WO2015109675A1 - 新型led照明装置 - Google Patents

新型led照明装置 Download PDF

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Publication number
WO2015109675A1
WO2015109675A1 PCT/CN2014/076052 CN2014076052W WO2015109675A1 WO 2015109675 A1 WO2015109675 A1 WO 2015109675A1 CN 2014076052 W CN2014076052 W CN 2014076052W WO 2015109675 A1 WO2015109675 A1 WO 2015109675A1
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WO
WIPO (PCT)
Prior art keywords
base
light
led lighting
lighting device
emitting chip
Prior art date
Application number
PCT/CN2014/076052
Other languages
English (en)
French (fr)
Inventor
陈必寿
许礼
潘辉
崔佳国
Original Assignee
上海三思电子工程有限公司
上海三思科技发展有限公司
嘉善三思光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海三思电子工程有限公司, 上海三思科技发展有限公司, 嘉善三思光电技术有限公司 filed Critical 上海三思电子工程有限公司
Priority to CA2937939A priority Critical patent/CA2937939C/en
Priority to KR1020167023574A priority patent/KR20160132825A/ko
Priority to JP2016548056A priority patent/JP6360180B2/ja
Priority to US15/114,835 priority patent/US20160341413A1/en
Priority to EP14880067.5A priority patent/EP3101332A1/en
Publication of WO2015109675A1 publication Critical patent/WO2015109675A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/023—Power supplies in a casing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to LEDs and, in particular, to novel LED lighting devices.
  • LED lighting units usually include: a package part, a light-emitting chip, a light source holder (also referred to as a substrate), a circuit board, and a heat sink. It can be seen that in the conventional LED lighting unit, the heat generated by the light-emitting chip needs to pass through the "chip-one light source bracket, the electrical layer of the circuit board surface, the circuit board, the thermal grease, the heat sink".
  • the path can eventually be dissipated, which creates a huge thermal resistance.
  • Conventional process packaging materials generally use resin materials. The thermal conductivity of such materials is very poor, and the heat generated by the chip cannot be derived through the direction of the package components. It can only rely on the heat conduction in one direction of the heat sink.
  • the chip in the manufacture of the bulb, usually the chip has a separate package, and then the hollow cover is covered to form the shape of the bulb, so that the heat generated by the chip needs to be transmitted to the air through the independent package. It is passed to the outer cover and then to the surrounding air, so that heat is almost impossible to export.
  • the inventors of the present invention have researched and developed a new type of LED lighting device which is much more powerful than the conventional LED bulb lamp in the volume of a conventional bulb lamp after repeated experiments.
  • a novel LED lighting device includes: a base, a circuit coating, a plurality of LED light emitting chips, and a lamp cover; wherein the base is a hollow structure, and the circuit coating is directly coated on the upper surface of the base, and the light emitting chip is directly Laminated on the pedestal and connected to each other by a circuit coating, the lamp cover is disposed on the pedestal, and the LED illuminating chip and the circuit coating are covered, and the lamp cover is a solid component made of a heat conductive material, the lamp cover includes An outer surface and an inner surface, wherein the outer surface is a light exit surface, the inner surface includes a light distribution surface and a heat conduction surface, wherein the light distribution surface is disposed on an inner surface area of the inner surface corresponding to the LED light emitting chip, There is a gap between the light distribution surface and the LED light emitting chip, and a light distribution cavity is formed together with the upper surface of the base, and the heat conduction surface is disposed on the inner surface and a part or all of
  • the inner surface of the lamp cover is composed only of the light distribution surface and the heat conduction surface.
  • the lampshade is made of transparent ceramic or glass.
  • the transparent ceramic comprises at least one material selected from the group consisting of a combination of one or more of PLZT, CaF2, Y203, YAG, polycrystalline AION, and MgA1204.
  • the inventors of the present invention made a lampshade by using PC, glass and transparent ceramics through repeated experiments.
  • the experimental results show that the junction temperature rise of PC is the highest, and the junction temperature of glass lens rises by 4 °C lower than that of PC, and transparent ceramics.
  • the temperature rise of the junction temperature of the lens is 8 °C lower than that of PC. Therefore, the present invention uses a glass and ceramic which have better thermal conductivity and lower temperature and temperature rise in use.
