WO2016184372A2 - Ensemble source de lumière à del, module d'intégration photoélectrique à del et projecteur à faisceau étroit à del - Google Patents

Ensemble source de lumière à del, module d'intégration photoélectrique à del et projecteur à faisceau étroit à del Download PDF

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Publication number
WO2016184372A2
WO2016184372A2 PCT/CN2016/082172 CN2016082172W WO2016184372A2 WO 2016184372 A2 WO2016184372 A2 WO 2016184372A2 CN 2016082172 W CN2016082172 W CN 2016082172W WO 2016184372 A2 WO2016184372 A2 WO 2016184372A2
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WO
WIPO (PCT)
Prior art keywords
led
heat sink
light source
metal pattern
metal
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PCT/CN2016/082172
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English (en)
Chinese (zh)
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WO2016184372A3 (fr
Inventor
赵依军
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赵依军
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Application filed by 赵依军 filed Critical 赵依军
Publication of WO2016184372A2 publication Critical patent/WO2016184372A2/fr
Publication of WO2016184372A3 publication Critical patent/WO2016184372A3/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
    • F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors

Definitions

  • the basic structure of an LED generally includes a leaded support, a semiconductor wafer disposed on the support, and an encapsulating material (such as a fluorescent silicone or epoxy) that seals the periphery of the wafer.
  • the semiconductor wafer includes a PN structure. When a current passes, electrons are pushed toward the P region. In the P region, electrons recombine with holes, and then emit energy in the form of photons, and the wavelength of the light is formed by the material forming the PN structure. decided.
  • a light source comprising one or more LED dies disposed in the second metal pattern region, the LED dies comprising electrodes formed on the top and interconnected by wires and electrically connected to the first metal pattern region.
  • the LED die is disposed in the second metal pattern region by a COB process.
  • an inner surface of the metal heat sink constitutes a concave mirror, and the light source is located near a focus of the concave mirror.
  • the above LED light source assembly further comprising a lens disposed on a bottom inner surface of the metal heat sink and surrounding the LED die.
  • a metal heat sink having a through hole at a bottom thereof adapted to pass through an output pin of the LED driving power module
  • a light source comprising one or more LED dies disposed on a surface of the flexible printed circuit board.
  • the LED die is disposed on a surface of the flexible printed circuit board in a flip chip process and is connected to the wiring.
  • the LED dies include electrodes formed on the top and are interconnected by wires and connected to the wiring.
  • the flexible printed circuit board is pressed or bonded to the bottom of the metal heat sink.
  • an LED light source assembly includes:
  • the LED dies comprise electrodes formed on the top and are interconnected by leads and connected to the wiring.
  • Another object of the present invention is to provide an LED photoelectric integrated module which has the advantages of simple structure, compactness, and convenient manufacture.
  • an LED optoelectronic integrated module includes:
  • the metal heat sink has an insulating layer and a metal pattern layer formed on the inner surface of the bottom, the metal pattern layer includes a first metal pattern area and a second metal pattern area that are not connected to each other, and the bottom of the metal heat sink is further opened.
  • An LED driving power module disposed under the metal heat sink, an output pin traversing the through hole and soldered to the first pattern region, thereby simultaneously implementing the LED driving power module and the first metal pattern region Electrical connection and rigid connection between.
  • a flexible printed circuit board disposed at a bottom of the metal heat sink and having a surface formed with a wiring
  • a light source comprising one or more LED dies disposed on a surface of the flexible printed circuit board
  • an LED optoelectronic integrated module includes:
  • a heat dissipating disc made of an aluminum substrate material having a through hole at a bottom thereof and a wiring formed on a bottom surface;
  • a light source comprising one or more LED dies disposed on the bottom surface
  • An LED driving power module disposed under the heat sink, an output pin of the output pin traversing the through hole and soldered to the wiring, thereby simultaneously achieving electrical connection and rigidity between the LED driving power module and the heat sink connection.
  • Still another object of the present invention is to provide an LED spotlight which has the advantages of simple structure, compactness, and ease of manufacture.
