CN106287258A - 一种发光模块及具有该发光模块的灯具 - Google Patents
一种发光模块及具有该发光模块的灯具 Download PDFInfo
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
- F21V23/026—Fastening of transformers or ballasts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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Abstract
本发明提供了一种发光模块,所述发光模块包括印刷有电路的导热基板、与所述导热基板电性连接的若干倒装LED芯片、焊接在所述导热基板上并与所述倒装LED芯片电性连接的前置电源、以及与所述前置电源电性连接的快拆接连接器插头。本发明的发光模块及具有该发光模块的灯具,可以防止热量积聚,减缓前置电源零部件老化从而方便更换发光模块和壳体,所述灯具使用方便、寿命长、成本低廉。
Description
技术领域
本发明涉及一种发光模块及具有该发光模块的灯具。
背景技术
现有灯具在壳体内设置有用以将交流电转换为直流电的前置电源,将带有LED芯片的导热基板直接与前置电源的电极进行焊接即可实现对LED芯片的供电。然而这样的前置电源热量难以散发,从而使得前置电源加速老化。另外,现有灯具最容易损坏的部分即前置电源,前置电源损坏往往造成灯具的整体报废,从而造成灯具的壳体浪费。
有鉴于此,有必要对现有的发光模块及灯具予以改进,以解决上述问题。
发明内容
本发明的目的在于提供一种发光模块及具有该发光模块的灯具,以解决现有灯具内前置电源热量难以散发从而加速前置电源老化的问题。
为实现上述目的,本发明提供了一种发光模块,所述发光模块包括印刷有电路的导热基板、与所述导热基板电性连接的若干倒装LED芯片、焊接在所述导热基板上并与所述倒装LED芯片电性连接的前置电源、以及与所述前置电源电性连接的快拆接连接器插头。
作为本发明的进一步改进,所述导热基板的两侧涂覆有绝缘层。
作为本发明的进一步改进,所述前置电源包括晶片式电容、晶片式电阻、恒流驱动芯片、桥式整流器及正温热敏电阻。
作为本发明的进一步改进,若干所述倒装LED芯片设置在所述导热基板的同一侧,所述晶片式电容、晶片式电阻、恒流驱动芯片、桥式整流器及正温热敏电阻选择性设置在所述导热基板的任意一侧。
作为本发明的进一步改进, 若干所述倒装LED芯片设置在所述导热基板的一侧,所述晶片式电容、晶片式电阻、恒流驱动芯片、桥式整流器及正温热敏电阻均设置在所述导热基板的另一侧。
作为本发明的进一步改进,所述绝缘层的材料为玻璃铀、BT和绝缘白油其中的一种或几种混合。
作为本发明的进一步改进,所述导热基板为铝金属基板、不锈钢金属基板、氧化铝陶瓷基板、氮化铝陶瓷基板或陶瓷覆膜之金属基板中的一种。
本发明还提供一种灯具,所述灯具包括壳体和上述的发光模块,所述壳体上设有用以与所述快拆接连接器插头电性连接的快拆接连接器插座,所述快拆接连接器插座用以连接外接电源。
本发明的有益效果是:本发明的发光模块及具有该发光模块的灯具,通过将所述前置电源设置在所述导热基板上,从而防止热量积聚,减缓前置电源零部件老化;通过在所述发光模块上设置快拆接连接器插头与在所述壳体上的快拆接连接器插座配合,从而方便更换发光模块和壳体。本发明的发光模块及具有该发光模块的灯具,使用方便、寿命长、成本低廉。
附图说明
图1是本发明灯具的结构示意图。
具体实施方式
为了使本发明的目的、技术方案和优点更加清楚,下面结合附图和具体实施例对本发明进行详细描述。
如图1所示,本发明的灯具100包括壳体(未图示)和发光模块2。
所述壳体上设有快拆接连接器插座11,所述快拆接连接器插座11用以连接外接电源200。
所述发光模块2包括导热基板21、用以给所述导热基板21散热的散热片(未图示)、与所述导热基板21电性连接的若干倒装LED芯片23、焊接在所述导热基板21上并与所述倒装LED芯片23电性连接的前置电源24、以及与所述前置电源24电性连接的快拆接连接器插头25。
所述导热基板21上印刷有电路,并在两侧涂覆有绝缘层26。
所述导热基板21为铝金属基板、不锈钢金属基板、氧化铝陶瓷基板、氮化铝陶瓷基板或陶瓷覆膜之金属基板中的一种。
所述绝缘层26的材料为玻璃铀、BT(BT树脂基板材料)和绝缘白油其中的一种或几种混合。
本发明中,发光芯片选择倒装LED芯片23。倒装LED芯片23相较正装LED芯片具有亮度大、电流分布均匀、耐高温高湿、抗氧化能力强、材料成本低等优势。若干所述倒装LED芯片23设置在所述导热基板21的同一侧。
所述前置电源24包括晶片式电容241、晶片式电阻242、恒流驱动芯片243、桥式整流器244及正温热敏电阻245。
所述前置电源24集整流、变压、稳压的作用于一身。本发明中,直接将所述前置电源24全部焊接在所述导热基板21上,从而所述灯具100工作时,所述前置电源24产生的热量传递到所述导热基板21并进一步传递到所述散热片以导出。如此,可以防止热量积聚、减缓前置电源24零部件老化,同时可以缩小灯具100体积。
所述晶片式电容241、晶片式电阻242、恒流驱动芯片243、桥式整流器244及正温热敏电阻245选择性设置在所述导热基板21的任意一侧。本实施例中,所述晶片式电容241、晶片式电阻242、恒流驱动芯片243、桥式整流器244及正温热敏电阻245均设置在所述导热基板21上与若干所述倒装LED芯片23相对的一侧。
