JP5082083B2 - Led照明装置 - Google Patents
Led照明装置 Download PDFInfo
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- JP5082083B2 JP5082083B2 JP2010094486A JP2010094486A JP5082083B2 JP 5082083 B2 JP5082083 B2 JP 5082083B2 JP 2010094486 A JP2010094486 A JP 2010094486A JP 2010094486 A JP2010094486 A JP 2010094486A JP 5082083 B2 JP5082083 B2 JP 5082083B2
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Description
また、本発明は、1つ以上のLED素子と、前記LED素子がマイクロバンプを介して実装され、内部に形成された配線が前記マイクロバンプに接続されたシリコン基板と、前記シリコン基板上のLED素子実装面と反対側の面に貼り合わされ、前記配線が通る貫通孔を有する断熱用有機基板と、前記断熱用有機基板上の前記シリコン基板側と反対側の面に貼り合わされ、内部に形成された配線が前記断熱用有機基板の貫通孔内の配線に接続されたチップ実装シリコン基板と、マイクロバンプを介して前記チップ実装シリコン基板の前記配線に接続されると共に、前記チップ実装シリコン基板上の前記断熱用有機基板側と反対側の面に、前記マイクロバンプを介して実装されたLED制御回路チップと、マイクロバンプを介して前記チップ実装シリコン基板の前記配線に接続されると共に、前記チップ実装シリコン基板上の前記断熱用有機基板側と反対側の面に、前記マイクロバンプを介して実装されたアプリケーションチップと、前記シリコン基板と前記断熱用有機基板の間に設けられ、前記シリコン基板内の配線と前記断熱用有機基板内の配線とが接続されるための貫通孔を有するアルミ基板と、を有する3次元LED基板と、アルミニウムを含み、前記3次元LED基板の端部を囲うと共に、前記チップ実装シリコン基板の縁側端部と、前記アルミ基板の縁側端部と、に接合された放熱部と、前記放熱部の開口部に前記LED基板のLED素子側を覆うように形成されたグローブと、前記放熱部に接続された口金と、を備えている。
図1は、第1の実施形態に係るLED照明装置の構成を示す図である。第1の実施形態に係るLED照明装置は、電球型に成形されており、LED素子21が実装された3次元シリコンインターポーザ20と、LED素子21で発生された光を外部へ放出するグローブ11と、3次元シリコンインターポーザ20を支持すると共に熱を外部へ放熱するアルミダイキャスト12と、複数の放熱フィン13aを有する放熱部13と、電球ソケットにねじ込まれる金属部分である口金14と、を備えている。なお、上記LED照明装置は、グローブ11の代わりにレンズを備えてもよい。
つぎに第2の実施形態について説明する。なお、第1の実施形態と同一の部位には同一の符号を付し、重複する説明は省略する。第1の実施形態では、第2基板24は、一般的な有機基板で構成されていた。これに対して、第2の実施形態では、第2基板24に代えて、シリコン基板で構成された第2基板24Aが用いられる。
つぎに第3の実施形態について説明する。なお、上述した実施形態と同一の部位には同一の符号を付し、重複する説明は省略する。
つぎに第4の実施形態について説明する。なお、上述した実施形態と同一の部位には同一の符号を付し、重複する説明は省略する。第1から第3の実施形態では、電球タイプについて説明したが、第4の実施形態では、直管形蛍光管型について説明する。
つぎに第5の実施形態について説明する。なお、上述した実施形態と同一の部位には同一の符号を付し、重複する説明は省略する
12 アルミダイキャスト
13 放熱部
14 口金
20 3次元シリコンインターポーザ
21 LED素子
22 第1基板
23 断熱用有機基板
24 第2基板
25 LED制御回路チップ
26 アプリケーションチップ
Claims (5)
- 1つ以上のLED素子と、前記LED素子がマイクロバンプを介して実装され、内部に形成された配線が前記マイクロバンプに接続されたシリコン基板と、前記シリコン基板上のLED素子実装面と反対側の面に貼り合わされ、前記配線が通る貫通孔を有する断熱用有機基板と、前記断熱用有機基板上の前記シリコン基板側と反対側の面に貼り合わされ、内部に形成された配線が前記断熱用有機基板の貫通孔内の配線に接続されたチップ実装基板と、マイクロバンプを介して前記チップ実装基板の前記配線に接続されると共に、前記チップ実装基板上の前記断熱用有機基板側と反対側の面に、前記マイクロバンプを介して実装されたLED制御回路チップと、マイクロバンプを介して前記チップ実装基板の前記配線に接続されると共に、前記チップ実装基板上の前記断熱用有機基板側と反対側の面に、前記マイクロバンプを介して実装されたアプリケーションチップと、を有する3次元LED基板と、
