CN217691214U

CN217691214U - Heat dissipation type light-emitting diode

Info

Publication number: CN217691214U
Application number: CN202221288203.1U
Authority: CN
Inventors: 黄晓峰
Original assignee: Jiangsu Guangyin Intelligent Technology Co ltd
Current assignee: Jiangsu Guangyin Intelligent Technology Co ltd
Priority date: 2022-05-26
Filing date: 2022-05-26
Publication date: 2022-10-28
Anticipated expiration: 2032-05-26

Abstract

The utility model relates to a heat dissipation type emitting diode, including the LED wafer, be equipped with the contact silk line on the LED wafer, LED wafer lower extreme is equipped with the reflection cap, the reflection cap outside is equipped with a plurality of fin that overlap the setting, the reflection cap lower extreme is equipped with the negative pole lead wire, negative pole lead wire one side is equipped with anodal lead wire, the reflection cap outside is equipped with the first heat conduction post that is connected with the fin, the groove of wearing has been seted up in the middle of a plurality of fin, be equipped with the perpendicular second heat conduction post of being connected with it between a plurality of fin, a plurality of second heat conduction post lower extremes are equipped with insulator foot, the last protecting crust that is equipped with of insulator foot, the insulator foot lower extreme is equipped with aluminium base board. The utility model has the advantages that: the structure of wearing the groove in the middle of adopting formation behind a plurality of fin stacks holds the LED wafer, and maximize thermal conductivity makes the heat that the LED wafer produced distribute evenly through a plurality of heat dissipation channels, transmits to aluminium base board by the second heat conduction post and gives off the heat, improves the radiating efficiency, extension emitting diode life.

Description

Heat dissipation type light-emitting diode

Technical Field

The utility model relates to a light emitting diode technical field, concretely relates to is a heat dissipation type light emitting diode.

Background

The light-emitting diode is a semiconductor component, has the characteristics of energy conservation, environmental protection, small volume and the like, and is widely applied to the fields of various indications, display, decoration, backlight sources, common illumination and urban night scene lamps;

the existing light-emitting diode generally has the problem of poor heat dissipation, the other part of energy of the LED wafer is converted into heat in the process of electro-photoluminescence, the heat cannot be dissipated in time, the junction temperature of a PN junction can be increased, the aging of the LED wafer and packaging resin is accelerated, and the service life is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an aim at: a heat dissipation light emitting diode is provided to solve the above problems in the prior art.

In order to achieve the above object, the present invention provides the following technical solutions: a heat dissipation type light-emitting diode comprises an LED wafer, wherein a touch wire is arranged on the LED wafer, a reflection cap is arranged at the lower end of the LED wafer, a plurality of heat radiating fins which are arranged in an overlapped mode are arranged on the outer side of the reflection cap, a negative lead is arranged at the lower end of the reflection cap, an anode lead is arranged on one side of the negative lead, a first heat conducting column connected with the heat radiating fins is arranged on the outer side of the reflection cap, a penetrating groove is formed in the middle of the plurality of heat radiating fins, a second heat conducting column which is perpendicularly connected with the heat radiating fins is arranged between the plurality of heat radiating fins, an insulating base is arranged at the lower end of the plurality of second heat conducting columns, a protective shell is arranged on the insulating base, and an aluminum substrate is arranged at the lower end of the insulating base.

Preferably, silver paste is arranged between the LED wafer and the reflecting cap.

Preferably, the positive lead penetrates through the plurality of heat sinks and is connected with the wire contact line at the upper rear end.

Preferably, a plurality of the radiating fins are arranged in a conical shape, and a plurality of radiating channels are formed in the radiating fins.

Preferably, the lower ends of the negative electrode lead and the positive electrode lead penetrate through the insulating base.

Preferably, one side of the insulating base, which is close to the negative electrode lead, is a straight edge.

The utility model has the advantages that: the utility model provides a structure of wearing groove in the middle of the heat dissipation type LED adopts to form behind a plurality of fin stacks holds the LED wafer, and the maximize heat conductivility, and the heat that makes the LED wafer produce through a plurality of heat dissipation channel gives off evenly, gives off the heat by the transmission of second heat conduction post to aluminium base board, improves the radiating efficiency, extension emitting diode life.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of a partial structure of the present invention;

fig. 3 is another angle schematic view of the local structure of the present invention.