  • an LED spotlight includes:
  • the LED photoelectric integrated module disposed in the glass lamp cup comprises:
  • the metal heat sink has a shape of the entire side or a portion of the side surface adapted to be in close contact with the inner surface of the glass lamp cup, and an insulating layer and a metal pattern layer are sequentially formed on the inner surface of the bottom portion, and the metal pattern layer includes mutually non-connected a first metal pattern region and a second metal pattern region, wherein a bottom of the metal heat sink is further provided with a through hole;
  • a light source comprising one or more LED dies disposed in the second metal pattern region, the LED dies comprising electrodes formed on top and electrically interconnected by leads and electrically connected to the first metal pattern region; as well as
  • An LED driving power module disposed under the metal heat sink, an output pin traversing the through hole and soldered to the first pattern region, thereby simultaneously implementing the LED driving power module and the first metal pattern region Electrical connection and rigid connection between.
  • the above LED spotlight further comprising a lens disposed at an opening of the glass lamp cup and facing the LED die to convert light emitted by the LED die into a desired shape Directional beam.
  • the lower end of the glass lamp cup has a through hole
  • the LED driving power supply module includes a pair of input pins extending through the through hole to the outside of the glass lamp cup.
  • the LED driving power module comprising a pair of input pins respectively inserted into the respective pins.
  • an LED spotlight includes:
  • the LED photoelectric integrated module disposed in the glass lamp cup comprises:
  • a metal heat sink having a through hole at a bottom thereof
  • a flexible printed circuit board disposed at a bottom of the metal heat sink and having a surface formed with a wiring
  • a light source comprising one or more LED dies disposed on a surface of the flexible printed circuit board
  • an LED spotlight includes:
  • the LED photoelectric integrated module disposed in the glass lamp cup comprises:
  • a heat dissipating disc made of an aluminum substrate material having a through hole at a bottom thereof and a wiring formed on a bottom surface;
  • a light source comprising one or more LED dies disposed on the bottom surface
  • An LED driving power module disposed under the heat sink, an output pin of the output pin traversing the through hole and soldered to the wiring, thereby simultaneously achieving electrical connection and rigidity between the LED driving power module and the heat sink connection.
  • FIG. 1 is a schematic illustration of an LED light source assembly in accordance with one embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of the LED light source assembly of FIG. 1.
  • FIG. 3 shows a schematic view of a lens made of an encapsulating material in the LED light source assembly shown in FIG. 1.
  • FIG. 4 and 5 show schematic views of two lenses that can be employed in the LED light source assembly shown in FIG.
  • FIG. 6 is a schematic diagram of an LED photoelectric integrated module according to another embodiment of the present invention.
  • Figure 7 is an exploded perspective view of an LED spotlight in accordance with another embodiment of the present invention.
  • FIG. 8 is a schematic cross-sectional view of the LED spotlight shown in FIG. 7 after assembly.
  • FIG. 9 is a schematic diagram of an LED light source assembly in accordance with another embodiment of the present invention.
  • Figure 10 is a cross-sectional view of the LED light source assembly of Figure 9.
  • FIG. 11 is a cross-sectional view of an LED light source assembly in accordance with another embodiment of the present invention.
  • FIG. 12 is a schematic diagram of an LED photoelectric integrated module according to another embodiment of the present invention.
  • Figure 13 is an exploded perspective view of an LED spotlight in accordance with another embodiment of the present invention.
  • FIG 14 is a schematic illustration of an LED light source assembly in accordance with another embodiment of the present invention.
  • Figure 15 is a cross-sectional view of the LED light source assembly of Figure 14.
  • Figure 16 is a cross-sectional view showing an LED light source assembly in accordance with another embodiment of the present invention.
  • spotlight should be understood broadly to mean various illumination devices capable of providing a directional beam, including but not limited to, a multi-faceted reflector cup (MR) lamp and a par light dish-shaped aluminum reflection (PAR) lamp, etc. .
  • MR multi-faceted reflector cup
  • PAR par light dish-shaped aluminum reflection
  • semiconductor wafer refers to a plurality of individual single circuits formed on a semiconductor material (eg, silicon, gallium arsenide, etc.), “semiconductor wafer” or “die”, unless otherwise specified. "This is a single circuit, and "packaged chip” refers to the physical structure of a semiconductor wafer after being packaged. In a typical such physical structure, the semiconductor wafer is mounted, for example, on a support and encapsulated with a sealing material.
  • a semiconductor material eg, silicon, gallium arsenide, etc.
  • light emitting diode unit refers to a unit comprising an electroluminescent material, examples of which include, but are not limited to, P-N junction inorganic semiconductor light emitting diodes and organic light emitting diodes (OLEDs and polymer light emitting diodes (PLEDs)).