アルミニウムを含み、前記3次元LED基板の端部を囲うように形成された放熱部と、
アルミニウムを含んで形成され、前記放熱部と前記シリコン基板の縁側端部とにそれぞれ接合され、前記シリコン基板の熱を前記放熱部に伝導する熱伝導部材と、
前記放熱部の開口部に前記LED基板のLED素子側を覆うように形成されたグローブと、
前記放熱部に接続された口金と、
を備えたLED照明装置。 - 前記チップ実装基板は、シリコン基板であり、縁側端部に設けられた熱伝導部を介して前記放熱部に接合され、前記熱伝導部を介して、前記アプリケーションチップの熱を前記放熱部に伝導する
請求項1に記載のLED照明装置。 - 1つ以上のLED素子と、前記LED素子がマイクロバンプを介して実装され、内部に形成された配線が前記マイクロバンプに接続されたシリコン基板と、前記シリコン基板上のLED素子実装面と反対側の面に貼り合わされ、前記配線が通る貫通孔を有する断熱用有機基板と、前記断熱用有機基板上の前記シリコン基板側と反対側の面に貼り合わされ、内部に形成された配線が前記断熱用有機基板の貫通孔内の配線に接続されたチップ実装シリコン基板と、マイクロバンプを介して前記チップ実装シリコン基板の前記配線に接続されると共に、前記チップ実装シリコン基板上の前記断熱用有機基板側と反対側の面に、前記マイクロバンプを介して実装されたLED制御回路チップと、マイクロバンプを介して前記チップ実装シリコン基板の前記配線に接続されると共に、前記チップ実装シリコン基板上の前記断熱用有機基板側と反対側の面に、前記マイクロバンプを介して実装されたアプリケーションチップと、前記シリコン基板と前記断熱用有機基板の間に設けられ、前記シリコン基板内の配線と前記断熱用有機基板内の配線とが接続されるための貫通孔を有するアルミ基板と、を有する3次元LED基板と、
アルミニウムを含み、前記3次元LED基板の端部を囲うと共に、前記チップ実装シリコン基板の縁側端部と、前記アルミ基板の縁側端部と、に接合された放熱部と、
前記放熱部の開口部に前記LED基板のLED素子側を覆うように形成されたグローブと、
前記放熱部に接続された口金と、
を備えたLED照明装置。 - 前記3次元LED基板は、マイクロバンプを介して前記チップ実装基板の前記配線に接続されると共に、前記チップ実装基板上の前記断熱用有機基板側と反対側の面に、前記マイクロバンプを介して実装されたセンサチップを更に備えた
請求項1または請求項2に記載のLED照明装置。 - 前記3次元LED基板は、マイクロバンプを介して前記チップ実装シリコン基板の前記配線に接続されると共に、前記チップ実装シリコン基板上の前記断熱用有機基板側と反対側の面に、前記マイクロバンプを介して実装されたセンサチップを更に備えた
請求項3に記載のLED照明装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010094486A JP5082083B2 (ja) | 2010-04-15 | 2010-04-15 | Led照明装置 |
KR1020127028472A KR101557868B1 (ko) | 2010-04-15 | 2011-04-14 | 3차원 led 기판 및 led 조명 장치 |
CN201410136526.2A CN103925492B (zh) | 2010-04-15 | 2011-04-14 | Led照明装置 |
US13/640,869 US8610141B2 (en) | 2010-04-15 | 2011-04-14 | Three-dimensional LED substrate and LED lighting device |
CN201180019031.6A CN102844898B (zh) | 2010-04-15 | 2011-04-14 | Led照明装置 |
PCT/JP2011/059311 WO2011129415A1 (ja) | 2010-04-15 | 2011-04-14 | 3次元led基板及びled照明装置 |
TW100113123A TWI434393B (zh) | 2010-04-15 | 2011-04-15 | Led照明裝置 |
TW103109887A TWI470765B (zh) | 2010-04-15 | 2011-04-15 | Led照明裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010094486A JP5082083B2 (ja) | 2010-04-15 | 2010-04-15 | Led照明装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012166547A Division JP5131668B2 (ja) | 2012-07-27 | 2012-07-27 | Led照明装置 |
Publications (2)
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JP5082083B2 true JP5082083B2 (ja) | 2012-11-28 |
