M361722 • . 五、新型說明： 【新型所屬之技術領域】 一種發光二極體 本創作有關於發光元件，尤其涉及 【先前技術】M361722 • . 5. New description: [New technology field] A light-emitting diode This work is about light-emitting elements, especially related to [Prior Art]
餐光兀件廣泛應用於各種發光或者顯示裝置上，例 如明燈、檯燈、指不燈、廣告顯示燈管以及液晶顯示 益的導光模組中。發光元件通常包括如冷陰極燈管、日 光k、場致發光器件及發光二極體（led)等，立中，[ED ::高效率、高亮度、高均勾度、高回應速度、能耗低 K點而備受關注。實際上，自LED問世以來，咖的 應用面越來越廣泛，其環保節能之優點被視為21世紀之 主要照明光源之一。 ^ ^ ^市面上的LED主要有如下類別：直插式lbd “=稱為DIP LED )、貼片式LED (簡稱為SMD led )、 廣膠貼LED (簡稱為TQp LED)及大功率式led 广1LED)。其中，大功率led具有亮度高、光 =小荨U ’適宜於大型化的使用。為了在照明市場占 于席之地不同封裝類型的大功率led在市場上不斷 ^型LED的封裝結構包括一個載體，載體上中央位 、/又有们杯脰，發光晶片即容置於該杯體内，然後 ，過石夕橡膠等封裝材料將發光晶片密封。在這種結構 备=膠通常作為透鏡’使得發光晶片發出 疋角度出射。 在這種典型led的結構中，透鏡通常通過自身的黏 3 M361722 合作用固設於截髀μ θ 力相對較弱。在4作Γ’=與載體間的這種結合 甚至從載體上脫落。並且下與载體間會發生錯位 產生㈣量較大，、在大功率的led中，其 載體間結合。因此，目熱升溫’此將影響透鏡與 存在隱患。目㈣led在透鏡的穩固性能方面 【新型内容】 本創作之目的，係提供—種能增強透鏡安裝穩固性 能的發光二極體。 上述之目的’本創作提供—種發光二極體，其 晶“该載體上的杯體、設於該杯體的發光 加二凰以魯S晶片的透鏡’該載體上設有一個支 鏡的邊緣’該透鏡係與支架-體成 主4 Μ皿5又的方式覆盍該杯體。 創！!具有之效益：與習知技術相較下，發光二極體 载胜上设置有支架，該支架環繞透鏡的邊緣設置，從 2以〜強透叙在載體上的穩固性。並且，透鏡採用與 :-體成型或蓋設的方式覆蓋杯體，增強透鏡在支架 載體上的結合力’促進透鏡的安裝穩固性。另外 =侧緣限定於支㈣内部空_，也可將透鏡 對其進行固定。 【實施方式】 為了使本創作的目的、技術方案及優點更加清楚明 二白，以下結合附圖及實施例，對本創作進行進一步詳細 况明。應當理解，此處所描述的具體實施例僅僅用以解 4 M361722 1 . 釋本創作’並不用於限定本創作。The dining light element is widely used in various light-emitting or display devices, such as a light lamp, a table lamp, a light-free lamp, an advertising display lamp, and a light-guiding module for liquid crystal display. Light-emitting elements usually include, for example, cold cathode fluorescent tubes, daylight k, electroluminescent devices, and light-emitting diodes (LEDs), etc. [ED: high efficiency, high brightness, high average hook, high response speed, energy It has attracted a lot of attention due to the low K point. In fact, since the advent of LED, coffee has become more and more widely used, and its environmental protection and energy saving advantages are regarded as one of the main lighting sources in the 21st century. ^ ^ ^The main LEDs on the market are as follows: In-line lbd “=DIP LED”, SMD LED (SMD led), Wide LED (TQp LED) and High Power LED Wide 1 LED). Among them, high-power LED has high brightness, light = small 荨 U 'suitable for large-scale use. In order to occupy the lighting market, the high-power LED of different package types is constantly on the market. The package structure comprises a carrier, the central position of the carrier, and/or the cups, and the illuminating chip is placed in the cup body, and then the encapsulating material such as Shishi rubber is used to seal the illuminating wafer. Usually used as a lens to make the illuminating chip emit a 疋 angle. In this typical led structure, the lens is usually relatively weak by the self-adhesive 3 M361722. The force is relatively weak at the 髀μθ. This combination between the carriers is even detached from the carrier, and misalignment occurs between the lower carrier and the carrier. (IV) The amount is large. In the high-power LED, the carrier is combined. Therefore, the heat is increased. This will affect the lens. And there are hidden dangers. Stable performance aspects [new content] The purpose of this creation is to provide a light-emitting diode that enhances the stability of lens mounting. The above objective 'This creation provides a kind of light-emitting diode, its crystal on the carrier a cup body, a light-emitting surface provided on the cup body, and a lens of the Er-Sui-S