TW200822797A - Light emitting system, method of fabricating a light emitting module and a subatrate with circuit patterns - Google Patents

Abstract

Embodiments disclose a light emitting system comprising at least a light emitting module. The module comprises light emitting rows supported by a substrate. Each light emitting row having light emitting chips without assembling is surrounded by a reflecting structure disposed on the substrate. A transparent lens is disposed above the light emitting rows for mixing lights emitted from the light emitting rows to form a light source.

Description

200822797 vv IX. Description of the Invention: [Technical Field] The present invention relates to an illumination system, a light-emitting module, and a method of fabricating the same, and particularly to an illumination system having a plurality of illumination columns, a light-emitting module, and Forming method. [Prior Art] Light Emitting Diode (LED) is widely used in various displays because of its liberation, small size, light weight, low damage, low power consumption and long life. In the product, the principle of illumination is as follows: a voltage is applied to the diode to drive the electrons in the diode to be combined with the hole. The energy generated by the combination is released in the form of light; In this structure, to adjust the wavelength (color) and intensity of the light. Among them, the appearance of white light-emitting diodes extends the application of light-emitting diodes to the field of illumination; the white-light-emitting diodes have lower heat generation than the most commonly used incandescent bulbs and fluorescent lamps in current illumination. The advantages of quantity, low power consumption, long life, fast response, small size, etc., are the focus of the development of the industry. : Based on the consideration of luminous efficiency and heat dissipation, the current method of manufacturing the light-emitting diode is generally packaged by using a single-die plus a reflector cup, and one can avoid heat dissipation of multiple crystal grains on the same substrate. The problem is not easy. The other is to prevent the two adjacent grains from blocking the light emitted from the sides of each other and affecting the luminous efficiency. However, the packaging method of such a single crystal chip will greatly increase the volume of the light-emitting module including a plurality of crystal grains.

Client’s Docket No.: TT^s Docket No: 0849-A41276-TW/final/chad 5 200822797 V. It is not easy to shrink, so the right two structures. SUMMARY OF THE INVENTION In view of the above, the present invention includes at least a two-dimensional embodiment of the illuminating mode, which discloses an illuminating system, which is carried on a carrier substrate, two carrier substrates, a plurality of illuminating columns, optical crystal grains, and each- _== includes a plurality of unmodulated payouts. The Christine is surrounded by a reflective structure; and a lens, and the other i of the present x to adjust the light of the illuminating columns Form a light source. Including: providing -f (four) uncovering - a method for manufacturing a light-emitting module, performing a positive-area structure, (4) a material composition; a carrier substrate layer; a cover-layer insulating oil film; and a surface forming-porous metal insulating hole : silk (4) belongs to '_, and is filled with:, LV: the surface of the porous metal insulating layer; forming a plurality of light-emitting particles composed of a plurality of particles arranged on the hole of the shirt to read the carrier substrate to have both $, w$ ^ ? ^ five ^ 夕 degrees of the insulating oil to buffer stress; = = is the insulating oil film on the surface of the insulating layer; and solid: a plurality of, constructed on the carrier substrate, each of which includes a column space The invention discloses a method for manufacturing a carrier substrate having an electric final pattern, which comprises: providing a bearing plate, which is composed of gold lung material; and performing anodizing on the carrier substrate, Forming a porous metal insulating layer including a plurality of holes on the surface of the board; covering an insulating oil film on the porous metal insulating layer' and filling each hole; removing the porous layer

Client's Docket No.: TT, s Docket N〇: 〇 849-A41270-TW/final/chad 6 200822797 The insulating oil film on the surface of the I Bar edge layer; forming a circuit pattern in the porous to the genus, 、, 巴, And the surface of the ruthenium layer is immersed in the insulating oil having a predetermined temperature to buffer stress; and the insulating oil film on the surface of the porous metal insulating layer is removed again. The above and other objects, features, and advantages of the present invention will become more apparent. The preferred embodiment will be described in detail with reference to the accompanying drawings. The PCT Patent Application No. PCT/C Foot 07_966 and PCT Patent Application No. PCT/CN2006/003037, the disclosure of which is incorporated herein by reference. In the following embodiments of the present invention, the clothing mode of the carrier substrate, the light-emitting module with the reflective structure and the heat conduction mode thereof, and the illumination device of the combination of the plurality of light-emitting groups, and the manufacturing method of the light-emitting module are mainly respectively described. However, the examples are only intended to illustrate the invention and are not intended to limit the scope of the invention. In the present specification, the term "reflective structure" refers to a closed structure. In the embodiment of the present invention, although a rectangle such as a rectangle or a square is cited, it is not intended to limit the scope of the present invention, and a circular reflective structure is used. The enclosed area may also be; in other embodiments, the area enclosed by the reflective structure may be any other shape. The reflective structure used in accordance with an embodiment of the present invention may be gathered from the light-emitting dies. The light emitted from the side, and the illuminating crystal grain may be composed of a light-emitting diode that emits a specific light, and the unmodulated illuminating crystal

Client's Docket No.: TT5s Docket No: 0849-A41276-TW/final/chad 200822797 granules, usually means that the luminescent crystal grain is not provided with a sealant layer or a reflector cup, or is a bare die. Further, the column of illuminating columns generally refers to a space formed substantially in a particular direction, and is not limited to a longitudinal direction, a lateral direction, or a straight line. Illumination Module with Reflective Structure FIG. 1A is a view of a light-reducing module having a reflective structure according to a preferred embodiment of the present invention. The illuminating module 100 includes a common carrier substrate for carrying at least one illuminating column 130. Each illuminating column 13 〇 includes a plurality of unmodulated illuminating dies 104, such as illuminating diode dies, and each A light-emitting column 130 is surrounded by a light-reflecting structure 11 ,, and the light-reflecting structure u 〇 includes a space corresponding to the light-emitting columns 130 to fix the plurality of light-emitting dies 104 on the carrier substrate 1 〇 2 in the column space. In another embodiment, each of the light-emitting columns may further include an inner cover layer 1 8 fixed in the light-reflecting structure 11A and covering the plurality of light-emitting crystal grains 104. The unmodulated luminescent crystal generally means that the illuminating crystal grain is not provided with a sealing layer or a reflector cup, or is a bare crystal grain, so that the required area of the illuminating module can be reduced. In addition, since a plurality of light-emitting crystal grains can be arranged in a plurality of rows and surrounded by a plurality of columns of reflective structures, each of the columns emits light compared to the case where all of the light-emitting crystal grains are surrounded by only one annular structure. The distance between the crystal grains and the reflective structure is not only short, but also it is easier for the emitted light to illuminate the adjacent reflective structure without being easily blocked by other luminescent crystal grains. That is, since each of the illuminating columns can include a plurality of unmodulated illuminating dies, the area required for the illuminating module can be reduced, and each illuminating column is surrounded by a reflective structure, thereby facilitating illuminating effectiveness.