所述导热基板21上的所述快拆接连接器插头25可以与所述壳体上的快拆接连接器插座11插接配合。从而,用户在需要更换壳体或者所述发光模块2时,不必解焊和焊接,直接插拔即可。如此设置,一方面在所述发光模块2损坏时可以直接更换发光模块2,减少壳体的浪费,另一方面,用户在根据喜好更换壳体时,可以不必更换发光模块2,方便使用且节约成本。
本发明的发光模块2及具有该发光模块2的灯具100,通过将所述前置电源24设置在所述导热基板21上,从而防止热量积聚,减缓前置电源24零部件老化;通过在所述发光模块2上设置快拆接连接器插头25与在所述壳体上的快拆接连接器插座11配合,从而方便更换发光模块2和壳体。本发明的发光模块2及具有该发光模块2的灯具100,使用方便、寿命长、成本低廉。
以上实施例仅用以说明本发明的技术方案而非限制,尽管参照较佳实施例对本发明进行了详细说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的精神和范围。
Claims (8)
1.一种发光模块,其特征在于:所述发光模块包括印刷有电路的导热基板、与所述导热基板电性连接的若干倒装LED芯片、焊接在所述导热基板上并与所述倒装LED芯片电性连接的前置电源、以及与所述前置电源电性连接的快拆接连接器插头。
2.根据权利要求1所述的发光模块,其特征在于:所述导热基板的两侧涂覆有绝缘层。
3.根据权利要求1所述的发光模块,其特征在于:所述前置电源包括晶片式电容、晶片式电阻、恒流驱动芯片、桥式整流器及正温热敏电阻。
4.根据权利要求3所述的发光模块,其特征在于:若干所述倒装LED芯片设置在所述导热基板的同一侧,所述晶片式电容、晶片式电阻、恒流驱动芯片、桥式整流器及正温热敏电阻选择性设置在所述导热基板的任意一侧。
5.根据权利要求4所述的发光模块,其特征在于: 若干所述倒装LED芯片设置在所述导热基板的一侧,所述晶片式电容、晶片式电阻、恒流驱动芯片、桥式整流器及正温热敏电阻均设置在所述导热基板的另一侧。
6.根据权利要求1所述的发光模块,其特征在于:所述绝缘层的材料为玻璃铀、BT和绝缘白油其中的一种或几种混合。
7.根据权利要求1所述的发光模块,其特征在于:所述导热基板为铝金属基板、不锈钢金属基板、氧化铝陶瓷基板、氮化铝陶瓷基板或陶瓷覆膜之金属基板中的一种。
8.一种灯具,其特征在于:所述灯具包括壳体和如权利要求1-7任意一项所述的发光模块,所述壳体上设有用以与所述快拆接连接器插头电性连接的快拆接连接器插座,所述快拆接连接器插座用以连接外接电源。
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CN103104828A (zh) * | 2011-11-11 | 2013-05-15 | 赵依军 | 发光二极管灯芯和采用发光二极管作为光源的照明装置 |
CN103247738A (zh) * | 2012-02-03 | 2013-08-14 | 顾淑梅 | 发光模块 |
CN103528010A (zh) * | 2013-09-22 | 2014-01-22 | 上海俪德照明科技股份有限公司 | 一种led光电模组 |
CN105351777A (zh) * | 2015-12-03 | 2016-02-24 | 漳州立达信光电子科技有限公司 | Led灯一体式电连接结构 |
US20160138763A1 (en) * | 2014-11-13 | 2016-05-19 | Yuan-Chou LIU | Led lamp |
CN206130563U (zh) * | 2016-09-26 | 2017-04-26 | 苏州圣咏电子科技有限公司 | 一种发光模块及具有该发光模块的灯具 |
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Patent Citations (6)
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CN103104828A (zh) * | 2011-11-11 | 2013-05-15 | 赵依军 | 发光二极管灯芯和采用发光二极管作为光源的照明装置 |
CN103247738A (zh) * | 2012-02-03 | 2013-08-14 | 顾淑梅 | 发光模块 |
CN103528010A (zh) * | 2013-09-22 | 2014-01-22 | 上海俪德照明科技股份有限公司 | 一种led光电模组 |
US20160138763A1 (en) * | 2014-11-13 | 2016-05-19 | Yuan-Chou LIU | Led lamp |
CN105351777A (zh) * | 2015-12-03 | 2016-02-24 | 漳州立达信光电子科技有限公司 | Led灯一体式电连接结构 |
CN206130563U (zh) * | 2016-09-26 | 2017-04-26 | 苏州圣咏电子科技有限公司 | 一种发光模块及具有该发光模块的灯具 |
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