WO2013139295A1 - Lampe de type ampoule à diodes électroluminescentes (del) ayant une forte capacité de dissipation thermique et son procédé de fabrication - Google Patents

Lampe de type ampoule à diodes électroluminescentes (del) ayant une forte capacité de dissipation thermique et son procédé de fabrication Download PDF

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Publication number
WO2013139295A1
WO2013139295A1 PCT/CN2013/073033 CN2013073033W WO2013139295A1 WO 2013139295 A1 WO2013139295 A1 WO 2013139295A1 CN 2013073033 W CN2013073033 W CN 2013073033W WO 2013139295 A1 WO2013139295 A1 WO 2013139295A1
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WIPO (PCT)
Prior art keywords
heat sink
metal heat
emitting diode
lamp
light
Prior art date
Application number
PCT/CN2013/073033
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English (en)
Chinese (zh)
Inventor
赵依军
李文雄
Original Assignee
Zhao Yijun
Li Wenxiong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhao Yijun, Li Wenxiong filed Critical Zhao Yijun
Publication of WO2013139295A1 publication Critical patent/WO2013139295A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb

Definitions

  • the present invention relates to semiconductor illumination technology, and more particularly to a bulb-type lamp using a light-emitting diode as a light source and a method of fabricating the same. Background technique
  • LED light-emitting diode
  • An LED is a solid state semiconductor device whose basic structure generally includes a leaded support, a semiconductor wafer disposed on the support, and an encapsulating material (e.g., fluorescent silicone or epoxy) that seals the periphery of the wafer.
  • the semiconductor wafer includes a PN structure. When a current passes, electrons are pushed toward the P region. In the P region, electrons recombine with holes, and then emit energy in the form of photons, and the wavelength of the light is formed by the material forming the PN structure. decided.
  • heat dissipation can generally be improved by increasing the chip size, changing the package structure and materials.
  • heat sink fins made of metal such as aluminum are used as part of the lamp housing to increase heat dissipation by increasing the area exposed to the external environment.
  • Another way to reduce the temperature of the LEDs is based on active cooling.
  • a fan can be installed inside the lamp housing to improve the heat dissipation by accelerating the flow of air on the surface of the radiator.
  • Synjet® Nuventix, Texas, recently developed a technology called Synjet®.
  • the jet the inside of the device includes a diaphragm, and when the diaphragm vibrates, a gas flow is generated inside the device and is rapidly ejected through the nozzle to the radiator.
  • the jetted air stream drives the surrounding air together to reach the heat sink, thereby carrying away the heat of the heat sink with high heat exchange efficiency.
  • SynJet® ejector see, for example, U.S. Patent Application Serial No. 12/288,144, filed on Jan. 16, 2008. This patent application is hereby incorporated by reference in its entirety in its entirety in its entirety in its entirety in its entirety.
  • An object of the present invention is to provide an LED bulb having a relatively high heat dissipation capability.
  • a light-emitting diode bulb comprising:
  • a lamp cap the side wall of which comprises an electrode connection region made of a metal material
  • LED wick which contains:
  • a metal heat sink disposed within the cavity and in contact with the electrode connection region
  • At least one light emitting diode unit disposed on a surface of the substrate; and a driving power source disposed inside the metal heat sink electrically connected to the light emitting diode unit.
  • the metal heat sink is in contact with the electrode connection region of the lamp cap, so that the heat generated by the LED unit and the driving power source is absorbed by the metal heat sink, and the heat is transmitted through the lamp on the one hand.
  • the army is distributed to the environment. On the other hand, it can also be dissipated into the environment via the electrode connection area of the lamp cap, which increases the overall heat dissipation area.
  • the above solution does not need to modify the structure of the lamp cap, so that it can provide an electric interface between the driving power source and the external power source, and also functions as a heat sink, thereby reducing the manufacturing cost.
  • the LED wick is mounted in the lamp army and the lamp holder within a defined space, this layout makes it possible to design LED bulbs with structures similar to those of ordinary incandescent lamps, enabling the application of simple, sophisticated incandescent lamp manufacturing processes to LED lamps.
  • the metal material is a copper-based alloy containing at least one of the following elements: zinc, aluminum, lead, tin, manganese, nickel, iron, and silicon.
  • the above-mentioned copper-based alloy is used for the lamp cap, it is advantageous to improve the corrosion resistance, so that the service life of the lamp cap matches the working life of the LED light source.
  • the substrate is fixed to the top and/or the side of the metal heat sink.
  • the metal heat sink is fixed to a side wall of the base.