Client's Docket No.: TT^ Docket No: 0849-A41276-TW/final/chad δ 200822797 In addition, at least one illuminating column may optionally include a plurality of illuminating dies in the same column. 1 〇 4 surface of the luminescent material layer 1 〇 6, for example, composed of fluorescent powder material, in one embodiment, the luminescent material layer continuously covers the unmodulated luminescent crystals 1 〇 4 and Extending to the inner side wall of the reflective structure. In a specific example, at least a portion of the luminescent material layer 〇6 may be a luminescent particle that is condensed into agglomerates and contains no adhesive, for example, a van der Waals bond may be formed by drying, in this example The phosphor powder layer completely covers the upper surface and the side of each of the illuminating crystal grains 104 in the same column. In another example, the light-emitting module may further include an inner cover layer 108 fixed in the reflective structure 1 1 并 and covering the luminescent material layer 106 as a protective layer. The area enclosed by the reflective structure 110 may be a polygon, such as a rectangle or a pentagon, or a circle or an ellipse. Please refer in particular to the schematic of the reflective structure 110 shown in Figure 3. In general, the protective layer 108 can be formed by coating a soft polymer material such as silicone in a reflective structure, or a hard glass layer, an epoxy resin or other transparent plastic material layer, such as a layer. A polycarbonate (PC: Polycarbonate) or polyethylene (PE: Polyethylene) material is embedded in the light-reflecting structure 110 to be pressed against the light-emitting crystal grains 1 or 4 or the light-emitting material layer. This prevents the luminescent material layer from falling off or preventing moisture from penetrating. Since the reflective structure 11 can be used to adjust the direction of the light emitted from the illuminating crystal 1Q4, such as shielding, reflecting, collecting, or focusing, the illuminating layer 106 can still solve the illuminating when the luminescent material layer 106 does not completely cover the side of the illuminating crystal. Light leakage on the side of the die 104 and improving the color shift of the light. The reflective structure 110 can generally be a metallic material having a reflective surface, or

Client's Docket No.: TT's Docket N〇:0849-A4127 6-TW/final/chad 9 200822797 " For a plastic body, the surface can form a layer of reflective material, such as selecting a layer of electric ore, recording, silver, fluorine Reagents, or reflective materials such as magnesium sulfide. Wherein, since the light-reflecting structure 110 is disposed on the same surface as the light-emitting crystal grains 1〇4, if a material having a better heat-dissipating property, such as polishing to form a metal material having a reflective surface, the heat-dissipating efficiency can be improved. In addition, a lens 2 may be disposed on the light-emitting column to cover the substrate 102, the light-emitting die 1〇4, the protective layer 1〇8, and the light-reflecting structure 11〇 to adjust the light of the light-emitting columns to form a light source. In addition to the use of the original Shishi plastic material, the lens part can also be changed to other materials, because the lens is more light-transparent, so PC or PE transparent plastic (Plastic), Acrylic (Acrylic), Glass (Glass) ), polycarbonate@((p〇iyCarb〇nate), etc. can also be used, and the light transmittance is related to the wavelength, and the light transmittance of different wavelengths is different, and the lens can also be a colored lens to increase the contrast of the light color. In one embodiment, the lens 200 can be adhered to the outer frame of the carrier substrate 1〇2 or the reflective structure 11〇 to form a closed cavity. The sealed cavity can be a vacuum environment or filled with φ inert gas to maintain the sealing. The stability of the cavity. In another embodiment, another inner cover layer may be refilled in the closed cavity above the protective layer 108 to further fill the reflective structures and the space above them to prevent moisture intrusion. Or in the 3 κ & example t 'first without forming the layer 1Q8, but after the lens is covered on the ▲ substrate, directly injecting, (4) cover the firefly layer and simultaneously fill the closed cavity to form - body molding and no The protective layer that exists in the interface. In the other embodiment, the inner side wall of the retroreflective structure 11 () forms an angle 与 with the surface of the substrate, and 〇 ° < θ < 90. , but with θ=45. In contrast, the material of the reflective, and mouth structure 110 is metal, such as stainless steel; or

Client's Docket No:: TT's Docket No: 0849-A41276-TW/fmal/chad 200822797 It is a plastic or resin material, such as silicone rubber, and other materials can be used. Therefore, PC or PE transparent plastic (Plastic), acrylic Acrylic, Giassas, polycarbonate (p〇iyCarb〇nate), etc. may also be used to select a coating on the surface of the reflective structure 110 to form a reflective effect. In particular, in a specific example, the phosphor particles in the phosphor particle layer 106 are free of glue' so that luminous efficiency can be increased. The number of crystal grains of the illuminating crystal grains 104 is determined as needed; in this example, the crystal grains are light emitting diodes. In addition, in other examples, the shape of the area surrounded by the reflective structure 110 may be appropriately changed as needed, for example, a rectangle, a circle, or other shapes; and the shape of the inverse structure 110 itself may be arbitrarily made. The change, for example, its cross-sectional shape may be trapezoidal, triangular or curved. In other embodiments, the area enclosed by the reflective structure may be any other shape, for example, a space suitable for the backlight module to produce a suitable strip-shaped reflective structure. Carrier substrate Referring to Figure 1A, the carrier substrate 1〇2 may be a metal material such as aluminum metal in this embodiment. However, it is not limited thereto. In other embodiments, for example, a tantalum carbide material or a ceramic containing aluminum oxide or other ceramic materials having good thermal conductivity may be employed. Further, in this example, as shown in Fig. 1β, the surface of the carrier substrate may be further formed with a metal insulating layer 160 including a plurality of exposed holes, such as a metal oxide layer. One embodiment is on the surface of the aluminum substrate 3

Client's Docket No.: TT>sDocketNo:0849-A41276.TW/flnal/chad 11 200822797=Polar treatment to form a thickness of about (4) ❹ 气 故 故 丨 ' ' ' ' ' ' ' ' ' 吕 吕 吕 吕 吕 吕 吕 吕 吕 吕 吕 吕 吕 吕 吕Between - the barrier layer 2 _. Heart hole Wei Ming layer! In the above embodiment, since the metal insulating layer 丨 102 can be tightly bonded, the thermal resistance is lowered, and the heat transfer efficiency can be as high as possible, and the second counter substrate has better heat conduction efficiency. Example ^ text. The problem that the crystal grains on the same substrate may be difficult to dissipate on the same substrate. It is worth noting that 'the porous metal insulating layer formed has the characteristics of soft hardness or easy adhesion of impurities on the surface before it is unsealed. Therefore, people in this technical field are going to treat the anode. Before the subsequent substrate is subjected to subsequent application ambiguity (such as the formation of the circuit pattern described below), the hole sealing process is first performed, taking the oxidized underlying substrate as an example. - Generally, the hydration sealing process and curing are included. Material sealing process. The hydration sealing treatment requires the recording board to be placed in hot water, such as above about 10 degrees Celsius, soaking for 30 to 60 minutes, so that the oxidized layer and water form an aqueous oxide to seal the pores and form a sealing layer. Tinan's wear resistance. The curable material sealing process is generally applied by coating a resin or molten paraffin to seal the pores and then hardening the plugging layer. However, the oxidation after the (four) hole treatment (4) in the subsequent high-temperature process is very easy to cause the oxidation of the oxidized layer due to evaporation of water or stress caused by the difference in expansion coefficient between the sealing layer, the substrate and the oxygen-aluminized layer. 'Crack 5 as shown in Fig. 1C, and thus a leakage path may be generated. In order to avoid the above situation, as shown in FIG. 1D, before the following patterned conductive layer is formed at a high temperature in this embodiment, the substrate after the anodization is not subjected to the hydration sealing process or the curable layer. Material sealing treatment, but directly

