TW554506B - Heat dissipation structure for solid-state light emitting device package and method for manufacturing the same - Google Patents

Abstract

A light emitting diode (LED) includes a heat dissipation structure characterized by having a heat dissipating fluidic coolant filled in a hermetically sealed housing where at least one LED chip mounted on a metallic substrate is dwelled inside. The heat dissipation structure is configured with a metallic wall erected from the metallic substrate, which is used to hold a transparent cap of the sealed housing in correct position. Furthermore, the erected wall surrounds in proximity with the at least one LED chip, so that the joule heat generated therefrom can be quickly spread out, through the heat dissipating fluidic coolant, to the erected wall, and then diffused along the wall down to the metallic substrate which adjoins with a larger external heat sink for draining the heat, thus preventing the at least one LED from overheating. The other characteristic of the invention resides in that the transparent cap of the sealed housing is made of transparent materials, wherein a convex portion contacted with the heat dissipating fluidic coolant is formed on the inner surface of the transparent cap. Hence if there is any air bubble existing inside the housing due to insufficient filling, it will not dwell in the field of line-of-sight due to buoyancy. The possibility of scattering the LED light due to existing of the bubbles therefore is avoided.

Description

V. Description of the Invention (1) [Background of the Invention] 1. Field of the Invention The present invention relates to a heat-dissipating structure of a light emitting diode (LED), and particularly to an LED that can be operated under extremely high driving current. In applications with extremely high brightness, the required brightness can be stably emitted. 2 · Description of related technology A light-emitting diode (LED), as it stands, is a light-emitting device composed of a semiconductor p-η junction diode. Recently, LEDs have been used only as a signal device for electronic devices whose low brightness does not cause adverse effects. For example, 'used in power supplies such as pure (τν) systems such as ON / OFF and filters, or digital display signals on clocks and electronic panels whose brightness is only visible to the naked eye at a close distance The system is extremely small, and its heat dissipation effect M must be considered. Power consumption However, due to recent advances in LED technology, LEDs are also multi-colored: from dark blue to beyond visible light. Therefore, Ke Er = Liao Geng "has far exceeded the scope expected by predecessors, such as outdoor benefits, parent lights, car lights, etc. In these application towels, the industry is :: Er Er / sufficient brightness. However, the structure of the cluster not only needs to produce, but also its package, an extremely large and attractive two or one array of wafers embedded in a "closed" and capable of emitting high-brightness light. The component system is related industry 554506

V. Description of the invention (2)

[Comprehensive description of the invention] Therefore, one object of the present invention ^ 'is to make a heat-dissipating structure for high brightness, high current, and small size. Another object of the present invention is to mention the structure of the package, which can make the The applied light beam, and at the same time, a heat dissipation structure based on an embodiment of the invention, including: a metal surface, the upper surface is formed into a cup, the lower surface is provided with a metal solder layer, an inner surface and an outer surface. Formed thereon, the metal oxide has an electrode layer formed; ^ An electrode system is formed on the cup-shaped portion, and the surface liquid formed in the cup-shaped portion is filled in the cup-shaped portion. And a transparent cover portion, which is electrically insulated in the cup-shaped portion, and the transparent cover portion has a convex surface of the light-emitting device. The invention provides a heat-dissipating structure of a light-emitting device, and the light-emitting device is free from temperature rise and can be used in applications. Provided is a package for a light emitting device, and the emitted light is condensed into a heat that is suitable for a specific generation and is extremely easily dissipated. In an aspect, a light-emitting device package substrate is provided, which has an upper surface and a lower surface-like portion, and the upper surface is formed thereon, wherein the cup-shaped portion and the outer surface have a metal oxide layer. Both the inner surface of the cup-shaped portion and the electrode layer are on the inner surface of the two electric portions separated from each other, and on the other electric surface; an electrically insulating cooling is performed by the cup-shaped portion. The inner surface is connected to the metal substrate, and the cooling liquid of the filling edge can be sealed on one of the inner surfaces of the cup-shaped portion, and it is formed to face the preferable structure. The metal substrate is made of a thermally conductive material. The metal oxide layer is made of an oxide of the thermally conductive material.