  • the region composed of a metal material is an electrode connection region including an internal thread and an outer surface of an end portion of the metal heat sink includes an inner thread adapted to be fitted External thread.
  • the threaded configuration described above allows the metal heat sink to be more tightly bonded to the electrode connection region, thereby reducing the thermal resistance between the two.
  • the inner surface and/or the outer surface of the lamp body is covered with graphite or a room temperature far-infrared ceramic radiation material.
  • the outer surface of the metal heat sink is covered with graphite or a room temperature far-infrared ceramic radiant material.
  • one of the input terminals of the driving power source is electrically connected to the metal heat sink.
  • the above connection structure can eliminate the step of soldering one of the electrodes of the driving power source to the side wall of the lamp cap, and also saves the consumption of the electrode material.
  • the substrate is made of a ceramic material or a heat-conductive insulating polymer composite material.
  • the low price of the ceramic material can drive down the cost.
  • the wiring can be formed by a silver paste sintering process, which can avoid environmental pollution caused by the copper etching process.
  • the light-emitting diode unit is a light-emitting diode unit electrically connected to a wiring formed on a surface of the substrate by soldering.
  • the light-emitting diode unit is a light-emitting diode die that is fixed on a surface of the substrate and is connected to a wiring formed on the surface of the substrate by a bonding process or a board
  • FCOB chip-on-chip
  • the driving power source is electrically connected to the light emitting diode unit via the wiring through a lead drawn from the substrate.
  • the wiring is formed on the surface of the substrate by a printed circuit process.
  • the wiring is such that a plurality of the light-emitting diode units are connected in series, parallel, hybrid or cross-array.
  • Still another object of the present invention is to provide a method of manufacturing the above-described light-emitting diode bulb which has the advantage of a simple manufacturing process.
  • the outer surface of the base is heated to cure the adhesive to secure the base, the lamp, and the LED wick.
  • the outer surface of the base is heated to cure the adhesive to secure the base, the lamp, and the LED wick.
  • the outer surface of the base is heated by a heading machine.
  • the heading machine is a device widely used in the manufacture of ordinary light bulbs, and thus the method of the present embodiment can be realized on an existing bulb production line.
  • the outer surface of the base is heated by a flame or a high temperature gas.
  • the end portion of the metal heat sink is in close contact with the electrode connection region by means of a threaded engagement of the electrode connection region with the end portion of the metal heat sink .
  • the binder is a cement.
  • FIG. 1 is an exploded perspective view of a light emitting diode bulb according to an embodiment of the present invention.
  • 2 is a schematic cross-sectional view of the LED bulb of FIG. 1.
  • FIG 3 is a schematic illustration of a light source module included in the LED bulb of Figures 1 and 2.
  • Fig. 4 is an exploded perspective view of a light emitting diode bulb according to another embodiment of the present invention.
  • Figure 5 is a cross-sectional view of the LED bulb shown in Figure 4.
  • Figure 6 is a flow chart showing a method of fabricating a light-emitting diode bulb according to an embodiment of the present invention.
  • FIG. 7A and 7B show state diagrams when the LED wick is assembled with the lamp cap.
  • FIG. 8 shows a light-emitting diode bulb manufacturing method according to another embodiment of the present invention. Flow chart of the law. List of reference numbers:
  • the term "lighting device” should be understood broadly to mean all devices capable of providing practical or aesthetic effects by providing light, including but not limited to bulbs, table lamps, wall lamps, spotlights, chandeliers, ceiling lamps. , street lights, flashlights, stage set lights and city lights.
  • semiconductor wafer refers to a plurality of individual single circuits formed on a semiconductor material (eg, silicon, gallium arsenide, etc.), "semiconductor wafer” or “die” “refers to such a single circuit, and "packaged chip” refers to a physical structure formed by packaging a semiconductor wafer. In a typical such physical structure, a semiconductor wafer is mounted, for example, on a support and encapsulated with a sealing material.
  • semiconductor material eg, silicon, gallium arsenide, etc.
  • die refers to such a single circuit
  • packaged chip refers to a physical structure formed by packaging a semiconductor wafer. In a typical such physical structure, a semiconductor wafer is mounted, for example, on a support and encapsulated with a sealing material.
  • light emitting diode unit refers to a unit comprising an electroluminescent material, examples of which include, but are not limited to, P-N junction inorganic semiconductor light emitting diodes and organic light emitting diodes (OLEDs and polymer light emitting diodes (PLEDs)).
