TWI389595B - Subatrate structure and method for fabricating the same - Google Patents

Description

Load bearing substrate structure and manufacturing method thereof

The present invention relates to an illumination system, a light-emitting module, and a method of fabricating the same, and more particularly to an illumination system having a plurality of illumination columns, a light-emitting module, and a method of forming the same.

Light Emitting Diode (LED) is widely used in various display products because of its high brightness, small size, light weight, low damage, low power consumption and long life. The principle is as follows: a voltage is applied to the diode to drive the electrons in the diode to be combined with the hole, and the energy generated by the combination is released in the form of light; in addition, a phosphor can be added to the structure. To adjust the wavelength (color) and intensity of the light.

Among them, the appearance of white light-emitting diodes extends the application of light-emitting diodes to the field of illumination; the white-light-emitting diodes have lower heat generation than the most commonly used incandescent bulbs and fluorescent lamps in current illumination. The advantages of quantity, low power consumption, long life, fast response, small size, etc., are the focus of the development of the industry.

Based on the consideration of luminous efficiency and heat dissipation, the current method of manufacturing the light-emitting diode is generally packaged by using a single-die plus a reflector cup, and one can avoid the heat dissipation that may be generated by multiple crystal grains on the same substrate. The other problem is to prevent the two adjacent grains from blocking the light emitted from the sides of each other and affecting the luminous efficiency. However, the packaging method of such a single crystal chip will greatly increase the volume of the light-emitting module including a plurality of crystal grains, and the size factor It is not easy to shrink, so there is a need for a novel carrier substrate and light emitting module structure.

In view of the above, an embodiment of the present invention provides an illumination system including at least one illumination module, including: a carrier substrate; a plurality of illumination columns supported on the carrier substrate, each of the illumination columns including a plurality of unmodulated The illuminating crystal grains are organized, and each illuminating column is surrounded by a reflective structure; and a lens is disposed on the illuminating columns to adjust the light of the illuminating columns to form a light source.

Another embodiment of the present invention discloses a method for manufacturing a light emitting module, comprising: providing a carrier substrate, which is made of a metal material; and performing anodization on the carrier substrate to form a porous metal insulating layer on the surface of the carrier substrate; Covering a layer of insulating oil film on the porous metal insulating layer and filling the holes; removing the insulating oil film on the surface of the porous metal insulating layer; forming a circuit pattern on the surface of the porous metal insulating layer; forming a plurality of The light-emitting crystal composition is arranged on the porous metal insulating layer; the carrier substrate is immersed in the insulating oil having a predetermined temperature to buffer stress; the insulating oil film on the surface of the porous metal insulating layer is removed again; and the plurality of fixed oil films are fixed The reflective structure is on the carrier substrate, wherein each of the reflective structures comprises a column space to accommodate one of the light-emitting columns.

Another embodiment of the present invention discloses a method for manufacturing a carrier substrate having a circuit pattern, comprising: providing a carrier substrate, which is made of a metal material; and performing anodization on the carrier substrate to form a plurality of surfaces on the carrier substrate a porous metal insulating layer of the hole; covering a layer of insulating oil on the porous metal insulating layer and filling the holes; removing the porous layer An insulating oil film on the surface of the metal insulating layer; forming a circuit pattern on the surface of the porous metal insulating layer; immersing the carrier substrate in the insulating oil having a predetermined temperature to buffer stress; and removing the insulating layer on the surface of the porous metal insulating layer again Oil film.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

The present application is hereby incorporated by reference in its entirety by reference in its entirety in its entirety in its entirety in the the the the the the the the the

In the following embodiments of the present invention, the manufacturing method of the carrier substrate, the light-emitting module having the reflective structure and the heat conduction mode thereof, and the lighting device of the plurality of light-emitting module combinations, and the manufacturing method of the light-emitting module are mainly described, respectively. The examples are intended to be illustrative only and not to limit the scope of the invention.

In the present specification, the term "reflective structure" generally refers to a closed structure. In the embodiment of the present invention, although a rectangle such as a rectangle or a square is listed, it is not intended to limit the scope of the present invention, and a region surrounded by a circular reflective structure may also be used; in other embodiments, the reflective structure is The enclosed area can also be any other shape.

According to the retroreflective structure used in the embodiments of the present invention, light rays emitted from the sides of the light-emitting dies can be collected. The illuminating crystal grain may be composed of a light emitting diode capable of emitting a specific light, and the unmodulated illuminating crystal Granules generally mean that the luminescent crystal grains are not provided with a sealant layer or a reflector cup, or are bare crystal grains. In addition, the column of illuminating columns generally refers to a space formed substantially in a specific direction, and is not limited to a longitudinal direction, a lateral direction, or a straight line.

Light-emitting module with reflective structure

FIG. 1A is a diagram showing a light-emitting module having a reflective structure according to a preferred embodiment of the present invention. The illuminating module 100 includes a common carrier substrate 102 for carrying at least one illuminating column 130. Each illuminating column 130 includes a plurality of unmodulated illuminating dies 104, such as illuminating diode dies, and each A light-emitting column 130 is surrounded by a light-reflecting structure 110, and the light-reflecting structure 110 includes a space corresponding to the light-emitting columns 130 to fix the plurality of light-emitting crystal grains 104 on the carrier substrate 102 in the column space. In another embodiment, each of the light-emitting columns may further include an inner cover layer 108 fixed in the light-reflecting structure 110 and covering the plurality of light-emitting dies 104. The unmodulated illuminating dies generally mean that the illuminating dies are not provided with a sealing layer or a reflector cup, or are bare dies, so that the required area of the illuminating module can be reduced. In addition, since a plurality of light-emitting crystal grains can be arranged in a plurality of rows and surrounded by a plurality of columns of reflective structures, each of the columns emits light compared to the case where all of the light-emitting crystal grains are surrounded by only one annular structure. The distance between the grain and the reflective structure is not only shorter, but also easier to cause the emitted light to illuminate the adjacent reflective structure without being easily blocked by other luminescent grains. That is, since each of the illuminating columns can include a plurality of unmodulated illuminating dies, the area required for the illuminating module can be reduced, and each illuminating column is surrounded by a reflective structure, thereby facilitating illuminating effectiveness.

