CN209447842U

CN209447842U - A kind of high-power LED encapsulation structure

Info

Publication number: CN209447842U
Application number: CN201920593546.0U
Authority: CN
Inventors: 史鹏飞
Original assignee: Zhengzhou Hanwei Au Optronics Co
Current assignee: Zhengzhou Hanwei Au Optronics Co
Priority date: 2019-04-28
Filing date: 2019-04-28
Publication date: 2019-09-27
Anticipated expiration: 2029-04-28

Abstract

The utility model discloses a kind of high-power LED encapsulation structures, including LED packaging plastic, LED luminescence chip, LED metal connecting wire, heat dissipation metal base, graphene radiating base layer and high-temperature-resistant epoxy resin；The upper surface of the graphene radiating base layer is connect with LED luminescence chip, and the lower surface of the graphene radiating base layer is connect with heat dissipation metal substrate surface, and the high-temperature-resistant epoxy resin is used to support heat dissipation metal base substrate；The LED metal connecting wire is connection LED luminescence chip and LED substrate positive and negative anodes；The LED packaging plastic is the entire LED of encapsulating；Fixed LED luminescence chip and LED metal connecting wire.The utility model is using graphene radiating base layer as heat sink body structure, it is graphene coated between heat dissipation metal base interface, it is radiated using the high thermal conductivity of grapheme material, while improving thermal conductivity of material, the heat dissipation effect of LED luminescence chip is improved by improving the swept area of heat source part and heat sink body.

Description

A kind of high-power LED encapsulation structure

Technical field

The utility model relates to a kind of LED encapsulation structures, are related specifically to a kind of high-power LED encapsulation structure.

Background technique

Energy conservation and protection environment are the social concerns of countries in the world today common concern, it directly influences human society Sustainable development.To the Lighting Industry for directly consuming the energy, more wish that the green illumination for realizing low energy consumption, semiconductor green shine The birth in Mingguang City source is known as the revolution of lighting area, and mark is that semiconductor light-emitting-diode (LED) is used as novel light Source progresses into general illumination market from special lighting market, and market prospects are extremely wide.With LED material epitaxy technology and The fast development of chip technology, so that the luminous efficiency of LED improves rapidly, LED will replace conventional light source to become 21 century in future Green illumination light source.

As LED develops to high photosynthetic efficiency, high power, heat dissipation problem is outstanding day by day, and one side power becomes greatly, LED Encapsulating structure also becomes increasingly complex；The volume of another aspect LED is smaller and smaller, is LED component brought by such change The accumulation of heat.When LED component temperature reaches critical point, light output characteristic and the service life of device of LED can have been seriously affected, Therefore it solves LED component heat dissipation problem and becomes particularly important.

Utility model content

Technical problem to be solved by the utility model is: in view of the shortcomings of the prior art, having supplied a kind of novel great power LED Encapsulating structure can be fully solved above-mentioned technical problem.

The technical solution adopted in the utility model are as follows: a kind of high-power LED encapsulation structure, including LED packaging plastic, LED hair Optical chip, LED metal connecting wire, heat dissipation metal base, graphene radiating base layer and high-temperature-resistant epoxy resin；The graphite The upper surface of alkene radiating base layer is connect with LED luminescence chip, the lower surface of the graphene radiating base layer and heat dissipation metal base Layer surface connection, the high-temperature-resistant epoxy resin are used to support heat dissipation metal base substrate；The LED metal connecting wire It is connection LED luminescence chip and LED substrate positive and negative anodes；The LED packaging plastic is the entire LED of encapsulating；Fixed LED luminescence chip With LED metal connecting wire.

Further, the exposed surface of the heat dissipation metal base is coated with one layer of graphene heat radiation coating.

Further, the LED metal connecting wire is gold, silver, copper or other high purity metal conducting wires.

Further, the LED packaging plastic is the mixture of fluorescent powder and transparent adhesive tape, has high refractive index and high light transmission Rate can increase the luminous flux of LED, and viscosity is small, easy deaeration, be suitble to encapsulating and compression molding, make LED have preferable durability and Reliability.