  • OLEDs organic light emitting diodes
  • PLEDs polymer light emitting diodes
  • the P-N junction inorganic semiconductor light emitting diodes can have different structural forms, such as, but not limited to, light emitting diode dies and light emitting diode cells.
  • light-emitting diode die refers to a semiconductor wafer having a PN structure and having electroluminescence capability
  • light-emitting diode cell refers to a physical structure formed by packaging a die, which is typical In a physical configuration, the die is mounted, for example, on a bracket and encapsulated with a sealing material.
  • wiring refers to conductive patterns disposed on an insulating surface for electrical connection between components, including but not limited to traces and holes (eg pads, Component holes, fastening holes, metallized holes, etc.).
  • traces and holes eg pads, Component holes, fastening holes, metallized holes, etc.
  • thermal radiation refers to the phenomenon that an object radiates electromagnetic waves due to its temperature.
  • the heat generated by the light emitting diode unit and the driving power source can be transmitted to the environment mainly by heat radiation by means of a heat radiating tube which covers the infrared radiant material through the surface.
  • thermal conduction refers to the way heat is transferred from a higher temperature part to a lower temperature part in a solid.
  • ceramic material generally refers to non-metallic inorganic materials that require high temperature treatment or densification, including but not limited to silicates, oxides, carbides, nitrides, sulfides, borides, and the like.
  • thermally conductive insulating polymer composite material refers to a polymer material which has a high thermal conductivity by forming a thermally conductive network chain inside a metal or inorganic filler filled with a high thermal conductivity.
  • the thermally conductive insulating polymer composite material includes, for example, but not limited to, added oxidation Aluminium polypropylene material, polycarbonate added with alumina, silicon carbide and cerium oxide, and acrylonitrile-butadiene-styrene terpolymer.
  • thermally conductive insulating polymer composite material For a detailed description of the thermally conductive insulating polymer composite material, see Li Li et al., "Research on Thermal Conductive and Insulating Polymer Materials for Polycarbonate and Polycarbonate Alloys” (Journal of Materials Heat Treatment, August 2007, Vol. 28, No.4, pp51-54) and Li Shui et al., "Application of Alumina in Thermal Conductive Insulating Polymer Composites"("PlasticAdditives", 2008, No. 3, ppl4-16), full text of these documents The manner of reference is included in this specification.
  • infrared radiation material refers to a material that is engineered to absorb heat and emit a large amount of infrared light, which has a high emissivity.
  • examples of the infrared radiation material include, but are not limited to, graphite and a room temperature infrared ceramic radiation material.
  • the room temperature infrared ceramic radiation material includes, for example but not limited to, at least one of the following materials: magnesium oxide, aluminum oxide, calcium oxide, titanium oxide, silicon oxide, chromium oxide, iron oxide, manganese oxide, zirconium oxide, cerium oxide.
  • cordierite, mullite boron carbide, silicon carbide, titanium carbide, molybdenum carbide, tungsten carbide, zirconium carbide, tantalum carbide, boron nitride, aluminum nitride, silicon nitride, zirconium nitride, titanium nitride, silicidation Titanium, molybdenum silicide, tungsten silicide, titanium boride, zirconium boride and chromium boride.
  • an infrared radiation material below the PN junction temperature of the set LED unit (for example, a temperature value in the range of 50-80 degrees Celsius), infrared
  • the radiant material still has a high emissivity (eg, greater than or equal to 70%).
  • Electrode connection should be understood to include situations where electrical energy or electrical signals are transmitted directly between two units, or where electrical energy or electrical signals are transmitted indirectly via one or more third units.
  • Drive power supply or “LED drive power supply” refers to an “electronic control device” between an alternating current (AC) or direct current (DC) power supply connected to the outside of the lighting device and a light emitting diode as a light source for providing the light emitting diode
  • the current or voltage required eg constant current, constant voltage or constant power, etc.
  • the driving power source can be implemented in a modular structure, such as comprising a printed circuit board and one or more mountings Components that are electrically connected to the board and electrically connected by wiring. Examples of such components include, but are not limited to, LED driver controller chips, rectifier chips, resistors, capacitors, and turns. Additionally, the printed circuit board and components can optionally be mounted in a single housing.
  • FIG. 1 is an exploded perspective view of a light emitting diode bulb according to an embodiment of the present invention.
  • 2 is a schematic cross-sectional view of the LED bulb of FIG. 1.
  • the LED bulb 1 mainly includes a lamp army 10, a lamp cap 20, and a light-emitting diode wick 30.
  • the lamp 10 can be secured to the base 20 to form a cavity that can accommodate the LED wick 30.