wafer, wherein the carrier is provided with an edge of a gantry, and the lens system and the holder-body are formed into a main body 4 Cup body. Create! Benefits: Compared with the conventional technology, the light-emitting diode is provided with a bracket, and the bracket is arranged around the edge of the lens, and the stability of the carrier is strong. Moreover, the lens covers the cup body in a manner of: - body shaping or capping, and the bonding force of the reinforcing lens on the carrier carrier 'accelerates the mounting stability of the lens. In addition, the side edge is limited to the inner space of the branch (4), and the lens can also be fixed. [Embodiment] In order to clarify the purpose, technical solutions, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to solve the invention.
凊茶閱第一圖和第二圖，為本創作實施例提供的發 :二極體1〇〇。該發光二極H 100包括载體3、開設於載 3上的杯體14、設於杯體14的發光晶片π、設置於 載體3上的支架2以及蓋設於發光晶片以上的透鏡 /支:2和載體3限定有容置透鏡1的腔體2〇 (如第五 圖所不），5亥腔體20與杯體14的内部空間相通，透鏡 支木2可為一體成型的結構。本實施例的發光二極 :100可適用於室内裝飾照明、室内輔助照明、室外景 觀、月紂道?、?、明、#曰示燈、廣告顯示燈管以及液晶顯 不器的導光模組等各種光源中。 其中’載體3由導熱性較好的材料製成，例如可採 用，或銅等金屬材料。載體3的外型可以呈長方型也可 =壬方型。在載體3上開設有杯體14的表面區域31佈 設有線路（圖未示）、正負極悍盤15A和i5B以及齊柄 —極體焊盤12。齊納二極體焊# 12用於電連接一個齊 納二極體，該齊納二極體設置於載體3上，齊納二極體 杯版14的表面區域31上佈設的線路並聯於發光晶 的兩端，用於防止靜電對發光晶片18的損壞，具 有保護發光晶片18的作用。正負極焊盤15A和⑽通 過弓1線16與發光晶片18電連接。正負極焊盤Μ和ΐ5β ^表面區域31上佈設的線路與相應的過孔从和4B 電連接。載體3的表面區域31上設有一絕緣區3u，以 便將正負極焊盤】5 A和】5B相互絕緣隔離。 如第一圖所不，本實施例中採用四個過孔，即在兩 端分別設有兩個過孔4八和4β，其中兩個過孔4A與正 5 M361722 極焊盤15A電連接，兩個過孔4β 接。當然’在其他實施例中，還可採用;、二;連 的過孔，視實際的使用需求而定。四 •盤15A和l5B分別σ换用—/门 理响上况，正負極焊 -實際應用中，卷心、曰過孔即可實施導通。而在 採用一個過孔連接，則容县屮相爪較大蚪，如果只 ,,, ^ . 、J谷易出現過孔燒壞的現象，因此 本貝知例對母個正負極焊盤ι =此 孔4A和4B來連接m〜 刀別知用兩個過 100。 妾防止笔^較大時損壞發光二極體 請再參閱第三圖，載體3在 設置有與過孔4A和4R ά隹相對杯肢Μ的底面32 22Λ和22Β，正倉&丨山目互電連接的正負極引出焊盤 32的兩端^ 出焊盤22Α^22Β可設置於底面 孔=4 R H _ 15 Α * 15 β通過相應的過 級 線路連接至载體3的底面32的正負極引 出丈干盤22Α和22Β，#欲脸找I 、 至底面32。因此，焊㈣^ 極體1〇0的正負極引 C知接的時候不需另外焊線。 23在載體3的底面32設有散熱焊盤 端，且5敎Μ ’干盤22Α^ 22Β位於散熱焊盤23的兩 (圖未^ ^ 23的面積較大’是為了與一個散熱裝置 輕大I目互貼合，如與散熱鰭片的底座貼合時具有 ^體3 I、傳導接觸面積。散熱焊盤23可直接電鑛在金屬 之‘:此種結合熱阻低。在散熱焊盤23與散熱裝置 ::採用焊料或者導熱膠相互貼合， 二3與:嶋t置之間的熱阻，促進大功率的發光二極： 發光日日/熱置及時散發出去，保證其正常高效地發光。 日日18所產生的大部份熱量可以直接通過金屬的 6 M361722 載體3傳至空氣和散熱裝置中，以將發光晶片i8所產生 的熱量及時散出，大幅降低了發光晶片18的工作溫产， 可以提高發光二極體⑽的發光效率、可靠性及使用又壽 - 命。The first and second figures of the tea are provided for the creation of the embodiment: a diode. The light-emitting diode H 100 includes a carrier 3, a cup 14 formed on the carrier 3, a light-emitting wafer π disposed on the cup 14, a holder 2 disposed on the carrier 3, and a lens/support disposed above the light-emitting wafer The 2 and the carrier 3 define a cavity 2 容 accommodating the lens 1 (as shown in the fifth figure), the 5 cavity 20 is in communication with the inner space of the cup 14, and the lens branch 2 can be an integrally formed structure. The light-emitting diode of the embodiment: 100 can be applied to indoor decorative lighting, indoor auxiliary lighting, outdoor landscape, moonlight road, ?, Ming, #曰灯, advertising display tube and liquid crystal display mode Groups and other light sources. The carrier 3 is made of a material having a good thermal conductivity, for example, a metal material such as copper or copper. The shape of the carrier 3 may be a rectangular shape or a square shape. A surface region 31 on which the cup body 14 is formed in the carrier 3 is provided with wiring (not shown), positive and negative electrodes 15A and i5B, and a shank-pole pad 12. Zener diode welding #12 is