Page 8 554506 V. Description of the invention (3) Furthermore, it is preferable that an electrode on one surface of the printed circuit board circuit board is electrically connected to the outer surface of the metal solder cup-shaped portion to the printed circuit. The electrode is preferably formed transparently with a heat dissipating structure formed on the inner surface of the electrode according to the present invention. A metal substrate is prepared thereon and formed with a plurality of treatments. An electrical material layer and a bottom layer are formed by a cover portion further comprising a printed circuit board and a material; the printed electrode, and by bonding the at least and by bonding another at least one electrode to each of the other electrodes, The light-emitting device encapsulates a light-reflecting system with another embodiment in which the convex surfaces are opposite to each other and is made of metal. The outer surface is another convex surface. The substrate of the next step is provided so that the upper table includes a material layer on the inner surface of the upper portion of the cup-shaped portion of the lower surface of the metal, and the inner portion of the upper edge of the inner surface of the metal-plating step portion is formed. On the metal >-^, cut all together; the cup-shaped oxides on the outside, which are on top of the electricity; and the same method for making oxides, where the cup-shaped portions are plated with a metal solder The ink-filling step makes the inner surface of the insulating-anodized metal substrate part; except for plating one electrode and one electrode, the upper part of the ink-filling step is removed by the ink step layer during the separation step. Layer and the electrode layer, fill an absolute upper edge for the insulation on the surface, remove the metal oxygen, and remove the upper sleeve can send a hair: a system with one side through the gold edge ink and cups In the step of sealing the electrode light device in addition to forming the ink to remove the insulating layer and removing the cup edges, the upper surface and the surface are polished, and each cup-shaped portion of the substrate to the plurality of portions is protected by a metal oxide. From the edge of the ink; on this side and each cup-shaped portion of the layer region is divided into Bureau

Page 9 554506

The other electrode located on the inner surface of each cup-shaped portion and above the outer surface; one electrode to the inner surface of each cup-shaped portion is connected to the other surface of the light-emitting device by a wire bonding method. The insulating liquid of the electrode to the upper edge of the plurality of cups and an upper edge of each cup-shaped portion is solidly clothed with an adhesive material. The peripheral edge of the front part of the cover part is tightly connected together; and a plate, thereby forming the light-emitting device seal, is preferably composed of materials in the preparation step. 2 an electrode, and the installation step of each cup-shaped portion is above the electrode on the bottom side of the surface of the light-emitting device, and another electrode is connected to each cup-shaped portion; a filling step is filled In an electrical property part, the quality of the cooling liquid is cut uniformly; a coating step is above a peripheral edge of the bottom of the coating surface; a covering part covers each cup-shaped part, and the peripheral edge The bottom cutting step with the outer surface of each cup is to cut the metal base. Among them, the metal substrate is made of a thermally conductive material, and preferably in the anodizing step, the metal oxide layer is made of an oxide of the thermal conductive material. The method for manufacturing a heat dissipation structure of a light emitting device package further includes the following steps: a mounting step for mounting the light emitting device package on a printed circuit board, wherein the printed circuit board is at least made of a thermally conductive material; Composition; at least one electrode is formed on one surface of the printed circuit board; and by bonding the at least one electrode to the metal solder layer and by bonding another at least one electrode to the bottom of the outer surface of each cup portion The other electrode electrically connects the light emitting device package to the printed circuit board. Preferably, the electrode layer is plated on the metal oxide layer and each cup shape.

