CN202834933U - Light-Emitting Diode (LED) support lamp - Google Patents
Light-Emitting Diode (LED) support lamp Download PDFInfo
- Publication number
- CN202834933U CN202834933U CN2012205220767U CN201220522076U CN202834933U CN 202834933 U CN202834933 U CN 202834933U CN 2012205220767 U CN2012205220767 U CN 2012205220767U CN 201220522076 U CN201220522076 U CN 201220522076U CN 202834933 U CN202834933 U CN 202834933U
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- heat dissipation
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- dissipating layer
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Abstract
A Light-Emitting Diode (LED) support lamp comprises a body, a shield, a surface mounting component, a heat dissipation layer, a lamp cap, an actuator and an aluminium alloy shell. The body is provided with the shield. The heat dissipation layer is arranged on the middle of the body. The surface mounting component is arranged on an upper side of the heat dissipation layer. The aluminium alloy shell is arranged in a lower portion of the body. The actuator is arranged between the heat dissipation layer and the aluminium alloy shell. Two sides of the lamp cap are respectively connected with the heat dissipation layer and the aluminium alloy shell. The Light-Emitting Diode (LED) support lamp has the advantages that a heat sink is arranged between a Light-Emitting Diode (LED) chip and an aluminium oxide ceramics heat dissipation baseplate, semi-packing structure is adopted, heat dissipation is accelerated and the service life of the surface mounting component is prolonged. A plurality of aluminium heat dissipation components are arranged on an outer side of the body, the heat dissipation is greatly increased and the whole heat dissipation effect of a lamp tube is better. The heat dissipation layer is arranged in the middle of the body. The heat dissipation layer is a thermally conductive and insulating plastic cement layer. The thermally conductive and insulating plastic cement layer has a good heat-conducting property, a good electrical insulation property and an electric shock resisting property.
Description
Technical field
The utility model relates to a kind of led support lamp, relates in particular to the led support lamp in a kind of photoelectric lighting field.
Background technology
Since 19th-century Edison invented incandescent lamp, brought in the dark bright and happy to the mankind.But because service life of incandescent lamp is short, electro-optical efficiency is low, and most of electric energy is used for generating heat, and small part is luminous, so energy consumption is large, will withdraw from gradually electric light source main flow illumination market at current Energy-saving Society.European Union progressively eliminates the application of incandescent lamp since on September 1st, 2009.
Second stage, the fluorescent lamp that common halogen-phosphate fluorescent material is made is after having experienced nearly 60 years course, although also exist many defectives, in constantly improvement, improve among the superiority of its quality, price make it in market always in occupation of suitable share.
Phase III, the 1970s and 1980s rare-earth trichromatic fluorescent powder is applied to energy-conservation fluorescent lamp at twentieth century.With respect to incandescent lamp, power saving fluorescent lamp is because its light efficiency is high, and the life-span is long, and obvious energy conservation becomes the major product of the global Green Lighting Project of twentieth century.But there is harmful mercury element in fluorescent lamp, not environmental protection by ultraviolet excited light-emitting; Stroboscopic; High pressure, there is potential danger in activated phosphor; Therefore the shortcomings such as ballast and starter power consumption are large still are not a kind of very good green illumination electric light sources.Along with the time is put off also and will be eliminated gradually.
Along with the electric light source scientific technological advance, semiconductor light-emitting-diode (LED) sixties appearred in twentieth century.Through decades development, LED has obtained the technical important breakthroughs such as extension, chip in the nineties, become the 4th generation electric light source, begin to enter the practical stage, and demonstrate the large advantage of its tool: optical efficiency is high; The light quality is good; Energy consumption is little; Life-span is long; Reliability and durability; Applying flexible; Safe and reliable; Environmental protection; Response time is short.Particularly through in recent years development, LED is just attracting global sight with its intrinsic superiority.For the application of LED, be that people expect the most extensively popularizing of general lighting field in the world.At present, the application of illumination LED is confined to the particular forms such as local lighting, decorative lighting, outline lighting, and people wish that urgently LED becomes general lighting light source of new generation, and each illumination company is all at the active development Related product.In addition, many buildings and Lighting designer are thought, use LED to can be them and increase many new designs, and they can utilize LED that the inspiration of oneself and design are specialized, so and the design sample that produces can be watched for people easily, this also is very beneficial for the universal of LED.With the perfect fusion of manufacturer, designer and user's imagination, the new application that developing traditional lighting light source can't be realized is most important.Along with the LED technology further develops, LED will become 21st century human revolutionary green illumination a new generation electric light source, will be global Lighting Industry prior development direction from now on.
Traditional LED encapsulating structure generally is with conduction or non-conductive adhesive is contained in chip in the undersized reflector or on the slide holder, forms with epoxy encapsulation finished the inside and outside connection of device by spun gold after, and its thermal resistance is up to 250～300 ℃/W.If adopt the LED packing forms of traditional type, will cause because heat radiation is bad junction temperature of chip to rise rapidly and epoxy carbonization flavescence, thereby cause the acceleration light decay of device until lost efficacy, even lose efficacy because the stress that rapidly thermal expansion produces causes open circuit.
The utility model content
In order to address the above problem, the utility model is intended to invent the LED-backlit source of a kind of good heat dissipation effect and long service life.