used for electrically connecting a Zener diode, the Zener diode is disposed on the carrier 3, and the line disposed on the surface region 31 of the Zener diode cup 14 is connected in parallel to the light. Both ends of the crystal are used to prevent damage of the luminescent wafer 18 by static electricity, and have the function of protecting the luminescent wafer 18. The positive and negative electrode pads 15A and (10) are electrically connected to the light-emitting chip 18 via the bow 1 line 16. The lines disposed on the positive and negative pads Μ and ΐ5β ^ surface area 31 are electrically connected to the corresponding vias from the 4B. An insulating region 3u is provided on the surface region 31 of the carrier 3 to insulate the positive and negative pads 5A and 5B from each other. As shown in the first figure, four via holes are used in the embodiment, that is, two via holes 4 and 4β are respectively disposed at two ends, and two of the via holes 4A are electrically connected to the positive 5 M361722 electrode pad 15A. Two vias 4β are connected. Of course, in other embodiments, it is also possible to use; and two; the vias are connected depending on the actual use requirements. 4. The discs 15A and 15B are respectively switched to σ-/the door is on the condition, positive and negative welding. In practical applications, the winding core and the through hole can be turned on. However, in the case of using a via connection, the Rongxian County has a large jaw. If only, ,, ^, and J Valley are prone to burnout of the via hole, the case of the positive and negative pads is = This hole 4A and 4B are connected to m~.妾Prevent the damage of the light-emitting diode when the pen is large. Please refer to the third figure. The carrier 3 is provided with a bottom surface 32 22 Λ and 22 ά隹 opposite the via holes 4A and 4R Β, 仓 && 丨山目Both ends of the positive and negative electrode lead-out pads 32 of the mutual electric connection are outputted to the bottom face = 4 RH _ 15 Α * 15 β is connected to the bottom surface 32 of the carrier 3 through the corresponding over-current line The negative electrode leads out the dry disk 22Α and 22Β, #欲脸I, to the bottom 32. Therefore, the welding of the (four) ^ pole body 1 〇 0 positive and negative lead C does not need additional welding wire. 23 is provided with a heat-dissipating pad end on the bottom surface 32 of the carrier 3, and 5 敎Μ 'dry disk 22 Α 22 22 Β located on the heat-dissipating pad 23 (the area of the figure is not large) is to be light with a heat sink I mesh with each other, such as when it is bonded to the base of the heat sink fin, it has a body 3 I, conductive contact area. The heat sink pad 23 can directly mine the metal in the metal': this combination of low thermal resistance. 23 and heat sink:: use solder or thermal adhesive to adhere to each other, the thermal resistance between 2 and 3: 嶋t set, promote high-power light-emitting diode: illuminate day/hot heat in time to ensure that it is normal and efficient The majority of the heat generated by the day 18 can be directly transmitted to the air and the heat sink through the metal 6 M361722 carrier 3 to dissipate the heat generated by the light-emitting chip i8 in time, thereby greatly reducing the light-emitting chip 18 Working at a low temperature, it can improve the luminous efficiency, reliability and use of the light-emitting diode (10).