Client's Docket No:: TT's Docket No: 0849-A41276-TW/fmal/chad 12 200822797 Soak the carrier substrate in some (10) 4 red insulating oil film 6 of insulating oil (such as the materials described below), and then remove it. The carrier substrate 2 is thus formed on the following patterned conductive/support substrate by a high temperature process. (4) does not contain any sealing layer or insulating oil , plate, and the temperature of the insulating oil can be from room temperature to Celsius (10) degrees. It is better not to exceed 300 degrees. For the patterned conductive layer, please refer to FIG. 1A. In this example, a patterned conductive layer m is additionally formed on the surface of the planarization insulating layer 160 of the carrier substrate 1〇2, and includes a contact pad 170a for connecting the illuminating crystal through the wire 190. The particle 1〇4, the portion of the patterned conductive layer described above, is a so-called circuit pattern. In addition, in order to make the height of the bottom of the luminescent crystal 104 and the contact pad 17A', it is also possible to form a bearing portion 170b on the surface of the planarization insulating layer 160 to carry the luminescent crystal grains 〇4. In one embodiment, the luminescent die 104 can be affixed to the carrier 170b by laser brazing of the patterned conductive layer 17〇. In an embodiment in which the patterned conductive layer is formed, a metal material may be selectively plated or magnetron-sputtered onto the planarization insulating layer 16 to form the patterned conductive layer 170. Another method is to screen print a conductive ink on the planarization insulating layer: and then thermally cure the conductive ink on the planarization insulating layer 160 to form a conductive layer 170 as a conductive ink. It can be a conductor filled thermosetting polymer resin ink filled with a conductive material, #J士口

Client's Docket No.: TT's Docket! Sio: 〇 849-A41276-TW/fmal/chad 13 200822797 A silver paste composition as disclosed in U.S. Patent No. 5,585,581. Another embodiment is to use a high temperature process, such as 400 degrees Celsius, to form a patterned conductive layer comprising a contact 塾 170a, and a carrier portion 170b that can be closely bonded to the luminescent crystal. Generally, the sound can be mixed into the glass. The powder or the resin material is used to improve the adhesion. Preferably, the patterned conductive layer can be made by using a mixture of silver and glass powder as the silver t. 9

However, as previously described, when the patterned conductive layer is subsequently formed on the substrate 102, it is possible that the thin metal insulating layer structure is damaged due to the 4 〇〇 6 high temperature process to form a leakage path. As shown in the figure ι, in addition to the hydration sealing process or the curable material sealing process before avoiding the surface pattern, the circuit pattern can be further immersed in the insulating oil after the high temperature process, for example, immersed in In the bismuth-based eucalyptus oil, the different stresses generated by the high temperature of the metal and metal insulating layers are reduced, and at the same time, the holes 4 can be filled again to be insulated. In an embodiment, an aluminum-deposited aluminum layer 160 is formed on the surface of the aluminum substrate 1〇2 by anodizing; and a conductive ink is printed on the aluminum oxide layer 16〇 by high-temperature sintering. When the conductive layer 17 is patterned, when the aluminum substrate 102 is cooled to 350 degrees or less, it is immersed in an insulating oil having a temperature of 100 degrees or more to reduce different stresses generated by high temperature of the metal and metal insulating layer to reduce formation. The opportunity for cracks also produces an insulating effect. In one embodiment, since the aluminum substrate is previously oxidized by the anodic treatment to form an aluminum oxide layer (such as aluminum oxide), it may be required to form a silver paste conductive line on the surface of the aluminum oxide layer. -600 degrees Celsius to cure, and

Client's Docket No.: TT's Docket Νο:〇849·Α41276-TW/final/chad 14 200822797 The oxidized Ming and Ming substrates may have different internal stresses after being subjected to a side-6 (10) degree high temperature, resulting in rupture of the oxide layer. Silver paste infiltrates, forming a leakage circuit port. One of the characteristics of this example is that it can be immersed in the insulating oil of about (10) degrees to (10) degrees Celsius in the process of thermal curing of the silver paste. It is better to not exceed 3 degrees. In this way, in the cooling process after the high-temperature curing of the silver paste, the different internal stresses generated by the different materials of the silver poly, the oxidized inscription layer and the Ming substrate are obtained after the high temperature of the 400' degree, and secondly, by The insulating oil filled in the holes can isolate the possible leakage path, and in an embodiment, the cooling process takes about 5-30 minutes. In the optional process, the insulating oil film remaining on the upper surface of the carrier substrate can be removed again, and therefore, the interface between the upper surface of the carrier substrate, particularly the surface of the patterned conductive layer_metal insulating layer, will not contain any Sealing layer or insulating oil film. It is worth noting that the plugging layer referred to herein refers to the person who produces the process by the sealing process plus ' instead of being naturally exposed to the external environment. Heat Dissipation Module Referring to FIG. 1A, in the implementation, the bottom of the carrier substrate 1 2 further includes a heat conducting portion 180 that can accommodate one or more heat pipes il2 to generate heat flow caused by the light emitting grains m. The surface of the heat conducting portion (10) includes - or a groove 1 〇 2a to accommodate the heat pipes 112. In a further embodiment, the light-emitting module 1 further selectively includes a heat-dissipating portion m located below the carrier substrate 1〇2. Wherein, the heat dissipation portion 114

Client's Docket No.: TT^ Docket No: 0849-A41276-TW/final/chad 200822797 • The heat transfer tube 112 and the carrier substrate 102 may be closely adhered by the corresponding recess 112a. In FIG. 1A, the lower surface of the heat dissipating portion 114 may include a heat dissipating fin or a honeycomb or porous ceramic structure 115 to promote a heat dissipating effect, wherein when the carrier substrate 102 is a layer of tantalum carbide material, it may be honeycombed with tantalum carbide, The porous ceramic heat dissipation structure is co-fired and integrally formed. The interface between the reflective structure and the carrier substrate. Refer to the light-emitting module shown in Figure 2A. In the present embodiment, the bottom of the reflective structure 110 is bonded to the carrier substrate 102 by the adhesive 150. However, since the adhesive 150 has a certain height after curing, the side light emitted from the side of the light-emitting die 104 is There may be a portion that will enter the interface between the reflective structure 110 and the carrier substrate 102. Therefore, regardless of whether the adhesive is made of a transparent or opaque resin, the light entering the interface cannot be reflected by the reflective structure, and thus the light-emitting column may be degraded. Luminous efficiency. In this example, a plurality of luminescent powders, such as phosphor powder, are mixed in the adhesive 150, such as a transparent resin, so that the side light entering the interface between the reflective structure 110 and the carrier substrate 102 can re-energize the adhesive. The illuminating powder in the light causes it to illuminate and re-enter the illuminating column, thereby improving the luminous efficiency. Arrangement of multiple illuminating dies: I. Please refer to the arrangement of illuminating columns with multiple illuminating dies as shown in Fig. 2B. The conventional illuminating module is mainly composed of a reflective cup surrounding a single wafer. The reason why the multiple wafer arrangement is not used is that the sides of the respective light-emitting dies may respectively shield the sides of the other light-emitting dies from being emitted.