The effective of the utility model generation is: the utility model is using graphene radiating base layer as heat sink body knot Structure, it is graphene coated between heat dissipation metal base interface, it is radiated using the high thermal conductivity of grapheme material, is improving material While expecting heating conduction, the heat dissipation of LED luminescence chip is improved by improving the swept area of heat source part and heat sink body In addition effect spreads rapidly the heat of point through graphene into plane, reduce the temperature of LED luminescence chip, LED device can be improved Part luminous efficiency, reduces the service life.

Detailed description of the invention

Fig. 1 is the schematic diagram of the utility model；

In figure: 1- heat dissipation metal base, 2- graphene radiating base layer, 3- high-temperature-resistant epoxy resin, the connection of 4-LED metal are led Line, 5-LED luminescence chip, 6-LED packaging plastic.

Specific embodiment

The utility model is described in further detail in the following with reference to the drawings and specific embodiments, so that those skilled in the art The utility model can be better understood and can be practiced, but illustrated embodiment is not as the restriction to the utility model.

A kind of graphene LED encapsulation structure shown in the utility model, including LED luminescence chip 5, graphene radiating base layer 1 and heat dissipation metal base 2, the upper surface of graphene radiating base layer 1 connect with LED luminescence chip 5, graphene radiating base layer 1 The connection of 2 upper surface of lower surface metal radiating base layer, high-temperature-resistant epoxy resin is a kind of high temperature resistant engineering PPS resin, for connecting Heat dissipation metal base 2 and graphene radiating base layer 1 are simultaneously located at its both ends；Connecting line 4 is that connecting substrate radiating base layer 2 and LED are sent out Optical chip 5；LED packaging plastic 6 is for fixing LED luminescence chip 5 and LED metal connecting wire 4；In the present embodiment, graphene For the graphene of radiating base layer 1 with a thickness of 1MM, effect is exactly that the heat that LED luminescence chip 5 is radiated timely is transmitted to gold Belong to above radiating base layer 2.Heat dissipation metal base 1 is Copper alloy material；By the advantageous thermal conductivity system of graphene radiating base layer 2 300~400W/mk of number and 100~300W/mk of thermal coefficient of heat dissipation metal base 1, the heat-conducting effect of superelevation can provide height Power or high current LED come using, make LED luminescence chip 5 will not because radiate it is bad caused by light decay, luminous efficiency reduce Deng the facts generate.

The utility model proposes a kind of graphene LED luminescence chip heat-dissipation packaging structure, simple and compact for structure, weight Gently, good insulation preformance, production cost are low, have good heat dissipation performance, and solve the heat dissipation performance of LED luminescence chip, mention The light output characteristic of high LED and the service life of LED component.

The above descriptions are merely preferred embodiments of the present invention, not does to the structure of the utility model any Formal limitation, any simple modification made by the above technical examples according to the technical essence of the present invention are equivalent Variation and modification, in the range of still falling within the technical solution of the utility model.

Claims

1. a kind of high-power LED encapsulation structure, it is characterised in that: including LED packaging plastic, LED luminescence chip, the connection of LED metal Conducting wire, heat dissipation metal base, graphene radiating base layer and high-temperature-resistant epoxy resin；The upper surface of the graphene radiating base layer It is connect with LED luminescence chip, the lower surface of the graphene radiating base layer is connect with heat dissipation metal substrate surface, and described is resistance to High temperature epoxy resins are used to support heat dissipation metal base substrate；The LED metal connecting wire be connection LED luminescence chip and LED substrate positive and negative anodes；The LED packaging plastic is the entire LED of encapsulating；Fixed LED luminescence chip and LED metal connecting wire.

2. a kind of high-power LED encapsulation structure according to claim 1, it is characterised in that: the heat dissipation metal base Exposed surface be coated with one layer of graphene heat radiation coating.

3. a kind of high-power LED encapsulation structure according to claim 1, it is characterised in that: the LED metal connection is led Line is gold, silver, copper or other high purity metal conducting wires.

4. a kind of high-power LED encapsulation structure according to claim 1, it is characterised in that: the LED packaging plastic is glimmering The mixture of light powder and transparent adhesive tape.