Ίο 554506 — _ V. Description of the invention (5) __ I! 之中 In the electroplating step above the surface, the electrode layer is composed of an anti- # metal. Han Guang Preferably, in the covering step, one surface of the transparent cover portion is formed as a convex surface, and the transparent cover is opposite to the convex surface. The surface is formed as [preferred embodiment] Detailed description] # 秘 ΐ In the following description of the preferred embodiment, refer to FIG. 1 and explain the installation 1. The solid state light emitting device with a heat dissipation structure according to the first embodiment of the invention The solid state light emitting device package 1 includes metal The substrate 10, at least one LED, is preferably a metal substrate 10 composed of a material having excellent thermal conductivity such as aluminum, copper, etc. On one surface, an upright wall portion 16 is formed, and the metal substrate 10 is This surface will be formed into a cup-shaped portion. Also, on the other surface of the metal substrate 10 opposite to the shape portion 11, there is a metal solder layer 12 such as copper, silver, or gold for connection. To the electrode 51 of the PCB50, and more specifically, the PCB50 is a Shawkey PCB. For example, the metal solder layer 12 can be electrically connected to the electrode 51 by a surface adhesion technology (SMT). Also, its , Is the function of the insulating layer and is preferably thorium oxide (oxygen < dagger) The metal vaporization layer 14 is first formed on the outer surface of the cup-shaped portion u, but not shaped, on the inner surface of the cup-shaped portion U. Next, it is preferably a reflective material such as silver, gold, or aluminum The metal electrode layer 丨 5 is formed on the alumina layer 4 and cup-shaped page 11 554506 V. Description of the invention (6) Both of the inner surface of the part 11 can not be covered by it. In other words, the electrode layer The i 5 series is formed on the inner surface of the alumina layer 丨 4 and the cup-shaped part 丨 丨 2. In this case, # the inside of the upper edge of the cup-shaped mouth is removed by appropriate processing, and the cup-shaped is removed at the same time. The inner β 卩 alumina layer 14 and the local electrode layer 15 of the upper edge can cut the electrode area into two parts, one of which is called electrode 1 5 b and is located in the cup-shaped part. Above the inner surface is substantially connected to the metal substrate 10, and the other is called an electrode 15a, which is located on the outer surface of the cup-shaped portion of the insulating aluminum oxide layer " above 'and serves as an individual of the metal substrate. For external electrodes. Preferably, the appropriate processing for forming the electrodes 15a and 15b is a mechanical metal substrate 1 With the above structure, at least one LEd chip 20 is mounted on a region of the electrode 15b, and the region is located on the bottom side of the inner surface of the cup portion 11, so that the at least one LED chip 2 can be made. One side of the electrode 15b is electrically connected to the electrode 15b. In addition, the other side of the at least one LED chip 20 is electrically connected to at least one region of the electrode 15a, and at least one region of the electrode 15 & The upper edge of the outer surface of the part. In this case, the electrically insulating cooling liquid 30 confined in the cup-shaped part Π is preferably 'such as pure water, liquid silicone resin, etc. The flow system is filled to a predetermined height of the cup-shaped portion 11, and then, the transparent cover portion 4 in which the inner surface and the outer surface of the cup-shaped portion u are in a close fit state 4 is made of a transparent cover portion 40 by an adhesive The peripheral edge of 刖 is in close contact with a part of the opposite metal substrate 10, 俾 can fix the cover portion 40 on the cup-shaped portion u. In order to avoid the residual bubbles 3 1 caused by insufficient filling, which remain in the cup portion 11 and cause page 554506