  • the lamp army 10 can be made of a transparent or translucent material (such as glass or plastic), and the inner or outer surface can be sanded to make the light softer and more evenly dissipated into the space.
  • a layer of infrared radiation material may be formed on the inner/outer surface of the lamp army 10, for example by electrostatic spraying or vacuum spraying process. The heat dissipation capability of the lamp army 10 is enhanced, and the glare effect of the LED is also suppressed or eliminated.
  • the lamp cap 20 provides an interface for the LED wick 30 to be electrically connected to an external power source such as various DC power sources or AC power sources, for example, a threaded screw interface or a rotary bayonet similar to an ordinary incandescent lamp and an energy saving lamp. form.
  • an external power source such as various DC power sources or AC power sources, for example, a threaded screw interface or a rotary bayonet similar to an ordinary incandescent lamp and an energy saving lamp. form.
  • the end portion 210 of the base 20 is made of a conductive material such as metal, and at least a portion of the side wall 220 is made of a metal material, so that the metal material of the end portion 210 and the side wall 220 can be made.
  • the area serves as an electrode connection area, and the end portion 210 is separated from the metal portion of the side wall 220 by an insulating portion 230 (for example, made of an insulating material such as plastic).
  • a common illumination line generally includes two wires of a live wire and a neutral wire.
  • the end portion 210 and the side wall 220 as electrode connection regions can be passed through electrodes of a lamp holder (not shown). Connect to the live and neutral lines respectively.
  • the metal material for the side wall 220 may be a copper-based alloy containing at least one of the following elements: zinc, aluminum, lead, tin, manganese, nickel, iron, and silicon.
  • the use of the above copper-based alloy can improve the corrosion resistance, so that the service life of the lamp cap is matched with the working life of the light-emitting diode light source, and the above copper-based alloy can also improve the processing performance.
  • the side walls 220 are entirely composed of a metal material.
  • the outer surface of the side wall 220 is provided with a thread. More preferably, the inner surface of the side wall 220 is also threaded to allow the metal heat sink 310 of the LED wick to more closely contact the side wall 220.
  • the LED wick 30 includes a metal heat sink 310, a light source module 320, and a drive power source 330.
  • the metal heat sink 310 of the present embodiment has a tubular shape which is disposed in a cavity defined by the lamp body 10 and the lamp cap 20, and a lower portion 311 thereof is in contact with the side wall 220 of the lamp cap 20.
  • the metal heat sink 310 can be secured to the side wall 220 of the base 20 by means of an adhesive (e.g., glue) to achieve the structure shown in Figure 2.
  • an adhesive e.g., glue
  • threads adapted to the threads on the inner surface of the side walls may be formed on the outer surface of the metal heat sink lower portion 311 to secure the metal heat sink 310 to the base 20.
  • both the adhesive and the threaded connection can be used.
  • the entire outer surface of the metal heat sink 310 may be threaded.
  • the metal heat sink 310 can also take other shapes than tubular, such as, but not limited to, polyhedrons such as prisms and cones.
  • the metal heat sink 310 may be an integrally formed component or may be comprised of a plurality of discrete components that may be assembled, for example, by gluing or bolting.
  • the metal heat sink 310 absorbs the heat generated by the light source module 320 and the driving power source 330. Some of the heat is radiated by the lamp army 10 to the surrounding environment in the form of heat radiation, and a part of the heat is transferred by heat. It is transmitted to the base 20 and then dissipated through the base 20.
  • an infrared radiation material for example, including but not limited to graphite or a room temperature infrared ceramic material, etc.
  • the light source module 320 is disposed on an outer surface of the top 312 of the metal heat sink 310, and includes a substrate 321 and one or more light emitting diode units 322 disposed on the substrate 321 .
  • the top of the metal heat sink 310 shown here 312 is a closed surface, but the top portion thereof may also be open to form an annular surface, the former having a larger contact area between the light source module 320 and the top portion 312 of the metal heat sink 310 than the latter, thereby having a more Good thermal conductivity, but the latter can reduce the weight of the metal heat sink.
  • FIG 3 is a schematic illustration of a light source module included in the LED bulb of Figures 1 and 2.
  • the substrate 321 can be made of an insulating heat conductive material (for example, a ceramic material or a thermally conductive insulating polymer composite material) or an infrared radiation material (for example, silicon carbide) having both insulating and heat conducting properties, or a printed circuit such as an aluminum substrate. Made of sheet material. Referring to Fig. 3, light emitting diode units 322 are disposed on the surface of the substrate 321, and the light emitting diode units 322 are connected together by wirings 323 formed on the surface.