In addition, the at least one illuminating column can optionally further comprise a luminescent material layer 106 disposed in the same column to cover the surface of the plurality of luminescent crystal grains 104, for example, composed of a luminescent material, in one embodiment, The luminescent material layer continuously covers the unmodulated luminescent dies 104 and extends onto the inner sidewalls of the reflective structure. In a specific example, at least a portion of the luminescent material layer 106 may be a luminescent particle that is condensed into agglomerates and contains no adhesive. For example, a van der Waals bond may be formed by drying, in this case, fluorescein. The light granule layer 106 completely covers the upper surface and the side of each of the luminescent crystal grains 104 in the same column. In another example, the light emitting module can further include an inner cover layer 108 fixed in the reflective structure 110 and covering the luminescent material layer 106 as a protective layer.

The area enclosed by the reflective structure 110 may be a polygon, such as a rectangle or a pentagon, or may be a circle or an ellipse. Please refer specifically to the schematic diagram of the reflective structure 110 shown in FIG.

In general, the protective layer 108 can be formed by coating a soft polymer material such as silicone in a reflective structure, or a hard glass layer, an epoxy resin or other transparent plastic material layer, such as a layer. A polycarbonate (PC: Polycarbonate) or polyethylene (PE: Polyethylene) material is embedded in the reflective structure 110 to be pressed against the luminescent crystal 104 or the luminescent material layer. This prevents the luminescent material layer from falling off or preventing moisture from penetrating.

Since the reflective structure 110 can be used to adjust the direction of the light emitted from the light-emitting die 104, such as shadowing, reflecting, collecting, or focusing, the light-emitting crystal can still be solved when the light-emitting material layer 106 does not completely cover the side of the light-emitting die. Light leakage on the side of the grain 104, and improve the problem of light color shift.

The reflective structure 110 can generally be a metallic material having a reflective surface, or For a plastic body, the surface may form a layer of reflective material, for example, a layer of reflective material such as chromium, nickel, silver, zinc fluoride, or magnesium sulfide is selectively plated.

Wherein, since the reflective structure 110 and the light-emitting die 104 are disposed on the same surface, if a material having better heat dissipation characteristics, such as polishing to form a metal material having a reflective surface, heat dissipation efficiency can be improved.

In addition, a lens 200 may be disposed on the light-emitting column to cover the substrate 102, the light-emitting die 104, the protective layer 108, and the light-reflecting structure 110 to adjust the light of the light-emitting columns to form a light source. In addition to the use of the original silicone material, the lens can be changed to other materials. Because the lens is more light-transparent, PC or PE transparent plastic, acrylic, glass, glass. Polycarbonate or the like can also be used, and the light transmittance is related to the wavelength, and the light transmittance of different wavelengths is different, and the lens can also be a colored lens to increase the contrast of the light color. In one embodiment, the lens 200 can be closely attached to the outer frame of the carrier substrate 102 or the reflective structure 110 to form a closed cavity. The sealed cavity can be a vacuum environment or filled with an inert gas to maintain stability in the closed cavity. . In another embodiment, another inner cover layer may be refilled in the closed cavity above the protective layer 108 to further fill the reflective structures and the space above them to prevent moisture intrusion. Or in another embodiment, the protective layer 108 is not formed first, but after the lens is covered on the carrier substrate, the silicone is directly injected to cover the phosphor powder layer while filling the sealed cavity to form a protective layer with integral interface and no interface. .

In another embodiment, the inner sidewall of the reflective structure 110 forms an angle θ with the surface of the substrate 102, and 0°<θ<90°, but preferably θ=45°; the material of the reflective structure 110 is metal, for example, Stainless steel material; or It is made of plastic or resin, such as silicone rubber. It can also be changed to other materials. Therefore, PC or PE transparent plastic (Acrylic), Acrylic, Glass, Polycarbonate, etc. A coating is then applied to the surface of the reflective structure 110 to form a reflective effect.

In particular, in a specific example, the phosphor particles in the phosphor particle layer 106 are free of glue, so that the luminous efficiency can be increased. The number of crystal grains of the light-emitting crystal grains 104 is determined according to requirements; in this example, the crystal grains are light-emitting diodes.

In addition, in other examples, the shape of the area surrounded by the reflective structure 110 may be appropriately changed as needed, for example, a rectangle, a circle, or other shapes; and the shape of the reflective structure 110 itself may be arbitrarily changed. For example, the cross-sectional shape thereof may be trapezoidal, triangular or curved. In other embodiments, the area enclosed by the reflective structure may be any other shape, such as a space suitable for the backlight module to fabricate a suitable elongated reflective structure.

Carrier substrate

Referring to FIG. 1A, the carrier substrate 102 may be a metal material such as aluminum metal in this embodiment. However, it is not limited thereto. In other embodiments, a tantalum carbide material or a ceramic containing aluminum oxide or other ceramic materials having good thermal conductivity may also be used. Further, in this example, as shown in FIG. 1B, the surface of the carrier substrate may be further formed with a metal insulating layer 160 including a plurality of exposed holes, such as a metal oxide layer. One embodiment is on the surface of the aluminum substrate 3 The porous alumina layer 1 having a thickness of about 30 to 50 um is formed by anodization, and the porous alumina layer 1 contains a plurality of honeycomb-shaped pores 4, which are separated by a barrier layer 2 between the aluminum substrate 3 and the porous alumina layer 1.

In the above embodiment, since the metal insulating layer 160 and the carrier substrate 102 can be tightly coupled, the thermal resistance is reduced, and the thermal conductivity can be improved, that is, the carrier substrate has better thermal conductivity, so the embodiment can improve the multiple crystals. The problem that the particles may be difficult to dissipate heat on the same substrate.