  • the circuit coating layer is a fluid or powder coating layer containing a metal material, and the circuit coating circuit layer has a thickness of 20 ⁇ or more.
  • the metal material of the circuit coating layer is at least one or a combination of molybdenum, manganese, tungsten, silver, gold, platinum, silver-palladium alloy, copper, aluminum, tin, and the like.
  • the upper surface of the pedestal provided with the light-emitting chip is a curved surface or a multi-plane combined shape.
  • the outer surface of the lamp cover is formed into a specific curved shape according to the light distribution requirement, and the inner surface in contact with the base is a curved surface or a multi-plane joint shape corresponding to the shape of the upper surface of the base.
  • the base is provided with a first heat dissipation through hole.
  • the lamp cover is provided with a second heat dissipation through hole, wherein the second heat dissipation through hole is in communication with the first heat dissipation through hole.
  • the susceptor is a metal pedestal coated with an insulating layer, or a pedestal made of an insulating material.
  • the power supply cavity is further included, wherein the power supply cavity can be made of plastic or ceramic material and does not communicate with the base, that is, the cavity of the power supply cavity is isolated from the base.
  • the outer casing and the base of the power supply chamber may be a whole or a separate structure, and are respectively connected by means of card insertion, snapping, screwing, etc., respectively, to achieve independent heat dissipation. Reduce the impact of the heat generated by the chip on the power supply, and enhance the overall heat dissipation of the entire LED lighting device.
  • the heat generated by the LED light-emitting chip can be led out through the lamp cover and can be led out through the susceptor. Since the heat conducting surface of the lamp cover is distributed in the central area and the edge area of the inner surface, the contact area of the lamp cover and the base is increased as compared with the prior art which only contacts the edge, thereby increasing the heat dissipation function of the lamp cover.
  • the inventors of the present invention calculated by computer thermal simulation software, and the temperature rise of the junction temperature can be lowered by at least 30 °C compared with the prior art, the same material, the same volume, and only the edge contact prior art.
  • the invention removes the circuit board and directly applies the circuit coating to the pedestal, thereby greatly reducing the thermal resistance and enhancing the heat dissipation effect of the entire luminaire.
  • the pedestal and the lampshade are respectively provided with first and second heat dissipation through holes, so that the entire LED illuminating device can realize air circulation from all directions, thereby being led to the surface through the lens and the pedestal. The heat is quickly taken away by the circulating air, which greatly enhances the heat dissipation function of the entire lighting device.
  • the inventors have verified through repeated experiments that the experimental results are in full compliance with the results of computer thermal simulation software simulation. Therefore, the technical solution of the present invention has made a breakthrough in increasing the heat dissipation of the entire LED lighting device.
  • the present invention has the following beneficial effects:
  • the heat generated by the chip can be externally discharged through the heat conduction surface of the inner surface of the lamp cover, which is directly attached to the inner surface of the lamp cover.
  • Some preferred structures such as thermal vias and hollowed out pedestals, can further enhance heat dissipation can. Thereby, the entire device can be cooled in all directions, the heat dissipation performance of the device is greatly improved, and the service life of the device is improved.
  • the independently set power supply cavity can dissipate the heat generated by the chip and the heat generated by the power supply through different structures, thereby reducing the influence of the heat generated by the chip on the power supply, thereby reducing the influence of excessive heat on the power supply.
  • a higher power lighting device can be manufactured without increasing the volume of the device, thereby improving the illumination brightness of the device, and increasing the range and flexibility of the LED lighting device in living and industrial use.
  • FIG. 1 is a schematic view showing the overall structure of an LED lighting device in a first embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional structural view of the novel LED lighting device of FIG. 1;
  • FIG. 3 is a schematic view showing a heat conducting surface and a light distributing surface of the novel LED lighting device of FIG. 1;
  • FIG. 4 is a schematic view showing the overall structure of a novel LED lighting device in a second embodiment of the present invention.
  • 2 is a light emitting chip
  • a novel LED lighting device includes: a base, a light emitting chip, a circuit coating, a lamp cover, and a power supply cavity.
  • the lampshade is made of a solid heat conductive material and has good heat conduction.
