JP2005285874A - 発光素子収納用パッケージおよび発光装置ならびに照明装置 - Google Patents
発光素子収納用パッケージおよび発光装置ならびに照明装置 Download PDFInfo
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- JP2005285874A JP2005285874A JP2004093883A JP2004093883A JP2005285874A JP 2005285874 A JP2005285874 A JP 2005285874A JP 2004093883 A JP2004093883 A JP 2004093883A JP 2004093883 A JP2004093883 A JP 2004093883A JP 2005285874 A JP2005285874 A JP 2005285874A
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- light emitting
- emitting element
- light
- package
- wiring conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Abstract
【解決手段】 発光素子収納用パッケージは、上面に発光素子3の搭載部1aを有する平板状の基体1と、基体1の上面に搭載部1aを取り囲むように接合された、内周面が発光素子3が発光する光を反射する反射面6とされている枠体2と、基体1の上面から下面または側面に導出された配線導体4とを具備しているものであって、反射面6は、互いに対向するとともに傾斜角度が異なっている部位を有している。
【選択図】 図1
Description
1a:搭載部
2:枠体
3:発光素子
4:配線導体
6:反射面
Claims (5)
- 上面に発光素子の搭載部を有する平板状の基体と、該基体の上面に前記搭載部を取り囲むように接合された、内周面が前記発光素子が発光する光を反射する反射面とされている枠体と、前記基体の上面から下面または側面に導出された配線導体とを具備している発光素子収納用パッケージであって、前記反射面は、互いに対向するとともに傾斜角度が異なっている部位を有していることを特徴とする発光素子収納用パッケージ。
- 請求項1記載の発光素子収納用パッケージと、前記搭載部に搭載されるとともに電極が前記配線導体に電気的に接続された前記発光素子と、前記発光素子を覆う透光性部材とを具備していることを特徴とする発光装置。
- 前記発光素子は、その上下面にそれぞれ前記電極が形成されており、下面側の前記電極は、前記配線導体に導電性接着剤を介して接続されており、上面側の前記電極は、前記反射面の前記傾斜角度が最も大きい部位に近接した他の前記配線導体にボンディングワイヤを介して接続されていることを特徴とする請求項2記載の発光装置。
- 前記発光素子は、前記反射面の前記傾斜角度が最も大きい部位に近接して搭載されていることを特徴とする請求項2または請求項3記載の発光装置。
- 請求項2乃至請求項4のいずれかに記載の発光装置を所定の配置となるように設置したことを特徴とする照明装置。
Priority Applications (1)
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JP2004093883A JP2005285874A (ja) | 2004-03-26 | 2004-03-26 | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
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JP2004093883A JP2005285874A (ja) | 2004-03-26 | 2004-03-26 | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
Related Child Applications (1)
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JP2009276013A Division JP5300702B2 (ja) | 2009-12-04 | 2009-12-04 | 発光装置および照明装置 |
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JP2005285874A true JP2005285874A (ja) | 2005-10-13 |
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JP2004093883A Pending JP2005285874A (ja) | 2004-03-26 | 2004-03-26 | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
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Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005353699A (ja) * | 2004-06-08 | 2005-12-22 | Rohm Co Ltd | 発光ダイオードランプ |
WO2008074218A1 (fr) * | 2006-12-20 | 2008-06-26 | Hujun Huang | Baguette électroluminescente à puces del |
JP2008282575A (ja) * | 2007-05-08 | 2008-11-20 | Stanley Electric Co Ltd | 前照灯光源用ledランプ |
US7592640B2 (en) | 2006-04-28 | 2009-09-22 | Stanley Electric Co., Ltd. | Light emitting semiconductor apparatus |
JP2010050498A (ja) * | 2009-12-04 | 2010-03-04 | Kyocera Corp | 発光装置および照明装置 |
JPWO2008117865A1 (ja) * | 2007-03-28 | 2010-07-15 | 京セラ株式会社 | 照明装置および照明ユニット |
KR200459947Y1 (ko) * | 2007-02-02 | 2012-04-20 | 렉스타 일렉트로닉스 코포레이션 | 발광다이오드 |