  • a substrate made of a ceramic material can be produced by a die pressing method, and the substrate produced by this method is thick (e.g., 1.5-3 mm) and has a high hardness.
  • the LED units 322 are in the form of a die which are disposed on the surface of the substrate 321 by adhesion to form better heat conduction between the LED unit 322 and the substrate 321 .
  • the wiring 323 on the surface includes a plurality of pads 3231 and traces 3232A and 3232B (for example, by forming a wiring by sintering a silver paste pattern on a ceramic material or an infrared radiation material), and the light emitting diode unit 322 passes through the lead 324 ( For example, gold wire, silver wire or alloy wire) is directly connected to the pad 3231 to form a series of light emitting diodes, and the light emitting diode units at both ends of the light emitting diode group are connected to the wires 3232A and 3232B through the wires 324, and the wires 3232A and 3232B are connected. Then, the wires 325A and 325B passing through the through holes 3211 are connected to the driving power source
  • the light-emitting diode unit 322 may be adhered to the surface of the substrate 321 by epoxy or silica gel mixed with phosphor, or the phosphor layer may be coated on the surface of the light-emitting diode unit 322. It is bonded to the surface of the substrate 321 by means of epoxy or silica gel.
  • the LED unit 322 in the form of a die is directly connected to the wiring 323 by a bonding process
  • the on-board flip chip (FCOB) process can also be utilized.
  • the LED die is electrically connected to the wiring.
  • the LED unit 322 can also be in the form of a single LED.
  • the light emitting diode unit can be electrically connected to the wiring of the substrate surface by soldering.
  • the LED units 322 are connected in series in the embodiment shown in FIG. 3, they may be connected in parallel, hybrid or cross-array.
  • the driving power source 330 can supply a suitable current or voltage to the LED unit 322 in a variety of driving modes such as constant voltage power supply, constant current power supply, and constant voltage constant current power supply. According to the external power supply mode, the driving power source 330 can use circuits of various topologies, including but not limited to non-isolated buck topology circuit structures, flyback topology circuit structures, and half-bridge LLC topology circuit structures. Wait. A detailed description of the drive power circuit can be found in the book "LED Lighting Driver Power Supply and Luminaire Design", First Edition, May 2011, People's Posts and Telecommunications Press, which is hereby incorporated by reference in its entirety.
  • a driving power source 330 is disposed inside the metal heat sink 310.
  • the driving power source 330 can be fixed to the inner wall of the metal heat sink 310 by means of bonding or bolting.
  • the electrical connection between the light source module 320, the driving power source 330 and the lamp cap 20 can be realized by the following single electrode lead structure which will be further described.
  • the metal heat sink 310 is in contact with the side wall 220 of the base 20, so that only one of the input terminals (not shown) of the driving power source 330 is connected to the metal heat sink 310. Electrical connection to the electrode connection region on the side wall 220 and the neutral line of the illumination line can be achieved. At the same time, as shown in Fig. 2, the other input of the drive power source 330 is electrically connected to the live line of the illumination line by means of an electrode lead 331, which extends into the interior of the base 20 and reaches the end 210.
  • the electrical connection between the driving power source 330 and the light source module 320 can also be realized by the structure of the above single electrode lead. Specifically, one of the wires 305A and 305B and one of the output terminals of the driving power source 330 shown in FIG. 3 can be connected to the metal heat sink 310, and the other of the wires 305A and 305B is coupled to the driving power source 330. The other output is connected.
  • the structure of the above single-electrode lead simplifies the electrical connection between the respective units, thereby improving reliability and contributing to reduction in manufacturing cost. It should be noted, however, that the structure of such a single electrode lead is not essential, and for the present embodiment, the structure of the multi-electrode lead is also applicable.
  • the drive power source 330 can include two electrode leads, one of which extends into the interior of the base 20 and contacts the end 210, and the other folds back up against the side wall of the base 20 after extending the metal heat sink 310. 220, thereby achieving an electrical connection to the live and neutral lines of the lighting line.
  • circuits for implementing other functions may also be integrated in the driving power source 330.
  • 4 is an exploded perspective view of a light emitting diode bulb according to another embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view of the LED bulb of FIG. 4.
  • the main difference of this embodiment is the interface form of the lamp cap 20 and the structure of the LED wick 30 as compared with the embodiment shown above with reference to Figs. 1-3.
  • the following focuses on the same aspects as the embodiment shown in Figs. 1-3.
