M366013 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種發光二極體封裝技術’特別是一種發光二極 體燈具模組。 【先前技術】 發光二極體（light-emittingdiodes ’ LED)具有壽命長、省電' 較耐用等優點，因此高亮度LED照明裝置為一綠能環保產品，未來 將可廣泛應用。一般高亮度LED燈具多是將發光模組，通常包含數 個LED燈泡’直接焊接在一般電路板或銘基板上。為了增加散熱效 果’會額外設計散熱構件，如於基板下方設置散熱鰭片。然而，高亮 度led照明裝置除了散熱性問題外，如何降低成本與簡化製造方^ 使其高單價問題獲得解決將是一個重要的課題。 【新型内容】 為了解決上述問題，本創作目的之一係提供一種發光二極體燈 鲁 具模組，直接將發光二極體晶片設置於散熱件上，再將發光二極體晶 片與設置於散熱件上的電路層或基板電性連接。 本創作目的之一係提供一種發光二極體燈具模組，係將具有開 口之電路基板設置於散熱件上，直接將發光H日日#設置於基板開 口處之散熱件上，具有極佳散熱效果且簡化製作過程。 為了達到上述目的，本創作一實施例之發光二極體燈具模組， 係包括.一散熱件，其中散熱件之材質為金屬或高導熱材料；一基板， 係:又置於散熱件上’其中基板上具有—電路與至少—開口暴露出散熱 件並形成1穴；—發光二鋪晶片，係設置於酿之散鱗上並利 M366013 用複數條金屬引線與基板上電路電性連接；以及一透光封裝材料，係 填入凹穴並包覆發光二極體晶片、金屬引線與部分基板。 本創作另一實施例之發光二極體燈具模組，係包括：一散熱件， 係具有至少一凹穴設置於其上，其中散熱件之材質為金屬或高導熱材 料；一電路層，係設置於散熱件上並圍繞凹穴；一發光二極體晶片， 係設置於散熱件之凹穴内並利用複數條金屬引線與電路層電性連 接；以及-透光封裝材料，係填人凹穴並包覆發光二極體晶片、 引線與部分電路層。M366013 V. New Description: [New Technology Field] This creation is about a kind of light-emitting diode packaging technology, especially a light-emitting diode lamp module. [Prior Art] The light-emitting diode (LED) has the advantages of long life and low power consumption. Therefore, the high-brightness LED lighting device is a green energy-friendly product and will be widely used in the future. Generally, high-brightness LED lamps usually have a light-emitting module, usually containing several LED bulbs, directly soldered to a general circuit board or a display substrate. In order to increase the heat dissipation effect, an additional heat dissipating member is designed, such as providing fins under the substrate. However, in addition to the heat dissipation problem, high-brightness LED lighting devices, how to reduce costs and simplify manufacturing, will solve the problem of high unit price, which will be an important issue. [New content] In order to solve the above problems, one of the purposes of the present invention is to provide a light-emitting diode lamp module, which directly mounts a light-emitting diode chip on a heat-dissipating member, and then sets the light-emitting diode chip and the light-emitting diode chip The circuit layer or the substrate on the heat sink is electrically connected. One of the purposes of the present invention is to provide a light-emitting diode lamp module in which a circuit board having an opening is disposed on a heat-dissipating member, and the light-emitting H-day # is directly disposed on the heat-dissipating member at the opening of the substrate, and has excellent heat dissipation. The effect and streamline the production process. In order to achieve the above object, a light-emitting diode lamp module according to an embodiment of the present invention comprises: a heat sink, wherein the heat sink is made of metal or a high thermal conductive material; and a substrate is placed on the heat sink. Wherein the substrate has a circuit and at least the opening exposes the heat sink and forms a hole; the light-emitting two-ply wafer is disposed on the brewed scale and the M366013 is electrically connected to the circuit on the substrate by a plurality of metal wires; A light-transmissive encapsulating material fills the cavity and encloses the LED chip, the metal lead and a portion of the substrate. The illuminating diode lamp module of another embodiment of the present invention comprises: a heat dissipating member having at least one recess disposed thereon, wherein the heat dissipating member is made of metal or a highly thermally conductive material; Disposed on the heat sink and surrounding the cavity; a light-emitting diode chip is disposed in the cavity of the heat sink and electrically connected to the circuit layer by using a plurality of metal wires; and - the light-transmissive packaging material is filled with a recess And covering the LED chip, lead and part of the circuit layer.