Client's Docket No:: TT’s Docket No: 0849-A41276-TW/fmal/chad 16 200822797 ^ Side light' thus detracts from luminous efficiency. In order to improve the luminous efficiency, the arrangement of the unmodulated illuminating crystal grains and the reflective structure disclosed in the embodiment can be applied to the illuminating module described in the previous embodiment. The light emitting module includes a plurality of light emitting columns 130a, 130b, and each of the light emitting columns is surrounded by a light reflecting structure 110. Taking the illuminating column 130b as an example, it includes a plurality of illuminating dies, such as illuminating dies 104a, 104b, which can be carried on the substrate 102. The side wall of the reflective structure 110 includes a reflecting surface for reflecting the light L emitted by the luminescent crystal grains. In the illuminating column 130b, in terms of the relationship between two adjacent illuminating dies, for example, the illuminating dies 1 〇 4a, 1 〇 4b each include at least one side 124a, 124b, and wherein the illuminating crystal grains are 1 〇 The projection surface of the side 124a of 4a does not substantially overlap the side 124b of the corresponding light-emitting die 1〇4b. In another embodiment, the projection surface of the side 124a of the light-emitting die 104a and the side 124b of the corresponding light-emitting die 104b may not substantially overlap at all, as required based on higher luminous efficiency. Further, a quadrilateral crystal grain is taken as an example. If the four side edges of two adjacent crystal grains are arranged in the above manner, the highest luminous efficiency can be obtained. In general, substantially incompletely overlapping means that the projection surface of the side edge 124a of the light-emitting crystal grain 1〇4& and the overlapping portion of the side edge 12 of the corresponding light-emitting crystal grain 104b are smaller than 90 of the projection surface area. % substantially does not overlap means that the overlapping portion of the projection surface of the light-emitting grain such as the side 124a of the layer 104a and the side edge 124b of the corresponding light-emitting crystal grain 104b is less than 1〇0/〇 of the area of the projection surface; If the projection surface of the side i24a of the light-emitting die 104a and the side 124b of the corresponding light-emitting die 104b are substantially smaller than the projection

Client’s Docket No·: TT5s Docket No: 0849-A41276-TW/fmal/chad 17 200822797 When the surface area is 50%, the effect is better. The effect is best when the overlap is essentially zero' and generally does not exceed 70%. Further, the illuminating crystal grains may be selected from polygonal light-emitting crystal grains, for example, a quadrangle or a hexagon, and the shape is determined according to the die cutting technique.

In terms of the relationship between the illuminating crystal grains and the reflective structure, in one embodiment, the direct ray rays emitted from the side of the illuminating crystal grains are substantially or obliquely oriented toward the anti-structure. The higher the luminous efficiency can be obtained when the side wall reflective surface is not blocked by other illuminating crystal grains; the direct ray L emitted from all the sides of one illuminating granule is substantially or at an oblique angle toward the reflecting light. The reflective side of the structure side wall is not blocked by other illuminating crystal grains, and the luminous efficiency of the rain can be paid. However, when the density of the illuminating crystal grains is required to be high, it is also possible to allow a portion of the direct ray to be blocked by the other illuminating crystal grains as defined by the overlapping area as previously described. In addition, as shown in FIG. 2B1I, the two adjacent wafers 1 () and the wafer secret include - the shortest pitch p, for example, the distance between the ends of the two wafers, so that the rotation of the shortest pitch p (four) of the crystal side surface can be adjusted. The projection surface Ai and the side surface 八2 of the wafer 104a do not overlap or completely overlap each other. For example, the overlapping portion should substantially be less than the projection surface area, preferably zero; or substantially less than 7°%, preferably: The number is below 5G%. In another embodiment, the direct light emitted by each of the two adjacent dies may be substantially or tilted by providing a plurality of illuminating dies at an appropriate pitch. The angle is toward the side wall of the reflective structure to achieve higher luminous efficiency. In another - implementation of the shoot, the light "general (4)

Client's Docket No.: TT^ Docket No: 0849-A41276-TW/fmal/chad 18 200822797, to avoid greening due to excessive overlap of the side projection surfaces of adjacent two illuminating dies, a & ν, § Some of the illuminating crystal grains are composed of polygonal light-emitting crystal grains; the illuminating crystal grains include a diagonal line extending from both end points, because the mtr crystal grains 1" diagonal lines are parallel to the side walls of the reflective structure 1(1) Bit 2 is automatically listed. For example, the plurality of illuminating dies may each include a pair of points on the bis- _* and the ends of the illuminating dies are located on the axis of the inner side wall or on the day parallel to the axis In the case of 1⁄4=4 inch ,, for example, in the quadrilateral grain, the sides of the side wall surface can be directly inclined to the same reflective edge, so that the phase of the grain 1(10)a can be made. Both sides of the connection a ' = facing the side wall of the same reflective structure. In addition, the length of each side of the illuminating crystal grain is not the same as that of the Γ 心 心 心 此 具有 具有 具有 具有 具有 具有 具有 具有 具有 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优 优Face-to-edge: two I::,,:1 'can be (four) and not easily by the other: two = quality toward the side of the reflective structure of the reflective surface 'rate. Blocking 'so can effectively improve the luminous efficacy'; please refer to Figure 2C, in another embodiment - 102 required area, or the summer of the old gossip \ 乂钿 small substrate, the second 疋 冋 冋 冋 day The arrangement density of the particles, 戋 is 捭, : ^ luminescence _ luminescence intensity, in the heat dissipation conditions allow:; direct light ray* emitted by the amber day will be produced by other luminescent crystal grains, and can be selected according to the above principles In a reflective structure:: Waitian

Client's Docket No.: TT's Docket No; 0849-A41276-TW/fmaI/chad 19 200822797 At least two rows of light-emitting dies 130a, 130b are disposed in the illuminating column. The number, density, brightness or color temperature of the two rows of illuminating crystal grains may not necessarily be the same, and the arrangement may not be side by side or symmetrical, and the misalignment may be arranged, for example, the position of the luminescent crystal 104e. In another embodiment, adjacent ones of the two rows of the light-emitting crystal grains 13a, 13B include at least one side, and as the side of the light-emitting die 1〇= The projection surface does not overlap or does not completely overlap with the side of the corresponding illuminating crystal grain 104c or 104d, for example, the overlapping portion may be substantially smaller than 10% of the area of the projection surface, preferably zero; or substantially Less than a long distance, 70% of the shirt area, preferably less than 50%. In other examples, the alignment principles of the embodiments disclosed in Figure 2B above may also be applied to the embodiments disclosed in the figures. frame

Please read the schematic diagram of the light-emitting module shown in Figure 3. In this embodiment, the φ illuminating module further includes a frame 310 fixed on the carrier substrate 102. In a consistent embodiment, the 'pivot frame 31' can be integrally formed with the reflective structure 11 以 to frame the illuminating columns. 13〇a, 130b, etc. The surface of the carrier substrate 102 on both sides of the frame 310 includes a circuit area 3〇〇 for electrically connecting the light-emitting columns to the power source. I Please refer to the schematic diagram of the light module shown in Figure 4. In this embodiment, the frame 310 may include an inner frame 310a to frame the light-emitting columns and an outer frame 310b to frame the circuit area 3'. In addition, the carrier substrate can be thinned, such as forming a flat substrate 102, to facilitate installation, and can effectively reduce

