TW201334227A - 發光模組 - Google Patents
發光模組 Download PDFInfo
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- TW201334227A TW201334227A TW101103507A TW101103507A TW201334227A TW 201334227 A TW201334227 A TW 201334227A TW 101103507 A TW101103507 A TW 101103507A TW 101103507 A TW101103507 A TW 101103507A TW 201334227 A TW201334227 A TW 201334227A
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V19/00—Fastening of light sources or lamp holders
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Abstract
一種發光模組,係包括:一板狀基材,係具有多個晶片承載座突出並設置於板狀基材之上下表面,其中板狀基材之周緣區域設置有多個晶片承載座;兩電路基板,係分別直接疊置於板狀基材之上下表面,其中每一電路基板對應設置多個開口供多個晶片承載座貫穿;以及多個晶片承載座之上表面係同水平或凸出於對應電路基板的表面;至少一個發光二極體晶片,係設置於每一晶片承載座上;多條導線,係電性連接每一發光二極體晶片與對應的電路基板;以及一封裝材料,係分別覆蓋每一發光二極體晶片、每一晶片承載座、多條導線、與部分電路基板。
Description
本發明係有關於一種發光二極體封裝技術,特別是一種利用晶片直接封裝(chip on board,COB)技術製成可應用於發光二極體燈具之發光模組。
發光二極體(light-emitting diodes,LED)因具有壽命長、省電、耐用等特點,故LED照明裝置為綠能環保的趨勢,未來將可廣泛應用。一般高亮度LED燈具多是將發光模組,通常包含數個LED燈泡,直接焊接在一般電路基板或鋁基板上。為了增加散熱效果,會額外設計散熱構件,如於基板下方設置散熱鰭片。然而,除了散熱性問題外,LED燈具多為直向性發光,無法達到如一般現有燈泡可270度發光的效果,因此,如何解決散熱與直向性發光的問題為此技術領域之重要課題。
為了解決上述問題,本發明目的之一係提供一種發光模組,其板狀基材之兩面均設置有多個發光二極體晶片,特別是設置於板狀基材之周緣區域,此發光模組無論直立式發光或橫躺式發光,都可藉由發光二極體晶片位置之設計達到此發光模組270度發光與良好的散熱效果。
為了達到上述目的,本發明一實施例之一種發光模組,係包括:一板狀基材,係具有多個晶片承載座突出並設置於板狀基材之上下表面,其中板狀基材之材質係為高導熱材料且板狀基材之周緣區域設置有多個晶片承載座;兩電路基板,係分別直接疊置於板狀基材之上下表面,其中每一電路基板對應設置多個開口供多個晶片承載座貫穿;以及多個晶片承載座之上表面係同水平或凸出於對應電路基板的表面;至少一個發光二極體晶片,係設置於每一晶片承載座上;多條導線,係電性連接每一發光二極體晶片與對應的電路基板;以及一封裝材料,係分別覆蓋每一發光二極體晶片、每一晶片承載座、多條導線、與部分電路基板。
本發明另一實施例之一種發光模組,係包括:一板狀基材,其中該板狀基材之材質係為高導熱材料;板狀基材之周緣區域係具有多個晶片承載座設置於其上;以及板狀基材之一側或一表面具有一散熱接合部;兩電路基板,係分別直接疊置於板狀基材之上下表面,其中每一電路基板對應設置多個開口暴露出多個晶片承載座;至少一個發光二極體晶片,係設置於每一晶片承載座上;多條導線,係電性連接每一發光二極體晶片與對應的電路基板;一封裝材料,係分別覆蓋每一發光二極體晶片、每一晶片承載座、多條導線、與部分電路基板;以及一散熱件,其中板狀基材藉由散熱接合部與散熱件直立或橫躺接合。
以下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。
其詳細說明如下,所述較佳實施例僅做一說明非用以限定本發明。圖1A與圖1B為本發明一實施例之發光模組的示意圖。圖1B為圖1A中板狀基材與電路基板之俯視示意圖。
於本實施例中,請參照圖1A與圖1B,發光模組包括一板狀基材10。板狀基材10之上下表面均設置多個晶片承載座12,且晶片承載座12係突出於板狀基材10之上下表面。其中,在板狀基材10之周緣區域設置多個晶片承載座12。另外,板狀基材10之上下表面分別各設置一電路基板20直接疊置於其上。電路基板20具有多個開口22對應每一晶片承載座12設置並供其貫穿。於本實施例中,晶片承載座12之上表面係與電路基板20上表面同水平(如圖1A所示)。但可理解的,晶片承載座12之上表面係可以是凸出或高於對應電路基板20之表面(如圖3所示)。