The light emitted by the led chip 20 passes through the residual bubbles 31 and causes an adverse scattering phenomenon. Therefore, the inner surface of the transparent cover portion 40 in contact with the electrically insulating cooling liquid 30 is designed as a convex surface. Preferably, the design As a papillary surface, the residual bubbles 31 can not be left on the path through which the light emitted by the LED chip 20 passes through the buoyancy effect. After the electrodes 15a and the electrodes 52 of the PCB 50 are properly electrically connected, the solid-state light-emitting device package 1 having a heat dissipation structure provided according to the first embodiment of the present invention can be mounted on the external substrate 60, which is inherently With the function as a huge external radiator. Therefore, according to the heat dissipation structure of the present invention, the Joule heat generated by the light-emitting at least one LED chip 20 can be quickly diffused to the bulging cup portion 11 through the heat-dissipating electrically insulating cooling liquid 30, and along the The cup-shaped portion 11 diffuses downward to the metal substrate 10, and the metal substrate 10 is bonded to the external substrate 60 for heat dissipation through the PCB 50, thereby preventing the temperature of the light-emitting LED chip 20 from rising. In addition, it is possible to select the electrically insulating cooling liquid 30 and the transparent cover portion 40 whose respective refractive indexes are very close, so as to minimize the refraction effect caused by the two constituent materials. In addition, the outer surface of the transparent cover portion 4 () can be selectively formed into an optical outer shape '# which can gather the light emitted by at least one UD to form a light beam for a specific purpose. 2A to 2L, a method for manufacturing a heat dissipation structure of a solid state light emitting device package 1 according to a second embodiment of the present invention will be described. First, as shown in FIG. 2A, a metal substrate 10 is prepared, in which a plurality of cup-shaped portions 丨 丨 are formed on one surface of the metal substrate 10, and a surface polishing treatment is applied to the surface.

Page 13 554506 V. Instruction (8) Next, as shown in FIG. 2B, a metal solder layer 12 is electroplated on the other surface of the metal substrate. Preferably, the metal solder layer 丨 2 Made of copper, silver, or gold. Next, as shown in FIG. 2C, an insulating ink 13 is filled into the plurality of cup-shaped portions 11, so that the upper edge of the M-edge ink 1 3 and the upper edge of each cup-shaped portion are substantially Qi Qi. Next, as shown in FIG. 2D, an anodizing treatment is performed to form a metal oxide layer 1 4 'on the surface of the metal substrate 10 except for the inner surface of each cup-shaped portion, and each cup-shaped The inner surface of the portion 11 is protected from the formation of the metal oxide layer 1 by the insulating ink 13. Preferably, the metal oxide layer 14 is an alumina layer (alumina). Next, as shown in FIG. 2E, the insulating ink 13 is removed. Next, as shown in FIG. 2F, an electrode layer 15 is plated on the metal oxide layer 14 and each cup-shaped portion; [1 is on the inner surface, preferably, the electrode layer 1 is such as silver and gold Or reflective metal such as aluminum. Next, as shown in FIG. 2G, the inside of the upper edge of each cup 11 is removed by rotating the drill bit 17, and the local metal oxidation on the inside of the upper edge of each cup is also removed. The object layer 14 and the electrode layer 15 can distinguish the electrode layer 15 into an electrode 15 located above the inner surface of each cup portion, and another electrode located above the outer surface of each cup portion. One electrode 丨. Next, as shown in FIG. 2H, one of the at least one LED chip 20 is mounted on the electrode 15b on the bottom side of the inner surface of each cup 11 and the at least one LED chip is connected by wire bonding. The other electrode of 20 is connected to the other electrode 15a on the outer surface of each cup.

Page 14 554506

Next, as shown in FIG. 2I, an electrically insulating cooling liquid 30 is filled into the plurality of cup-shaped portions U, and an upper edge of the cooling liquid 30 and one of the cup-shaped cymbals 11 are filled. The upper edge is cut uniformly. Preferably, the cooling liquid 30 is an electrically insulating fluid such as pure water or liquid stone oxyresin. Next, as shown in FIG. 2J, a glue material 4 i is coated on a peripheral edge of the bottom of the outer surface of each cup-shaped portion. Preferably, the glue material 41 is a glue hardened by ultraviolet light. material. Then, as shown in FIG. 2K, each cup-shaped portion 11 is covered and covered with a transparent cover portion 40, and the front peripheral edge of the transparent cover portion 40 and each cup-shaped portion are covered with an adhesive material 4 丨. 11 The peripheral edges of the bottom of the outer surface are tightly connected together, wherein the inner surface of the cover portion 40 is cut into a close fit with the outer surface of the cup portion H to cut the metal substrate 10 to form a final shape, as shown in FIG. 2 The light emitting device package 1 is shown by L. The above is only for the convenience of describing the preferred embodiment of the present invention, and does not limit the present invention to the preferred embodiment in a narrow sense. For example, a solid-state light-emitting device package i such as an array (FIG. 3) , Which is filled with any electrically insulating cooling liquid 30. In addition, the above is only for the convenience of describing the preferred embodiment of the present invention, and does not limit the present invention to the preferred embodiment in a narrow sense, for example, a laser diode (LD) package丨, (Figure 4), which is filled with the electrically insulating cooling liquid 2 of 2. And when the heat dissipation structure of the present invention is applied; when the package 1 is used, its heat dissipation effect will be more significant, because no matter whether it is low-power or high-power LD, ′ is more susceptible to temperature rise than LED ′-

