CN202072655U - Heat-conducting silica gel sheet for light-emitting diode (LED) illuminating lamp - Google Patents
Heat-conducting silica gel sheet for light-emitting diode (LED) illuminating lamp Download PDFInfo
- Publication number
- CN202072655U CN202072655U CN2011200562640U CN201120056264U CN202072655U CN 202072655 U CN202072655 U CN 202072655U CN 2011200562640 U CN2011200562640 U CN 2011200562640U CN 201120056264 U CN201120056264 U CN 201120056264U CN 202072655 U CN202072655 U CN 202072655U
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- heat
- silica gel
- gel sheet
- conducting silica
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Abstract
The utility model relates to the field of silica gels, in particular to a quickly radiating heat-conducting silica gel sheet for a light-emitting diode (LED) illuminating lamp. The heat-conducting silica gel sheet comprises a heat-conducting silica gel sheet body, wherein bonding faces, which are stuck and fixed with a shell and a printed circuit board (PCB), are respectively arranged on the upper side and the lower side of the heat-conducting silica gel sheet body; and a lamp bead is arranged on the PCB. The heat-conducting silica gel sheet has the beneficial effects that: the heat-conducting silica gel sheet can be cut into strips with proper sizes according to the length and the width of a lamp strip; the LED illuminating lamp is mounted only by bonding the heat-conducting silica gel sheet on the heating PCB and then mounting a radiator on the heat-conducting silica gel sheet or directly mounting the shell of the lamp; and a heat-conducting passage from the PCB to the heat-conducting silica gel sheet to the radiator or the shell is formed. When the heat-conducting silica gel sheet is compared with a heat-conducting silicone grease, the LED illuminating lamp is simply mounted and detached and secondary pollution is not caused after the heat-conducting silica gel sheet is used. Ordinary radiating ways include convection, conduction and radiation, but the conduction way is the simplest and lowest in cost.
Description
Technical field
The utility model relates to the silica gel field, especially relates to a kind of thermal conductive silicon film that is used for the LED head light of quick heat radiating.
Background technology
LED (Lighting Emitting Diode) promptly is a photodiode, is a kind of semi-conductor solid luminescence device.It is to utilize the solid semiconductor chip as luminescent material, by current carrier compound energy of emitting surplus takes place and cause photo emissions in semi-conductor, directly sends red, yellow, blue, green, blue or green, orange, purple, white light.LED interior lighting product utilizes LED as the produced lighting fixtures of light source exactly.The LED lighting fixtures of energy-saving and environmental protection, high brightness replaces traditional lighting just gradually.Photodiode is the device of current drives, and the function of supply convertor is that original power supply is done conversion, for photodiode provides stable unidirectional drive electric current, guarantees that photodiode under any circumstance can both works better.But electric current is that the resistance that produces can make lamp body heat up by photodiode, and this just makes photodiode accelerated deterioration at high temperature, and light efficiency descends.So slow down the light decay of photodiode, prolong the work-ing life of LED lamp, just must reduce the temperature of LED core, resolve the heat dissipation problem of LED.
Based on the heat radiation aspect weak point of existing LED lamp, the inventor has designed the utility model " a kind of thermal conductive silicon film of the LED of being used for head light ".
The utility model content
The utility model at above-mentioned the deficiencies in the prior art technical problem to be solved is: the thermal conductive silicon film that is used for the LED head light that a kind of quick heat radiating is provided.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of thermal conductive silicon film that is used for the LED head light comprises a thermal conductive silicon film body, is respectively and shell and the pcb board fixed adhesive face that fits in the upper and lower sides of thermal conductive silicon film body.Lamp is located on the pcb board by pearl.
Described thermal conductive silicon film body shape is a strip.It also can be square or circular or other shapes, and the LED lighting generally all is long narrow, and the thermal conductive silicon film can cut into sizeable strip according to lamp bar length and width.