  • the light-emitting chip is fixed on the base, and the light cover is disposed on the base, and the light-emitting chip is covered.
  • the inner surface of the light cover except the corresponding area of the light-emitting chip ie, the light distribution surface
  • the inner surface of the corresponding area of the lampshade and the light-emitting chip is formed into a specific spatial structure shape according to the design to change the light intensity distribution; wherein the heat-conducting surface is used as a part of the inner surface of the lamp cover, which itself can utilize the reflection of the light and The refractive properties are involved in the light distribution, and therefore the technical solution for participating in the light distribution with the heat-conducting surface is also a non-limiting embodiment of the invention.
  • the upper surface of the pedestal is a curved surface or a multi-planar combined shape.
  • the pedestal adopts a hollow structure to increase air circulation to enhance heat dissipation.
  • a first heat dissipation through hole is disposed in the middle of the pedestal to increase air circulation to enhance heat dissipation.
  • the second heat dissipation through hole is disposed at a position corresponding to the base of the lamp cover.
  • the number of light emitting chips is plural.
  • the lampshade has a light distribution function selected from ceramics, glass or other high thermal conductivity materials with light transmission properties.
  • the outer surface of the lamp cover is designed to have a specific shape according to actual needs.
  • the pedestal is provided with a power supply cavity on the top, which can achieve independent heat dissipation.
  • the pedestal may be a metal pedestal coated insulating layer, a ceramic pedestal or the like.
  • the novel LED lighting device mainly comprises a base, 22 LED light emitting chips, a circuit coating and a high heat conducting lampshade.
  • the pedestal is a ceramic pedestal whose upper surface is a curved surface, a first heat dissipation through hole is defined in the middle of the pedestal, and the upper surface of the pedestal is directly coated with a circuit coating except for the first heat dissipation through hole.
  • the circuit coating is a conductive silver paste, and the light-emitting chips are directly adhered to the susceptor and communicated with each other through the circuit coating.
  • the lampshade is a solid light transmissive ceramic made of polycrystalline AINO.
  • the lamp cover opens a second heat dissipation through hole at an intermediate position corresponding to the first heat dissipation through hole of the base, Air circulation is now available.
  • the inner surface of the lampshade contacting the pedestal is a curved surface corresponding to the shape of the pedestal, directly contacting the pedestal and covering the pedestal, encapsulating the LED illuminating chip and the circuit coating, the light distribution surface setting
  • the inner surface corresponding to the LED light-emitting chip does not fit with the LED light-emitting chip, and forms a light distribution cavity together with the upper surface of the base, and the heat-transfer surface is distributed at least in a central area and an edge area of the inner surface of the light cover, and is completely opposite to the upper surface of the base Fit to achieve light transmission and heat dissipation.
  • the pedestal is fully hollow and allows for convection ventilation.
  • the power chamber is made of ceramic and has a unitary structure with the base and is not in communication with the base. Independent heat dissipation can be achieved.
  • the novel LED lighting device mainly comprises a base, 27 LED light emitting chips, a circuit coating and a lamp cover.
  • the base is an aluminum base coated with an insulating material on the upper surface, and the upper surface is in the shape of a multi-segment.
  • the upper surface of the base is directly coated with a circuit coating except for the first heat dissipation through hole.
  • the layer is a conductive palladium-silver alloy slurry, and the LED light-emitting chips are directly adhered to the susceptor and communicated with each other through the circuit coating.
  • the lampshade is a solid light transmissive ceramic made of MgAl 2 0 4 .
  • the lamp cover opens a second heat dissipation through hole at an intermediate position corresponding to the first heat dissipation through hole of the base to realize air circulation.
  • the inner surface of the lampshade contacting the pedestal is a multi-planar bonding shape corresponding to the shape of the pedestal, directly contacting the pedestal and covering the pedestal, and encapsulating the LED illuminating chip and the circuit coating.
  • the light surface is disposed on the inner surface corresponding to the LED light emitting chip, does not fit with the LED light emitting chip, and forms a light distribution cavity together with the upper surface of the base, and the heat conducting surface is distributed at least in a central area and an edge area of the inner surface of the light cover, and the base
  • the upper surface is completely fitted to achieve light transmission and heat dissipation.