  • OLEDs organic light emitting diodes
  • PLEDs polymer light emitting diodes
  • the P-N junction inorganic semiconductor light emitting diodes can have different structural forms including, for example, but not limited to, light emitting diode dies and light emitting diode cells.
  • light emitting diode die refers to a semiconductor wafer having a PN structure and having electroluminescence capability
  • light emitting diode cell refers to a physical structure formed by packaging a die, which is typical In a physical configuration, the die is mounted, for example, on a bracket and encapsulated with a sealing material.
  • wiring refers to conductive patterns disposed on an insulating surface for electrical connection between components, including but not limited to traces and holes (eg, pads, Component holes, fastening holes, metallized holes, etc.).
  • traces and holes eg, pads, Component holes, fastening holes, metallized holes, etc.
  • Electrode connection should be understood to include the case where electrical energy or electrical signals are transmitted directly between two units, or where electrical energy or electrical signals are transmitted indirectly via one or more third units.
  • Drive power or “LED drive power” refers to an “electronic control device” between an alternating current (AC) or direct current (DC) power source connected to the outside of the lighting device and a light emitting diode as a light source for providing the light emitting diode
  • the current or voltage required eg constant current, constant voltage or constant power, etc.
  • the driving power source can be implemented in a modular structure, for example, comprising a printed circuit board and one or more components mounted on the printed circuit board and electrically connected together by wiring, examples of which include However, it is not limited to LED driver controller chips, rectifier chips, resistors, capacitors, inductors, and transformers.
  • FIG. 1 is a schematic illustration of an LED light source assembly in accordance with one embodiment of the present invention.
  • 2 is a schematic cross-sectional view of the LED light source assembly of FIG. 1.
  • an LED light source assembly 110 in accordance with the present embodiment includes a metal heat sink 111 and a light source 112, wherein the light source 112 includes a plurality of LED dies 1121 disposed on a metal heat sink.
  • the light source 112 includes a plurality of LED dies 1121 disposed on a metal heat sink.
  • the metal heat sink 111 can be made, for example, of a pure metal such as aluminum and copper or an alloy material.
  • the shape of the entire side or the shape of the side of the metal heat sink matches the shape of the inner surface of the lamp cup (not shown) of the LED spotlight, and when it is assembled into the lamp cup, the entire side or part of the side of the former The inner surface of the latter is closely attached, which significantly improves the heat transfer capability, so that the heat generated by the light source 112 can be conducted to the lamp cup in time.
  • the inner surface of the metal heat sink 111 constitutes a concave mirror, and the light source 112 is located substantially near the focus of the concave mirror, thereby producing a better light collecting effect.
  • the inner surface of the metal heat sink 111 also forms a protrusion of a mesh pattern (for example, a mesh or scale pattern protrusion similar to the inner surface of the lamp cup of a conventional spotlight) to cause light emitted from the metal heat sink 111. More even.
  • a lens can be placed over the LED die 1121, and in particular, such a lens can be formed using an encapsulation material that encapsulates the LED die.
  • the metal heat sink 111 may take the form of a non-concave mirror, in which case a lens may be provided at the opening of the metal heat sink 111 in order to convert the light emitted by the light source 112 into a light beam of a desired shape.
  • the bottom of the metal heat sink 111 is also provided with through holes 1111A and 1111B to allow the output pins of the LED drive power module (not shown) to traverse and be electrically connected to the light source 112, as will be further described below.
  • FIG. 2 The cross-sectional view shown in Fig. 2 is taken along a line parallel to the connection between the through holes 1111A and 1111B. As shown in FIG. 2, an insulating layer 113 and a metal pattern layer 114 are sequentially formed on the inner surface of the bottom of the metal heat sink 111.
  • the insulating layer 113 is overlaid on the entire inner surface of the bottom surface of the metal heat sink 111 as shown in FIG. 2 by, for example, a coating process.
  • the insulating layer 113 is made of a material such as a low thermal resistance insulating material such as an inorganic filler including, but not limited to, a resin.
  • a resin Preferably, sapphire powder or other metal oxide may be added to the resin. More preferably, an anodized film or a diamond film is formed as an insulating layer on the inner surface of the bottom of the metal heat sink 111.
  • the insulating layer 113 is shown covering the entire area of the inner surface of the bottom of the metal heat sink, it may alternatively cover only a partial area (for example, the central area) of the inner surface of the bottom. .