【實施方式】 請參照圖1，於本實施例中，發光二極體燈具模組係包括：一 散熱件10 ; 一基板20 ; 一發光二極體晶片3〇 ;以及-透光封裝材料 4〇包覆發光二極體晶片3〇與部分基板％。其中，基板％係設置於 散熱件1G上且基板2G具有—電路（圖上未示）與至少—開口（圖上 未標）暴露出散熱件10並形成一凹穴（圖上未標）。其中，散熱件1〇 之材質為金屬或高導熱材料。 、r 、上述s兑明，發光二極體晶片30係設置於凹穴之散熱件】 上亚利用複數條金屬引線（圖±未標）與基板2〇上電路電性連接 :透光封歸料4G，係填人凹穴並包覆發光二極體晶片3()、金 ^部^基板2G。於—實施例中，_丨線可以是部份被覆蓋令 J ’綠^光二極體晶# 3〇後可提供一螢光材料（圖上; :中。於發光二鋪晶片3G或是將螢光材料混合於透光封裳圳 认 …划圃z所不’散熱件10係具有至少一凹穴 i其上。—電路層2G，則設置於散熱件1G上並_凹穴。發光二 =片雷散熱件1〇之凹穴内並利用複數條金屬引線與ΐ 扪連接。透光封裝材料40係填入凹穴並包覆發光二極體晶 M3 66013 30、金屬引線與部分電路層2〇, 基板。 於—實施例中’電路層2〇,亦可為一[Embodiment] Referring to FIG. 1, in this embodiment, a light-emitting diode lamp module includes: a heat sink 10; a substrate 20; a light-emitting diode chip 3; and a light-transmitting package material 4. The germanium is coated with the light-emitting diode wafer 3〇 and a portion of the substrate. The substrate % is disposed on the heat sink 1G and the substrate 2G has a circuit (not shown) and at least an opening (not shown) exposing the heat sink 10 and forming a recess (not shown). Among them, the heat sink 1〇 is made of metal or a highly thermally conductive material. , r, the above s, the light-emitting diode chip 30 is arranged in the heat sink of the cavity] The upper Asia uses a plurality of metal wires (Fig. ± unlabeled) to electrically connect with the circuit on the substrate 2: light-transmissive The material 4G is filled with a recess and covers the light-emitting diode chip 3 () and the gold portion 2 substrate 2G. In the embodiment, the _ 丨 line may be partially covered so that the J 'green ^ photodiode crystal # 3 〇 can provide a fluorescent material (on the picture; : in the illuminating two-layer wafer 3G or The fluorescent material is mixed in the light-transmissive seal. The heat-dissipating member 10 has at least one recess i thereon. The circuit layer 2G is disposed on the heat-dissipating member 1G and is recessed. = a piece of thunder heat sink 1 inside the cavity and connected with a plurality of metal leads and ΐ 。. The light-transmissive encapsulation material 40 is filled into the cavity and covered with the light-emitting diode crystal M3 66013 30, the metal lead and part of the circuit layer 2 〇, substrate. In the embodiment, 'the circuit layer 2 〇 can also be a
圖3A、圖3BFigure 3A, Figure 3B
程干立圍Μ〜所示為根據本創作一實施例之流 #^_鎌_細包括下列 步H先’如圖3A所示，提供_ :ϊΐ)少一開口暴露出散熱件1〇並形成-凹穴(圖 =二 為一銅箱基板、-絕緣材質基板、-玻璃 纖維基板、_基板、-_纖_浸布或—高分子材料基板。 固」tl，請參照圖3Β ’利用一黏著材料32將發光二極體晶片3〇 緣二曾γΓ 10上，其中黏著材料32係為導電材質，導熱材質或絕 、曰屬或非金屬材質。利用複數條金屬引線使發光二極體 :片^0與基板20上電路（圖上未示）電性連接。之後，如圖冗所 丨透光封储料*填人敎並包覆發光二鋪晶片30、金 屬引線與部分基板20。 片魅Ϊ 明，於一實施例中，如圖3D所示，可將一控制晶 L 件60等設置於基板20上與其上電路電性連接。如此， 光二極體燈具模組組裝上燈罩或殼體即為一發光二極體燈泡之 於—實施例中’亦可以將控制電路整合於基板20之電路内。 圖4A與圖4B所示為根據本創作一實施例之流程示意圖。於本 施例中_’發光二鋪燈具模朗製造方法包括下列步驟。首先，如 二4A所示，提供一散熱件1〇，其係具有至少一凹穴設置於其上。接 者利用—黏著層22,設置一電路層20,於散熱件1〇 ±並圍繞凹穴。 ίο接ΐ ’請參照圖4B所示，設置一發光二極體晶片30於散熱件 2〇，^凹八内並利用複數條金屬引線使發光二極體晶片％與電路層 於41生連接。其中，利用—黏著材料32將發光二極體晶片30固定 ；…、件10上，且黏著材料32係為導熱材質或絕緣材質，可為金屬 M366013 或非金屬材質。之後，於—實施例中，可提供—螢光材料（圖上未示） 塗佈於發光—麵晶# %。—透辆裝材料4Q填人凹穴並包覆發光 二極體晶片30、金屬引線與部分電路層20,。於-實施例中，榮光材 料（圖上未*)亦可混合於透光封裝材料40中。 接續上述說明，於一實施例中，可設置控制晶片或被動元 於電路層上與電路電性連接。