JP4659515B2 - 発光素子搭載用基板,発光素子収納用パッケージ,発光装置および照明装置 - Google Patents
発光素子搭載用基板,発光素子収納用パッケージ,発光装置および照明装置 Download PDFInfo
- Publication number
- JP4659515B2 JP4659515B2 JP2005145214A JP2005145214A JP4659515B2 JP 4659515 B2 JP4659515 B2 JP 4659515B2 JP 2005145214 A JP2005145214 A JP 2005145214A JP 2005145214 A JP2005145214 A JP 2005145214A JP 4659515 B2 JP4659515 B2 JP 4659515B2
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- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- light
- conductor layer
- mounting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Description
1a:搭載部
2:反射部材
2b:光反射面
3:実装用パッド
3a:第一の実装用パッド
3b:第二の実装用パッド
4:導体層
4a:第一の導体層
4b:第二の導体層
5:接続導体
5a:第一の接続導体
5b:第二の接続導体
6:発光素子
40:金属層
40a:第一の金属層
40b:第二の金属層
41:非形成部
41a:第一の非形成部
41b:第二の非形成部
101:発光装置
102:発光装置駆動回路基板
103:反射具
Claims (4)
- 上側主面に発光素子の電極が電気的に接続される実装用パッドが形成されるとともに、下側主面に導体層が形成され、且つ前記実装用パッドと前記導体層とを電気的に接続するための接続導体が形成されて成る発光素子搭載用基板において、前記導体層は、スリット状の非形成部によって区画された複数個の金属層に取り囲まれていることを特徴とする発光素子搭載用基板。
- 請求項1記載の発光素子搭載用基板の上側主面に、前記発光素子を取り囲むように取着され、内周面が光反射面とされた枠状の反射部材を具備していることを特徴とする発光素子収納用パッケージ。
- 請求項2記載の発光素子収納用パッケージと、前記実装用パッドに電気的に接続された前記発光素子とを具備していることを特徴とする発光装置。
- 請求項3記載の発光装置を光源として用いたことを特徴とする照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005145214A JP4659515B2 (ja) | 2005-05-18 | 2005-05-18 | 発光素子搭載用基板,発光素子収納用パッケージ,発光装置および照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005145214A JP4659515B2 (ja) | 2005-05-18 | 2005-05-18 | 発光素子搭載用基板,発光素子収納用パッケージ,発光装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006324392A JP2006324392A (ja) | 2006-11-30 |
JP4659515B2 true JP4659515B2 (ja) | 2011-03-30 |
Family
ID=37543857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005145214A Expired - Fee Related JP4659515B2 (ja) | 2005-05-18 | 2005-05-18 | 発光素子搭載用基板,発光素子収納用パッケージ,発光装置および照明装置 |
Country Status (1)
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JP (1) | JP4659515B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009231847A (ja) * | 2006-03-02 | 2009-10-08 | Tokuyama Corp | 半導体装置用の支持体およびその形成方法 |
JP5130680B2 (ja) * | 2006-03-02 | 2013-01-30 | 日亜化学工業株式会社 | 半導体装置およびその形成方法 |
TWI381564B (zh) * | 2009-08-06 | 2013-01-01 | Everlight Electronics Co Ltd | 發光二極體 |
CN102834942B (zh) * | 2010-04-09 | 2016-04-13 | 罗姆股份有限公司 | Led模块 |
EP3384539B1 (en) * | 2015-12-02 | 2019-09-18 | Lumileds Holding B.V. | Led metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields |
JP7179613B2 (ja) * | 2015-12-02 | 2022-11-29 | ルミレッズ ホールディング ベーフェー | デバイス |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09162341A (ja) * | 1995-12-07 | 1997-06-20 | Kyocera Corp | 半導体素子収納用パッケージ |
JP2000114556A (ja) * | 1998-09-30 | 2000-04-21 | Sharp Corp | 太陽電池およびその製造方法 |
JP2003209199A (ja) * | 2002-01-15 | 2003-07-25 | Kyocera Corp | 半導体素子搭載用基板 |
JP2004200253A (ja) * | 2002-12-17 | 2004-07-15 | Matsushita Electric Works Ltd | 発光装置 |
JP2004207537A (ja) * | 2002-12-25 | 2004-07-22 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2004288657A (ja) * | 2003-01-28 | 2004-10-14 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2004289106A (ja) * | 2003-01-27 | 2004-10-14 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
-
2005
- 2005-05-18 JP JP2005145214A patent/JP4659515B2/ja not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09162341A (ja) * | 1995-12-07 | 1997-06-20 | Kyocera Corp | 半導体素子収納用パッケージ |
JP2000114556A (ja) * | 1998-09-30 | 2000-04-21 | Sharp Corp | 太陽電池およびその製造方法 |
JP2003209199A (ja) * | 2002-01-15 | 2003-07-25 | Kyocera Corp | 半導体素子搭載用基板 |
JP2004200253A (ja) * | 2002-12-17 | 2004-07-15 | Matsushita Electric Works Ltd | 発光装置 |
JP2004207537A (ja) * | 2002-12-25 | 2004-07-22 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2004289106A (ja) * | 2003-01-27 | 2004-10-14 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2004288657A (ja) * | 2003-01-28 | 2004-10-14 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
Also Published As
Publication number | Publication date |
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JP2006324392A (ja) | 2006-11-30 |
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