It is worth noting that since the formed porous metal insulating layer has a soft hardness or a sticky impurity on the surface before being subjected to the sealing treatment, those skilled in the art are required to treat the anode. Before the substrate is subjected to subsequent application or processing (such as forming the circuit pattern described below), a sealing process is first performed, taking an aluminum substrate having an aluminum oxide layer as an example, generally including a hydration sealing process and a curing material sealing hole. Process. The hydration sealing treatment requires the aluminum substrate to be placed in hot water, generally about 90 degrees Celsius, soaked for 30 to 60 minutes, so that the aluminum oxide layer and water form aqueous alumina to close the pores and form a sealing layer, thereby improving Its wear resistance. The curing process of the curable material is generally applied by coating a resin or molten paraffin to seal the holes and then hardening the sealing layer. However, in the subsequent high-temperature process, the aluminum oxide layer after the sealing treatment is easily broken by the evaporation of water or the stress caused by the difference in expansion coefficient between the sealing layer, the aluminum substrate and the aluminum oxide layer. The crack 5 as shown in Fig. 1C may thus generate a leakage path. In order to avoid the above situation, as shown in FIG. 1D, before the following patterned conductive layer is formed by a high temperature process in this embodiment, the anodized substrate will not be subjected to a hydration sealing process or a curable material sealing process. But directly The carrier substrate is immersed in an insulating oil (such as the material described below), and after the holes 4 are covered with the insulating oil film 6, the insulating oil film remaining on the upper surface of the carrier substrate is removed, so that the process is performed at a high temperature. Before the formation of the following patterned conductive layer, the upper surface of the carrier substrate will not contain any sealing layer or insulating oil film, and the temperature of the insulating oil may be from room temperature to 150 degrees Celsius, and generally not more than 300 degrees.

Patterned conductive layer

Referring to FIG. 1A , in this example, a patterned conductive layer 170 is formed on the surface of the planarization insulating layer 160 of the carrier substrate 102 , and includes a contact pad 170 a for connecting the light emitting die 104 through the wire 190 . A portion of the conductive layer is a so-called circuit pattern. In addition, in order to make the height of the bottom of the light-emitting die 104 coincide with the contact pad 170a, a bearing portion 170b may be formed on the surface of the planarization insulating layer 160 to carry the light-emitting die 104. In one embodiment, the luminescent die 104 can be affixed to the carrier portion 170b by laser brazing the patterned conductive layer 170.

In an embodiment in which the patterned conductive layer is formed, a metal material may be selectively deposited on the planarization insulating layer 160 by electroplating or magnetron sputtering to serve as the patterned conductive layer 170. Another way is to screen print a conductive ink on the planarization insulating layer and then thermally cure the conductive ink on the planarization insulating layer 160 as the patterned conductive layer 170.

The conductive ink may be a conductor filled thermosetting polymer resin ink, for example, A silver paste composition as disclosed in U.S. Patent No. 5,585,581.

Another embodiment is to use a high temperature process, such as 400-600 degrees Celsius, to form a patterned conductive layer comprising a contact pad 170a, and a carrier portion 170b that can be closely bonded to the luminescent crystal grain. Generally, the silver paste can be mixed. The glass powder or the resin material is used to improve the adhesion. Preferably, the indium material is mixed with silver and glass powder as a silver paste to form a patterned conductive layer to increase the thermal conductivity.

However, as previously described, when the patterned conductive layer is subsequently formed on the substrate 102, it is possible that the thin metal insulating layer structure is damaged due to the 400-600 degree high temperature process to form a leakage path, and thus, as shown in FIG. As shown, in addition to avoiding the hydration sealing process or the curable material sealing process before forming the circuit pattern, the circuit pattern may be further immersed in the insulating oil after the circuit pattern is formed in a high temperature process, for example, immersed in methyl eucalyptus oil. The metal and metal insulating layers are reduced in different stresses due to high temperatures, and can be filled again in the holes 4 to be insulated.

That is, in an embodiment, an aluminum oxide layer 160 is formed on the surface of the aluminum substrate 102 by anodizing; and a conductive ink is printed on the aluminum oxide layer 160 by high temperature sintering to form a patterned conductive layer 170. When the aluminum substrate 102 is cooled down to 350 degrees or less, it is immersed in an insulating oil having a temperature of 100 degrees or more to reduce different stresses generated by the high temperature of the metal and metal insulating layers, thereby reducing the chance of crack formation and insulating. Effect.

In one embodiment, since the aluminum substrate is previously oxidized by the anodic treatment to form an aluminum oxide layer (such as aluminum oxide), it may be required to form a silver paste conductive line on the surface of the aluminum oxide layer. -600 degrees Celsius to cure, and The aluminum oxide layer and the aluminum substrate may generate different internal stresses after being subjected to a high temperature of 400-600 degrees, thereby causing the aluminum oxide layer to rupture and causing the silver paste to infiltrate, forming a leakage path. Therefore, one of the characteristics of the present example is that it can be immersed in an insulating oil of about 100 to 150 degrees Celsius before it is completely cooled in the thermal curing process of the silver paste, and generally not more than 300 degrees. In this way, the temperature of the high temperature curing silver paste can be buffered and reduced, and the different internal stresses of the different materials of the silver paste, the aluminum oxide layer and the aluminum substrate after being subjected to the high temperature of 400-600 degrees, and secondly, by filling the holes The insulating oil can isolate the leakage path that may be generated, and in an embodiment, the cooling process takes about 5-30 minutes.

In an alternative process, the insulating oil film remaining on the upper surface of the carrier substrate can be removed again, so that the interface on the upper surface of the carrier substrate, particularly between the patterned conductive layer and the surface of the metal insulating layer, will not be included. Any sealing layer or insulating oil film. It is worth noting that the plugging layer referred to herein refers to the person produced by the sealing process, rather than being naturally exposed to the external environment.