接續上述說明,每一晶片承載座12上均設置至少一LED晶片30於其上。LED晶片30與電路基板20係利用多個導線來電性連接。封裝材料50係分別覆蓋每一LED晶片30、每一晶片承載座12、導線40與部分電路基板10。
熟知該項技術者應能了解,上述一實施例中晶片承載座12之上表面係與電路基板20上表面同水平,然而實際於板狀基材10與電路基板20疊置製作的過程中晶片承載座12之上表面有可能是略為微凹的。本發明的板狀基材係為高導熱材質,例如金屬板。於一實施例中,電路基板20可為印刷電路板。於一實施例中,電路基板20可包含絕緣層、線路層與防焊層所組成。
請同時參照圖1A、圖1B與圖2,於本實施例中板狀基材10之一側具有一散熱接合部14。散熱接合部14可凸出於板狀基材10之一側或是以板狀基材10之一側作為散熱接合部14。板狀基材10可藉由散熱接合部14與一散熱件60直立接合。
於一實施例中,請參照圖5,散熱接合部14可凸出於板狀基材10之一表面用以讓板狀基材10與一散熱件60橫躺接合。可理解的是,本發明之散熱接合部並不限定為突出接合部與散熱件進行接合,散熱接合部亦可為板狀基材之一表面區域,可利用鎖固元件與將散熱接合部與散熱件接合固定。
於本發明中,如圖3與圖5所示,板狀基材10兩面的邊緣均設置有LED晶片30,故可提供如光路B的發光路徑。因此,本發明發光模組無論是直立式發光或橫躺式發光皆可提供如燈泡般270度的發光光路,並不會有一般LED燈具有出光角度限制的問題。當然,於一實施例中,晶片承載座12亦可設置於板狀基材10中間區域或其他非邊緣區域。
繼續,請參照圖4A與圖4B,其中圖4B為圖4A中板狀基材與電路基板之俯視示意圖。於一實施例中,發光模組包括一板狀基材10。於本實施例中,板狀基材10之周緣區域具有多個晶片承載座12於其上,且該板狀基材10之一側具有一散熱接合部14。板狀基材10之上下表面分別各設置一電路基板20直接疊置於其上。電路基板20具有多個開口22暴露出每一晶片承載座12。
接續上述說明,每一晶片承載座12上均設置至少一LED晶片30於其上。LED晶片30與電路基板20係利用多個導線40來電性連接。封裝材料50係分別覆蓋每一LED晶片30、每一晶片承載座12、導線40與部分電路基板20。此外,板狀基材10藉由散熱接合部14與一散熱件60直立接合。又,於一實施例中,請參照圖6,散熱接合部14亦可凸出於板狀基材10之一表面用以讓板狀基材10與一散熱件60橫躺接合。
此外,於一實施例中,部分晶片承載座12亦可設置於板狀基材10之中間區域或非邊緣區域。
於上述實施例中,熟知該項技術領域的人應可了解,晶片承載座12或LED晶片30設置之密度可依照不同光源需求進行設計。於本發明中,發光模組中可將控制晶片整合於其內。如此,發光模組同時具有發光單元與控制單元,可有效減少燈具產品的組裝構件與組裝工序及成本。同時,控制晶片運作亦會產生熱量,熱量累積不散容易降低產品使用壽命。本發明發光模組之散熱效果優良,可同時克服控制晶片散熱問題。請參照圖7與圖8,於不同實施例中,控制晶片32可設置於一控制晶片承載座16上並與電路基板20透過導線40電性連接。其中,控制晶片承載座16可水平(如圖7所示)或突出(如圖8所示)設置於板狀基材10之表面。當然,控制晶片承載座16之上表面可如同晶片承載座12般,同水平或凸出於對應電路基板20的表面。
於本發明中,無論是晶片或是電路基板內線路所產生熱量,板狀基材都能提供良好的直接散熱效果。若額外設置散熱件也能強化散熱效益。於本發明,晶片承載座設置於板狀基材之周緣區域。於不同實施例中,電路基板之開口亦位於板狀基材之周緣區域,此處電路基板開口可為開放性或為封閉式。若為開放式(如圖所示),部分晶片承載座會暴露於電路基板之周緣,因此晶片承載座是否凸出於板狀基材表面均部會影響板狀基材周緣LED晶片之出光角度。若為封閉式(圖上未示),則晶片承載座之上表面最好與對應電路基板之表面同平面或較凸出為佳。
可理解的是,於本發明中,晶片的設置需要黏著固定於晶片承載座,板狀基材與電路基板間隙係電性隔絕的,所使用的材料技術為一般技術者所熟知的,於此不再進一步說明。本發明之散熱件並不侷限於散熱鰭片,而是可透過散熱接合部可與散熱件結合輔助散熱。
另外,可於板狀基材之整個上表面設置一高反射層。此高反射層之材質可為金屬銀或其他高反射率物質。金屬銀可提供相當優良的反射效果並可利用電鍍的方式設置於板狀基材上。
綜合上述,本發明藉由將電路基板直接覆蓋板狀基材之上下表面,換言之電路基板與LED晶片係直接向板狀基材方向散熱。本發明之結構的構件簡單故可簡化製程與使用材料,因此可大幅降低製造與材料的成本。此外,本發明板狀基材之兩面均設置有多個發光二極體晶片於板狀基材之周緣區域,本發明發光方光模組無論是直立式發光或是橫躺式發光均可克服以往發光二極體燈泡只有直向性發光,無法達到一般燈泡可270度發光的缺點。