  • the LED bulb 1 also includes a lamp army 10, a lamp cap 20, and a light-emitting diode wick 30.
  • the lamp army 10 can employ the various features described above that are secured to the base 20 to form a cavity that can accommodate the LED wick 10.
  • the base 20 of the present embodiment takes the form of a rotary bayonet similar to a conventional incandescent lamp.
  • the base 20 includes an end portion 210 made of a conductive material such as metal, a side wall 220 made of at least a portion of a metal material, and an insulating portion 230 therebetween, and the metal for the side wall 220
  • the material may be a copper-based alloy containing at least one of the following elements: zinc, aluminum, lead, tin, manganese, nickel, iron, and silicon.
  • two mutually insulated electrode connection regions or solder joints are provided juxtaposed on the end portion 210, which are adapted to be connected to the live and neutral wires, respectively, via electrodes of a socket (not shown).
  • the LED wick 30 includes a metal heat sink 310, a light source module 320, and a drive power source 330.
  • the metal heat sink 310 can be secured to the side wall 220 of the base 20 by a conductive adhesive (e.g., glue), thereby being disposed within the cavity defined by the lamp 10 and the base 20 as shown in FIG.
  • the heat generated by the light source module 320 and the driving power source 330 is dissipated in the following manner: a part of the heat is radiated in the form of heat radiation, and is radiated to the surrounding environment by the lamp army 10, and a part of the heat is transferred by heat. It is transmitted to the base 20 and then dissipated through the base 20.
  • a layer of infrared radiation material may be formed on the inner/outer surface of the lamp army 10, for example, by electrostatic spraying or vacuum spraying, or may be, for example,
  • the infrared radiation material is covered on the outer surface of the metal heat sink by a spraying process (including but not limited to graphite or Normal temperature infrared ceramic materials, etc.).
  • the light source module 320 includes a plurality of sub-modules, each of which includes a substrate 321 and one or more light emitting diode units 322 disposed on the substrate 321 .
  • each sub-module it may for example be a light source module having the various features described above with reference to Figure 3.
  • the light source module is provided on the outer surface of the side of the metal heat sink 310 in addition to the outer surface of the top portion 312 of the metal heat sink 310.
  • the metal heat sink 310 has a prismatic shape and the lower portion 311 has a larger size than the upper portion.
  • the sub-modules of the light source module 320 can be disposed at the top and the side of the metal heat sink 310 at the same time, the light-emitting angle of the light-emitting diode bulb is increased.
  • a driving power source 330 is disposed inside the metal heat sink 310, and includes first and second electrode leads 331A and 331B electrically connected to the two electrode connection regions of the end portion 210 of the lamp cap 20, respectively.
  • the drive power supply of the present embodiment can have various features as described above with reference to Figures 1-3.
  • Figure 6 is a flow chart showing a method of fabricating a light-emitting diode bulb according to an embodiment of the present invention. For convenience of explanation, the present embodiment is described by taking the LED bulb shown in FIG. 1-5 as an example.
  • step S610 the inner surface of the base 20 is covered with an adhesive (e.g., cement).
  • an adhesive e.g., cement
  • This step can be accomplished by means of a typical bulb production apparatus, for example, a cement machine can be used to extrude the cement onto the inner surface of the base 20.
  • an adhesive may also be applied to the outer surface of the lower portion 311 of the metal heat sink 310 of the LED wick 30; or alternatively, the inner surface and the lower portion 311 of the base 20 may be considered.
  • the outer surface is covered with an adhesive.
  • Fig. 7A is a view showing a state in which the LED wick of the embodiment shown in Figs. 1-3 is assembled with the lamp cap.
  • the lower portion 311 of the metal heat sink 110 extends into the interior of the base 20 such that the electrode lead 331 of the driving power source 330 is in contact with the end of the base 20, and the outer surface of the lower portion of the metal heat sink 110 and the base 20 are made.
  • Side wall 220 The inner surface is in contact.
  • the metal heat sink 310 is brought into closer contact with the side wall 220 by means of a threaded engagement between the outer surface of the lower portion 311 of the metal heat sink and the inner surface of the side wall 220.
  • Fig. 7B is a view showing a state in which the LED wick of the embodiment shown in Figs. 4 and 5 is assembled with the lamp cap.
  • the lower portion 311 of the metal heat sink 110 projects into the interior of the base 20 such that the first and second electrode leads 331A and 331B of the drive power source 330 are in contact with the two electrode connection regions of the ends of the base 20, respectively, and the metal heat sink is made
  • the outer surface of the lower portion of the 110 is in contact with the inner surface of the side wall 220 of the base 20.
