CN103247738A - 发光模块 - Google Patents

发光模块 Download PDF

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CN103247738A
CN103247738A CN2013100011355A CN201310001135A CN103247738A CN 103247738 A CN103247738 A CN 103247738A CN 2013100011355 A CN2013100011355 A CN 2013100011355A CN 201310001135 A CN201310001135 A CN 201310001135A CN 103247738 A CN103247738 A CN 103247738A
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light emitting
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杨政道
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Abstract

本发明提供一种发光模块，包括：一板状基材，具有多个芯片承载座突出并设置于板状基材之上下表面，其中板状基材之周缘区域设置有多个芯片承载座；两电路基板，分别直接迭置于板状基材之上下表面，其中每一电路基板对应设置多个开口供多个芯片承载座贯穿；以及多个芯片承载座之上表面的同水平或凸出于对应电路基板的表面；至少一个发光二极管芯片，设置于每一芯片承载座上；多条导线，电性连接每一发光二极管芯片与对应的电路基板；以及一封装材料，分别覆盖每一发光二极管芯片、每一芯片承载座、多条导线、与部分电路基板。

Description

发光模块
技术领域
本发明有关于一种发光二极管封装技术，特别是一种利用芯片直接封装(chip on board，COB)技术制成可应用于发光二极管灯具之发光模块。
背景技术
发光二极管（light-emitting diodes，LED）因具有寿命长、省电、耐用等特点，故LED照明装置为绿能环保的趋势，未来将可广泛应用。一般高亮度LED灯具多是将发光模块，通常包含数个LED灯泡，直接焊接在一般电路基板或铝基板上。为了增加散热效果，会额外设计散热构件，如于基板下方设置散热鳍片。然而，除了散热性问题外，LED灯具多为直向性发光，无法达到如一般现有灯泡可270度发光的效果，因此，如何解决散热与直向性发光的问题为此技术领域之重要课题。
发明内容
为了解决上述问题，本发明目的之一为提供一种发光模块，其板状基材之两面均设置有多个发光二极管芯片，特别是设置于板状基材之周缘区域，此发光模块无论直立式发光或横躺式发光，都可通过发光二极管芯片位置之设计达到此发光模块270度发光与良好的散热效果。
为了达到上述目的，本发明一实施例之一种发光模块，包括：一板状基材，具有多个芯片承载座突出并设置于板状基材之上下表面，其中板状基材的材质为高导热材料且板状基材之周缘区域设置有多个芯片承载座；两电路基板，分别直接迭置于板状基材之上下表面，其中每一电路基板对应设置多个开口供多个芯片承载座贯穿；以及多个芯片承载座之上表面同水平或凸出于对应电路基板的表面；至少一个发光二极管芯片，设置于每一芯片承载座上；多条导线，电性连接每一发光二极管芯片与对应的电路基板；以及一封装材料，分别覆盖每一发光二极管芯片、每一芯片承载座、多条导线、与部分电路基板。
本发明另一实施例的一种发光模块，包括：一板状基材，其中该板状基材的材质为高导热材料；板状基材之周缘区域具有多个芯片承载座设置于其上；以及板状基材之一侧或一表面具有一散热接合部；两电路基板，分别直接迭置于板状基材之上下表面，其中每一电路基板对应设置多个开口暴露出多个芯片承载座；至少一个发光二极管芯片，设置于每一芯片承载座上；多条导线，电性连接每一发光二极管芯片与对应的电路基板；一封装材料，分别覆盖每一发光二极管芯片、每一芯片承载座、多条导线、与部分电路基板；以及一散热件，其中板状基材通过散热接合部与散热件直立或横躺接合。
以下通过具体实施例配合所附的图式详加说明，当更容易了解本发明之目的、技术内容、特点及其所达成之功效。
附图说明
图1A与图1B为本发明一实施例之示意图。
图2为本发明一实施例之示意图。
图3为本发明一实施例之局部示意图。
图4A与图4B为本发明一实施例之示意图。
图5为本发明一实施例之示意图。
图6为本发明一实施例之示意图。
图7为本发明一实施例之示意图。
图8为本发明一实施例之示意图。
图中主要组件符号说明：
10    板状基材
12    芯片承载座
14    散热接合部
16    控制芯片承载座
20    电路基板
22    开口
30    LED芯片
32    控制芯片
40    导线
50    封装材料
60    散热件
B     光路
具体实施方式
其详细说明如下，所述较佳实施例仅做一说明非用以限定本发明。图1A与图1B为本发明一实施例之发光模块的示意图。图1B为图1A中板状基材与电路基板之俯视示意图。