The thermal conductive silicon film has good pressure-strain performance, only need add point pressure a little, and bigger deformation will take place product, can play good joint filling effect, reduces surperficial thermal contact resistance, has increased passage of heat, improves heat-conducting effect; The thermal conductive silicon film has different thermal conductivitys in addition, is fit to the demand of different heat electronic components of high power; Also have thermal conductive silicon film surface to have natural viscosity, in use can provide certain cementability; And have superior insulating property, can widespread use in electronic devices and components; Also have good snappiness, can cut into various sizes according to client's needs; Also possesses certain shock-absorbing function in addition.
The beneficial effect of the thermal conductive silicon film of a kind of LED of being used for head light of the utility model is:
The thermal conductive silicon film can cut into sizeable strip according to lamp bar length and width, only need during installation the thermal conductive silicon adhesive tape is attached on the pcb board of heating, scatterer is installed on the thermal conductive silicon adhesive tape then or is directly loaded onto the shell of light fixture, so just formed from the pcb board to the heat-conducting silicon rubber again the passage of heat of scatterer or shell.Compare with heat-conducting silicone grease, use the thermal conductive silicon adhesive tape to install, dismantle simply, can not produce secondary pollution.The mode of general heat radiation has convection current, conduction and radiation, and wherein Chuan Dao mode is the simplest, and is that cost is minimum.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is an one-piece construction sectional view of the present utility model.
Description of reference numerals:
1, shell 2, pcb board 3, lamp pearl
4, thermal conductive silicon film
Embodiment
With reference to Fig. 1, the utility model is to implement like this:
In Fig. 1, a kind of thermal conductive silicon film that is used for the LED head light comprises a thermal conductive silicon film body 4, is respectively and shell 1 and the pcb board 2 fixed adhesive face that fits in the upper and lower sides of thermal conductive silicon film body 4.Lamp pearl 3 is located on the pcb board 2.
Thermal conductive silicon film body 4 is shaped as strip.It also can be square or circular or other shapes, and the LED lighting generally all is long narrow, and the thermal conductive silicon film can cut into sizeable strip according to lamp bar length and width.
The above, it only is the preferred embodiment of the thermal conductive silicon film of a kind of LED of being used for head light of the utility model, be not that technical scope of the present utility model is imposed any restrictions, every foundation technical spirit of the present utility model all still belongs in the scope of the utility model technology any trickle modification, equivalent variations and modification that top embodiment did.
Claims (2)
1. thermal conductive silicon film that is used for the LED head light is characterized in that: comprise a thermal conductive silicon film body (4), be respectively and shell (1) and pcb board (2) the fixed adhesive face that fits in the upper and lower sides of thermal conductive silicon film body (4).
2. a kind of thermal conductive silicon film that is used for the LED head light according to claim 1 is characterized in that described thermal conductive silicon film body (4) is shaped as strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200562640U CN202072655U (en) | 2011-03-04 | 2011-03-04 | Heat-conducting silica gel sheet for light-emitting diode (LED) illuminating lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200562640U CN202072655U (en) | 2011-03-04 | 2011-03-04 | Heat-conducting silica gel sheet for light-emitting diode (LED) illuminating lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202072655U true CN202072655U (en) | 2011-12-14 |
Family
ID=45110761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200562640U Expired - Fee Related CN202072655U (en) | 2011-03-04 | 2011-03-04 | Heat-conducting silica gel sheet for light-emitting diode (LED) illuminating lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202072655U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105003868A (en) * | 2015-08-06 | 2015-10-28 | 桂林海威科技有限公司 | LED streetlamp module |
| CN106833404A (en) * | 2016-12-28 | 2017-06-13 | 广东三泰迈高光电科技有限公司 | A kind of LED light bar gum and LED light bar gum coating technique |
-
2011
- 2011-03-04 CN CN2011200562640U patent/CN202072655U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105003868A (en) * | 2015-08-06 | 2015-10-28 | 桂林海威科技有限公司 | LED streetlamp module |
| CN106833404A (en) * | 2016-12-28 | 2017-06-13 | 广东三泰迈高光电科技有限公司 | A kind of LED light bar gum and LED light bar gum coating technique |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111214 Termination date: 20150304 |
|
| EXPY | Termination of patent right or utility model |