另外，於上述實施例中，本創作可對金 f材質之散齡表面進行—陽極表鱗理程序，使其產生—陽極表面 處理層，增加其散熱或反光效果。 另外，如圖5所示，於一實施例中，取決於設計或功能需求， 本創作並不限疋發光二極體晶片的數量。更者，亦不限制散熱件 ^形狀及數目，如可設計成具複數侧片或有則及熱導管之散熱件 5 10 ^ 4體12的均皿板'熱導管或壓平之熱導管。均、、w 腔體。當熱由熱源傳導至蒸= 凝，再_一構:====:: 溫板的運作原理。發光二極體晶片3〇設置於散熱： (均咖板）的凹穴内，發光二極體晶片3G所產生千川 :=ΓΓ散熱裝置，如與散熱件10接觸的散_片:= 實包例中，如圖6Β所示，散熱鰭片14亦可以與 、 ::為一_型(。ne_piece f_)。均溫板亦可為；面;凹 的表面顯紐與冗，料__中，雖板式之雜件 的表面藉由設置於其上的基板2G或電路層2G _件10 發光二極體晶片3。設置於凹穴中並直接接觸散熱件"=穴結構’ 獲得良好的触、散熱效果。 、、面，故能 M366013 綜合上述，本創作係直接將發光二極體晶片設置於散熱件上， 再將發光二極體晶片與設置於散熱件上的電路層或基板電性連接。封 裝完成之發光二極體燈具模組可直接使用，簡化既有製程’無須再焊 接於電路板上或加裝散熱構件。本創作可依發光產品之需求調整發光 二極體之數量與排列方式，再配合發光產品之外罩與組件即可完成產 品。本創作簡化製程可降低成本並使原來高單價LED燈具之產品價 格降低更能為市場接受。 、 以上所述之實施例僅係為說明本創作之技術思想及特點，其目 =使此織藝之人士 __本創作之魄並獅實施，當不 :==作之專利範圍’即大凡依本創作所揭示之精神所作之 均等變化雜飾，仍應涵蓋在摘作之專利範圍内。 M366013 40 透光封裝材料 50 控制晶片 60 被動元件Cheng Ganli Μ 所示 所示 所示 所示 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # The recess (Fig. = two is a copper box substrate, - insulating substrate, - glass fiber substrate, _ substrate, - _ fiber _ dip or - polymer material substrate. Solid) tl, please refer to Figure 3 Β 'Using a sticky The material 32 will be a light-emitting diode wafer 3, which is made of a conductive material, a heat-conducting material, or a non-metallic material. The light-emitting diode is made of a plurality of metal wires: ^0 is electrically connected to a circuit (not shown) on the substrate 20. After that, the light-transmissive sealing material* is filled and covered with the light-emitting two-wafer wafer 30, the metal lead and the partial substrate 20. In an embodiment, as shown in FIG. 3D, a control crystal L 60 or the like can be disposed on the substrate 20 and electrically connected to the upper circuit. Thus, the photodiode lamp module is assembled with a lampshade or a shell. The body is a light-emitting diode bulb. In the embodiment, the control circuit can also be integrated into the base. FIG. 4A and FIG. 4B are schematic diagrams showing a flow according to an embodiment of the present invention. In the present embodiment, the method for manufacturing a luminaire is composed of the following steps. First, as shown in FIG. A heat dissipating member 1 is provided, which has at least one recess disposed thereon. The adhesive layer 22 is used to provide a circuit layer 20 on the heat dissipating member 1 and surround the recess. ίο接ΐ 'Please refer to As shown in FIG. 4B, a light-emitting diode wafer 30 is disposed in the heat sink 2, and a plurality of metal leads are used to connect the light-emitting diode wafer % to the circuit layer. 32, the light-emitting diode wafer 30 is fixed; ..., the member 10, and the adhesive material 32 is made of a heat conductive material or an insulating material, which may be metal M366013 or a non-metal material. Thereafter, in the embodiment, - fluorescent light is provided The material (not shown) is applied to the luminescence-surface crystal #%. The through-package material 4Q fills the cavity and covers the light-emitting diode wafer 30, the metal lead and the partial circuit layer 20, in the