  • the adhesive used in step S610 can be completely or partially filled in the gap between the base 20 and the metal heat sink 310 because of fluidity.
  • step S620 can also be performed on a typical bulb production line (e.g., an incandescent lamp production line).
  • a typical bulb production line e.g., an incandescent lamp production line.
  • the LED wick 30 can be transported through a conveyor belt to a corresponding assembly station, and the base 20 can be screwed manually or mechanically to the lower portion of the metal heat sink 310 of the LED wick 30.
  • the LED wick 30 can be transported to the corresponding assembly station through the conveyor belt, and the lamp cap 20 is manually or mechanically sheathed to the lower portion 311 of the metal heat sink 310 of the LED wick 30.
  • the assembly operation is not limited to the above one.
  • the LED wick 30 can also be transported to the assembly station through the conveyor belt, and the lower portion 311 of the metal heat sink 310 is manually or mechanically rotated. Enter or insert into the interior of the base 20.
  • the lamp army 10 is assembled with the lamp cap 20 and the LED wick 30.
  • the assembly operation can be accomplished by extending the open end of the lamp 10 into the gap between the base 20 and the metal heat sink 310.
  • the assembly operation of this step can also be done on a typical bulb production line.
  • the lamp cap 20 and the LED wick 30 which are assembled in step S620 can be transported through a conveyor belt to a corresponding assembly station, where the lamp army 10 is manually or mechanically inserted into the gap between the lamp cap 20 and the metal heat sink 310. .
  • step S640 the adhesive in the gap between the lamp cap 20 and the metal heat sink 310 is solidified by heating, and the lamp army 10, the lamp cap 20 and the light-emitting diode wick 30 which complete the assembly operation in step S630 are fixed together, thereby A light-emitting diode bulb 1 as a finished product is produced.
  • Curing of the adhesive can also be accomplished using typical bulb production equipment.
  • the lamp army 10, the lamp cap 20, and the LED wick 30 that complete the assembly operation in step S630 can be transported to the heading machine for sealing the lamp cap and the lamp army in the incandescent lamp production process by using the conveyor belt, where the lamp cap 20 is heated. The outer surface cures the adhesive.
  • FIG. 8 is a flow chart showing a method of fabricating a LED bulb according to another embodiment of the present invention. For the sake of convenience, the present embodiment is also described by taking the LED bulb shown in FIG. 1-5 as an example.
  • the main difference of this embodiment compared to the embodiment shown in Fig. 6 is that the adhesive is applied after the base 20 and the LED wick 30 are assembled together.
  • step S810 the base 20 and the LED wick 30 are assembled by projecting the open end of the lamp 10 into the gap between the base 20 and the metal heat sink 310. Obviously, the assembly operation of step S810 can also be completed on a typical bulb production line.
  • step S820 the adhesive is filled in the gap between the base 20 and the metal heat sink 310 of the LED wick 10.
  • step S830 the lamp army 10 is assembled with the lamp cap 20 and the light-emitting diode wick 30.
  • the open end of the lamp arm 30 is located in the gap between the lamp cap 20 and the metal heat sink 310.
  • the assembling operation of this step can be performed on a typical bulb production line as in the step S630 of the above embodiment.
  • step S840 the adhesive in the gap between the lamp cap 20 and the metal heat sink 310 is solidified by heating, thereby fixing the lamp army 10, the lamp cap 20 and the light-emitting diode wick 30 which are completed in the assembly operation in step S830.
  • the curing of the adhesive can also be carried out using a typical bulb production apparatus as in the step S640 of the above embodiment, and a flame or a high temperature gas can be used as the heating medium.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention porte sur une lampe de type ampoule à diodes électroluminescentes (DEL) et sur son procédé de fabrication. Selon un mode de réalisation du procédé de fabrication, une machine de scellage de ligne ou une machine de scellage d'ouverture est utilisée pour chauffer la partie de contact d'un tube de dissipation de chaleur et d'une extrémité d'ouverture; une machine de pose de tête est utilisée pour chauffer la surface extérieure d'une douille de lampe. La machine de pose de tête, la machine de scellage de ligne et la machine de scellage d'ouverture sont toutes largement utilisées dans le processus de fabrication d'ampoules communes. Par conséquent, le procédé de fabrication peut être utilisé dans une ligne de production d'ampoules existante.