Thermal module

Referring to FIG. 1A again, in the embodiment, the bottom of the carrier substrate 102 further includes a heat conducting portion 180 that can accommodate one or more heat pipes 112 to derive the heat flow caused by the light crystal grains 104. The surface of the heat conducting portion 180 includes one or more grooves 102a to accommodate the heat pipes 112.

In a preferred embodiment, the light emitting module 100 further selectively includes a heat dissipation portion 114 located under the carrier substrate 102. Wherein, the heat dissipation portion 114 The heat transfer tube 112 and the carrier substrate 102 can be closely adhered by the corresponding recess 112a. In FIG. 1A, the lower surface of the heat dissipating portion 114 may include a heat dissipating fin or a honeycomb or porous ceramic structure 115 to promote a heat dissipating effect, wherein when the carrier substrate 102 is a layer of tantalum carbide material, it may be honeycombed with tantalum carbide, The porous ceramic heat dissipation structure is co-fired and integrally formed.

Interface between reflective structure and carrier substrate

Please refer to the lighting module shown in Figure 2A. In this embodiment, the bottom of the reflective structure 110 is bonded to the carrier substrate 102 by the adhesive 150. However, since the adhesive 150 has a certain height after curing, the side light emitted from the side of the light-emitting die 104 will be There may be a portion that enters the interface between the reflective structure 110 and the carrier substrate 102. Therefore, regardless of whether the adhesive is made of a transparent or opaque resin, the light entering the interface cannot be reflected by the reflective structure, and thus may degrade the illumination column. Luminous efficiency.

In this example, a plurality of luminescent particles, such as phosphor powder, are mixed in the adhesive 150, such as a transparent resin, so that the side light entering the interface between the reflective structure 110 and the carrier substrate 102 can be re-energized in the adhesive. The luminescent particles are illuminated to re-enter the illuminating column, thereby improving luminous efficiency.

Arrangement of multiple luminescent grains

Please refer to the arrangement of the illuminating columns with multiple illuminating dies shown in FIG. 2B. The conventional illuminating module is mainly composed of a reflective cup surrounding a single wafer, and the reason why the multi-wafer arrangement is not used is that The sides of each of the illuminating dies may each occlude the side of the other illuminating dies Side light, thus detracting from luminous efficiency.

In order to improve the luminous efficiency, the arrangement and the reflective structure of the unmodulated light-emitting dies disclosed in this embodiment can be applied to the light-emitting module described in the previous embodiments.

The light emitting module includes a plurality of light emitting columns 130a, 130b, and each of the light emitting columns is surrounded by a light reflecting structure 110. Taking the illuminating column 130b as an example, it includes a plurality of illuminating dies, such as illuminating dies 104a, 104b, which can be carried on the substrate 102. The sidewall of the reflective structure 110 includes a reflective surface for reflecting the light L emitted by the luminescent crystal. In the illuminating column 130b, for example, in terms of the relationship between two adjacent illuminating dies, for example, the illuminating dies 104a, 104b each include at least one side 124a, 124b, and wherein the illuminating crystal grains are such as the side 124a of the 104a The projection surface does not substantially overlap the side 124b of the corresponding illuminating die 104b. In another embodiment, the projection surface of the side 124a of the illuminating die 104a and the side 124b of the corresponding illuminating die 104b may not substantially overlap at all, as required by higher luminous efficiency. Taking the quadrilateral crystal grains as an example, if the four sides of the adjacent two crystal grains are arranged in the above manner, the highest luminous efficiency can be obtained.

In general, substantially incompletely overlapping means that the overlapping portion of the projection surface of the side edge 124a of the light-emitting die 104a and the side edge 124b of the corresponding light-emitting die 104b is less than 90% of the area of the projection surface; substantially does not overlap. It means that the overlapping portion of the projection surface of the light-emitting grain 104 such as the side 124a of the 104a and the side 124b of the corresponding light-emitting die 104b is less than 10% of the area of the projection surface; wherein if the side 124a of the light-emitting die 104a is The overlapping portion of the projection surface and the side 124b of the corresponding illuminating crystal grain 104b is substantially smaller than the projection When the surface area is 50%, the effect is better. The effect is best when the overlap is substantially zero, and generally does not exceed 70%.

In addition, the illuminating crystal grains may be selected from polygonal luminescent crystal grains, such as a quadrangle or a hexagon, and the shape is determined according to the die cutting technique.

In terms of the relationship between the illuminating crystal grains and the reflective structure, in one embodiment, the direct ray L emitted from the side of the illuminating crystal grain is substantially or at an oblique angle toward the side surface of the reflective structure. The higher the luminous efficiency can be obtained without being blocked by other luminescent crystal grains; the direct ray L emitted from all the sides of one illuminating crystal grain is substantially or at an oblique angle toward the reflective surface of the reflective structure side wall. The highest luminous efficiency is obtained when blocked by other luminescent crystal grains. However, when the density requirements of the luminescent grains are high, it is also possible to allow a portion of the direct ray to be blocked by other illuminating dies, as defined by the overlap area previously described.

As shown in FIG. 2B, a shortest pitch p is provided between two adjacent wafers 104a and 104b, for example, the distance between the ends of the two wafers, so that the distance of the shortest pitch p can be adjusted so that the side surface of the wafer 104b The projection surface A1 and the side surface A2 of the wafer 104a do not overlap or completely overlap, for example, the overlapping portion substantially accounts for less than 10% of the projection surface area, preferably zero; or substantially less than 70%, preferably 50 %the following. In another embodiment, by arranging a plurality of light-emitting dies at an appropriate pitch, the direct light emitted by each of the at least two adjacent dies can be directed toward the sidewall of the reflective structure substantially at an oblique angle. And achieve higher luminous efficiency.