  • the pedestal is fully hollow and allows for convection ventilation.
  • the power supply cavity is made of plastic and is a separate structure that does not communicate with the base. The pedestal and the power supply cavity are connected by a screw, so that separate heat dissipation can be achieved.
  • the power supply cavity and the base may also be snapped or otherwise connected.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED照明装置包括：基座、电路涂层、发光芯片、灯罩。基座为镂空结构，电路涂层直接涂覆在基座上表面，发光芯片直接贴合在基座上并通过电路涂层相互连接。灯罩设置在基座上，将发光芯片和电路涂层包覆在内。灯罩的内表面包括配光面和导热面，导热面至少分布于内表面的中央区域和边缘区域。该LED照明装置采用了导热性能较好的实体材料作灯罩，同时采用了镂空基座和散热通孔，芯片产生的热量可以通过基座、灯罩向外导出，再由通过镂空和通孔流通的空气带走，从而形成整个装置全方位均可散热，提高了装置的散热性能。

Description

新型 LED照明装置
技术领域
本发明涉及 LED , 具体地， 涉及新型 LED照明装置。
背景技术
LED技术应用于照明系统已经渐渐成为主流趋势， 但是 LED照明装置的散热一 直是业内较难解决的一个难题， 因此也限制了大功率 LED装置的制造， 从而导致单 个 LED光源的亮度不足以及陈列式 LED照明装置的体积过大。 传统的 LED发光单元 通常包括： 封装部分、 发光芯片、 光源支架 （也称基板） 、 线路板和散热器等结构。 可以看到， 在传统的 LED发光单元中， 发光芯片所产生的热量需要依次通过 "芯片 一一光源支架一一线路板表面的电气层一一线路板一一导热硅脂一一散热器" 的路 径才能最终散去， 这其中会产生巨大的热阻。 传统工艺的封装材料一般多采用树脂 材料， 此种材料导热性能很差， 导致芯片产生的热量无法通过封装部件方向导出， 只能依赖于散热器一个方向进行导热。 另外， 在球泡灯的制作中， 通常是芯片有独 立的封装件， 然后再罩上中空的外罩以形成球泡灯的形状， 这样芯片产生的热量需 要先通过独立的封装件传到空气中再传到外罩然后再传到周围空气中， 致使热量几 乎无法导出。另外，传统 LED照明装置的基座多数都采用增加鳞片以增加散热面积， 散热结果也不甚令人满意。 有些较新型的 LED灯具采用了镂空的基座， 通过空气流 通带走热量来增加散热效率， 起到了较好的作用， 但是由于 LED发光芯片产生的热 量较多， 此种方法的散热效果在一定的体积范围内仍不能制造较大功率的 LED照明 灯具。
本发明的发明人经过反复实验， 研究出了一种散热效果非常好， 可以在传统球 泡灯的体积上制作出比现有 LED球泡灯功率大很多的新型 LED照明装置。 针对现有技术中的缺陷， 本发明的目的是提供一种新型 LED照明装置， 该 LED 照明装置具有更好的散热功能， 从而可以以较小的体积实现更大的功率， 从而可以 在不需要增加装置体积的情况下实现更高的照明亮度。