A kind of led support lamp comprises main body, guard shield, surface mount device, heat dissipating layer, lamp holder, driver and aluminum alloy casing, described main body top is provided with guard shield, the middle part of main body is provided with heat dissipating layer, the heat dissipating layer upside is provided with surface mount device, lower body part is provided with aluminum alloy casing, be fixed with driver between heat dissipating layer and the aluminum alloy casing, the lamp holder both sides are connected with aluminum alloy casing with heat dissipating layer respectively, described surface mount device inside is filled with silicon rubber, surface mount device comprises led chip, heat sink and aluminium oxide ceramics heat-radiating substrate, led chip is fixed in aluminium oxide ceramics heat-radiating substrate one side, be provided with heat sinkly between this led chip and the aluminium oxide ceramics heat-radiating substrate, and adopt half encapsulating structure.
Preferably, described heat dissipating layer is the heat conductive insulating plastic layer.
Preferably, be provided with some shallow slot shape aluminium alloy radiating pieces outside the described main body.
The beneficial effect of a kind of led support lamp of the utility model is:
1. surface mount device comprises led chip, heat sink and aluminium oxide ceramics heat-radiating substrate, be provided with heat sink between led chip and the aluminium oxide ceramics heat-radiating substrate, and adopt half encapsulating structure, accelerate heat radiation, inside at surface mount device, fill the high flexible silicone rubber of transparency, in the temperature range that silicon rubber bears, (be generally-40～200 ℃), colloid can the Yin Wendu abrupt change and cause the device open circuit, the flavescence phenomenon can not appear, part material takes into full account its heat conduction, heat dissipation characteristics to obtain good overall thermal characteristics, increases the physical life of surface mount device;
2. the main body outside is provided with some shallow slot shape aluminium alloy radiating pieces, has greatly increased area of dissipation, makes fluorescent tube integral heat sink better effects if;
3. the middle part of main body is provided with heat dissipating layer, heat dissipating layer is the heat conductive insulating plastic layer, the thermal conductivity factor of heat conductive insulating plastic cement is 2w/m k, fire-retardant rank is high, existing good heat conductivility, electrical insulation properties again tool prevent electric shock function, can effectively reduce semiconductor components and devices to the impact of temperature thermal sensitivity, and be more safe and reliable, weight is light by 40% than aluminium alloy, reduces cost.
Description of drawings
Fig. 1 is overall structure schematic diagram of the present utility model.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing structure of the present utility model is described further.
Embodiment 1
Such as Fig. 1, shown in 2, a kind of led support lamp comprises main body 1, guard shield 2, surface mount device 3, heat dissipating layer 4, lamp holder 5, driver 6 and aluminum alloy casing 7, described main body 1 top is provided with guard shield 2, the middle part of main body 1 is provided with heat dissipating layer 4, heat dissipating layer 4 upsides are provided with surface mount device 3, main body 1 bottom is provided with aluminum alloy casing 7, be fixed with driver 6 between heat dissipating layer 4 and the aluminum alloy casing 7, are connected with aluminum alloy casing with heat dissipating layer 4 respectively and are connected in lamp holder 5 both sides, described surface mount device 3 inside are filled with silicon rubber, surface mount device 3 comprises led chip, heat sink and aluminium oxide ceramics heat-radiating substrate, led chip is fixed in aluminium oxide ceramics heat-radiating substrate one side, be provided with heat sink between this led chip and the aluminium oxide ceramics heat-radiating substrate, and adopt half encapsulating structure, heat dissipating layer 4 is the heat conductive insulating plastic layer, and main body 1 outside is provided with some shallow slot shape aluminium alloy radiating pieces.
Claims (3)
1. led support lamp, it is characterized in that: described led support lamp comprises main body, guard shield, surface mount device, heat dissipating layer, lamp holder, driver and aluminum alloy casing, described main body top is provided with guard shield, the middle part of main body is provided with heat dissipating layer, the heat dissipating layer upside is provided with surface mount device, lower body part is provided with aluminum alloy casing, be fixed with driver between heat dissipating layer and the aluminum alloy casing, the lamp holder both sides are connected with aluminum alloy casing with heat dissipating layer respectively, described surface mount device inside is filled with silicon rubber, surface mount device comprises led chip, heat sink and aluminium oxide ceramics heat-radiating substrate, led chip is fixed in aluminium oxide ceramics heat-radiating substrate one side, be provided with heat sinkly between this led chip and the aluminium oxide ceramics heat-radiating substrate, and adopt half encapsulating structure.
2. led support lamp according to claim 1, it is characterized in that: described heat dissipating layer is the heat conductive insulating plastic layer.
3. led support lamp according to claim 1 is characterized in that: be provided with some shallow slot shape aluminium alloy radiating pieces outside the described main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205220767U CN202834933U (en) | 2012-10-12 | 2012-10-12 | Light-Emitting Diode (LED) support lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205220767U CN202834933U (en) | 2012-10-12 | 2012-10-12 | Light-Emitting Diode (LED) support lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202834933U true CN202834933U (en) | 2013-03-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012205220767U Expired - Fee Related CN202834933U (en) | 2012-10-12 | 2012-10-12 | Light-Emitting Diode (LED) support lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202834933U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102927466A (en) * | 2012-10-12 | 2013-02-13 | 浙江省缙云县天煌实业有限公司 | LED (Light Emitting Diode) bracket lamp |
-
2012
- 2012-10-12 CN CN2012205220767U patent/CN202834933U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102927466A (en) * | 2012-10-12 | 2013-02-13 | 浙江省缙云县天煌实业有限公司 | LED (Light Emitting Diode) bracket lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20151012 |
|
| EXPY | Termination of patent right or utility model |