Client’s Docket No.: TT's Docket N〇: 0849^A41276-TW/finaychad 20 200822797 The size of the lighting module. In addition, since the illuminating device of the embodiment has been modularized and planarized, the ease of assembly is greatly improved, and the circuit pattern for electrically connecting the illuminating dies is further increased, for example, to further improve the versatility and simplicity thereof. The wire 302 can extend to the substrate region 102 ′′ outside the reflective structure, for example, the substrate 1 〇 2 outside the circuit region 300 , and can electrically contact a conductive block 30 , for example, can cover a layer of flat copper or metal layer on the wire. 3 〇 2, or directly replace the part of the wire with the conductive block 3 ,, so that it is more convenient to connect the power supply 'and can also effectively reduce the resistance. Lens Refer to the lens structure 500 of Figure 5A-5B and the 6th m仏1 mouthpiece Handi 6 and its fabrication and combination. First, as shown in FIG. 6, in an embodiment, the lens 5 (9) covers the entire illuminating column and is fixed on the 2= including the reflective structure ιι, wherein the lens 500 faces the carrier substrate 1 〇 2, and the projection surface serves as a crotch region, which may be a polygonal face, such as a rectangular face, a square face,

= Γ, Γΐ column and can emit a uniform first line in a circle by the lens. In a consistent embodiment, the lens adjusts the color temperature of the source. ',,, thoroughly, brother, can be used in the production of the lens structure 500, such as a first preparation -: circular or elliptical lens, after the autumn ~ Α _5 Β 所示 ' 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首 首Pu'er_Arc side 530 510. In the case where the lens is too thin, the lens of the face or the octagonal face J Γ is attached to a temple, but 55 〇 to avoid lens breakage. Low #光层层 In this embodiment, if using an octagonal read cable projection

Client's Docket No,: TT^ Docket No:0849-A41276-TW/fmal/chad The area is about 2nd to 2/2 of the original circle 21 200822797 > shape or oval lens projection surface area, such as using six The angular lens structure can be reduced by an area of about 3 cents to 2 centimeters compared to the use of a circular lens, and the carrier substrate 102' can therefore have additional surfaces on both sides to accommodate the circuit area. In a specific embodiment, for example, a slightly smaller octagonal lens is used in combination with a rectangular reflective structure having a slightly larger size, and the stone enamel material is first placed in a vacuum pump to extract the air. Apply to the inner surface of the lens and the frame of the reflective structure _ inside', and the corner portion will create a gap when the octagonal lens is placed in the rectangular frame. Therefore, when the lens is directly pressed into the frame, the excess shijiao can be made. The material and the air are overflowed from the gap, so that the filling of the lens and the inner layer of the layer of the light-emitting material or the underlying protective layer can be completed and the residual air in the sealed chamber is maintained. In other words, the light of the embodiment The size of the module can be reduced, and the light emitted by each of the illuminating columns can still be combined with the output of the mixed light source by the combination of the reflective structure 11 〇 and the lens structure 5 。. In addition, please refer to the fifth Βϋ, in order to increase the illuminating crystal The light emitted by the particles can be projected to the outside world more quickly. This can be turned to the inner surface of the illuminating column 515 (four) roughening treatment, in which the roughened surface 515 is closer to the luminescent crystal. The luminescence of the granules can therefore dissipate the light source early, that is, the roughening of the inner surface of the lens to form a plurality of irregularities or lines can increase the scattering angle after the light is reflected, and the light extraction rate can be increased by about 10%, in other words, Through the inner surface of the lens

Client's Docket No.: TT,s Docket No:0849-A41276-TW/fmaI/ciiad 22 200822797 • As a result of the coarsening, the light emitted by each of the luminescent grains of each column is multi-refractive and forms (10) degrees. The light source of this lighting module is softer and suitable for lighting sources. For lighting equipment, refer to the lighting equipment such as the combined street lamp or table lamp shown in Fig. 7. Generally, the lighting device includes an opening body 71〇, and the supporting plate 72 is fixed to the opening of the lamp housing 710. The plurality of light-emitting modules 600 can be fixed to the outer surface of the support plate 700 through the detachable fixing device 730, such as the screw of the carrier substrate 102 and the support plate 720 by a screw-locking screw. Fixed by holes. In another embodiment, the carrier substrate can be directly part of the housing body, such as an alumina substrate to form an integrally formed lamp housing and the desired carrier substrate. Heat Dissipation of Lighting Equipment #Please refer to the external and internal schematic diagrams of the lighting apparatus shown in Figures 7 and 10, wherein each lighting module is further included in the lighting apparatus of the present embodiment. a plurality of light-emitting columns and their light-emitting crystals, so that the heat-dissipating portion 800 is disposed in the chamber of the entire lamp housing: in the space 'and is shared by the respective heat-dissipating modules, so that each light crystal is generated Granules and δ, the heat dissipating area may include the entire heat dissipating portion 800, and it is less likely to cause a single illuminating crystal grain to be damaged due to heat loss. First, referring to FIG. 8 to FIG. 1 , the heat dissipation path of the light-emitting module mainly includes a carrier substrate 102, and can also serve as a support plate 720 of the heat dissipation plate.

Client's Docket No.: TT, s Docket No: 0849-A41276-TW/fmal/chad 23 200822797 and a heat dissipating portion 800 attached to the inner surface of the support plate 720. The heat dissipating portion 800 mainly includes one or more heat conducting tubes 810 and a heat dissipating block 820. The heat conducting tube 81 is L-shaped in this example, so that one side thereof can be attached to the inner surface of the supporting plate 720. The other side can pass through the heat dissipation block 820 to preferentially heat the heat-emitting module 820, and the heat-dissipating block 820 is also attached to the support plate 720 to disperse the heat on the support plate 720. In addition, the heat dissipation path can continue to extend to an external mechanism outside the lamp housing. In addition, _ can be installed with a power-free heat dissipation system on the housing body or in the receiving space to increase the heat dissipation effect. For example, a film vibration device, such as a metal or alloy spring piece, is added to the accommodation space in the chamber, and the principle of thermal expansion and contraction caused by the temperature difference is used. When the heat of the light-emitting module is guided to the accommodation space, the temperature difference can be made. The film generates vibration, thereby causing a disturbance of the air in the accommodation space, thereby improving the heat dissipation effect. In another embodiment, a wind or thermal (e.g., solar) driven fan may be disposed outside the lamp housing, so that the fan can be operated to cool the lamp housing by external wind or heat. φ In this example, the heat pipe 810 can increase the heat transfer efficiency, and includes a body having a vacuum sealed cavity. The body can be made of a heat dissipating metal such as copper or aluminum. The vacuum sealed cavity is filled with a heat transfer fluid such as water and fine. The wick is distributed on the inner wall of the closed cavity. Therefore, the heat transfer fluid in the heat pipe is heated and evaporated to the ends of the body near the heat source, and is condensed at the cold regions at both ends and then borrowed by the filament. The capillary principle pulls back the heat source to continue heat conduction. The heat sink block and the support plate are generally made of a metal having a good thermal conductivity, such as Ming, copper or its alloy. In addition, please refer to Figure 9 and Figure 1 at the same time, in another implementation.

