  • the package is usually to fix the LED chip on the substrate with a bonding adhesive, and then in the LED
  • the chip is covered with a phosphor layer.
  • the LED light source packaged in this way is an opaque material, and its illumination angle is only 180 o at most.
  • This package has the following disadvantages: l.
  • the LED chip is originally a 360 o illuminator.
  • the opaque substrate is used for concentrating or connecting with a metal heat sink.
  • the original 360 o illuminator is made.
  • 180 o illuminator which makes the 180 side of the radiator The light of o must be reflected to be emitted, so the reflectivity of the surface of the substrate has a great influence on the light effect.
  • a silver reflective layer with a high reflectivity is formed on the substrate, which is expensive and complicated to manufacture, resulting in high cost of the bulb. The yield is low. 2 substrate pair LED The heat dissipation of the chip hinders the heat dissipation effect of the overall light source.
  • the substrate material is generally made of a metal substrate.
  • the insulation resistance of the metal substrate is poor. Therefore, it is necessary to use a solid crystal primer with excellent insulation performance, but the transmittance of the solid crystal primer with good insulation performance is better. Low, thus further affecting the light efficiency of the entire system.
  • the light bulb Since the light bulb is connected to the power supply bracket by the core column, a part of the light is blocked by the core column and cannot be transmitted, and the light bulb is assembled with many welding points, and the light strip is only Through the connection of the connectors, the contact area of the connector is small, which affects the heat dissipation performance of the system.
  • the prior art high-angle light-emitting LED Lamps generally have many shortcomings such as low light efficiency, poor electrical connection reliability, complicated assembly process, and poor heat dissipation.
  • An omnidirectional LED a bulb lamp comprising a light-emitting portion and an electrical connection portion, the electrical connection portion being composed of a control circuit, an electrical connector, and an insulating connector, the control circuit being mounted in the electrical connector, through the insulating connector and the light-emitting device Partial connection, characterized in that: the light-emitting portion is covered by a transparent cover, a transparent bulb and The LED light source is configured, the LED light source is installed between the transparent upper cover and the transparent outer casing, and the transparent upper cover and the transparent outer casing are glued or screwed, the LED The light source comprises a transparent substrate, and at least one string of LED chips connected in series in the same direction is mounted on the transparent substrate, and the light output angle of the LED chip is 360 o, LED The chip is fixed on the transparent substrate with a solid crystal insulating glue, and the surface of the LED chip and the back surface of the transparent substrate are covered with a phosphor layer, and the phosphor will be LED Part of the blue light emitted by the
  • the transparent substrate, the transparent upper cover, and the transparent bulb may be doped with fluorescent ions, and the fluorescent ions will be LED Part of the blue light emitted by the chip is converted into red light or yellow light, thereby obtaining white light with a high color rendering index, and the center of the transparent substrate is evaporated with a transparent electrode, the LED
  • the chip is electrically connected to the electrode through a gold wire or an aluminum wire, and the transparent electrode is connected to the control power source by using a wire, and the transparent electrode material may be ITO, graphene or ZnO.
  • the material of the transparent substrate, the transparent upper cover and the transparent blister may be transparent ceramic, glass ceramic or single crystal with high thermal conductivity, and one end of the near-electric connector of the transparent blister is provided with a light reflection a plate; the transparent upper cover may be A-type, G-type, R-type, PAR-type, T-type, candle type or any of the bulbs of existing bulbs.
  • LED The chip emits blue light to excite the phosphor layer to produce yellow light, and the blue light and yellow light mix to obtain white light. It is also possible to incorporate fluorescent ions into the transparent substrate, the transparent upper cover and the transparent bulb to obtain a higher color rendering index, and the white light is emitted. The process is basically not blocked, and the range of light is close to 360 o , and the heat generated by the chip passes through the high thermal conductive transparent substrate, and the transparent upper cover and the transparent blister can be quickly dissipated.
  • FIG. 1 is a schematic structural view of an omnidirectional light-emitting LED bulb according to the present invention.
  • 101 is a transparent cover
  • 102 is LED light source
  • 103 is transparent bulb
  • 104 is reflective layer
  • 105 is control power
  • 106 is wire
  • 107 is insulated connector
  • 108 is electrical connector
  • FIG. 2 is a schematic view showing the structure of an LED light source of an omnidirectional light-emitting LED bulb according to the present invention.
  • 201 for the transparent electrode 202 is an LED chip
  • 203 is a gold wire
  • 204 is a transparent substrate
  • 205 is a phosphor layer.
  • FIG. 1 is a schematic structural view of an embodiment of an omnidirectional light-emitting LED bulb according to the present invention, which will control a power supply 105 is mounted in the electrical connector 108, and the electrical connector 108 is combined with the light-transmitting bulb 103 by an insulating connector 107, and then the packaged 360 o light-emitting LED is assembled.
  • the light source 102 is mounted in the light-transmissive bulb 103, covered with a transparent upper cover 101 and sealed with glue.
  • the LED light source 102 as shown in Fig. 2, will be an LED chip 202.
  • the bonding is formed on the transparent substrate 204, and the LED chip 202 and the transparent substrate 204 are bonded by a high thermal conductive solid glue, and the ITO is evaporated at a central position of the transparent substrate to form a transparent electrode.
  • the transparent electrode material is ITO, and a gold wire 203 is used between the transparent electrode 201 and the LED chip 202.
  • the prepared phosphor powder 109 is covered on the surface of the chip and the back surface of the transparent substrate, and the control power source 105 and the transparent electrode 201 are connected by a wire 106, wherein the transparent cover 101
  • the transparent bulb 103 is a glass ceramic, and the transparent substrate 204 is a single crystal material doped with erbium ions. After the package is completed, the bulb has a full light effect of 151 lm/W and a color rendering index of 80 ⁇ .
  • FIG. 1 is a schematic structural view of another embodiment of an omnidirectional light-emitting LED bulb according to the present invention, which will control a power supply.
  • 105 is mounted in the electrical connector 108, and the electrical connector 108 is combined with the light-transmitting bulb 103 by an insulating connector 107, and then the packaged 360 o light-emitting LED is assembled.
  • the light source 102 is mounted in the light-transmissive bulb 103, covered with a transparent upper cover 101 and sealed with glue.
  • the LED light source 102 as shown in Fig. 2, will be an LED chip 202.
  • the bonding is formed on the transparent substrate 204, and the LED chip 202 and the transparent substrate 204 are bonded by a high thermal conductive solid glue, and ZnO is evaporated and formed at a central position of the transparent substrate to form a transparent electrode.
  • 201, the transparent electrode 201 and the LED chip 202 are soldered by a gold wire 203, and a wire 106 is used between the control power source 105 and the transparent electrode 201.
  • the connection wherein the transparent upper cover 101, the transparent blister 103 and the transparent substrate 204 are both transparent ceramics doped with Ce3+ ions and Eu2+ ions, and the bulb is fully illuminated after the package is completed. 117lm/W, color rendering index is 90.
  • FIG. 1 is a schematic structural view of another embodiment of an omnidirectional light-emitting LED bulb according to the present invention, which will control a power supply 105 is mounted in the electrical connector 108, and the electrical connector 108 is combined with the light-transmitting bulb 103 by an insulating connector 107, and then the packaged 360 o light-emitting LED is assembled.
  • the light source 102 is mounted in the light-transmissive bulb 103, covered with a transparent upper cover 101 and sealed with glue.
  • the LED light source 102 as shown in Fig. 2, will be an LED chip 202.
  • the bonding is formed on the transparent substrate 204, and the LED chip 202 and the transparent substrate 204 are bonded by a high thermal conductive solid glue, and the ITO is evaporated at a central position of the transparent substrate to form a transparent electrode.
  • the transparent electrode 201 and the LED chip 202 are soldered with a gold wire 203, and after the soldering is completed, the prepared phosphor powder 109 is covered on the surface of the chip and the back surface of the transparent substrate, and the control power source is controlled.
  • the bulb lamp has a full light efficiency of 96 lm/W and a color rendering index of 95 ⁇ .