. $外’在散熱焊盤23與正負極引出焊盤22A和22B 絕緣’因此’本實施例分別在散熱焊盤Μ與正 I出丈干盤22A，以及散熱焊盤23與負極引出焊盤灿 之間分別設有絕緣部2卜以防止正負極發生短路。 1 所述g在賴3與透鏡1相接觸的表面區域31 :有；路、正負極焊盤15以及齊納二極體焊盤12。通 :此I光反射至這些結構上時’大部分反射人的光合被 ^…構所吸收。為避免這種吸收現象，載體3的丄面 區域3 1 (也就是非功能區域） ' 成-個反光層Π，使光不光絕緣層，形 被反光層η所反射出透鏡〜外：…構的表面，而 杯體14可開設於載體3的中央位 ^平面，用來安裝發光晶片18，杯體14#^4底部 ，理的結構，使内表面成為亮面 T =過免化 可以有效的將發光日曰月π冗 射出杯體14,則 大提高發光二極體發，光導出杯體Η，大 可以在杯體14内點、、曰有〃备要製作白光的時候， « ^ 此有營光粉的矽橡膠，gpw』 層】9。通過改變螢光粉 / P形成螢光膠 白光輸出。 的/辰度及置可以得到不同色系的 括^四圖所示’本實施例中的透鏡！為凸心 括一個凸面1(H和—個 兄為凸透鏡，其包 们與梅⑻相對的底面1〇3。 7 M361722 • . • . 凸面i ο ]也就是發光__ 】8經透鏡1内部折射7聚C光面，從發光晶片 101傳遞到外界。根據不 ：的角度’然後由凸面 .的光學透鏡I，例如可通過;定凸^做成不同出光角度 -到所需的出光角度，甚面101的弧度，來達 底面103與載體3的表面31::可換成凹面。透鏡i的 之間凸設有-個凸緣102妾觸。在凸面】〇】和底面】03 並且凸緣⑽與支竿凸緣102凸出於凸面〗01， 底面103之間過渡連接=㈣合H緣102與 緣I。2向底面心104由凸 透鏡】的邊緣部分。 、·彖102和斜面]04都是 請配合參閱第五圖所示 板，其黏合在金屬的载體3上，支::：：金屬蓋 壁U和向圍透鏡〗8的凸緣1们的例 :1和向载體3漸縮的斜壁13，侧壁】 二 :接和斜壁13銜接可形成一臺階。側= 置：：1 立的壁’其内限定-個圓柱形腔，用以容 置透鏡1的凸緣1 〇2。斜辟η + μ 扣乂合 上’豆肉卩卩〜/ 斜壁13支撐於透鏡1的斜面104 i / 個倒圓臺形腔。因此，通過支竿2對4 1竞：的邊緣部分（如凸緣叫斜面吻：二： γΓ透ί :合Γ，有助於牢固地安裝透鏡1於载# /。進一步’透鏡1與支架2可為一體成型的4體 :加增強它們之間的結合力，促進透们的安口固 生。例如，可通過將透鏡材料如㈣膠直接灌〜= 2的内部腔體中模鑄成型，以形成透鏡i 二木 體結構。當然，也可以將透鏡直接蓋設於杯體上，：： M361722 * . • > 變發光二極體的私氺# 一 x 又’同日寸透鏡充滿整個腔體2 〇。 並不=構只是本創作的-個實施例， -他改變。例如’支架2的侧壁❹斜壁二 .為一體的直立的側壁，透鏡丨1Π/ 了以疋3合 為-個凸緣，沒有她二的斜面104和凸緣⑽合 2的斜壁13也可是―：首：面1〇4而是直立侧面。支架 壁11之間仍狭且有^ .的内壁，此内壁與直立的侧 , …、八有一個堂階，以提高結合力。本餘浐似 >中’只設置有—個發光晶片18，在盆他實：：“:例 以在杯體14内設置多個發光晶片。、 也可 本實施例中的發光二極體 架2圍繞透鏡】的邊緣設又置有支木2，,亥支 體上的穩陳。透鏡〗操㈣強透鏡1在載 方弋费芸&- U木用與支架2 一體成型或芸-& ^式復盍杯體14’增強透鏡！在支架2及_^叹的 =，促進透鏡！的安裝穩固性 二的結 限定於支架2的内部 Μ卜透叙1的侧緣 t對其進行固定。支架這種將透鏡1從側緣 型於支架2上，例如直 鏡 ^透鏡1 -體成 部腔體20中模鑄成型。透鏡材科洛注入支架2的内 所述僅為本創作的較佳實施例而已，、’ ::本創作，凡在本創作的精神和❹:内所 修改、等同替換和改進等 ^之内所作的任何 利範圍之内。 、=…匕3在本創作的申請專 【圖式簡單說明】 第1是本創作實施例的發光二極體剖面結構示意 9 M361722 * « 圖。 第二圖是本創作實施例 俯視結構示意圖。 的發光二極體未設有透鏡 的 第三圖是本創作實施例的發光 意圖 極體的底面結構示 第四圖是第一圖的發光二極許 仏聪甲的透鏡結構示意圖。 第五圖是m的發光二極體中的支架結構示意圖〇 • 【主要元件符號說明】 發光二極體100 透鏡1 凸面101 凸緣102 底面103 斜面104 φ 側壁11 齊納二極體焊盤12 斜壁13 杯體14The outer surface of the heat-dissipating pad 23 is insulated from the positive and negative electrode lead-out pads 22A and 22B. Therefore, the present embodiment is respectively disposed on the heat-dissipating pad Μ and the positive-distributing disk 22A, and the heat-dissipating pad 23 and the negative-electrode lead-out pad. An insulating portion 2 is provided between the cans to prevent short circuits between the positive and negative electrodes. 1 The surface area 31 where the g is in contact with the lens 1 is: a path, a positive and negative electrode pad 15, and a Zener diode pad 12. Pass: When this I light is reflected onto these structures, the photosynthetic unit of most of the reflected people is absorbed by the structure. In order to avoid this absorption phenomenon, the facet area 3 1 (that is, the non-functional area) of the carrier 3 is formed into a reflective layer Π, so that the light is not insulated, and the shape