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US (1) | US8610141B2 (ja) |
JP (1) | JP5082083B2 (ja) |
KR (1) | KR101557868B1 (ja) |
CN (2) | CN103925492B (ja) |
TW (2) | TWI434393B (ja) |
WO (1) | WO2011129415A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8803269B2 (en) | 2011-05-05 | 2014-08-12 | Cisco Technology, Inc. | Wafer scale packaging platform for transceivers |
CN103179475A (zh) * | 2011-12-22 | 2013-06-26 | 深圳市三诺电子有限公司 | 无线音箱及其无线音箱系统 |
JP6455563B2 (ja) * | 2012-06-12 | 2019-01-23 | 株式会社リコー | 照明装置及び位置情報管理システム |
US9572249B2 (en) | 2013-03-14 | 2017-02-14 | Nthdegree Technologies Worldwide Inc. | Printing complex electronic circuits |
CN104051439A (zh) * | 2013-03-14 | 2014-09-17 | 台积固态照明股份有限公司 | 具有ic集成照明模块的led |
US9449954B2 (en) * | 2013-03-14 | 2016-09-20 | Epistar Corporation | LED with IC integrated lighting module |
US9913371B2 (en) * | 2013-03-14 | 2018-03-06 | Nthdegree Technologies Worldwide Inc. | Printing complex electronic circuits using a patterned hydrophobic layer |
CN103400835B (zh) * | 2013-07-12 | 2016-01-20 | 广东洲明节能科技有限公司 | Led模组的集成封装方法 |
JP6699134B2 (ja) * | 2015-08-19 | 2020-05-27 | 三菱電機株式会社 | 照明器具、照明用通信ユニット |
CZ2015589A3 (cs) | 2015-08-31 | 2016-10-26 | Varroc Lighting Systems, s.r.o. | Svítilna motorového vozidla |
FR3041148A1 (fr) * | 2015-09-14 | 2017-03-17 | Valeo Vision | Source lumineuse led comprenant un circuit electronique |
FR3041144B1 (fr) * | 2015-09-14 | 2019-04-12 | Valeo Vision | Source lumineuse led comprenant un circuit electronique |
CN107068816A (zh) * | 2017-04-17 | 2017-08-18 | 安徽路明光电科技有限公司 | 一种led灯硅片电路板的制作工艺 |
CN106898602B (zh) * | 2017-04-28 | 2023-08-04 | 福建祥云光电科技有限公司 | Led模组bga封装固定结构 |
US10739595B2 (en) * | 2018-01-22 | 2020-08-11 | Facebook Technologies, Llc | Application specific integrated circuit for waveguide display |
US10692799B2 (en) * | 2018-06-01 | 2020-06-23 | Innolux Corporation | Semiconductor electronic device |
FR3086035B1 (fr) * | 2018-09-13 | 2021-12-31 | Valeo Vision | Module lumineux pour vehicule |
CN111081693B (zh) * | 2018-10-19 | 2021-06-29 | 欣兴电子股份有限公司 | 发光组件封装结构及其制造方法 |
JP7093128B2 (ja) * | 2021-02-05 | 2022-06-29 | 株式会社ホタルクス | 感震led照明器具 |