  • the metal pattern layer 114 located above the insulating layer 113 is made of a metal having excellent thermal conductivity, and may be, for example, a pure metal material such as aluminum and copper or an alloy material.
  • a metal pattern layer 114 of a desired pattern can be formed on the insulating layer 113 by an etching process.
  • the metal pattern layer 114 includes first metal pattern regions 1141A, 1141B and a second metal pattern region 1142 located between the first metal pattern regions 1141A, 1141B, wherein the first metal pattern regions 1141A, 1141B
  • the second metal pattern layer 1142 is used to carry the light source 112.
  • the two output pins of the LED drive power module can be soldered to the first metal pattern regions 1141A, 1141B through the vias 1111A and 1111B, respectively.
  • the surface of the second metal pattern region 1142 is treated as a surface having high reflectivity (for example, by forming a mirror surface by plating a high reflectivity metal such as silver or tin or an alloy thereof on the surface), so that the LED die is emitted.
  • the component of the downward propagation in the light is substantially totally reflected back, thereby improving the luminous efficiency.
  • plating such as silver or tin further improves the heat transfer capability between the light source 112 and the metal heat sink 111.
  • the first metal pattern regions 1141A, 1141B are not in communication with each other and with the second metal pattern region 1142.
  • first and second metal pattern regions shown in the figures and the positional relationship therebetween are merely exemplary, and other arrangements are also possible.
  • the number of first metal pattern regions may be increased; for example, the LED dies may be divided into several Group, the LED die sets are respectively disposed in two or more second metal pattern regions; further, the second metal pattern regions are located between the first metal pattern regions
  • the arrangement is not essential, for example, the first metal pattern area may also be arranged on the same side of the second metal pattern area.
  • the light source 112 includes a plurality of LED dies 1121 disposed in the second metal pattern region 1142.
  • the P-type electrode and the N-type electrode of each LED die 1121 are disposed on the upper surface of the die, and the lower surface thereof is fixed to the second metal pattern region 1142 by means of the thermal paste.
  • the heat generated by the LED die 1121 is efficiently transferred to the metal heat sink 111 via the thermal paste, the second metal pattern region 1142, and the insulating layer 113.
  • LED die 1121 achieves interconnection therebetween and connections to first pattern regions 1141A, 1141B via leads 1122, which may be made, for example, of gold, copper, aluminum or alloy materials.
  • the fixing of the LED dies on the second metal pattern region and wire bonding can be achieved, for example, using a COB process.
  • the LED dies 1121 are connected in a hybrid manner between the first pattern regions 1141A, 1141B. It should be noted that other forms of connections such as series, parallel or cross arrays may also be employed between the LED dies. Furthermore, the embodiment shown in Figures 1 and 2 is exemplified by a plurality of LED dies, however it is also possible to use a single LED dies as the illuminating elements.
  • LED dies 1121 and leads 1122 may be encapsulated with a packaging material such as a transparent silicone.
  • phosphors may be mixed in the encapsulating material (including, for example, but not limited to, yttrium aluminum garnet (YAG) phosphors, nitride phosphors, silicate phosphors, and sulfide phosphors, etc.).
  • FIG. 3 shows a schematic view of a lens made of an encapsulating material in the LED light source assembly shown in FIG. 1.
  • an encapsulation material 1123 is disposed on the bottom inner surface of the metal heat sink 111 to enclose the LED die 1121 and the leads 1122, and the outer surface of the encapsulation material has a desired shape (eg, A curved surface having a set curvature to constitute a lens.
  • the phosphor may be mixed in the encapsulating material from which the lens is made.
  • Such a lens made of an encapsulating material can be fabricated using a device such as an LED die top machine.
  • a special lens can be arranged in the LED light source assembly to optimize the outgoing beam distribution and improve the light extraction efficiency.
  • 4 and 5 show schematic views of two lenses that can be employed in the LED light source assembly shown in FIG.
  • the lens 115 has a bowl shape and is The buckle is fastened to the bottom inner surface of the metal heat sink 111 to accommodate the LED die 1121 and the lead 1122 therein.
  • a layer of phosphor 116 can be applied to the inner surface of the lens 115 to obtain light of a desired color temperature. Since both the LED dies and the leads are surrounded by the lens 115, it is considered that the encapsulating material as a protective material is omitted.