Page 15 554506 V. Description of the invention (10)-Sounding device. The heat dissipation structure of the present invention will enable the operation of the laser diode cold section, and improve the optical magnification performance, reliability, and more importantly, that is, improve the wavelength stability in some cases. A is also 'the above is only for the convenience of explaining the preferred example of the present invention' and does not limit the present invention to the preferred embodiment in a narrow sense. For example,% TTl —- * _ δ The polar body (0LED) package is filled with any electrically insulating cooling liquid 30. For example, the above description is only for the convenience of describing the preferred implementation of the present invention, and does not limit the present invention to the preferred embodiment in a narrow sense. Any changes made in accordance with this / 11. Ting are within the scope of the patent application for this invention.

Page 16 554506 Brief Description of Drawings Figure 1 is a structural diagram showing an LED package having a heat dissipation structure according to a first embodiment of the present invention, wherein the package has been mounted on an external substrate. 2A to 2L are schematic diagrams showing a method for forming a heat dissipation structure of a light emitting device package according to a second embodiment of the present invention. Fig. 3 is a configuration diagram showing a modification according to the first embodiment of the present invention. Fig. 4 is a configuration diagram showing another variation according to the first embodiment of the present invention.

[Symbol description] 1. Γ Light emitting device package 10 Metal substrate 11 Cup portion 12 Metal solder layer 13 Insulating ink 14 Metal oxide layer 15 Electrode layer

15a, 15b, 51, 52 Electrode 16 Wall 17 Drill bit 20 LED chip 30 Coolant 31 Bubble

Page 17 554506 Schematic description of drawings 40 Cover 41 Adhesive 50 Printed circuit board 60 External substrate

Page 18

Claims (1)