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une lampe à ampoule à DEL pouvant émettre des lumières dans toutes les directions qui comprend une partie électroluminescente et une partie de connexion électrique. La partie de connexion électrique et la partie électroluminescente sont connectées au moyen d'un composant (107) de connexion d'isolation. La partie électroluminescente est constituée d'un couvercle (101) transparent supérieur, d'un logement d'ampoule (103) transparent et d'une source de lumière (102) à DEL. La source de lumière (102) à DEL est montée entre le couvercle (101) transparent supérieur et le logement d'ampoule (103) transparent. La source de lumière (102) à DEL est formée en collant une puce de DEL (202) sur un substrat (204) transparent au moyen de colle de fixation (109) en cristal transparent. Des lumières bleues émises par la puce de DEL (202) excitent de la colle en poudre fluorescente appliquée sur la surface de la puce de DEL (202) ou des ions fluorescents dopés sur le couvercle (101) transparent supérieur, le logement d'ampoule (103) transparent ou le substrat (204) transparent pour générer des lumières jaunes et des lumières rouges, et les lumières jaunes et les lumières rouges sont combinées avec les lumières bleues pour générer des lumières blanches. La portée d'émission de lumière de la lampe à ampoule à DEL est proche de 360 degrés, un effet d'éclairage supérieur peut être obtenu, et les défauts de mauvaise connexion électrique, de mauvaise conductivité thermique et de petit angle d'émission de lumière dans une lampe à ampoule électroluminescente à grand angle traditionnelle sont surmontés efficacement ; et la lampe à ampoule à DEL convient à une popularisation à grande échelle.
PCT/CN2013/083662 2013-06-19 2013-09-17 Lampe à ampoule à del pouvant émettre des lumières dans toutes les directions WO2014201774A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2013102442651A CN103335226A (zh) 2013-06-19 2013-06-19 一种全方向出光的led球泡灯
CN201310244265.1 2013-06-19