EP2452330A1 (en) * | 2009-07-06 | 2012-05-16 | Cree Huizhou Opto Limited | Light emitting diode display with tilted peak emission pattern |
JP2012134530A (ja) * | 2006-05-11 | 2012-07-12 | Lg Innotek Co Ltd | 発光装置及び発光装置の製造方法 |
JP2013012732A (ja) * | 2011-05-30 | 2013-01-17 | Nichia Chem Ind Ltd | 発光装置 |
JP2013140117A (ja) * | 2012-01-06 | 2013-07-18 | Renesas Electronics Corp | 半導体装置の製造方法及び半導体試験装置 |
KR20130083173A (ko) * | 2012-01-12 | 2013-07-22 | 엘지이노텍 주식회사 | 발광소자 패키지 및 조명 장치 |
KR101621544B1 (ko) * | 2009-10-22 | 2016-05-17 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지 및 이를 구비한 백라이트 유닛 |
US9425235B2 (en) | 2012-07-09 | 2016-08-23 | Nichia Corporation | Light emitting device including resin package having differently curved parts |
KR101831274B1 (ko) * | 2011-07-07 | 2018-02-22 | 엘지이노텍 주식회사 | 발광소자 패키지 및 전자기기. |
KR20180032206A (ko) * | 2016-09-21 | 2018-03-29 | 포산 내션스타 옵토일렉트로닉스 코., 엘티디 | Led 지지대, led 소자 및 led 스크린 |
JP2018056491A (ja) * | 2016-09-30 | 2018-04-05 | 日亜化学工業株式会社 | 表示装置及び表示装置 |
WO2020166772A1 (ko) * | 2019-02-11 | 2020-08-20 | 진재언 | 지향각이 조절된 발광소자 패키지 및 이를 이용한 발광장치 |
CN112219060A (zh) * | 2018-05-24 | 2021-01-12 | Lg伊诺特有限公司 | 照明模块及具有该照明模块的照明装置 |
CN114153093A (zh) * | 2021-12-09 | 2022-03-08 | 武汉华星光电技术有限公司 | 曲面背光模组及曲面显示装置 |
Citations (5)
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JPH0525752U (ja) * | 1991-09-10 | 1993-04-02 | サンケン電気株式会社 | 半導体発光装置 |
JPH10208507A (ja) * | 1997-01-24 | 1998-08-07 | Koito Mfg Co Ltd | 車輌用前照灯 |
JP2000012894A (ja) * | 1998-06-17 | 2000-01-14 | Matsushita Electron Corp | 半導体発光装置 |
JP2004087935A (ja) * | 2002-08-28 | 2004-03-18 | Sharp Corp | 半導体発光装置 |
JP2005078937A (ja) * | 2003-08-29 | 2005-03-24 | Ichikoh Ind Ltd | 薄型発光装置 |
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2004
- 2004-03-26 JP JP2004093883A patent/JP2005285874A/ja active Pending
Patent Citations (5)
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JPH0525752U (ja) * | 1991-09-10 | 1993-04-02 | サンケン電気株式会社 | 半導体発光装置 |
JPH10208507A (ja) * | 1997-01-24 | 1998-08-07 | Koito Mfg Co Ltd | 車輌用前照灯 |
JP2000012894A (ja) * | 1998-06-17 | 2000-01-14 | Matsushita Electron Corp | 半導体発光装置 |
JP2004087935A (ja) * | 2002-08-28 | 2004-03-18 | Sharp Corp | 半導体発光装置 |
JP2005078937A (ja) * | 2003-08-29 | 2005-03-24 | Ichikoh Ind Ltd | 薄型発光装置 |
Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005353699A (ja) * | 2004-06-08 | 2005-12-22 | Rohm Co Ltd | 発光ダイオードランプ |
JP4544619B2 (ja) * | 2004-06-08 | 2010-09-15 | ローム株式会社 | 発光ダイオードランプ |
US7592640B2 (en) | 2006-04-28 | 2009-09-22 | Stanley Electric Co., Ltd. | Light emitting semiconductor apparatus |
US8680545B2 (en) | 2006-05-11 | 2014-03-25 | Lg Innotek Co., Ltd | Light emitting device and method for fabricating the same |
US10580943B2 (en) | 2006-05-11 | 2020-03-03 | Lg Innotek Co., Ltd. | Light emitting device and method for fabricating the same |
JP2012134530A (ja) * | 2006-05-11 | 2012-07-12 | Lg Innotek Co Ltd | 発光装置及び発光装置の製造方法 |
