CN211670217U

CN211670217U - High-heat-conduction high-efficiency LED (light emitting diode) insulating packaging device

Info

Publication number: CN211670217U
Application number: CN202020287695.7U
Authority: CN
Inventors: 李杲宇; 张西刚
Original assignee: Shenzhen Shenhongsheng Electronic Co ltd
Current assignee: Shenzhen Shenhongsheng Electronic Co ltd
Priority date: 2020-03-10
Filing date: 2020-03-10
Publication date: 2020-10-13
Anticipated expiration: 2030-03-10

Abstract

The utility model discloses an insulating encapsulation device of high heat conduction high efficiency LED, which comprises a substrate, the bottom central authorities position fixedly connected with radiator of base plate, the insulating cover of top central authorities position fixedly connected with of base plate, anti-light cup has been seted up to the top central authorities position of insulating cover, anti-light cup's inner wall is provided with the reflector panel, the top of insulating cover and the bottom position fixedly connected with boss that is located anti-light cup, the top of boss is provided with the LED chip, the corresponding both sides in insulating cover surface all are provided with output electrode, be connected through the gold thread electricity between LED chip and the output electrode, the top of insulating cover is provided with lens, the utility model relates to a LED packaging technology field. This high heat conduction high efficiency LED insulation package device has reached quick heat dissipation, improves the effect of luminous efficiency, and is rational in infrastructure simple, convenient to use, and the luminous efficiency is high, and the radiating effect is good, can in time give off the heat, has prolonged life, has improved work efficiency and performance.

Description

High-heat-conduction high-efficiency LED (light emitting diode) insulating packaging device

Technical Field

The utility model relates to a LED encapsulates technical field, specifically is a high heat conduction high efficiency LED insulation package device.

Background

With the continuous progress of science and technology and the continuous development of society, the LED is applied to various fields, the LED is called as a fourth generation lighting source or a green light source, has the characteristics of energy conservation, environmental protection, long service life, small volume and the like, can be widely applied to the fields of various indications, display, decoration, backlight sources, common lighting, urban night scenes and the like, and the high-power LED lamp chip is produced along with the actual demand for increasing the light emission quantity of the LED lamp. At present, the existing LED packaging device in the market has poor heat dissipation effect, can not dissipate heat in time, and the temperature rise effect can greatly reduce the light output of an LED lamp, so that the service life of an LED chip can be greatly reduced, the luminous efficiency is reduced, the luminous performance of a product is influenced, and the service performance is reduced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a high heat conduction high efficiency LED insulation package device has solved the radiating effect poor, can not in time give off the heat, and the temperature rise effect can make the light output of LED lamp discount greatly, also can make the life-span of LED chip also will reduce by a wide margin, and the luminous efficacy reduces moreover, influences the product luminous performance, has reduced the problem of performance.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides an insulating encapsulation device of high heat conduction high efficiency LED, includes the base plate, the bottom central authorities position fixedly connected with radiator of base plate, the insulating cover of top central authorities position fixedly connected with of base plate, anti-light cup has been seted up to the top central authorities position of insulating cover, anti-light cup's inner wall is provided with the reflector panel, the top of insulating cover and the bottom position fixedly connected with boss that is located anti-light cup, the top of boss is provided with the LED chip, the corresponding both sides in insulating cover surface all are provided with output electrode, be connected through the gold thread electricity between LED chip and the output electrode, the top of insulating cover is provided with lens.

Preferably, the inner wall of the lens is a corrugated net, and the inside of the reflector and the inside of the lens are provided with packaging glue.

Preferably, the radiator comprises a radiating main board, the top of the radiating main board is fixedly connected with a heat conducting plate, the bottom of the radiating main board is fixedly connected with radiating fins, and through holes are formed in the surface of the radiating fins.

Preferably, the radiating fin is S-shaped, and the through holes are uniformly distributed on the surface of the radiating fin.

Preferably, the insulating sleeve is made of plastic.

(III) advantageous effects

The utility model provides a high heat conduction high efficiency LED insulation packaging device. The method has the following beneficial effects:

(1) this high heat conduction high efficiency LED insulation package device, bottom central position fixedly connected with radiator through the base plate, the insulating cover of top central position fixedly connected with of base plate, anti-light cup has been seted up to the top central position of insulating cover, anti-light cup's inner wall is provided with the reflector panel, the top of insulating cover and the bottom position fixedly connected with boss that is located anti-light cup, the top of boss is provided with the LED chip, the corresponding both sides in insulating cover surface all are provided with output electrode, be connected through the gold thread electricity between LED chip and the output electrode, the top of insulating cover is provided with lens, quick heat dissipation has been reached, the effect of luminous efficiency is improved, and the steam generator is reasonable in structure and simple, high durability and convenient use, and the luminous efficiency is high, and the heat dissipation effect is good in time, and the service life is.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a heat sink;

fig. 3 is a schematic view of a lens structure.