  • encapsulation material 1123 may be formed on LED die 1121 and leads 1122, and then the bottom surface of lens 115 is bonded to the layer of encapsulation material.
  • Materials for making the above two lenses include, but are not limited to, glass, polymethyl methacrylate, polycarbonate, and the like.
  • FIG. 6 is an exploded perspective view of an LED photoelectric integrated module according to another embodiment of the present invention.
  • the LED optoelectronic integrated module 10 includes an LED light source assembly 110 and an LED driving power module 120 integrated together. The above various units are further described below.
  • the LED light source assembly 110 can adopt, for example, the structure shown in FIGS. 1-5.
  • the LED driving power supply module 120 adopts a modular structure including a printed circuit board 121 and one or more mounted on the printed circuit board. And components that are electrically connected together by wiring.
  • the LED drive power module 120 is disposed below the metal heat sink 111 and includes a pair of input pins 122A, 122B and a pair of output pins 123A, 123B.
  • the pair of input pins 122A, 122B are adapted to be inserted into a socket (not shown) of the LED spotlight to establish an electrical connection between an external power source (not shown) and the LED drive power module 120.
  • the output pins 123A and 123B respectively pass through the through holes 1111A and 1111B opened in the metal heat sink 111 and are electrically connected to the first metal pattern regions 1141A and 1141B provided at the bottom of the metal heat sink 111, respectively.
  • the output pins 123A and 123B are bent downward after passing through the through holes 1111A and 1111B, thereby being soldered to the first metal pattern regions 1141A and 1141B as the input electrodes of the LED light source assembly 110, respectively. Together, electrical and rigid connections between the LED light source assembly 110 and the LED drive power module 120 are thereby achieved simultaneously.
  • the LED driving power module 120 can adopt various topological architecture circuits, such as, but not limited to, a non-isolated buck topology circuit structure, a flyback topology circuit structure, and a half bridge LLC topology circuit structure.
  • Drive circuit can be driven in multiple ways (For example, constant voltage power supply, constant current power supply, and constant voltage constant current power supply), the LED light source assembly 110 is supplied with a suitable current or voltage.
  • a detailed description of the driving power supply circuit can be found in the book "LED Lighting Driver Power Supply and Luminaire Design", first edition of the People's Posts and Telecommunications Press, May 2011, which is hereby incorporated by reference in its entirety.
  • FIG. 7 is an exploded perspective view of an LED spotlight in accordance with another embodiment of the present invention.
  • FIG. 8 is a schematic cross-sectional view of the LED spotlight shown in FIG. 7 after assembly.
  • the LED spotlight 1 includes an LED optoelectronic integrated module 10, a glass bulb 20 and a cover glass 30.
  • LED optoelectronic integrated module 10 includes an LED optoelectronic integrated module 10, a glass bulb 20 and a cover glass 30.
  • cover glass 30 The above various units are further described below.
  • the glass bulb 20 is funnel shaped, but this is not required.
  • the glass bulb 20 can also take other shapes, such as a straight cylinder and a prismatic shape.
  • a cover plate 30 made of a material having a desired transmittance and insulation covers the upper opening of the glass bulb 20.
  • the LED optoelectronic integrated module 10 is located in a lumen defined by the glass bulb 20 and the cover plate 30.
  • the LED optoelectronic integrated module 10 can adopt, for example, the structure shown in FIG. 6.
  • the heat generated by the LED light source component and the LED driving power module in the module is thermally transmitted to the glass lamp cup 20, and Dissipated into the environment through a glass lamp cup. Since the glass has a high transmittance for infrared radiation, the heat can also be radiated through the lamp cup by means of heat radiation.
  • the cross-sectional view shown in FIG. 8 is taken along a plane perpendicular to the circuit board 121 of the LED drive power module 120.
  • the LED optoelectronic integrated module 10 is disposed in the inner cavity of the glass bulb 20, and the outer surface shape of the metal heat sink 111 and the inner surface of the glass bulb 20 The shape is matched so that the entire side or part of the side of the former is closely attached to the inner surface of the latter, thereby eliminating or reducing the gap between the two, and significantly improving the heat transfer capability.
  • the LED driving power module 120 is disposed under the metal heat sink 111 and located in the inner cavity of the glass bulb 20.
  • an insulating thermal conductive adhesive may be filled between the LED driving power module 120 and the inner wall of the glass bulb 20, which on the one hand helps to transfer the heat of the LED driving power module 120 to the glass bulb 20, and on the other hand The position of the LED drive power module 120 is more stable.