Client's Docket No.: TT^ Docket No: 0849-A41276-TW/final/chad 24 200822797 In the example, the heat dissipating portion 800 further includes a heat dissipating member 830, such as a heat dissipating fin, which is generally made of a copper material. In another embodiment, as shown in Fig. 9, the heat dissipating member 830 may also be selected from a honeycomb heat dissipating ceramic structure, for example, sintered from a carbon carbide material. As shown in FIG. 10, the heat dissipating component 830 can be attached to the heat dissipation block 820 and the support plate 720 for better heat dissipation. When the adhesive for fixing the heat dissipating parts of the heat dissipating portion is selected, the heat dissipating effect of the adhesive should be paid attention to not hinder the heat dissipating path. In this example, for example, an atomic ash containing an unsaturated polyester resin component can be used. Adhesive. Light-emitting module of the light-emitting module Please refer to the light-emitting module shown in Figures 11 and 12. Wherein, the light-emitting module of the embodiment includes a plurality of light-emitting columns, so that at least one of the light-emitting columns emits a first light having a first color temperature, and at least one of the second light-emitting columns can emit a second light. a second light of color temperature, and then mixing the first and second rays by the lens to output a third light having a third color temperature, or in another embodiment, mixing by a colored lens filter effect The first and second light rays output a third light having a third color temperature, whereby a harmonic effect can be produced. The third color temperature value is between the first color temperature value and the second color temperature value. Taking the white light illumination device as an example, as shown in FIG. 11 , the light having the different color temperature can be listed on the same carrier substrate 102 ′. And outputting the mixed light through the reflective structure and the lens, so that the color temperature of each light column can be set according to the color temperature requirement of the overall light, for example, currently

Client's Docket No.: TT's Docket No:0849-A41276-TW/fmal/chad 25 200822797 The color of the warmer color is about 33〇〇k, and its color temperature is about 3300k-6500k, while the cool color is light. Its color temperature is about 6500k or more. Therefore, in this example, if the illumination of the warm white series is to be set, the low color temperature illumination column 13〇a may occupy a higher proportion than the high color temperature illumination column 130b. In addition, please refer to FIG. 12, which shows another embodiment of a light-emitting column having different color temperatures, for example, a whitish light column i32a' covered with a layer of luminescent material may be selected according to the color temperature setting. For example, with a red-yellow light (low color / or light (still color temperature) and other light-emitting columns without a layer of luminescent material mixed to form a lower color temperature of the warm color light, or a higher color temperature of the cold color light. Manufacturing Method The present embodiment provides a method for manufacturing a light emitting module. The manufacturing process includes the following steps, but the order of the steps may be adjusted according to the needs of the process without limitation. Please refer to Figures 1A to 1D, firstly, provide A substrate 102, such as a metal substrate of the inscription material, is anodized to form an aluminum carrier substrate having a planarized aluminum oxide layer 160, wherein the planarized aluminum oxide layer 160 is wrapped with a plurality of holes 4. The substrate is then 〇 2 ^ immersed in the insulating oil to coat the upper surface of the oxidized layer 160 and the hole 4 with a film of insulating oil 6 to remove the insulating oil film on the upper surface of the aluminum oxide layer 160. The road pattern 170 is formed on the surface of the substrate 102 by a high-temperature silver paste process, and is fixed in a plurality of rows of light-emitting crystal grains.

Client's Docket No.: TT's Docket No: 0849-A41276-TW/fmal/chad 26 200822797 On the board 102 or the bearing portion 170b, the arrangement of the light-emitting dies can be selected such that the direct light of the side faces as far as possible toward the side wall of the reflective structure. And reducing the overlap of its projection surface and other luminescent dies, as in the previous embodiments shown in Figures 2B and 2C. Then, during the cooling process, it is again immersed in the insulating oil film 6 below 3 degrees Celsius, such as 100 degrees to 150 degrees, to buffer the stress between the layers of different materials, and the insulating oil film is again filled into the hole 4 to avoid A possible leakage circuit control 5' subsequently removes the insulating oil film on the surface of the metal insulating layer. Next, referring to the brothers 1A and 2, the present embodiment provides a reflective structure 110 having a plurality of columns of spaces. For example, a plastic reflective structure having a chrome-plated or silver-plated reflective surface is used to carry the light on the substrate 1Q2 to accommodate the columns of light. The illuminating crystal grains 104 are listed. The reflective structure 11A can be integrated on a frame 31, as shown in Fig. 4, which includes an inner frame 31a and an outer frame 31b. The adhesive between the reflective structure 110 and the substrate 102 can be mixed with a plurality of phosphor particles to illuminate and re-enter the light-emitting column. After the wire bonding process is electrically connected to the die and the circuit pattern, the phosphor powder can be directly coated in the column of the light-emitting column by spraying; the other way is to make the plurality of phosphor particles and one The liquid containing the adhesive is mixed to form a mixed liquid, and secondly, the mixed liquid can be filled into the inner frame 310a of the reflective structure 1 1 , for example, by using a dropping method, and removing the liquid after the wire, for example, using a drying process to make the firefly The light powder particles are agglomerated into a phosphor powder layer 106 by van der Waals and adhered at least to the crystal grains (7) in the above-mentioned reflective structure 11 . By the above process, a luminescent material layer 1 〇 6 which continuously covers the columns of the luminescent crystal grains 1 〇 4 and extends to the side walls of the light reflecting structure 110 can be formed.

Client's Docket No·: TT's Docket No:0849-A41276-TW/fmal/chad 27 200822797 Proud τ II I · This example can choose to perform nanocrystallization on these fluorescent particles to 44 δ δ sticky , 丨之,, right Μ ^ j / night body more evenly mixed to form a mixture. Another way of homogenizing is to add a medium to the liquid without the adhesive. ^θ 1V4 Some of the phosphor particles are more uniformly mixed with the liquid without the adhesive. Evil stop ^ then privately remove the liquid and organic solvent to make the phosphor particles agglomerate, for example, V, V attached to the light-emitting crystal grains in the above-mentioned reflective structure: s 'organic solvent can generally choose stone can or pine, ά, Rude can remove the organic solvent through the high temperature program, the sapphire oil, and then according to the invention below ^ degrees Celsius. To improve the general mind "the reflective structure 110 used in the example can be in the inner frame 31Ga, 2, that is, only a small amount of mixed liquid is left in the mouth, and the drying method can be used to remove the remaining = : Chengrong light powder layer 106 and adhered to the upper part of the reflective structure 110 can improve the process efficiency. The sonic enamel powder layer detachment 'this embodiment can be selected to fill - transport" or % oxygen resin layer Or embedding a hard glass layer in the reflective structure 110 to press on the bran & h, ^, loyal granules 106 as an inner cover layer 108. Figure 6 shows a lens 5提供0 to cover the entire reflective structure 11〇' lens can be selectively cut to form a rectangle or polygon to reduce the area occupied by the substrate: the closed cavity inside the lens can be refilled with another - inner cover to improve the penetration of the bears Alternatively, the two layers of the cover layer may cover the reflective structure 11()n in the lens 5, and then inject the dia plastic material to form an inner cover layer which is integrally formed and has no interface. The flattened light-emitting module Can be assembled in a detachable manner as shown in Figure 7 The support plate constituting a lighting system.

Client's Docket No.: TT's Docket No: 0849-A41276-TW/fmal/chad 28 200822797 Although the present invention has been disclosed above in several preferred embodiments, the second embodiment of the present invention is defined as 'anyone skilled in the art, The present invention is intended to be used as a singular change and refinement. Therefore, the scope of the patent application of the present invention is defined by the scope of the patent application. Alignment t-view [Simplified description of the drawings] Fig. 1A is a partial cross-sectional view showing a light-emitting module of an embodiment.

1B to 1D are diagrams showing a process profile of a carrier substrate of an embodiment.