554506 VI__Please patent scope 1 · A light-emitting metal is formed as a cup of metal solder layer on an outer surface, which is oxidized and formed on the surface of the cup-shaped portion, electrically on the transparent portion of the cup-shaped portion of the metal It is formed in the cup-shaped part and the transparent device sealing substrate 5-shaped part of the transparent device, and is formed on the electrical cover part of the cover part of the inner surface and the outer layer is insulated from the surface of the electrical part. The installed heat dissipation structure includes: a cooling liquid having an upper surface and a lower surface, and an upper surface opposite to the upper surface, which has the cup-shaped pole layer with an inner surface, which is limited by the surface, and has an inner convex surface which is in close contact with the sexual insulation; The cup-shaped portion of the upper surface in the table below has a metal oxide layer shape, and the inner surface has two separate electrodes, and the other electrode is filled in the cup-shaped portion; and the metal The substrate is sealed with the cooling liquid on the surface of the cup, and is formed so that the upper surface has an inner surface and is formed thereon, an electrode layer shape and an electrode system are formed in the cup shape, and The filling in the portion toward the emission range of Li 2 m by a heat radiating structure of the light emitting device package, Paragraph 1, wherein the metal substrate based Intuit is composed of a thermally conductive material. "3. If the metal oxide layer in the loose soil of the light-emitting device package of the second patent application scope is composed of the oxide of the heat-conducting material.-= Application: Green light-emitting device package of the second patent scope Contains a printed circuit board in which mildew & more 554506, please request the scope of the patent for the printed circuit; A at least one electrical option is formed on the surface of the printed circuit composed of the thermally conductive material, and another 22 the at least-electrode to the metal solder layer, and by bonding Make a diagnosis: Dream to the bottom of the outer surface of each cup portion. The electrode is connected to the printed circuit board. The heat dissipation structure of the light-emitting device package according to item 1 ', in which the 3H electrode layer is made of a reflective metal. 6H please! The scattered structure of the light-emitting device package of item 1 in the first range, the first part of the surface has an outer surface, and the outer surface is formed as another convex surface opposite to the convex surface of the inner surface. Step: A method for manufacturing a heat dissipation structure of a light emitting device package, including the following steps and a preparation step, is to prepare a combination which will have an upper surface and an upper substrate; 'its, above the lower surface of the metal substrate; a surface After-surface polishing treatment; there are a plurality of cup-shaped portions, and the above two shovel steps are recorded by a metal solder layer in the metal substrate filling step. The "upper edge" of the insulating ink is cut into a wide range of cup-shaped portions; the upper edge and an upper edge of each cup-shaped portion are substantially an anodizing step for removing the Outside the surface, page 20, 554506 VI. The patent application for a metal substrate with a metal oxide layer formed on the upper surface of the 4 metal substrate, and the inner surface of each cup is protected by the insulating ink from forming the Metallization layer;-a deinking step to remove the insulating ink; a plating step to plate an electrode layer on the metal oxide layer and the inner surface of each cup portion;: an electrode separation step to remove Above the cups The metal oxygen ^^ and the electrode layer above the inner side of the upper edge of each cup-shaped portion can distinguish the electrode layer into an electrode located on the other side of each cup-shaped portion, and In the step above the outer surface of each cup, the -electrode of the light-emitting device is mounted on the electrode on the bottom side of the inner surface of each cup, and the s of the light-emitting device is pulled and- The wire bonding method connects the other electrode of the i = set to one of the electrodes of each cup; "The other filling step above the surface is to fill an electrically insulated cup portion, 栋 # 今, Person, crotch fluid are substantially cut to the plural; the elephant and the upper edge of each cup-shaped part are applied in a coating step, which is to apply a glue on one of the peripheral edges of the part; the outer surface of the part And a bottom covering step for making a transparent cover 4 and holding the cup portion with the transparent cover portion by the glue material, and the peripheral edges of the bottom of the surface are closely contacted together; and D ,, A cutting step other than the cups is to cut the metal substrate to form the light-emitting device. Page 554506 Placing package. The manufacturing method is: Manufacture of the heat dissipation structure of the light-emitting device package of the seventh item. In the preparation step, the whole is made of US board as a Dowler material. , AI belongs to the substrate consisting of a light-emitting device package of thermal conductivity range No. 8 ^^ ;;; in the anodizing step, the metal oxide layer is composed of an oxide of a hot material such as J. The heat dissipation structure of the light-emitting device package is made in 10. If the manufacturing method of the eighth item of the patent application scope includes the following steps: a mounting step on the circuit board, wherein the light-emitting device package is mounted on a printed circuit and the printed circuit. The board is composed of at least the thermally conductive material; at least one electrode is formed on one surface of the printed circuit board; and the at least one electrode is bonded to the metal solder layer by bonding, and the other electrode is bonded to each cup by bonding The other electrode at the bottom of the outer surface of the shape portion electrically connects the light emitting device package to the printed circuit board. 11. The manufacturing method of a heat dissipation structure of a light emitting device package according to item 7 of the scope of patent application, wherein in the electroplating step of plating the electrode layer on the metal oxide layer and the inner surface of each cup portion, the electrode The layer is made of a reflective metal. 554506 VI. Village patent scope 1 2. The manufacturing method of the heat dissipation structure of the light emitting device package according to item 7 of the patent application scope, wherein in the covering step, an inner surface of one of the transparent cover portions is formed as a convex surface , And an outer surface of the transparent cover portion is formed as another convex opposite to the convex surface. Page 23