于本实施例中，请参照图1A与图1B，发光模块包括一板状基材10。板状基材10之上下表面均设置多个芯片承载座12，且芯片承载座12突出于板状基材10之上下表面。其中，在板状基材10之周缘区域设置多个芯片承载座12。另外，板状基材10之上下表面分别各设置一电路基板20直接迭置于其上。电路基板20具有多个开口22对应每一芯片承载座12设置并供其贯穿。于本实施例中，芯片承载座12之上表面与电路基板20上表面同水平(如图1A所示)。但可理解的，芯片承载座12之上表面可以是凸出或高于对应电路基板20的表面(如图3所示)。
接续上述说明，每一芯片承载座12上均设置至少一LED芯片30于其上。LED芯片30与电路基板20利用多个导线来电性连接。封装材料50分别覆盖每一LED芯片30、每一芯片承载座12、导线40与部分电路基板10。
熟知该项技术者应能了解，上述一实施例中芯片承载座12之上表面与电路基板20上表面同水平，然而实际于板状基材10与电路基板20迭置制作的过程中，芯片承载座12之上表面有可能是略为微凹的。本发明的板状基材为高导热材质，例如金属板。于一实施例中，电路基板20可为印刷电路板。于一实施例中，电路基板20可包含绝缘层、线路层与防焊层所组成。
请同时参照图1A、图1B与图2，于本实施例中板状基材10之一侧具有一散热接合部14。散热接合部14可凸出于板状基材10之一侧或是以板状基材10之一侧作为散热接合部14。板状基材10可通过散热接合部14与一散热件60直立接合。
于一实施例中，请参照图5，散热接合部14可凸出于板状基材10之一表面用以让板状基材10与一散热件60横躺接合。可理解的是，本发明之散热接合部并不限定为突出接合部与散热件进行接合，散热接合部亦可为板状基材之一表面区域，可利用锁固组件与将散热接合部与散热件接合固定。
于本发明中，如图3与图5所示，板状基材10两面的边缘均设置有LED芯片30，故可提供如光路B的发光路径。因此，本发明发光模块无论是直立式发光或横躺式发光皆可提供如灯泡般270度的发光光路，并不会有一般LED灯具有出光角度限制的问题。当然，于一实施例中，芯片承载座12亦可设置于板状基材10中间区域或其它非边缘区域。
继续，请参照图4A与图4B，其中图4B为图4A中板状基材与电路基板之俯视示意图。于一实施例中，发光模块包括一板状基材10。于本实施例中，板状基材10之周缘区域具有多个芯片承载座12于其上，且该板状基材10之一侧具有一散热接合部14。板状基材10之上下表面分别各设置一电路基板20直接迭置于其上。电路基板20具有多个开口22暴露出每一芯片承载座12。
接续上述说明，每一芯片承载座12上均设置至少一LED芯片30于其上。LED芯片30与电路基板20利用多个导线40来电性连接。封装材料50分别覆盖每一LED芯片30、每一芯片承载座12、导线40与部分电路基板20。此外，板状基材10通过散热接合部14与一散热件60直立接合。又，于一实施例中，请参照图6，散热接合部14亦可凸出于板状基材10之一表面用以让板状基材10与一散热件60横躺接合。
此外，于一实施例中，部分芯片承载座12亦可设置于板状基材10之中间区域或非边缘区域。
于上述实施例中，熟知该项技术领域的人应可了解，芯片承载座12或LED芯片30设置之密度可依照不同光源需求进行设计。于本发明中，发光模块中可将控制芯片整合于其内。如此，发光模块同时具有发光单元与控制单元，可有效减少灯具产品的组装构件与组装工序及成本。同时，控制芯片运作亦会产生热量，热量累积不散容易降低产品使用寿命。本发明发光模块之散热效果优良，可同时克服控制芯片散热问题。请参照图7与图8，于不同实施例中，控制芯片32可设置于一控制芯片承载座16上并与电路基板20透过导线40电性连接。其中，控制芯片承载座16可水平(如图7所示)或突出(如图8所示)设置于板状基材10的表面。当然，控制芯片承载座16之上表面可如同芯片承载座12般，同水平或凸出于对应电路基板20的表面。
于本发明中，无论是芯片或是电路基板内线路所产生热量，板状基材都能提供良好的直接散热效果。若额外设置散热件也能强化散热效益。于本发明，芯片承载座设置于板状基材之周缘区域。于不同实施例中，电路基板之开口亦位于板状基材之周缘区域，此处电路基板开口可为开放性或为封闭式。若为开放式(如图所示)，部分芯片承载座会暴露于电路基板之周缘，因此芯片承载座是否凸出于板状基材表面均部会影响板状基材周缘LED芯片之出光角度。若为封闭式(图上未示)，则芯片承载座之上表面最好与对应电路基板的表面同平面或较凸出为佳。
可理解的是，于本发明中，芯片的设置需要黏着固定于芯片承载座，板状基材与电路基板间隙为电性隔绝的，所使用的材料技术为一般技术者所熟知的，于此不再进一步说明。本发明之散热件并不局限于散热鳍片，而是可透过散热接合部可与散热件结合辅助散热。
另外，可于板状基材之整个上表面设置一高反射层。此高反射层的材质可为金属银或其它高反射率物质。金属银可提供相当优良的反射效果并可利用电镀的方式设置于板状基材上。
综合上述，本发明通过将电路基板直接覆盖板状基材之上下表面，换言之电路基板与LED芯片直接向板状基材方向散热。本发明之结构的构件简单故可简化工艺制程与使用材料，因此可大幅降低制造与材料的成本。此外，本发明板状基材之两面均设置有多个发光二极管芯片于板状基材之周缘区域，本发明发光方光模块无论是直立式发光或是横躺式发光均可克服以往发光二极管灯泡只有直向性发光，无法达到一般灯泡可270度发光的缺点。
以上所述的实施例仅为说明本发明之技术思想及特点，其目的在使熟习此项技艺之人士能够了解本发明之内容并据以实施，当不能以之限定本发明之专利范围，即大凡依本发明所揭示之精神所作之均等变化或修饰，仍应涵盖在本发明之专利范围内。