In the figure: the LED packaging structure comprises a substrate 1, a radiator 2, a radiating main board 21, a heat conducting plate 22, radiating fins 23, through holes 24, an insulating sleeve 3, a reflecting cup 4, a reflecting plate 5, a boss 6, an LED chip 7, an output electrode 8, a gold wire 9, a lens 10, a corrugated net 11 and packaging glue 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a high heat conduction high efficiency LED insulation packaging device comprises a substrate 1, a radiator 2 is fixedly connected with the bottom center position of the substrate 1, the radiator 2 has good heat dissipation effect, heat can be dissipated timely, the service life is prolonged, the working efficiency and the service performance are improved, the radiator 2 comprises a heat dissipation mainboard 21, a heat conduction plate 22 is fixedly connected with the top of the heat dissipation mainboard 21, the top end of the heat conduction plate 22 is contacted with the bottom end of an insulation sleeve 3, the heat conduction plate 22 has the heat conduction function and can dissipate heat timely, a radiating fin 23 is fixedly connected with the bottom of the heat dissipation mainboard 21, the radiating fin 23 is S-shaped, the heat dissipation area is increased, a through hole 24 is arranged on the surface of the radiating fin 23, the through hole 24 has the heat dissipation function, the through hole 24 is uniformly distributed on the surface of the radiating fin 23, the insulation sleeve 3 is fixedly, insulating cover 3's material sets up to the plastics material, it is insulating effectual and with low costs, insulating cover 3's top central point puts and has seted up reflection of light cup 4, reflection of light cup 4's inner wall is provided with reflector panel 5, reflector panel 5 has the function of reflection of light, the luminous efficiency is improved, insulating cover 3's top and the bottom position fixedly connected with boss 6 that is located reflection of light cup 4, boss 6's top is provided with LED chip 7, the corresponding both sides in insulating cover 3 surface all are provided with output electrode 8, connect through gold thread 9 electricity between LED chip 7 and the output electrode 8, insulating cover 3's top is provided with lens 10, lens 10's inner wall sets up to ripple net 11, the inside of reflector panel 5 and lens 10 is provided with encapsulating glue 12.

During the use, at first because reflection of light cup 4 undercut, thereby make reflection of light effectual, and reflector panel 5 is as for reflection of light cup 4 inside, reflector panel 5 has the function of reflection of light, the luminous efficiency is improved, when long-term use, interior components and parts generate heat, produce the heat, because the top of heat-conducting plate 22 contacts with the bottom of insulating bush 3, heat-conducting plate 22 can in time derive the heat this moment, and transmit for heat dissipation mainboard 21, heat dissipation mainboard 21 can dispel the heat this moment, heat can continue to transmit for fin 23 simultaneously, in time dispel the heat, and fin 23 sets up to the S-shaped, through-hole 24 evenly distributed is on the surface of fin 23, the heat radiating area all increases, the radiating efficiency is improved, the radiating effect is good, can in time give off the heat, the service life is prolonged, work efficiency and performance.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising one of the elements does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an insulating encapsulation device of high thermal conductivity high efficiency LED, includes base plate (1), its characterized in that: the LED lamp is characterized in that a radiator (2) is fixedly connected to the central position of the bottom of the substrate (1), an insulating sleeve (3) is fixedly connected to the central position of the top of the substrate (1), a reflection cup (4) is arranged at the central position of the top of the insulating sleeve (3), a reflection plate (5) is arranged on the inner wall of the reflection cup (4), a boss (6) is fixedly connected to the top of the insulating sleeve (3) and is located at the bottom of the reflection cup (4), an LED chip (7) is arranged at the top of the boss (6), output electrodes (8) are arranged on the two corresponding surfaces of the insulating sleeve (3), the LED chip (7) is electrically connected with the output electrodes (8) through gold threads (9), and a lens (10) is arranged at the top of the insulating sleeve (3).

2. The high thermal conductivity and high efficiency LED insulation package device according to claim 1, wherein: the inner wall of the lens (10) is provided with a corrugated net (11), and the inside of the reflector (5) and the inside of the lens (10) are provided with packaging glue (12).

3. The high thermal conductivity and high efficiency LED insulation package device according to claim 1, wherein: radiator (2) are including heat dissipation mainboard (21), the top fixedly connected with heat-conducting plate (22) of heat dissipation mainboard (21), the bottom fixedly connected with fin (23) of heat dissipation mainboard (21), through-hole (24) have been seted up on the surface of fin (23).

4. The high thermal conductivity and high efficiency LED insulation package device according to claim 3, wherein: the radiating fins (23) are S-shaped, and the through holes (24) are uniformly distributed on the surfaces of the radiating fins (23).

5. The high thermal conductivity and high efficiency LED insulation package device according to claim 1, wherein: the insulating sleeve (3) is made of plastic.