根据本发明提供的新型 LED照明装置， 包括： 基座、 电路涂层、 多个 LED发光 芯片、 灯罩； 其中， 基座为镂空结构， 电路涂层直接涂覆在基座上表面， 发光芯片 直接贴合在基座上， 并通过电路涂层相互连接， 灯罩设置在基座上， 将 LED发光芯 片和电路涂层包覆在内， 灯罩为由导热材料制成的实体部件， 所述灯罩包括外表面 和内表面， 所述外表面为光线出射面， 所述内表面包括配光面和导热面， 其中， 所 述配光面设置在内表面的与 LED发光芯片对应的内表面区域上， 配光面不与 LED发 光芯片贴合之间存在间隙， 与基座上表面共同形成配光腔， 所述导热面设置在内表 面的与基座上安装 LED发光芯片以外的部分或全部上表面所对应的内表面区域上， 与基座紧密贴合， 导热面至少分布于内表面的中央区域和边缘区域。
优选地， 灯罩的内表面仅由配光面以及导热面构成。
优选地， 灯罩采用透明陶瓷或者玻璃制成。
优选地，所述透明陶瓷包含从为 PLZT、 CaF2、 Y203、 YAG、多晶 AION 和 MgA1204 中的一种或几种的组合组成的组中选择的至少一种材料。
本发明的发明人通过反复实验， 分别使用了 PC， 玻璃和透明陶瓷制作灯罩， 实验结 果证明采用 PC的结温温升最高， 玻璃透镜的结温温升比 PC低 4°C， 而透明陶瓷透镜的 结温温升比 PC低 8 °C。 因此本发明采用导热性更好、 使用中结温温升更低玻璃和陶 瓷。 优选地， 所述电路涂层为包含有金属材料的流质或粉末涂层， 所述电路涂层线路层 的厚度为 20 μ πι以上。 优选地， 所述电路涂层的金属材料为钼、 锰、 钨、 银、 金、 铂、 银钯合金、 铜、 铝、 锡等中的至少一种或几种的组合。 优选地， 设置有发光芯片的基座的上表面为曲面、 或者多平面结合形状。 优选地， 灯罩外表面按照配光要求制成特定曲面形状， 与基座接触的内表面为与 基座上表面形状相对应的曲面或多平面结合形状。 优选地， 基座设置有第一散热通孔。
优选地， 灯罩设置有第二散热通孔， 其中， 第二散热通孔与第一散热通孔对应 连通。
优选地， 基座为涂覆有绝缘层的金属基座、 或者由绝缘材料制成的基座。
优选地， 还包括电源腔， 其中， 电源腔可以采用塑料或者陶瓷材质制成， 不与 基座相通， 即电源腔的腔体与基座相隔离。 电源腔的外壳体与基座可以是一个整体， 也可以是独立结构， 通过卡插、 卡接、 螺口等方式相连接， 可以实现分别独立散热。 降低芯片产生的热量对电源的影响， 增强整个 LED照明装置的综合散热能力。
本发明的 LED照明装置的结构， 由于灯罩与基座相贴合， 使得 LED发光芯片产 生的热量即可以通过灯罩导出又可以通过基座导出。由于灯罩导热面分布于内表面的 中央区域和边缘区域， 与仅边缘接触的现有技术相比， 增大了灯罩与基座的接触面积， 从而增加的灯罩的散热功能。本发明的发明人通过计算机热模拟软件进行计算， 本发 明与相同材料， 相同体积， 相同功率的仅边缘接触的现有技术相比， 结温温升可降 低至少 30 °C以上。 另外， 本发明去掉线路板， 直接将线路涂层涂覆于基座上， 大大减 小了热阻， 加强了整个灯具的散热效果。 同时， 由于基座为镂空结构， 基座和灯罩还 分别设置有第一及第二散热通孔， 所以整个 LED照明装置从各个方向均可以实现空 气流通， 从而使得通过透镜和基座导出到表面的热量迅速被流通的空气带走， 大大 加强了整个照明装置的散热功能。
同时， 发明人经过反复实验验证， 得出的实验结果， 完全符合计算机热模拟软 件模拟出的结果。 因此， 本发明的技术方案在增加整个 LED照明装置的散热方面， 有突破性的进步。
与现有技术相比， 本发明具有如下的有益效果：
由于采用了导热性能较好的材料用作灯罩， 芯片产生的热量除了可以通过基座 散热， 还可以通过灯罩内表面上设置的与基座直接贴合的导热面向外导出， 另外， 本发明的一些优选的结构， 如散热通孔和镂空的基座， 可以更进一步地增强散热功 能。 从而形成整个装置全方位均可散热， 大大提高了装置的散热性能， 提高了装置 的使用寿命。 独立设置的电源腔可以使芯片产生的热量和电源产生的热量分别通过 不同的结构向外散出， 从而可以减少芯片产生的热量对电源造成的影响， 从而减少 因热量过高对电源的影响。