US9882095B2 (en) | 2006-05-11 | 2018-01-30 | Lg Innotek Co., Ltd. | Light emitting device and method for fabricating the same |
US9564556B2 (en) | 2006-05-11 | 2017-02-07 | Lg Innotek Co., Ltd. | Light emitting device and method for fabricating the same |
US10243112B2 (en) | 2006-05-11 | 2019-03-26 | Lg Innotek Co., Ltd. | Light emitting device and method for fabricating the same |
WO2008074218A1 (fr) * | 2006-12-20 | 2008-06-26 | Hujun Huang | Baguette électroluminescente à puces del |
KR200459947Y1 (ko) * | 2007-02-02 | 2012-04-20 | 렉스타 일렉트로닉스 코포레이션 | 발광다이오드 |
JPWO2008117865A1 (ja) * | 2007-03-28 | 2010-07-15 | 京セラ株式会社 | 照明装置および照明ユニット |
JP2008282575A (ja) * | 2007-05-08 | 2008-11-20 | Stanley Electric Co Ltd | 前照灯光源用ledランプ |
EP2452330A1 (en) * | 2009-07-06 | 2012-05-16 | Cree Huizhou Opto Limited | Light emitting diode display with tilted peak emission pattern |
EP2452330A4 (en) * | 2009-07-06 | 2014-10-29 | Cree Huizhou Opto Ltd | LED DISPLAY WITH ADJUSTED TOP EMISSION PATTERN |
US11210971B2 (en) | 2009-07-06 | 2021-12-28 | Cree Huizhou Solid State Lighting Company Limited | Light emitting diode display with tilted peak emission pattern |
KR101621544B1 (ko) * | 2009-10-22 | 2016-05-17 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지 및 이를 구비한 백라이트 유닛 |
JP2010050498A (ja) * | 2009-12-04 | 2010-03-04 | Kyocera Corp | 発光装置および照明装置 |
JP2013012732A (ja) * | 2011-05-30 | 2013-01-17 | Nichia Chem Ind Ltd | 発光装置 |
KR101831274B1 (ko) * | 2011-07-07 | 2018-02-22 | 엘지이노텍 주식회사 | 발광소자 패키지 및 전자기기. |
JP2013140117A (ja) * | 2012-01-06 | 2013-07-18 | Renesas Electronics Corp | 半導体装置の製造方法及び半導体試験装置 |
KR101976433B1 (ko) * | 2012-01-12 | 2019-05-09 | 엘지이노텍 주식회사 | 발광소자 패키지 및 조명 장치 |
KR20130083173A (ko) * | 2012-01-12 | 2013-07-22 | 엘지이노텍 주식회사 | 발광소자 패키지 및 조명 장치 |
US9425235B2 (en) | 2012-07-09 | 2016-08-23 | Nichia Corporation | Light emitting device including resin package having differently curved parts |
KR20180032206A (ko) * | 2016-09-21 | 2018-03-29 | 포산 내션스타 옵토일렉트로닉스 코., 엘티디 | Led 지지대, led 소자 및 led 스크린 |
US10290783B2 (en) | 2016-09-21 | 2019-05-14 | Foshan Nationstar Optoelectronics Co., Ltd. | LED bracket, LED device and LED display screen |
JP2018056491A (ja) * | 2016-09-30 | 2018-04-05 | 日亜化学工業株式会社 | 表示装置及び表示装置 |
US10263160B2 (en) | 2016-09-30 | 2019-04-16 | Nichia Corporation | Light emitting device and display device |
CN112219060A (zh) * | 2018-05-24 | 2021-01-12 | Lg伊诺特有限公司 | 照明模块及具有该照明模块的照明装置 |
US11742465B2 (en) | 2018-05-24 | 2023-08-29 | Lg Innotek Co., Ltd. | Lighting module and lighting apparatus having same |
CN112219060B (zh) * | 2018-05-24 | 2024-03-26 | Lg伊诺特有限公司 | 照明模块 |
WO2020166772A1 (ko) * | 2019-02-11 | 2020-08-20 | 진재언 | 지향각이 조절된 발광소자 패키지 및 이를 이용한 발광장치 |
US11848196B2 (en) | 2019-02-11 | 2023-12-19 | Jea Un JIN | Light-emitting diode package having controlled beam angle and light-emitting device using same |
CN114153093A (zh) * | 2021-12-09 | 2022-03-08 | 武汉华星光电技术有限公司 | 曲面背光模组及曲面显示装置 |
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