is reflected by the reflective layer η out of the lens. The surface of the cup 14 can be opened in the central plane of the carrier 3 for mounting the illuminating wafer 18, the bottom of the cup body 14#4, and the structure of the surface, so that the inner surface becomes a bright surface T = over-utilization can be effective The luminescence of the sun 曰 π will be shot out of the cup body 14, which will greatly increase the light-emitting diodes, and the light will be exported to the cup body. This has the enamel rubber of the camping powder, gpw layer]9. The fluorescent white light output is formed by changing the phosphor powder / P. The lens in this embodiment can be obtained in different colors. A convex surface 1 is included for the convex core (H and - the brother is a convex lens, and the bottom surface of the package opposite to the plum (8) is 1〇3. 7 M361722 • . . . . convex surface i ο ] is also illuminated __ 】 8 through the lens 1 Refraction of the 7-C light surface, transmitted from the light-emitting chip 101 to the outside. According to the angle 'n': then the optical lens I of the convex surface, for example, can be made through different convex light angles to the desired light-emitting angle, The curvature of the face 101, the surface 31 of the face 103 and the surface of the carrier 3: can be replaced by a concave surface. The flange i is convexly provided with a flange 102. The convex surface and the bottom surface are 03 and convex. The edge (10) and the support flange 102 protrude from the convex surface 01, and the transition connection between the bottom surface 103 = (4) the H edge 102 and the edge I. 2 toward the bottom surface 104 is the edge portion of the convex lens], · 彖 102 and the slope] 04 are all please refer to the board shown in the fifth figure, which is bonded to the metal carrier 3, the support:::: the metal cover wall U and the flange 1 of the lens 8: 1 and the load The inclined wall 13 of the body 3 is tapered, and the side wall is second. The joint of the inclined wall 13 and the inclined wall 13 can form a step. Side =:: 1 The vertical wall defines a cylindrical cavity therein. To accommodate the flange 1 〇2 of the lens 1. The θ + μ buckle is closed and the 'bean 卩卩 / ~ / slanted wall 13 is supported on the inclined surface 104 i of the lens 1 / a rounded table cavity. Therefore, Support 2 pairs of 4 1 competition: the edge part (such as the flange called the beveled kiss: two: γ Γ ί : Γ, helps to firmly mount the lens 1 on the load # /. Further 'lens 1 and bracket 2 can be Integrally formed 4 body: add and strengthen the bonding force between them, and promote the solidification of the mouth. For example, it can be formed by molding a lens material such as (4) glue directly into the inner cavity of 〜2 to form Lens i Two-wood