2A is a partial cross-sectional view showing a light emitting module of another embodiment. Fig. 2B is a diagram showing the arrangement of the luminescent particles in the illuminating column of one embodiment of the ία diagram. $ 曰曰 Fig. 2C is a view showing the arrangement of the luminescent crystal grains in the illuminating column of another embodiment of Fig. 1A. FIG. 3 is a schematic diagram showing the combination of the light emitting modules of an embodiment. FIG. 4 is a schematic diagram showing the combination of the light emitting module of another embodiment. 5A-5B shows a lens structure of an embodiment and a manufacturing method thereof. FIG. 6 is a schematic diagram showing a combination of a light-emitting module and a lens structure according to an embodiment. The seventh chaotic diagram shows a schematic diagram of an illumination device combining a plurality of illumination modules in an embodiment. Fig. 8 is a view showing a heat radiating portion used in an embodiment of the lighting device of Fig. 7. Figure 9 is a diagram showing another embodiment of the lighting device of Figure 7

Client’s Docket No·: XT's Docket No: 0849-A41276-TW/fmaI/chad 29 200822797 Heat Dissipation Department. Fig. 1 is a view showing a heat radiating portion used in another embodiment of the lighting device of Fig. 7. Figure 11 is a schematic view showing an embodiment of a light-emitting module having light-emitting columns emitting light of different color temperatures in an embodiment. Figure 12 is a schematic view showing another embodiment of a light-emitting module having light-emitting columns emitting light of different color temperatures. 10 [Description of main component symbols] Light-emitting module 100; carrier substrate 102, 102; light-emitting die 104; luminescent material layer 106; reflective structure 110; inner cover layer 〇8; lens 2 〇〇; illuminating column 130; Insulating layer 16〇; heat conducting portion 18〇; heat conducting tube 112; groove 102a; heat dissipating portion 114; heat dissipating fin 115; patterned conductive layer 170; contact pad 170a, wire 190; bearing portion n〇b; 112a; adhesive 150; illuminating column 130. 13013, 1323, 1321>; illuminating crystal grains 1043~1046; illuminating crystal grain sides 124a, 124b; side direct ray L; shortest pitch p; φ projection plane A1; Side surface A2; frame 310, circuit area 300; inner frame 31〇a, outer frame 310b; lens structure 5〇〇; arc side 53〇; rectangular lens 510; bottom light transmissive layer 550; roughened surface 515; The light-emitting module 6〇〇; the support plate 720: the shell body 710; the fixing device 73〇; the heat pipe 81〇; the heat sink block 820; the heat dissipating component 830. :

Client’s Docket No.: TT5s Docket No: 〇849-A41276-TW/finaI/chad 30

Claims (1)