Claims (10)

1.一种发光模块，其特征是，包含：
一板状基材，具有多个芯片承载座突出并设置于该板状基材之上下表面，其中该板状基材的材质为高导热材料且该板状基材之周缘区域设置有多个该芯片承载座；
两电路基板，分别直接迭置于该板状基材之上下表面，其中每一该电路基板对应设置多个开口供该多个芯片承载座贯穿；以及该多个芯片承载座之上表面同水平或凸出于对应该电路基板的表面；
至少一个发光二极管芯片，设置于每一该芯片承载座上；
多条导线，电性连接每一该发光二极管芯片与对应的该电路基板；以及
一封装材料，分别覆盖每一该发光二极管芯片、每一该芯片承载座、该多条导线、与部分该电路基板。
2.如权利要求1所述的发光模块，其特征是，该板状基材之一侧具有一散热接合部。
3.如权利要求2所述的发光模块，其特征是，更包含一散热件，其中该板状基材通过该散热接合部与该散热件直立接合。
4.如权利要求1所述的发光模块，其特征是，该板状基材之一表面具有一散热接合部。
5.如权利要求4所述的发光模块，其特征是，更包含一散热件，其中该板状基材通过该散热接合部与该散热件横躺接合。
6.如权利要求1所述的发光模块，其特征是，多个该芯片承载座设置于该板状基材之中间区域。
7.如权利要求1所述的发光模块，其特征是，更包含一控制芯片设置于一控制芯片承载座上并与该电路基板电性连接，其中该控制芯片承载座可水平或突出设置于该板状基材的表面。
8.一种发光模块，其特征是，包含：
一板状基材，其中该板状基材的材质为高导热材料；该板状基材之周缘区域具有多个芯片承载座设置于其上；以及该板状基材之一侧或一表面具有一散热接合部；
两电路基板，分别直接迭置于该板状基材之上下表面，其中每一该电路基板对应设置多个开口暴露出该多个芯片承载座；
至少一个发光二极管芯片，设置于每一该芯片承载座上；
多条导线，电性连接每一该发光二极管芯片与对应的该电路基板；
一封装材料，分别覆盖每一该发光二极管芯片、每一该芯片承载座、该多条导线、与部分该电路基板；以及
一散热件，其中该板状基材通过该散热接合部与该散热件直立接合或横躺接合。
9.如权利要求8所述的发光模块，其特征是，部分该多个芯片承载座设置于该板状基材之中间区域。
10.如权利要求8所述的发光模块，其特征是，更包含一控制芯片设置于一控制芯片承载座上并与该电路基板电性连接，其中该控制芯片承载座可水平或突出设置于该板状基材的表面。
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