embodiment. Medium, glory material (not shown on the figure) can also be mixed in light-transmissive packaging materials 40. In the above description, in one embodiment, a control chip or a passive element may be disposed on the circuit layer to be electrically connected to the circuit. In addition, in the above embodiment, the creation may be performed on the surface of the gold f material. - The anode scale process, which produces an anode surface treatment layer to increase its heat dissipation or reflective effect. In addition, as shown in Figure 5, in one embodiment, depending on the design or functional requirements, the creation is not limited. The number of the light-emitting diode chips. Moreover, the shape and the number of the heat-dissipating members are not limited. For example, the heat-dissipating members of the plurality of side sheets or the heat-dissipating members of the heat pipes can be designed. Catheter or flattening heat pipe. Both, w cavity. When heat is conducted from heat source to steaming = condensation, then _ a structure: ====:: The operating principle of the warm plate. The light-emitting diode chip 3 is disposed in the cavity of the heat dissipation: (all-coffee board), and the light-emitting diode chip 3G generates a thousand-channel:=ΓΓ heat sink, such as a loose film that is in contact with the heat sink 10: = a real package example In the case, as shown in FIG. 6A, the heat dissipation fins 14 may also be, and :: is a type (.ne_piece f_). The temperature equalization plate can also be a surface; a concave surface display and redundancy, in the material __, although the surface of the plate type miscellaneous piece is provided by the substrate 2G or the circuit layer 2G _ piece 10 illuminating diode chip disposed thereon 3. Set in the pocket and directly contact the heat sink "=hole structure' to get good touch and heat dissipation. M366013 In summary, the present invention directly mounts the light-emitting diode chip on the heat sink, and electrically connects the light-emitting diode chip to the circuit layer or substrate disposed on the heat sink. The packaged LED module can be used directly to simplify existing processes' without having to solder to the board or add heat sinks. This creation can adjust the quantity and arrangement of the LEDs according to the needs of the illuminating products, and then complete the products with the cover and components of the illuminating products. This creation simplifies the process and reduces the cost and makes the price reduction of the original high-priced LED lamps more acceptable to the market. The above-mentioned embodiments are only for explaining the technical ideas and characteristics of the creation, and the purpose is to make the person of the weaving art __ the creation of the lion and the lion, when not: == the scope of the patent' Equivalent changes in the spirit revealed by this creation should still be covered by the scope of the patents. M366013 40 Light Transmissive Packaging Material 50 Control Wafer 60 Passive Components