以上所述之實施例僅係為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。
10...板狀基材
12...晶片承載座
14...散熱接合部
16...控制晶片承載座
20...電路基板
22...開口
30...LED晶片
32...控制晶片
40...導線
50...封裝材料
60...散熱件
B...光路
圖1A與圖1B為本發明一實施例之示意圖。
圖2為本發明一實施例之示意圖。
圖3為本發明一實施例之局部示意圖。
圖4A與圖4B為本發明一實施例之示意圖。
圖5為本發明一實施例之示意圖。
圖6為本發明一實施例之示意圖。
圖7為本發明一實施例之示意圖。
圖8為本發明一實施例之示意圖。
10...板狀基材
12...晶片承載座
14...散熱接合部
20...電路基板
22...開口
30...LED晶片
40...導線
50...封裝材料
Claims (10)
- 一種發光模組,係包含:一板狀基材,係具有多個晶片承載座突出並設置於該板狀基材之上下表面,其中該板狀基材之材質係為高導熱材料且該板狀基材之周緣區域設置有多個該晶片承載座;兩電路基板,係分別直接疊置於該板狀基材之上下表面,其中每一該電路基板對應設置多個開口供該多個晶片承載座貫穿;以及該多個晶片承載座之上表面係同水平或凸出於對應該電路基板的表面;至少一個發光二極體晶片,係設置於每一該晶片承載座上;多條導線,係電性連接每一該發光二極體晶片與對應的該電路基板;以及一封裝材料,係分別覆蓋每一該發光二極體晶片、每一該晶片承載座、該多條導線、與部分該電路基板。
- 如請求項1所述之發光模組,其中該板狀基材之一側具有一散熱接合部。
- 如請求項2所述之發光模組,更包含一散熱件,其中該板狀基材藉由該散熱接合部與該散熱件直立接合。
- 如請求項1所述之發光模組,其中該板狀基材之一表面具有一散熱接合部。
- 如請求項4所述之發光模組,更包含一散熱件,其中該板狀基材藉由該散熱接合部與該散熱件橫躺接合。
- 如請求項1所述之發光模組,其中多個該晶片承載座設置於該板狀基材之中間區域。
- 如請求項1所述之發光模組,更包含一控制晶片設置於一控制晶片承載座上並與該電路基板電性連接,其中該控制晶片承載座可水平或突出設置於該板狀基材之表面。
- 一種發光模組,係包含:一板狀基材,其中該板狀基材之材質係為高導熱材料;該板狀基材之周緣區域係具有多個晶片承載座設置於其上;以及該板狀基材之一側或一表面具有一散熱接合部;兩電路基板,係分別直接疊置於該板狀基材之上下表面,其中每一該電路基板對應設置多個開口暴露出該多個晶片承載座;至少一個發光二極體晶片,係設置於每一該晶片承載座上;多條導線,係電性連接每一該發光二極體晶片與對應的該電路基板;一封裝材料,係分別覆蓋每一該發光二極體晶片、每一該晶片承載座、該多條導線、與部分該電路基板;以及一散熱件,其中該板狀基材藉由該散熱接合部與該散熱件直立接合或橫躺接合。
- 如請求項8所述之發光模組,其中部分該多個晶片承載座設置於該板狀基材之中間區域。
- 如請求項8所述之發光模組,更包含一控制晶片設置於一控制晶片承載座上並與該電路基板電性連接,其中該控制晶片承載座可水平或突出設置於該板狀基材之表面。
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US13/752,937 US20130200402A1 (en) | 2012-02-03 | 2013-01-29 | Light-emitting module |
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US9964258B2 (en) | 2015-12-02 | 2018-05-08 | Feit Electric Company, Inc. | Light emitting diode (LED) lighting device |
US10480752B2 (en) | 2016-02-27 | 2019-11-19 | Svv Technology Innovations, Inc. | Structurally reinforced illumination panels and a method of making the same |
CN106287258A (zh) * | 2016-09-26 | 2017-01-04 | 苏州圣咏电子科技有限公司 | 一种发光模块及具有该发光模块的灯具 |
DE102018109225B4 (de) * | 2018-04-18 | 2019-11-28 | Ledvance Gmbh | LED-Modul, LED-Leuchtmittel, LED-Lampe und LED-Leuchte |
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