In the figure: 1-LED chip, 2-touch wire, 3-reflection cap, 4-heat sink, 5-negative lead, 6-positive lead, 7-first heat-conducting column, 8-through groove, 9-second heat-conducting column, 10-insulating base, 11-protective shell, 12-aluminum substrate, 13-silver adhesive, 14-heat-dissipation channel, and 15-straight edge.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

Referring to fig. 1-3, a heat dissipation type light emitting diode includes an LED chip 1, a contact wire 2 is disposed on the LED chip 1, the contact wire 2 is connected to an anode lead 6, a reflective cap 3 is disposed at a lower end of the LED chip 1, and is used for reflecting light, a plurality of heat dissipation fins 4 disposed in an overlapping manner are disposed at an outer side of the reflective cap 3, heat generated by the LED chip 1 is absorbed by the plurality of heat dissipation fins 4, a cathode lead 5 is disposed at a lower end of the reflective cap 3, the anode lead 6 is disposed at one side of the cathode lead 5, a first heat conduction post 7 connected to the heat dissipation fins 4 is disposed at an outer side of the reflective cap 3, and is used for transferring heat to the plurality of heat dissipation fins 4, a through groove 8 is disposed in the middle of the plurality of heat dissipation fins 4, a receiving space for receiving the LED chip 1 is formed in the through groove 8, a second heat conduction post 9 vertically connected to the plurality of heat dissipation fins 4 is disposed between the plurality of heat dissipation fins 4, an insulating base 10 is disposed at a lower end of the plurality of the second heat conduction post 9, a protective shell 11 is disposed on the insulating base 10, and is made of a transparent epoxy resin material for packaging and protecting an internal structure, and transferring heat conducting aluminum substrate behind the insulating base 11.

And silver glue 13 is arranged between the LED wafer 1 and the reflecting cap 3 and used for fixing the LED wafer and playing a role of electric conduction.

The positive electrode lead 6 penetrates the plurality of heat sinks 4 and is connected to the wire contact 2 at the upper end, and the wire contact 2 is a gold wire having a purity of 99.99% Au, and is used for connecting the pad of the LED chip 1 to conduct.

The plurality of radiating fins 4 are arranged in a conical shape, and a plurality of radiating channels 14 are formed in the radiating fins 4 and used for increasing the radiating efficiency of the radiating fins.

The lower ends of the cathode lead 5 and the anode lead 6 penetrate through the insulating base 10 to play a role in supporting and packaging.

One side of the insulating base 10 close to the negative lead 5 is a straight edge 15 for distinguishing the negative lead 5 from the positive lead 6.

After the radiating fins 4 are stacked, the through grooves 8 form accommodating spaces of the LED wafers 1, the LED wafers and the accommodating spaces are connected through the first heat conducting columns 1 to achieve a heat conduction effect, and heat generated by the LED wafers 1 is transmitted to an aluminum substrate at the lower end of the insulating base 10 through the plurality of radiating fins 4 and the second heat conducting columns 9 to be radiated.

The above examples are provided to further illustrate the present invention, but do not limit the present invention to these specific embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be understood as being within the protection scope of the present invention.

Claims

1. A heat dissipation type light emitting diode includes an LED chip (1), characterized in that: the LED heat-conducting wire is characterized in that a contact wire (2) is arranged on the LED wafer (1), a reflecting cap (3) is arranged at the lower end of the LED wafer (1), a plurality of heat-radiating fins (4) which are overlapped are arranged on the outer side of the reflecting cap (3), a cathode lead (5) is arranged at the lower end of the reflecting cap (3), an anode lead (6) is arranged on one side of the cathode lead (5), a first heat-conducting column (7) connected with the heat-radiating fins (4) is arranged on the outer side of the reflecting cap (3), a plurality of through grooves (8) are formed in the middle of the heat-radiating fins (4), a plurality of second heat-conducting columns (9) which are vertically connected with the heat-radiating fins are arranged between the heat-radiating fins (4), an insulating base (10) is arranged at the lower ends of the second heat-conducting columns (9), a protective shell (11) is arranged on the insulating base (10), and an aluminum base (12) is arranged at the lower end of the insulating base (10).

2. The heat dissipation light-emitting diode of claim 1, wherein: and silver glue (13) is arranged between the LED wafer (1) and the reflecting cap (3).

3. The heat dissipation light-emitting diode of claim 1, wherein: the positive lead (6) penetrates through the rear upper ends of the radiating fins (4) and is connected with the contact wire line (2).

4. The heat dissipation light-emitting diode of claim 1, wherein: the radiating fins (4) are arranged in a conical shape, and a plurality of radiating channels (14) are formed in the radiating fins (4).

5. The heat dissipation light-emitting diode of claim 1, wherein: the lower ends of the negative lead (5) and the positive lead (6) penetrate through the insulating base (10).

6. The heat dissipation light-emitting diode of claim 1, wherein: one side of the insulating base (10) close to the negative electrode lead (5) is a straight edge (15).