In another embodiment, the illuminating crystal grains 104a may be arranged in a diamond arrangement. In order to avoid blocking light due to excessive overlap of the side projection surfaces of the adjacent two light-emitting dies, when the light-emitting dies are composed of polygonal light-emitting dies, each of the light-emitting dies includes one end The diagonal of the point extension is such that the light-emitting dies are arranged in a line diagonally parallel to the sidewalls of the light-reflecting structure 110. For example, the plurality of illuminating crystal grains may each include a pair of two end points on the oblique line, and the two end points of the illuminating crystal grains are located on an axis parallel to the inner side wall of the reflective structure, or are located parallel to the axis. Parallel lines are also available.

In addition, in a specific embodiment, for example, in a quadrilateral crystal grain, the two sides of the die 104a can be disposed at an oblique angle toward the sidewall of the same reflective structure, so that the die 104a can be connected. The direct rays on both sides of the sides are directed toward the side walls of the same reflective structure. In addition, when the lengths of the sides of the illuminating crystal grains are different, it is preferred to set the direct ray of the longest side or thus the larger illuminating area to face the side wall surface of the retroreflective structure directly or at an oblique angle.

The arrangement of the illuminating crystal grains can effectively guide the direct light emitted from the side of the illuminating crystal grain, and substantially face the reflecting surface of the side wall of the reflective structure, and is not easily blocked by other illuminating crystal grains, thereby effectively improving the luminous efficiency. .

Referring to FIG. 2C, in another embodiment, in order to further reduce the required area of the substrate 102, or to increase the arrangement density of the illuminating crystal grains, or enhance the illuminating intensity of a specific illuminating column, under the condition of heat dissipation, And in the case that the direct light emitted by the light-emitting crystal grains is not completely blocked by the other light-emitting crystal grains, it may be selected according to the above principle to be surrounded by the reflective structure 110. At least two rows of light-emitting dies 130a, 130b are disposed in the illuminating column. The number, density, brightness or color temperature of the two rows of illuminating crystal grains may not be the same arrangement and need not be side by side or symmetrical, and the misalignment may also be, for example, the position of the illuminating crystal grains 104e.

In another embodiment, adjacent ones of the two rows of illuminating dies 130a, 130b include at least one side, and a projection surface such as a side of the illuminating die 104b and a corresponding illuminating die The sides of 104c or 104d do not substantially overlap or overlap completely, for example, the overlapping portion may be substantially less than 10% of the area of the projection surface, preferably zero; or substantially less than 70% of the area of the projection surface, The best is below 50%. In other examples, the alignment principle of the embodiment disclosed in FIG. 2B above may also be applied to the embodiment disclosed in FIG. 2C.

frame

Please refer to the schematic diagram of the light module shown in Figure 3. In this embodiment, the light-emitting module further includes a frame 310 fixed on the carrier substrate 102. In an embodiment, the frame 310 can be integrally formed with the light-reflecting structure 110 to frame the light-emitting columns 130a, 130b, and the like. The surface of the carrier substrate 102 on both sides of the frame 310 includes a circuit region 300 for electrically connecting the light-emitting dies of each of the light-emitting columns to a power source.

Please refer to the schematic diagram of the light module shown in Figure 4. In this embodiment, the frame 310 may include an inner frame 310a to frame the light-emitting columns and an outer frame 310b to frame the circuit area 300. In addition, the carrier substrate can be thinned, such as forming a flat substrate 102' for installation, and can effectively reduce The volume of the lighting module. In addition, since the illuminating device of the embodiment has been modularized and planarized, the ease of assembly is greatly improved, and the circuit pattern for electrically connecting the illuminating dies, such as a wire, is further increased to further improve its practicability and simplicity. 302 can extend to the substrate region 102 ′ outside the reflective structure, such as the substrate 102 ′ outside the circuit region 300 , and can electrically contact a conductive block 301 , for example, can cover a layer of flat copper or aluminum metal on the wire 302 , Alternatively, the partial wires 302 may be directly replaced by the conductive blocks 301, which is more convenient for connecting the power source and also effectively reducing the resistance.

lens

Please refer to the lens structure 500 shown in Figures 5A-5B and Figure 6 and the manner in which they are made and combined. First, as shown in FIG. 6, in an embodiment, the lens 500 is fixed to the frame 310 including the reflective structure 110, and the projection surface of the lens 500 facing the carrier substrate 102' serves as a concentrating area. It may be a polygonal surface, such as a rectangular surface, a square surface, or an octagonal surface, and each of the light-emitting columns may emit a uniform circular light by the lens 500. In one embodiment, the lens is a colored lens that can be used to adjust the color temperature of the source.

In the fabrication of the lens structure 500, as shown in Figures 5A-5B, first a circular or elliptical lens is prepared, and then the four arc side edges 530 are cut away to leave a polygonal surface, such as a rectangular surface, a square surface, or An octagonal face lens 510. In the case where the lens is too thin, a bottom light transmitting layer 550 may be additionally attached to avoid lens breakage.

In this embodiment, the projected area of the octagonal lens is about the original circle. 2 to 2/3 of the area of the projection surface of the shaped or elliptical lens. If a hexagonal lens structure is used, the area can be reduced by about 1/1 to 2/1 compared to the circular lens, and the substrate 102' is loaded. It is therefore also possible to add additional surfaces on both sides to accommodate the circuit area.

In a specific embodiment, for example, a slightly smaller octagonal lens is used in combination with a rectangular reflective structure having a slightly larger size. The silicone material is first placed in a vacuum pump to extract the air in the silicone material and then applied to the inner surface of the lens. And the frame of the reflective structure, and since the corner portion of the octagonal lens is placed in the rectangular frame, a gap is generated. Therefore, when the lens is directly pressed into the frame, excess silicone material and air can escape from the gap. In this way, the inner cover layer between the filling lens and the LED die, or the luminescent material layer or the underlying protective layer can be completed and the residual air in the closed cavity can be maintained.

In other words, the size of the light-emitting module of the embodiment can be reduced, and the light emitted by each of the light-emitting columns can still be focused and outputted by the combination of the light-reflecting structure 110 and the lens structure 500.