structure. Of course, the lens can also be directly placed on the cup body:: M361722 * . • > The light-emitting diode is privately ## and the same-day lens fills the entire cavity 2并不 并不 构 构 构 构 构 构 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 支架 支架 支架 支架The flange, the inclined wall 13 without the second inclined surface 104 and the flange (10) 2 may also be the ": first: the surface 1〇4 but the upright side. The bracket wall 11 is still between And there is an inner wall of the inner wall, the inner wall and the upright side, ..., eight have a church order to improve the bonding force. In the present, only one light emitting chip 18 is disposed in the pot: ": For example, a plurality of light-emitting chips are disposed in the cup body 14. Alternatively, the edge of the light-emitting diode frame 2 around the lens in the embodiment is provided with a branch 2, and the solid support on the branch body is Lens 〗 (4) Strong lens 1 in the carrier 弋 芸 &- U wood with bracket 2 integrated or 芸-& 式 盍 cup 14' enhanced lens! In the bracket 2 and _^ sigh =, promote the lens! The installation stability is limited to the inside of the bracket 2, and the side edge t of the dialysis 1 is fixed. The holder molds the lens 1 from the side edge of the holder 2, for example, the lens ^ lens 1 - body cavity 20. The description of the lens material Colo injecting bracket 2 is only a preferred embodiment of the present invention, ':: This creation, within the spirit and the ambiguity of the creation: modification, equivalent replacement and improvement, etc. Any range of benefits made. , =...匕3 In the application for this creation [Simplified illustration] The first is the cross-sectional structure of the light-emitting diode of the present embodiment. 9 M361722 * «图. The second figure is a schematic plan view of the present embodiment. The light-emitting diode is not provided with a lens. The third figure is the bottom structure of the light-emitting inductive body of the present embodiment. The fourth figure is the lens structure of the light-emitting diode of the first figure. The fifth figure is a schematic diagram of the structure of the bracket in the light-emitting diode of m. 【• [Key element symbol description] Light-emitting diode 100 Lens 1 convex 101 Flange 102 Bottom surface 103 Bevel 104 φ Side wall 11 Zener diode pad 12 Inclined wall 13 cup body 14
- 正負極焊盤15A、15B - 弓丨線16 反光層17 發光晶片18 螢光膠層19 M3 61722- Positive and negative pads 15A, 15B - Bow line 16 Reflective layer 17 Illuminated wafer 18 Fluorescent layer 19 M3 61722
* V 支架2 腔體20 絕緣部21 ' 正負極引出焊盤22A、22B 散熱焊盤23 載體3 表面區域31 絕緣區3 1 a > 底面32* V bracket 2 cavity 20 insulation 21 ' positive and negative terminal pads 22A, 22B heat dissipation pad 23 carrier 3 surface area 31 insulation area 3 1 a > bottom surface 32
過孔4A、4BVia 4A, 4B
1111