JP6360180B2 - Led照明装置 - Google Patents
Led照明装置 Download PDFInfo
- Publication number
- JP6360180B2 JP6360180B2 JP2016548056A JP2016548056A JP6360180B2 JP 6360180 B2 JP6360180 B2 JP 6360180B2 JP 2016548056 A JP2016548056 A JP 2016548056A JP 2016548056 A JP2016548056 A JP 2016548056A JP 6360180 B2 JP6360180 B2 JP 6360180B2
- Authority
- JP
- Japan
- Prior art keywords
- base
- heat
- coating layer
- led
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
- F21V23/023—Power supplies in a casing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/15—Thermal insulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Description
(実施例1)
(実施例2)
2 発光チップ、
3 ランプカバー、
31 配光面、
32 熱伝導面、
4 電源チャンパー、
51 第一放熱貫通孔、
52 第一放熱貫通孔。
Claims (10)
- 中空アウトの構造であるベースと、ベースの上表面に直接塗布される回路コーティング層と、直接ベースに貼合され、回路コーティング層によって互いに接続される複数のLED発光チップと、ベースに設けられ、LED発光チップおよび回路コーティング層を覆い、熱伝導材料で製造された中実の部品であり、光線射出面である外表面と配光面および熱伝導面を含む内表面とを備えるランプカバーと、を含み、前記配光面は、内表面におけるLED発光チップに対応するエリアに設置され、LED発光チップとの間には隙間が存在し、ベースの上表面と共に配光チャンパーを形成しており、前記熱伝導面は、内表面における前記配光面以外のエリアの一部または全部に設置され、ベースの形状と対応する形状を有し、かつベースと隙間なく貼合されており、熱伝導面は少なくとも内表面の中央エリアおよびエッジエリアに分布されており、
前記回路コーティング層は金属材料を含む流体又は粉末のコーティング層であり、前記回路コーティング層の厚さは20μm以上であることを特徴とするLED照明装置。 - ランプカバーの内表面は配光面及び熱伝導面のみによって構成されていることを特徴とする請求項1に記載のLED照明装置。
- ランプカバーは透明性セラミックス又はガラスによって製造されていることを特徴とする請求項1または2に記載のLED照明装置。
- 前記透明性セラミックスはPLZT、CaF2、Y2O3、YAG、多結晶AIONとMgAl2O4の内の一種又は複数種類の組み合わせであることを特徴とする請求項3に記載のLED照明装置。
- 前記回路コーティング層の金属材料はモリブデン、マンガン、タングステン、銀、金、プラチナ、銀パラジウム合金、銅、アルミ、スズの内少なくとも一種類又は複数種類によって構成されていることを特徴とする請求項1〜4のいずれか一項に記載のLED照明装置。
- 発光チップが設置されたベースの上表面は曲面又は複数の平面を組み合わせた形状であることを特徴とする請求項1〜5のいずれか一項に記載のLED照明装置。
- ベースには第一放熱貫通孔が設置されていることを特徴とする請求項1〜6のいずれか一項に記載のLED照明装置。
- ランプカバーには、第一放熱貫通孔に対応して連通している第二放熱貫通孔が設置されていることを特徴とする請求項7に記載のLED照明装置。
- ベースは絶縁層が塗布されている金属ベース又は絶縁材料によって製造されているベースであることを特徴とする請求項1〜8のいずれか一項に記載のLED照明装置。
- ハウジングはベースに接続され、チャンパーはベースから隔てている電源チャンパーをさらに含むことを特徴とする請求項1〜9のいずれか一項に記載のLED照明装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410040152.4A CN103791439B (zh) | 2014-01-27 | 2014-01-27 | 新型led照明装置 |
CN201410040152.4 | 2014-01-27 | ||
PCT/CN2014/076052 WO2015109675A1 (zh) | 2014-01-27 | 2014-04-23 | 新型led照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017508246A JP2017508246A (ja) | 2017-03-23 |
JP6360180B2 true JP6360180B2 (ja) | 2018-07-18 |
Family
ID=50667356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016548056A Active JP6360180B2 (ja) | 2014-01-27 | 2014-04-23 | Led照明装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160341413A1 (ja) |
EP (1) | EP3101332A1 (ja) |
JP (1) | JP6360180B2 (ja) |
KR (1) | KR20160132825A (ja) |
CN (1) | CN103791439B (ja) |
CA (1) | CA2937939C (ja) |
WO (1) | WO2015109675A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3102011A4 (en) * | 2014-01-27 | 2017-03-08 | Shanghai Sansi Electronics Engineering Co., Ltd. | Led lighting apparatus, light shade, and circuit manufacturing method for the apparatus |
WO2015109674A1 (zh) * | 2014-01-27 | 2015-07-30 | 上海三思电子工程有限公司 | Led照明装置 |
CN104566309A (zh) * | 2014-12-25 | 2015-04-29 | 上海三思电子工程有限公司 | 一种散热器的制备方法及具有该散热器的灯具 |
CN104659027A (zh) * | 2015-02-09 | 2015-05-27 | 上海三思电子工程有限公司 | 一种led发光体及其制备方法 |
CN106151923A (zh) * | 2015-03-25 | 2016-11-23 | 上海三思电子工程有限公司 | 一种led照明装置 |
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US7728345B2 (en) * | 2001-08-24 | 2010-06-01 | Cao Group, Inc. | Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame |
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DE102010001047A1 (de) * | 2010-01-20 | 2011-07-21 | Osram Gesellschaft mit beschränkter Haftung, 81543 | Leuchtvorrichtung |
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-
2014
- 2014-01-27 CN CN201410040152.4A patent/CN103791439B/zh active Active
- 2014-04-23 JP JP2016548056A patent/JP6360180B2/ja active Active
- 2014-04-23 US US15/114,835 patent/US20160341413A1/en not_active Abandoned
- 2014-04-23 WO PCT/CN2014/076052 patent/WO2015109675A1/zh active Application Filing
- 2014-04-23 CA CA2937939A patent/CA2937939C/en active Active
- 2014-04-23 KR KR1020167023574A patent/KR20160132825A/ko active Search and Examination
- 2014-04-23 EP EP14880067.5A patent/EP3101332A1/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
CN103791439A (zh) | 2014-05-14 |
WO2015109675A1 (zh) | 2015-07-30 |
EP3101332A4 (en) | 2016-12-07 |
KR20160132825A (ko) | 2016-11-21 |
CN103791439B (zh) | 2015-05-06 |
CA2937939C (en) | 2020-08-04 |
CA2937939A1 (en) | 2015-07-30 |
US20160341413A1 (en) | 2016-11-24 |
JP2017508246A (ja) | 2017-03-23 |
EP3101332A1 (en) | 2016-12-07 |
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