PCT/CN2013/073033 2012-03-22 2013-03-22 Lampe de type ampoule à diodes électroluminescentes (del) ayant une forte capacité de dissipation thermique et son procédé de fabrication WO2013139295A1 (fr)

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CN201210080239.5A CN103322437B (zh) 2012-03-22 2012-03-22 具有强散热能力的发光二极管球泡灯及其制造方法
CN201210080239.5 2012-03-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106499960A (zh) * 2015-09-08 2017-03-15 亿光电子工业股份有限公司 发光二极管照明模块及具有该发光二极管照明模块的灯

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103672507B (zh) * 2013-11-20 2016-08-17 李坤 Led cob石英灯
CN103742802A (zh) * 2013-12-23 2014-04-23 蔡干强 一种led灯泡
CN104075297B (zh) * 2014-07-24 2017-02-08 佛山电器照明股份有限公司 一种led灯泡
CN105202393A (zh) * 2015-10-22 2015-12-30 上海亚浦耳照明电器有限公司 一种led球泡灯及其制备方法
CN107620874A (zh) * 2017-02-24 2018-01-23 江苏厚睦莱照明科技有限公司 一种新型结构led灯
CN107420761A (zh) * 2017-08-30 2017-12-01 重庆舜辉庆驰光电科技有限公司 一种led高效搜救灯
CN109538993A (zh) * 2018-10-24 2019-03-29 浙江鼎鑫工艺品有限公司 一种照明灯
CN110173631A (zh) * 2019-06-03 2019-08-27 史杰 一种光源线路板及低发热led灯泡

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201555042U (zh) * 2009-10-26 2010-08-18 李博 贴片式小功率led灯泡
CN101846253A (zh) * 2010-04-20 2010-09-29 李春宪 Led灯泡
CN201636612U (zh) * 2010-03-23 2010-11-17 福州日光照明电器有限公司 新型高效散热led灯泡
CN201696943U (zh) * 2010-06-24 2011-01-05 上海合复新材料科技有限公司 具有散热装置的led灯
CN201772323U (zh) * 2010-09-11 2011-03-23 陈喜润 节能减排led灯
CN102147070A (zh) * 2011-05-17 2011-08-10 潘宇强 Led灯
CN102159872A (zh) * 2008-09-16 2011-08-17 皇家飞利浦电子股份有限公司 球状led灯和用于生产球状led灯的方法
CN202012759U (zh) * 2010-12-23 2011-10-19 郑州傲世实业有限公司 一种新型led灯

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2536899Y (zh) * 2001-12-12 2003-02-19 陈乾南 多聚点光源发光二极管与灯体的结合构造
DE202004003793U1 (de) * 2004-03-11 2004-05-13 Hella Kg Hueck & Co. Leuchtdiodenanordnung, insbesondere zum Einbau in Fahrzeuge
CN101089461A (zh) * 2007-06-11 2007-12-19 安提亚科技股份有限公司 旋入式发光二极管模块及发光二极管装置
KR100907310B1 (ko) * 2008-06-16 2009-07-09 주식회사 엠에스엠텍 형광등형 엘이디 전등
CN101799152A (zh) * 2010-04-09 2010-08-11 白建国 一种小功率led灯泡的散热头及制造方法
CN202074282U (zh) * 2011-05-05 2011-12-14 邹正康 Led灯泡

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102159872A (zh) * 2008-09-16 2011-08-17 皇家飞利浦电子股份有限公司 球状led灯和用于生产球状led灯的方法
CN201555042U (zh) * 2009-10-26 2010-08-18 李博 贴片式小功率led灯泡
CN201636612U (zh) * 2010-03-23 2010-11-17 福州日光照明电器有限公司 新型高效散热led灯泡
CN101846253A (zh) * 2010-04-20 2010-09-29 李春宪 Led灯泡
CN201696943U (zh) * 2010-06-24 2011-01-05 上海合复新材料科技有限公司 具有散热装置的led灯
CN201772323U (zh) * 2010-09-11 2011-03-23 陈喜润 节能减排led灯
CN202012759U (zh) * 2010-12-23 2011-10-19 郑州傲世实业有限公司 一种新型led灯
CN102147070A (zh) * 2011-05-17 2011-08-10 潘宇强 Led灯

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106499960A (zh) * 2015-09-08 2017-03-15 亿光电子工业股份有限公司 发光二极管照明模块及具有该发光二极管照明模块的灯
EP3141795A1 (fr) * 2015-09-08 2017-03-15 Everlight Electronics Co., Ltd Base monolithique de module d'éclairage à del et lampe comportant celle-ci

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