In addition, referring to FIG. 5B, in order to increase the light emitted by each of the illuminating crystal grains to be more quickly projected to the outside, the embodiment may select the inner surface 515 of the lens facing the illuminating columns to be roughened. Since the roughened surface 515 is closer to the light-emitting path of the light-emitting die, the light source can be scattered earlier, that is, the inner surface of the lens is roughened to form a plurality of irregularities or lines to increase the scattering angle after the light is reflected, and the light extraction rate is thus Can be increased by about 10%, in other words, via the inner surface of the lens As a result of the coarsening, the light emitted by each of the illuminating crystal grains of each column is multi-refractive and forms a scattering range of 180 degrees, so that the light source of the illuminating module is softer and suitable for use as a lighting source.

lighting device

Please refer to the lighting device such as the combined street lamp or table lamp shown in FIG. 7. Generally, the lighting device includes a housing body 710 having an opening, and the supporting plate 720 is fixed at the opening of the lamp housing 710 to form a receiving space. The plurality of light-emitting modules 600 can be fixed to the outer surface of the support plate 700 through the detachable fixing device 730, for example, by screwing the screw holes of the carrier substrate 102' and the support plate 720. In another embodiment, the carrier substrate can be directly part of the housing body, for example, using an alumina substrate to make an integrally formed lamp housing and a desired carrier substrate.

Cooling of lighting equipment

Please refer to the external and internal schematic diagrams of the lighting device shown in FIG. 7 and FIG. 10 , wherein the lighting device of the embodiment uses a plurality of lighting modules 600, and each of the lighting modules further includes a plurality of lighting columns and The heat-emitting portion 800 is disposed in the accommodating space of the chamber of the lamp housing and is shared by the heat-dissipating modules. Therefore, for each illuminating die, the heat-dissipating area may include the entire In the heat dissipating portion 800, it is less likely that a single illuminating crystal grain is damaged due to heat loss.

First, referring to FIG. 8 to FIG. 10, the heat dissipation path of the light-emitting module mainly includes a carrier substrate 102', and a support plate 720 which can simultaneously serve as a heat dissipation plate. And a heat dissipation portion 800 attached to the inner surface of the support plate 720. The heat dissipating portion 800 mainly includes one or more heat conducting tubes 810 and a heat dissipating block 820. The heat conducting tube 810 is L-shaped in this example, so that one side thereof can be attached to the inner surface of the supporting plate 720, and the heat conducting tube 810 The other side can pass through the heat dissipation block 820 to preferentially heat the heat-emitting module 820, and the heat-dissipating block 820 is also attached to the support plate 720 to disperse the heat on the support plate 720. In addition, the heat dissipation path can continue to extend to an external mechanism outside the lamp housing. In addition, a power-free heat dissipation system can be added to the housing body or the receiving space to increase the heat dissipation effect. For example, a film vibration device, such as a metal or alloy spring piece, is added to the accommodation space in the chamber, and the principle of thermal expansion and contraction caused by the temperature difference is used. When the heat of the light-emitting module is guided to the accommodation space, the temperature difference can be made. The film generates vibration, thereby causing a disturbance of the air in the accommodation space, thereby improving the heat dissipation effect. In another embodiment, a wind or thermal (eg, solar) driven fan may be disposed outside the lamp housing, so that the fan can be operated to cool the lamp housing by natural wind or heat.

In this example, the heat pipe 810 can increase the heat conduction efficiency, and includes a body having a vacuum sealed cavity, the body can be made of a heat dissipating metal such as copper or aluminum, and the vacuum sealed cavity is filled with a heat transfer fluid such as water, filament. (wick) is distributed in the inner wall of the closed cavity. Therefore, the heat transfer fluid in the heat pipe is condensed at the cold regions of both ends when it is evaporated by heat near the heat source and flows to the ends of the body, and then borrowed by the filament. The capillary principle pulls back the heat source to continue heat conduction. The heat sink block and the support plate are generally made of a metal having a good thermal conductivity, such as aluminum, copper or an alloy thereof.

In addition, please refer to Figure 9 and Figure 10 at the same time, in another implementation. For example, the heat dissipating portion 800 further includes a heat dissipating member 830, such as a heat dissipating fin, which is generally made of a copper material. In another embodiment, as shown in FIG. 9, the heat dissipating component 830 may also be selected from a honeycomb heat dissipating ceramic structure, such as sintered from a tantalum carbide material. As shown in FIG. 10, the heat dissipating component 830 can be attached to the heat dissipation block 820 and the support plate 720 for better heat dissipation. When the adhesive for fixing the heat dissipating parts of the heat dissipating portion is selected, the heat dissipating effect of the adhesive should be paid attention to not hinder the heat dissipating path. In this example, for example, an atomic ash containing an unsaturated polyester resin component may be used. Adhesive.

Illumination column of illumination module

Please refer to the lighting modules shown in Figures 11 and 12. Wherein, the light-emitting module of the embodiment includes a plurality of light-emitting columns, so that at least one of the light-emitting columns emits a first light having a first color temperature, and at least one of the second light-emitting columns can emit a second light. a second light of color temperature, and then mixing the first and second rays by the lens to output a third light having a third color temperature, or in another embodiment, mixing by a colored lens filter effect The first and second light rays output a third light having a third color temperature, whereby a harmonic effect can be produced. The third color temperature value is between the first color temperature value and the second color temperature value.

Taking the white light illumination device as an example, as shown in FIG. 11, the light having the different color temperatures can be arranged on the same carrier substrate 102', and the mixed light can be output through the reflective structure and the lens, so that the light can be based on the overall light. The color temperature requirement to set the color temperature of each light column, for example, currently The warm color of the light has a color temperature of about 3300k or less, the intermediate color of the light has a color temperature of about 3300k-6500k, and the light of the cool color has a color temperature of about 6500k or more. Therefore, in this example, if the illumination of the warm white series is to be set, the low color temperature illumination column 130a may occupy a higher proportion than the high color temperature illumination column 130b.