  • the LED light source assembly 110 includes a metal heat sink 111, a flexible printed circuit board 117, and a light source 112, wherein the light source 112 includes a plurality of flexible printed circuit boards 117 disposed, for example, in a flip chip process. Surface LED die 1121.
  • a metal heat sink 111 a flexible printed circuit board 117
  • a light source 112 includes a plurality of flexible printed circuit boards 117 disposed, for example, in a flip chip process.
  • Surface LED die 1121 The above various units are further described below.
  • a lens may be disposed over the LED die 1121, and in particular, may be formed using an encapsulating material encapsulating the LED die. Such a lens.
  • the metal heat sink 111 may take the form of a non-concave mirror, in which case a lens may be provided at the opening of the metal heat sink 111 in order to convert the light emitted by the light source 112 into a light beam of a desired shape.
  • the LED light source assembly 110 can adopt, for example, the structure shown in FIGS. 9 and 10.
  • the LED driving power supply module 120 adopts a modular structure including a printed circuit board 121 and one or more mounted on the printed circuit board. And components that are electrically connected together by wiring.
  • the output pins 123A and 123B are bent downward after passing through the through holes 1111A and 1111B, thereby being soldered to the pads 1171A and 1171B as the input electrodes of the LED light source assembly 110, respectively. This achieves both an electrical connection and a rigid connection between the LED light source assembly 110 and the LED drive power module 120.
  • the heat sink 111' can be made, for example, of an aluminum substrate material.
  • the shape of the entire side of the heat sink or the shape of the side of the portion matches the shape of the inner surface of the lamp cup (not shown) of the LED spotlight.
  • a lens may be disposed over the LED die 1121, and in particular, may be formed using an encapsulating material encapsulating the LED die. Such a lens.
  • a lens may be provided at the opening of the heat sink 111' to convert the light emitted by the light source 112 into a light beam of a desired shape.
  • phosphors may be mixed in the encapsulating material (including, for example, but not limited to, yttrium aluminum garnet (YAG) phosphors, nitride phosphors, silicate phosphors, and sulfide phosphors, etc.).
  • YAG yttrium aluminum garnet
  • nitride phosphors nitride phosphors
  • silicate phosphors silicate phosphors
  • sulfide phosphors etc.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

La présente invention concerne la technologie de l'éclairage à semi-conducteurs. Elle concerne en particulier un ensemble source de lumière à diodes électroluminescentes (DEL), un module d'intégration photoélectrique à DEL et un projecteur à faisceau étroit à DEL comportant le module d'intégration photoélectrique à DEL. L'ensemble source de lumière à DEL comprend une plaque de dissipation de chaleur en métal. Une couche d'isolation et une couche de motif en métal sont formées dans l'ordre sur une surface intérieure d'une partie de fond de la plaque de dissipation de chaleur en métal. La couche de motif en métal comporte des premières zones de motif en métal et une seconde zone de motif en métal qui ne sont pas en communication les unes avec les autres. La partie de fond de la plaque de dissipation de chaleur en métal est également pourvue de trous traversants appropriés pour être traversés par des broches de sortie d'un module de source de courant d'excitation de DEL d'une manière telle que les broches de sortie sont raccordées électriquement aux premières zones de motif en métal. L'ensemble source de lumière à DEL comprend également une source de lumière contenant une ou plusieurs puces de DEL disposées sur la seconde zone de motif en métal. Les puces de DEL contiennent des électrodes formées sur les parties supérieures. Lesdites puces de DEL sont interconnectées et raccordées électriquement aux premières zones de motif en métal par l'intermédiaire de conducteurs.
PCT/CN2016/082172 2015-05-19 2016-05-16 Ensemble source de lumière à del, module d'intégration photoélectrique à del et projecteur à faisceau étroit à del WO2016184372A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510255535.8 2015-05-19
CN201510255535.8A CN106287496A (zh) 2015-05-19 2015-05-19 Led光源组件、led光电一体化模组和led射灯

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WO2016184372A2 true WO2016184372A2 (fr) 2016-11-24
WO2016184372A3 WO2016184372A3 (fr) 2017-02-02

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CN108447854A (zh) * 2018-03-30 2018-08-24 南昌大学 一种led芯片的封装模块及其制备方法

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