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WO2014201774A1 true WO2014201774A1 (fr) 2014-12-24

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CN107702997A (zh) * 2017-10-30 2018-02-16 贵州润柏吉科技有限公司 灯泡耐压检测装置
CN111954026A (zh) * 2016-02-29 2020-11-17 格雷斯诺特公司 利用基于参考流比较的多匹配检测的媒体频道识别和动作
WO2023123324A1 (fr) * 2021-12-31 2023-07-06 深圳易联智能电气有限公司 Ensemble source de lumière et dispositif d'ajout de lumière

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CN103697351A (zh) * 2013-12-03 2014-04-02 杭州杭科光电股份有限公司 一种led日光灯组件
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
JP2017528876A (ja) * 2014-11-17 2017-09-28 フィリップス ライティング ホールディング ビー ヴィ 照明デバイス
CN104806905A (zh) * 2015-03-31 2015-07-29 章建 一种光源和电源一体的高散热四面发光led灯
CN104948953A (zh) * 2015-06-16 2015-09-30 吴明番 全发光高照度led灯泡及其组装方法
CN105222101A (zh) * 2015-10-23 2016-01-06 晶阳照明有限公司 一种发光二极管灯板与照明装置
CN106224799A (zh) * 2016-07-26 2016-12-14 江门市龙胜光电科技有限公司 一种背面发光的飞碟灯

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CN202252997U (zh) * 2011-09-09 2012-05-30 福建省万邦光电科技有限公司 带塑料外壳的高白度基板led球泡灯
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CN111954026A (zh) * 2016-02-29 2020-11-17 格雷斯诺特公司 利用基于参考流比较的多匹配检测的媒体频道识别和动作
CN111954026B (zh) * 2016-02-29 2024-03-01 六科股份有限公司 利用基于参考流比较的多匹配检测的媒体频道识别和动作
CN107702997A (zh) * 2017-10-30 2018-02-16 贵州润柏吉科技有限公司 灯泡耐压检测装置
WO2023123324A1 (fr) * 2021-12-31 2023-07-06 深圳易联智能电气有限公司 Ensemble source de lumière et dispositif d'ajout de lumière

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