本发明的产品无论采用什么方向安装， 均可实现 360全方位空气流通， 从来有 效带走灯具本身产生的热量， 大大降低结温温升。
进一步地， 由于散热性能的提升， 可以在不增加装置体积的情况下制造更大功 率的照明装置， 提高装置的照明亮度， 同时在生活和工业使用上增加了 LED照明装 置的使用范围和灵活度。
附图说明 通过阅读参照以下附图对非限制性实施例所作的详细描述， 本发明的其它特 征、 目的和优点将会变得更明显：
图 1为本发明第一实施例中 LED照明装置的整体结构示意图；
图 2为图 1中新型 LED照明装置的剖面结构示意图；
图 3为图 1中的新型 LED照明装置的导热面和配光面的示意图；
图 4为本发明第二实施例中的新型 LED照明装置的整体结构示意图。
图中：
1为基座；
2为发光芯片；
3为灯罩；
31为配光面；
32为导热面；
4为电源腔；
51为第一散热通孔；
52为第二散热通孔。 具体实施方式
下面结合具体实施例对本发明进行详细说明。 以下实施例将有助于本领域的技术人 员进一步理解本发明， 但不以任何形式限制本发明。 应当指出的是， 对本领域的普通技 术人员来说， 在不脱离本发明构思的前提下， 还可以做出若干变形和改进。 这些都属于 本发明的保护范围。
根据本发明提供的新型 LED照明装置， 包括： 基座、 发光芯片、 电路涂层、 灯罩、 电源腔。 所述灯罩是实体导热材料制成， 具有良好的导热作用。 所述发光芯片固定在基 座上， 灯罩设置在基座上， 把发光芯片包覆在内， 灯罩除与发光芯片对应区域 （即配光 面） 以外的内表面作为导热面与基座接触， 以实现散热功能， 灯罩与发光芯片对应区域 的内表面按设计需要形成特定的空间结构形状， 以改变光强分布； 其中， 导热面作为灯 罩内表面的一部分， 其本身可以利用对光线的反射和 /或折射特性参与配光， 因此， 利 用导热面参与配光的技术方案同样属于本发明所保护的非限制性实施例。
基座的上表面为曲面、 或者多平面结合形状。 基座采用镂空结构以增加空气流通加 强散热， 例如基座的中间设置第一散热通孔以增加空气流通加强散热， 相应地， 灯罩与 基座对应的位置设置第二散热通孔。 发光芯片的数量为多个。
灯罩具有配光功能， 选自陶瓷， 玻璃或其他具有透光性能的高导热材料。 所述灯罩 的外表面根据实际需要设计成特定形状。基座设置电源腔在上，可以实现分别独立散热。 基座可以是金属基座涂覆绝缘层， 陶瓷基座等。
实施例 1
接下来结合图 1和图 2对第一实施例进行具体描述。
所述新型 LED照明装置主要包括基座、 22个 LED发光芯片、电路涂层和高导热灯罩。 所述基座为一上表面是曲面的陶瓷基座， 基座的中间开设第一散热通孔， 基座的上表面 除第一散热通孔以外的其他部分直接涂覆电路涂层， 所述电路涂层为导电银浆， 发光芯 片直接粘附在基座上， 通过电路涂层相互连通。 所述灯罩为一实体的透光陶瓷， 由多晶 AI0N制成。所述灯罩在与基座的第一散热通孔对应的中间位置开设第二散热通孔， 以实 现空气流通。 所述灯罩与基座接触的内表面为与基座形状相对应的曲面， 与基座直接接 触并覆盖在基座上， 把 LED发光芯片和电路涂层封装在内， 所述配光面设置在与 LED发 光芯片对应的内表面， 不与 LED发光芯片贴合， 与基座上表面共同形成配光腔， 导热面 至少分布于灯罩内表面的中央区域和边缘区域， 与基座上表面完全贴合从而实现透光及 散热作用。 基座为全镂空结构， 可以实现对流通风。 电源腔由陶瓷制成， 与基座为整体 结构， 不和基座连通。 可以实现分别独立散热。
实施例 2
接下来结合图 4对第二实施例进行具体描述。