In addition, please refer to FIG. 12, which shows another embodiment of a light-emitting column having different color temperatures, for example, a white light-emitting column 132a covered with a layer of luminescent material may be selected, and then set according to a color temperature, for example, with red-yellow light. (Low color temperature) or blue light (high color temperature), etc., which does not contain the light-emitting column 132b of the luminescent material layer, and is mixed to form a warm color light of a lower color temperature, or a cool color light of a higher color temperature.

Light-emitting module manufacturing method

This embodiment provides a method for manufacturing a light emitting module. The manufacturing process includes the following steps, but the order of the steps can be adjusted according to the needs of the process without limitation.

Referring to FIGS. 1A to 1D, first, a substrate 102, such as a metal substrate of aluminum material, is provided for anodization to form an aluminum carrier substrate having a planarized aluminum oxide layer 160, wherein the planarized aluminum oxide layer 160 includes Hole 4. Next, the substrate 102 is immersed in an insulating oil to coat the upper surface of the aluminum oxide layer 160 and the hole 4 with an insulating oil film 6, and the insulating oil film on the upper surface of the aluminum oxide layer 160 is removed.

Next, the circuit pattern 170 is formed on the surface of the substrate 102 by a high-temperature silver paste process, and a plurality of light-emitting dies 104 arranged in a plurality of rows are fixed. On the plate 102 or the bearing portion 170b, the arrangement of the illuminating crystal grains may be selected such that the direct rays of the side edges are directed toward the side walls of the reflective structure as much as possible, and the overlapping portions of the projection surfaces and other illuminating dies are reduced, as in the previous 2B and 2C drawings. The illustrated embodiment. Then, in the cooling process, it is again immersed in the insulating oil film 6 below 300 degrees Celsius, such as 100 degrees to 150 degrees, to buffer the stress between the layers of different materials, and the insulating oil film is again filled into the hole 4 to avoid possible generation. Leakage path 5, followed by removal of an insulating oil film on the surface of the metal insulating layer.

Next, referring to FIGS. 1A and 2, the present embodiment provides a reflective structure 110 having a plurality of columns of spaces, for example, a plastic reflective structure having a chrome-plated or silver-plated reflective surface is mounted on the substrate 102 to accommodate the columns of light. The illuminating crystal grains 104 are listed. The retroreflective structure 110 can be integrated into a frame 310, as shown in FIG. 4, which includes an inner frame 310a and an outer frame 310b. The adhesive between the reflective structure 110 and the substrate 102 can be mixed with a plurality of phosphor particles to illuminate and re-enter the light-emitting column.

After the wire bonding process is electrically connected to the die and the circuit pattern, the phosphor powder can be directly coated in the column of the light-emitting column by spraying; the other way is to make the plurality of phosphor particles and one not included. The liquid of the adhesive is mixed to form a mixed liquid, and secondly, the mixed liquid can be filled into the inner frame 310a of the reflective structure 110, for example, by using a dropping method, and then the liquid is removed, for example, by using a drying process, the fluorescent powder particles are borrowed. The van der Waals force is agglomerated into a phosphor particle layer 106 and adhered to at least the die 104 in the reflective structure 110. Through the above process, a luminescent material layer 106 continuously covering the columns of the luminescent crystal grains 104 and extending to the sidewalls of the reflective structure 110 can be formed.

In this embodiment, the phosphor particles may be selected to be nano-formed to form a mixed liquid more uniformly with the liquid without the adhesive. Another way of homogenizing is to mix the organic solvent into the liquid without the adhesive so that the phosphor particles are more uniformly mixed with the liquid without the binder to form a mixture. Finally, the liquid and the organic solvent are removed to agglomerate the phosphor particles into a phosphor particle layer and adhere to at least the light-emitting crystal grains in the reflective structure. For example, the organic solvent is generally selected from paraffin or rosin oil, and finally The organic solvent can be removed through a high temperature program such as 450 degrees Celsius.

The retroreflective structure 110 used in accordance with embodiments of the present invention enhances the efficiency of conventional precipitation processes. That is, only a small amount of the mixed liquid remains in the inner frame 310a, so that the remaining liquid can be removed more quickly by the drying method to form the phosphor particle layer 106 and adhere to the crystal grains in the light reflecting structure 110. In this way, the process efficiency can be improved.

In order to avoid the detachment of the phosphor powder layer, the embodiment may be filled with a silicone protective layer or an epoxy layer or embedded in a hard glass layer in the reflective structure 110 to be pressed onto the phosphor particle layer 106. An inner cover layer 108. Then, as shown in Fig. 6, a lens 500 is provided to cover the entire reflective structure 110, and the lens can be selectively cut to form a rectangle or a polygon to reduce the area occupied by the substrate. The closed cavity in the lens can then be refilled with another inner cover to further block the ingress of moisture. Alternatively, the two layers of the cover layer may be filled with the silicone material after the lens 500 covers the reflective structure 110 to form an inner cover layer which is integrally formed and has no interface. The flattened light-emitting module can be detachably assembled on the support plate of the housing as shown in FIG. 7 to form an illumination system.

While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Lighting module

102, 102'‧‧‧ bearing substrate

104‧‧‧Lighting grain

106‧‧‧ luminescent material layer

110‧‧‧Reflective structure

108‧‧‧ inner cover

200‧‧‧ lens

130‧‧‧Light column

160‧‧‧Flating insulation

180‧‧‧Transfer Department

112‧‧‧Heat pipe

102a‧‧‧ Groove

114‧‧‧ Department of heat dissipation

115‧‧‧Heat fins

170‧‧‧ patterned conductive layer

170a‧‧‧Contact pads

190‧‧‧Wire

170b‧‧‧Loading Department

112a‧‧‧ Groove

150‧‧‧Adhesive

130a, 130b, 132a, 132b‧‧‧ illuminated columns

104a~104e‧‧‧Lighting grain

124a, 124b‧‧‧Lighting grain sides

L‧‧‧Side direct light

P‧‧‧ shortest spacing

A1‧‧‧projection surface

A2‧‧‧ grain side surface

310‧‧‧Frame

300‧‧‧Circuit area

310a‧‧ inside frame

310b‧‧‧External framework

500‧‧‧ lens structure

530‧‧‧Arc side

510‧‧‧Rectangular lens

550‧‧‧Bottom light transmission layer

515‧‧‧ roughened surface

600‧‧‧Lighting Module

720‧‧‧support plate

710‧‧‧ shell body

730‧‧‧Fixed devices

810‧‧‧Heat pipe

820‧‧‧heat block

830‧‧‧Heat components

FIG. 1A is a partial cross-sectional view showing a light emitting module of an embodiment.