JP7285600B2 (ja) | 2021-02-05 | 2023-06-02 | 株式会社ホタルクス | 感震led照明器具 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0548073A (ja) * | 1991-08-14 | 1993-02-26 | Hitachi Ltd | 半導体装置 |
JP2942398B2 (ja) * | 1991-09-17 | 1999-08-30 | 電気化学工業株式会社 | マトリックス回路基板 |
JP3992553B2 (ja) * | 2001-12-28 | 2007-10-17 | イビデン株式会社 | 光通信用デバイスおよび光通信用デバイスの製造方法 |
JP4572312B2 (ja) | 2004-02-23 | 2010-11-04 | スタンレー電気株式会社 | Led及びその製造方法 |
CN2736638Y (zh) * | 2004-10-11 | 2005-10-26 | 于波 | Led防水装饰灯 |
CN101660738A (zh) * | 2005-04-08 | 2010-03-03 | 东芝照明技术株式会社 | 灯 |
JP4482706B2 (ja) * | 2005-04-08 | 2010-06-16 | 東芝ライテック株式会社 | 電球型ランプ |
JP3128613U (ja) | 2006-10-31 | 2007-01-18 | 岡谷電機産業株式会社 | 発光ダイオード |
JP5353216B2 (ja) | 2008-01-07 | 2013-11-27 | 東芝ライテック株式会社 | Led電球及び照明器具 |
JP5243806B2 (ja) * | 2008-01-28 | 2013-07-24 | パナソニック株式会社 | 紫外光発光装置 |
JP5451981B2 (ja) * | 2008-04-22 | 2014-03-26 | 三菱電機株式会社 | 光源モジュール及び照明器具 |
CN201180976Y (zh) * | 2008-04-23 | 2009-01-14 | 王义宏 | 发光二极体灯具的导热散热结构 |
JP5320560B2 (ja) * | 2008-05-20 | 2013-10-23 | 東芝ライテック株式会社 | 光源ユニット及び照明装置 |
-
2010
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2011
- 2011-04-14 US US13/640,869 patent/US8610141B2/en not_active Expired - Fee Related
- 2011-04-14 CN CN201410136526.2A patent/CN103925492B/zh not_active Expired - Fee Related
- 2011-04-14 KR KR1020127028472A patent/KR101557868B1/ko active IP Right Grant
- 2011-04-14 WO PCT/JP2011/059311 patent/WO2011129415A1/ja active Application Filing
- 2011-04-14 CN CN201180019031.6A patent/CN102844898B/zh not_active Expired - Fee Related
- 2011-04-15 TW TW100113123A patent/TWI434393B/zh not_active IP Right Cessation
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Also Published As
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CN102844898B (zh) | 2014-04-16 |
KR101557868B1 (ko) | 2015-10-06 |
KR20130067264A (ko) | 2013-06-21 |
CN102844898A (zh) | 2012-12-26 |
CN103925492B (zh) | 2015-08-12 |
CN103925492A (zh) | 2014-07-16 |
US20130026509A1 (en) | 2013-01-31 |
TW201203505A (en) | 2012-01-16 |
TW201432882A (zh) | 2014-08-16 |
TWI434393B (zh) | 2014-04-11 |
JP2011228367A (ja) | 2011-11-10 |
TWI470765B (zh) | 2015-01-21 |
US8610141B2 (en) | 2013-12-17 |
WO2011129415A1 (ja) | 2011-10-20 |
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