所述新型 LED照明装置主要包括基座、 27个 LED发光芯片、 电路涂层和灯罩。所述 基座为一上表面涂覆有绝缘材料的铝基座， 上表面为多棱台形状， 基座的上表面除第 一散热通孔以外的其他部分直接涂覆电路涂层， 电路涂层为导电钯银合金浆体， LED发 光芯片直接粘附在基座上， 通过电路涂层相互连通。 所述灯罩为一实体的透光陶瓷， 由 MgAl204制成。所述灯罩在与基座的第一散热通孔对应的中间位置开设第二散热通孔， 以 实现空气流通。 所述灯罩与基座接触的内表面为与基座形状相对应的多平面结合形状， 与基座直接接触并覆盖在基座上， 把 LED发光芯片和电路涂层封装在内， 所述配光面设 置在与 LED发光芯片对应的内表面， 不与 LED发光芯片贴合， 与基座上表面共同形成配 光腔， 导热面至少分布于灯罩内表面的中央区域和边缘区域， 与基座上表面完全贴合从 而实现透光及散热作用。 基座为全镂空结构， 可以实现对流通风。 电源腔由塑料制成， 为独立结构， 不和基座连通。 基座与电源腔用螺口方式连接， 可以实现分别独立散热。 所述电源腔和基座还可以是卡接或者其他方式连接。
以上对本发明的具体实施例进行了描述。 需要理解的是， 本发明并不局限于上 述特定实施方式， 本领域技术人员可以在权利要求的范围内做出各种变形或修改， 这并不影响本发明的实质内容。

Claims

权利要求书
1、 一种新型 LED照明装置， 其特征在于， 包括： 基座、 电路涂层、 多个 LED发光 芯片、 灯罩； 其中， 基座为镂空结构， 电路涂层直接涂覆在基座上表面， 发光芯片直接 贴合在基座上， 并通过电路涂层相互连接， 灯罩设置在基座上， 将 LED发光芯片和电路 涂层包覆在内， 灯罩为由导热材料制成的实体部件， 所述灯罩包括外表面和内表面， 所 述外表面为光线出射面， 所述内表面包括配光面和导热面， 其中， 所述配光面设置在内 表面的与 LED发光芯片对应的区域上， 配光面与 LED发光芯片之间存在间隙， 与基座上 表面共同形成配光腔，所述导热面设置在内表面的与基座上安装 LED发光芯片以外的部 分或全部上表面所对应的区域上， 与基座紧密贴合， 导热面至少分布于内表面的中央区 域和边缘区域。
2、 根据权利要求 1所述的新型 LED照明装置，其特征在于，灯罩的内表面仅由配 光面以及导热面构成。
3、 根据权利要求 1所述的新型 LED照明装置， 其特征在于， 灯罩采用透明陶瓷或 者玻璃制成。
4、 根据权利要求 3所述的新型 LED照明装置，其特征在于，所述透明陶瓷为 PLZT、 CaF2、 Y203、 YAG、 多晶 AION和 MgAl204中的一种或几种的组合。
5、 根据权利要求 1所述的新型 LED照明装置， 其特征在于， 所述电路涂层为包含 有金属材料的流质或粉末涂层， 所述电路涂层的厚度为 20 μ m以上。
6、 根据权利要求 5所述的新型 LED照明装置， 其特征在于， 所述电路涂层的金属 材料为钼、 锰、 钨、 银、 金、 铂、 银钯合金、 铜、 铝、 锡中的至少一种或几种的组合。
7、 根据权利要求 1所述的新型 LED照明装置， 其特征在于， 设置有发光芯片的基 座的上表面为曲面、 或者多平面结合形状。
8、 根据权利要求 1所述的新型 LED照明装置， 其特征在于， 基座设置有第一散热 通孔。
9、 根据权利要求 8所述的新型 LED照明装置， 其特征在于， 灯罩设置有第二散热 通孔， 其中， 第二散热通孔与第一散热通孔对应连通。
10、 根据权利要求 1所述的新型 LED照明装置，其特征在于，基座为涂覆有绝缘层 的金属基座、 或者为由绝缘材料制成的基座。
11、 根据权利要求 1所述的新型 LED照明装置，其特征在于，还包括电源腔，其中， 电源腔的外壳体与基座相连接， 电源腔的腔体与基座相隔离。
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JP2017508246A (ja) 2017-03-23
CN103791439A (zh) 2014-05-14
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