200822797 X. Patent application scope: 1. An illumination system comprising at least one illumination module, comprising: a carrier substrate; a plurality of illumination columns being carried on the carrier substrate, each illumination column comprising a plurality of un-modules Light-emitting crystal grains, and each light-emitting array is surrounded by a reflective structure; and A lens is disposed on the light-emitting columns to adjust the light of the light-emitting columns to form a light source. 2. The system of claim 4, wherein the light-emitting module further comprises a layer of luminescent material disposed in at least one of the columns of illuminating columns and covering the unmodulated illuminating Grain. 3. The hairline system of claim 2, wherein the luminescent material layer comprises a plurality of multi-powder powders - a portion of which is a coagulating block and is free of an adhesive. 4. The illuminating system of claim 2, wherein the illuminating = further comprising a lamella layer is included in the reflective structure and is housed in the fascia / / as described in item 2 of the patent scope An illuminating system, wherein the illuminating layer continuity covers the unmodulated illuminating dies and the inner side wall of the reflective structure is 发光 任 任 任 , , , , , , , , , , , , The illuminating system according to the first aspect of the invention, wherein at least Clients Docket No.: TT5s Docket N〇: 0849-A41276.TW/fma]/chad 31 200822797 The two adjacent first illuminating crystal grains are shortly spaced and each include at least a side edge, a projection surface of the side of the shortest interval, and the second illuminating day Λ 光 日 日 钐 钐 钐 钐The sides do not overlap. 8. The illuminating system of claim i, wherein the two adjacent first and second illuminating dies of the sub- illuminating column have 1 = and 2 ί a light-emitting system of the side of the first light-emitting dies, wherein the side of the light-emitting dies At least - the illuminating column - the illuminating dies comprise a plurality of sides, and the direct ray emitted by each of the illuminating dies is blocked by the sidewall illuminating dies. The illuminating system of claim 2, wherein at least one of the illuminating columns comprises a pair of points on both sides of the oblique line, and the two ends of the illuminating crystal grains are in parallel The axis of the reflective structure or the axis of the axis is parallel. The illuminating system of claim 1, wherein the illuminating column comprises a illuminating column that emits light of a higher color temperature and a illuminating column that emits a lower color temperature. The illuminating system of the invention, wherein at least one of the illuminating columns is covered with the luminescent material layer to emit a first ray, and the at least one illuminating column does not include the illuminating system. The luminescent material layer emits a second light, and the first light and the second light are mixed by the lens to output a third light. 13. The illumination system of claim 1, wherein the carrier is a Client's Docket No.: TT's Docket No: 0849-A41276-TW/fmal/cliad 32 200822797 The substrate is a metal substrate, and the surface thereof further includes / a metal insulating layer further comprising a patterned conductive layer on the surface of the metal insulating layer to electrically connect the light emitting crystal grains, wherein the patterned conductive layer and the surface of the metal insulating layer do not include a sealing layer or an insulating oil film. 14. The illumination system of claim 13, wherein the metal insulating layer comprises a plurality of holes, and the contact holes are covered with a layer of insulating oil film. ’ 15. The illumination system of claim 14, wherein the upper surface of the metal insulating layer does not comprise a sealing layer or an insulating oil film. 16. The illuminating system of claim 13, wherein the carrier substrate is a 'substrate' and the metal insulating layer is a porous oxidized layer that has not been hydrated or sealed with a curable material. 17. The patented scope of the invention is characterized in that the conductive layer is thermally cured by a silver paste, wherein the figure is constructed. 18. The illumination system according to claim 14 is characterized in that the insulating oil film is composed of methyl eucalyptus oil. The illuminating system of claim 1, wherein the basin substrate is made of a tantalum carbide material. The illuminating system according to the item 7, wherein the plurality of melons are as described in the above patent scope: the projection surface facing the carrier substrate is a polygon. 21·If the patent application scope is 2〇7, the first one of the first 癸 癸 b b 发光 , , , , , , y y y y y y y y y y y y y y y 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光Color temperature 1 first line, and at least 'mix the first output = line = hunting by the colored j has a second color of the second color of the client's Docket No.: TT^s Docket N〇: 〇 849.A4l276-TW/fmal/chad 33 200822797 The second color temperature value is between the first color temperature value and the second color temperature value. The illuminating system of claim 2, wherein the lens is rectangular, square, hexagonal or octagonal, and includes a circuit area on the carrier substrate on the outer side of the lens. The illuminating system of claim 22, wherein the illuminating module further comprises a frame - gj is set to the bearing, and the frame comprises an inner frame to frame the langs and reflect Structure, and - outer frame to frame the circuit area. The hair extension of claim 23, wherein the lens is smaller in size than the miscellaneous frame, and the lens faces the illuminating inner surface as a roughened surface. The light-emitting system of claim 1, wherein the light-emitting module comprises a circuit pattern on the carrier substrate to electrically connect the light-emitting crystal grains and extend outside the reflective structure And a conductive block, the conductive substrate is located on the surface of the carrier substrate outside the reflective structure to contact the circuit with the f-type. 26. The optical system according to the above claims 25 to 25, further includes: The shell body has an opening; a support member is fixed to the opening of the shell body to form - 1 wherein the light-emitting modules are detachably fixed to the side of the outer side of the support, and the heat dissipation portion is included Fitted in the cutting board =: The two hot parts as described in claim 26 include: τ a plurality of heat pipes, which are attached to the cutting plate, and the "support plate" is used as a Client's Docket No.: TT's Docket No: 0849-A41276-TW/final/chad 34 200822797 is a heat sink; and the eve of the political block 'attached to the support plate _ face and is covered by the heat pipes 0 Patent Application No. 27 The illumination system further includes The H r,, " sheet or honeycomb heat dissipation ceramic structure is attached to the inner side surface of the support plate and the heat dissipation blocks. The illuminating system of claim 26, further comprising a _ exempt source device, fixed to the housing body or in the accommodating space. The illuminating system of claim 1, wherein the at least one illuminating column surrounded by the illuminating structure comprises at least two columns of unmodulated illuminating dies. The illumination system of claim 3, wherein at least one of the illumination columns comprises two sides connected to each other, and the sides of the connection are oriented at the same angle Reflective structure side wall surface. The illuminating system of claim 2, wherein at least one of the illuminating crystal grains comprises at least one long side and one short side, at least the long side of the illuminating crystal grain is emitted The direct light is substantially or at an oblique angle toward the side wall of the reflective structure and is not blocked by other luminescent crystal grains. 33. A method for manufacturing a light-emitting module, comprising: providing a carrier substrate, which is made of a metal material; 4 anodizing the carrier substrate to form a porous metal insulating layer on the surface of the carrier substrate; covering a layer of insulating oil a film is formed on the porous metal insulating layer and filled in each hole; Client's Docket No:: TT^ Docket No: 0849-A41276-TW/fmal/chad 35 200822797 • Removing the insulating oil film on the surface of the porous metal insulating layer Forming a circuit pattern on the surface of the porous metal insulating layer; forming a plurality of light-emitting layers composed of a plurality of light-emitting crystal grains on the porous metal insulating layer; soaking the carrier substrate in the insulating oil having a predetermined temperature to buffer stress; The insulating oil film on the surface of the porous metal insulating layer is removed again; and a plurality of reflective structures are fixed on the carrier substrate, wherein each of the reflective structures includes a column space to accommodate one of the light-emitting columns. The method of manufacturing a light-emitting module according to claim 33, wherein after the plurality of reflective structures are fixed on the carrier substrate, the method further includes performing a wire bonding process to electrically connect the circuit pattern and the light-emitting crystals. grain. 35. The method of fabricating a light-emitting module according to claim 33, further comprising providing a lens to cover the light-emitting columns and the light-reflecting structure to adjust the light of the light-emitting columns to form a light source. The manufacturing method of the light-emitting module of claim 33, further comprising arranging the light-emitting dies of the light-emitting columns such that the two sides of the at least one light-emitting dies are connected at an oblique angle toward the same Reflective structure side wall surface. The method for manufacturing a light-emitting module according to claim 33, further comprising: arranging the light-emitting dies of the light-emitting columns to direct the direct light emitted by each side of the at least one light-emitting die to be substantially An oblique angle is toward the sidewall of the retroreflective structure and is not completely blocked by other illuminating dies. 38. The method for manufacturing a light-emitting module according to claim 35, wherein the lens is formed by: Client's Docket No.: TT9s Docket No: 0849-A41276-TW/finaychad 36 200822797 provides a circle Or an elliptical lens; and cutting 4 arc sides to leave a polygonal lens; wherein the polygonal lens projection surface area accounts for 2/2 to 2/3 of the area of the circular or elliptical lens projection surface. The method of manufacturing the illuminating module of claim 33, further comprising forming at least one luminescent material layer in one of the plurality of columns of spaces to cover the illuminating dies, the luminescent material layer The formation method comprises the following steps (4) or (b): (a) spraying the phosphor particles into the array spaces by spraying; (b) making the plurality of phosphor particles and an adhesive-free agent The liquid is mixed to form a mixed solution; the mixed liquid is filled in at least one of the array spaces; and the liquid is removed to agglomerate the fluorescent powder particles into a phosphor powder layer. 40. The method of manufacturing a light-emitting module stomach according to claim 33, wherein the carrier substrate is a substrate, and the method comprises: forming an aluminum-deposited aluminum layer on the surface of the aluminum substrate by anodizing. / Forking the substrate in the insulating oil from room temperature to 150 degrees Celsius; removing the insulating oil film on the surface of the oxidized layer; conducting electricity at a high temperature sintering method of 4 〇〇 -6 ° C The ink is printed on the oxidized inscription layer to form a patterned conductive layer, and when immersed to a temperature below 350 degrees Celsius, immersed in an insulating oil having a temperature between 10 and 300 degrees Celsius to buffer the conductive ink, The oxidation layer and the stress between the plates are formed, and an insulating oil film is formed on the aluminum oxide layer, and the k soil is again removed from the insulating oil film on the surface of the aluminum oxide layer. The manufacturing method of the light-emitting module according to the invention of claim 4, wherein the insulating oil is a sulphur-based stone oil. 42. The method of manufacturing a light-emitting module according to claim 41, wherein the conductive ink comprises silver paste or solder paste. 43. The method of fabricating a light-emitting module of claim 1 , further comprising the step of filling an inner cover layer in the lens to cover the light-emitting columns. The method of manufacturing a light-emitting module according to claim 43, wherein the step of filling the inner cover layer comprises: applying a stone coating material to the inner surface of the lens and the reflective structure, wherein the lens a octagonal lens having a small size, and the reflective structure is a rectangular reflective structure having a wide size; placing the octagonal lens in the rectangular reflective structure to create a void at a corner portion thereof; Pressing into the rectangular retroreflective structure allows excess litmus material and air to escape from the void. The illuminating system of claim 35, further comprising forming a roughened surface on the inner surface of the lens facing the illuminating columns. A method for manufacturing a carrier substrate having a circuit pattern, comprising: providing a carrier substrate, which is made of a metal material; and performing anodization on the carrier substrate to form a porous metal including a plurality of holes on the surface of the carrier substrate An insulating layer; a cover-layer insulating oil film on the porous metal insulating layer and filled in the hole; a Client's Docket No:: TT^ Docket No: 0849-A41276-TW/fmal/chad 38 200822797 Removal in the porous metal An insulating oil film on the surface of the insulating layer; forming a circuit pattern on the surface of the porous metal insulating layer; immersing the carrier substrate in the insulating oil having a predetermined temperature to buffer stress; and removing the insulating oil on the surface of the porous metal insulating layer again film. 47. The method of manufacturing a carrier substrate having a circuit pattern according to claim 46, wherein the circuit pattern is formed by printing a conductive material on the porous metal insulation at a high temperature sintering manner of 400 degrees Celsius or higher. Floor Client’s Docket No.: TT’s Docket No: 0849-A41276-TW/fmal/chad