1B to 1D are cross-sectional views showing a process of a carrier substrate of an embodiment.

2A is a partial cross-sectional view showing a light emitting module of another embodiment.

Fig. 2B is a view showing the arrangement of the luminescent crystal grains in the illuminating column of an embodiment of Fig. 1A.

Fig. 2C is a view showing the arrangement of the light-emitting crystal grains in the light-emitting column of another embodiment of Fig. 1A.

FIG. 3 is a schematic diagram showing the combination of the light emitting modules of an embodiment.

FIG. 4 is a schematic diagram showing the combination of the light emitting module of another embodiment.

5A-5B illustrate a lens structure of an embodiment and a method of fabricating the same.

Figure 6 is a schematic diagram showing the combination of the light-emitting module and the lens structure of an embodiment.

FIG. 7 is a schematic diagram showing an illumination device combining a plurality of light-emitting modules according to an embodiment.

Fig. 8 is a view showing a heat radiating portion used in an embodiment of the lighting device of Fig. 7.

Figure 9 is a diagram showing another embodiment of the lighting device of Figure 7 Heat sink.

Fig. 10 is a view showing a heat radiating portion used in another embodiment of the lighting device of Fig. 7.

FIG. 11 is a schematic diagram of a light emitting module having an illumination column emitting light of different color temperatures according to an embodiment.

FIG. 12 is a schematic diagram of a light-emitting module having a light-emitting column emitting light of different color temperatures according to another embodiment.

102'‧‧‧ Carrier substrate

310‧‧‧Frame

500‧‧‧ lens

110‧‧‧Reflective structure

300‧‧‧Circuit area

Claims (14)

A carrier substrate structure comprising: a metal carrier substrate, the surface further comprising a metal insulating layer; and a patterned conductive layer pattern formed on the surface of the metal insulating layer, wherein the patterned conductive layer and the surface of the metal insulating layer The interface between them does not include a sealing layer or an insulating oil film. The carrier substrate structure of claim 1, wherein the metal insulating layer comprises a plurality of holes, and the holes are covered with a film of insulating oil. The carrier substrate structure of claim 2, wherein the outer surface of the metal insulating layer does not include a sealing layer or an insulating oil film. The carrier substrate structure according to claim 3, wherein the metal carrier substrate is an aluminum substrate for carrying the die, and the metal insulating layer is an unhydrated sealing hole or is sealed by a curable material. Treated porous alumina layer. The carrier substrate structure according to claim 4, wherein the insulating oil film is composed of methyl eucalyptus oil. A manufacturing method for supporting a substrate structure, comprising: providing a carrier substrate, which is made of a metal material; performing anodization on the carrier substrate to form a porous metal insulating layer including a plurality of holes on the surface of the carrier substrate; covering an insulating oil film On the porous metal insulating layer, and filled into each hole; Removing an insulating oil film on the surface of the porous metal insulating layer; forming a circuit pattern on the surface of the porous metal insulating layer; soaking the carrier substrate in the insulating oil having a predetermined temperature to buffer stress; and removing the porous metal insulating layer again An insulating oil film on the surface of the layer. The method for manufacturing a carrier substrate structure according to claim 6, wherein the circuit pattern is formed by printing a conductive material on the porous metal insulating layer at a high temperature sintering manner of 400 degrees Celsius or higher. The method for manufacturing a carrier substrate structure according to claim 6, wherein the carrier substrate is an aluminum substrate, and the method comprises: forming an aluminum oxide layer on the surface of the aluminum substrate by anodizing; soaking the aluminum substrate In the insulating oil from room temperature to 150 degrees Celsius; removing the insulating oil film on the surface of the aluminum oxide layer; printing a conductive ink on the aluminum oxide layer at a high temperature sintering method of 400-600 degrees Celsius to form a Patterning the conductive layer; and when cooling to below 350 degrees Celsius, immersing in an insulating oil having a temperature between 100 degrees Celsius and 300 degrees Celsius to buffer stress between the conductive ink, the aluminum oxide layer and the aluminum substrate, and Forming an insulating oil film on the aluminum oxide layer; and removing the insulating oil film on the surface of the aluminum oxide layer again. The method for producing a carrier substrate structure according to claim 8, wherein the insulating oil is methyl eucalyptus oil. The method of manufacturing a carrier substrate structure according to claim 9, wherein the conductive ink comprises silver paste or solder paste. The method for manufacturing a carrier substrate structure according to claim 6, further comprising a reflective structure on the carrier substrate, wherein the reflective structure is configured to receive at least one light emitting component. The manufacturing method of the carrier substrate structure of claim 11, wherein after the fixed reflective structure is mounted on the carrier substrate, the circuit pattern and the light emitting element are electrically connected. The method for manufacturing a carrier substrate structure according to claim 12, further comprising providing a lens to cover the light emitting component and the light reflecting structure to adjust the light of the light emitting component to form a light source. The method for manufacturing a carrier substrate structure according to claim 11, further comprising forming at least one luminescent material layer in the reflective structure to cover the illuminating element, wherein the luminescent material layer is formed by the following steps (a) Or step (b): (a) spraying the phosphor particles into the reflective structure by spraying; (b) mixing the plurality of phosphor particles with a liquid to form a mixed solution; filling the mixed solution for the reflective Within the structure; and removing the liquid causes the phosphor particles to agglomerate into a layer of phosphor particles.