CN114994980B - Backlight plate, preparation method thereof and display device - Google Patents
Backlight plate, preparation method thereof and display device Download PDFInfo
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- CN114994980B CN114994980B CN202210622997.9A CN202210622997A CN114994980B CN 114994980 B CN114994980 B CN 114994980B CN 202210622997 A CN202210622997 A CN 202210622997A CN 114994980 B CN114994980 B CN 114994980B
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- driving substrate
- substrate
- backlight
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- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims description 148
- 238000005538 encapsulation Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 238000004806 packaging method and process Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000010009 beating Methods 0.000 claims 2
- 239000003292 glue Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229920006335 epoxy glue Polymers 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
Abstract
The application provides a backlight plate and a preparation method thereof, a display device, be provided with a plurality of first binding terminals and a plurality of second binding terminals on the drive base plate of this backlight plate, light emitting device binds on drive base plate through first binding terminals, the one end that the drive base plate was kept away from to the supporting member is provided with the third binding terminal, the third binding terminal binds together with the second binding terminals to make the supporting member bind on drive base plate through the second binding terminals, compare in prior art to set up the support column on white oil, the supporting member of this application is owing to bind on drive base plate through binding terminals for the supporting member is stronger with drive base plate's cohesion, avoid the supporting member to drop, in order to alleviate the problem that the support column drops easily on the current backlight plate.
Description
Technical Field
The application relates to the technical field of display, in particular to a backlight plate, a preparation method thereof and a display device.
Background
The liquid crystal display generally includes a backlight module and a display panel, and the backlight module provides backlight to the display panel. The backlight source of the backlight module is placed in a manner of two types, such as a side-in type backlight source and a direct type backlight source, for example, a mini LED is used as the backlight source, which is a typical direct type backlight technology. In the direct backlight mode, a mini LED is usually disposed on a backlight board, and a white oil is covered on a position of the backlight board where the mini LED is not disposed to reflect light. Meanwhile, the support column is attached to the white oil of the backlight plate so as to prevent the optical film on the backlight plate from interfering with the mini LED, however, the support column is easy to fall off from the white oil due to smaller adhesion force between the support column and the white oil.
Disclosure of Invention
The application provides a backlight plate, a preparation method thereof and a display device, so as to solve the technical problem that support columns on the existing backlight plate are easy to fall off.
In order to solve the problems, the technical scheme provided by the application is as follows:
the embodiment of the application provides a backlight plate, which comprises:
a driving substrate;
the plurality of binding terminals are arranged on the driving substrate and comprise a plurality of first binding terminals and a plurality of second binding terminals, and each second binding terminal is positioned between two adjacent first binding terminals;
a plurality of light emitting devices bound to the driving substrate through the first binding terminals; and
a plurality of support members bound to the driving substrate through the second binding terminals;
each supporting member is provided with a third binding terminal at one end close to the driving substrate, and the third binding terminals are bound on the second binding terminals.
In the backlight board provided by the embodiment of the application, in the direction perpendicular to the driving substrate, the height of the supporting member is greater than or equal to the height of the light emitting device.
In the backlight plate provided by the embodiment of the application, the backlight plate further comprises a reflecting layer, the reflecting layer is covered on the driving substrate, a first opening is formed in a position corresponding to the first binding terminal, and a second opening is formed in a position corresponding to the second binding terminal.
In the backlight plate provided by the embodiment of the application, the backlight plate further comprises a first packaging layer, and the first packaging layer wraps the light emitting device and is filled in the first opening.
In the backlight plate provided in the embodiment of the application, the backlight plate further includes a second encapsulation layer, and the second encapsulation layer wraps the supporting member and fills the second opening.
The embodiment of the application also provides a preparation method of the backlight plate, which comprises the following steps:
providing a driving substrate, wherein a plurality of binding terminals are arranged on the driving substrate, the binding terminals comprise a plurality of first binding terminals and a plurality of second binding terminals, and each second binding terminal is positioned between two adjacent first binding terminals;
providing a first transfer substrate, and preparing a plurality of light emitting devices on the first transfer substrate;
providing a second transfer substrate, and preparing a plurality of support members on the second transfer substrate, wherein one end of each support member is provided with a third binding terminal;
transferring the plurality of light emitting devices on the first transfer substrate to the driving substrate, each of the light emitting devices being bonded to the driving substrate through the first bonding terminal; and
transferring the plurality of support members on the second transfer substrate to the driving substrate includes binding the third binding terminals to the second binding terminals such that each of the support members is bound to the driving substrate through the second binding terminals.
In the method for manufacturing a backlight plate provided in the embodiment of the present application, before the step of transferring the plurality of light emitting devices on the first transfer substrate onto the driving substrate, the method further includes:
and preparing a reflecting layer on the driving substrate, wherein the reflecting layer is covered on the driving substrate, a first opening is formed in a position corresponding to the first binding terminal, and a second opening is formed in a position corresponding to the second binding terminal.
In the method for manufacturing a backlight plate provided in the embodiment of the present application, after the step of transferring the plurality of support members on the second transfer substrate onto the driving substrate, the method further includes:
and preparing a first packaging layer on the light-emitting device, wherein the first packaging layer wraps the light-emitting device and is filled in the first opening.
In the method for manufacturing a backlight plate provided in the embodiment of the present application, after the step of transferring the plurality of support members on the second transfer substrate onto the driving substrate, the method further includes:
and preparing a second packaging layer on the supporting member, wherein the second packaging layer wraps the supporting member and is filled in the second opening.
The embodiment of the application also provides a display device which comprises a backlight module and a display panel which are oppositely arranged, wherein the backlight module comprises the backlight plate of one of the embodiments.
The beneficial effects of this application are: in the backlight plate, the preparation method thereof and the display device provided by the application, the driving substrate is provided with the first binding terminals and the second binding terminals, the light emitting device is bound on the driving substrate through the first binding terminals, one end, far away from the driving substrate, of the supporting member is provided with the third binding terminals, the third binding terminals are bound with the second binding terminals together, so that the supporting member is bound on the driving substrate through the second binding terminals, and compared with the supporting column arranged on white oil in the prior art, the supporting member is bound on the driving substrate through the binding terminals, so that the binding force between the supporting member and the driving substrate is stronger, the supporting member is prevented from falling off, and the problem that the supporting column on the existing backlight plate falls off easily is solved.
Drawings
In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of a backlight plate according to an embodiment of the present application.
Fig. 2 is a schematic flow chart of a method for manufacturing a backlight plate according to an embodiment of the present application.
Fig. 3 is a schematic cross-sectional structure of a driving substrate according to an embodiment of the present disclosure.
Fig. 4 is a schematic cross-sectional structure of a light emitting device fabricated on a first transfer substrate according to an embodiment of the present application.
Fig. 5 is a schematic cross-sectional structure of a support member prepared on a second transfer substrate according to an embodiment of the present application.
Fig. 6 is a schematic cross-sectional structure of a reflective layer fabricated on the driving substrate of fig. 3.
Fig. 7 is a schematic cross-sectional structure of a light emitting device bonded on the driving substrate of fig. 6.
Fig. 8 is a schematic cross-sectional structure of binding a support member on the driving substrate of fig. 7.
Fig. 9 is a schematic cross-sectional structure of a first encapsulation layer prepared on the light emitting device of fig. 8.
Fig. 10 is a schematic cross-sectional structure of a display device according to an embodiment of the present application.
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments that can be used to practice the present application. The directional terms mentioned in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., are only referring to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the application and is not intended to be limiting of the application. In the drawings, like elements are designated by like reference numerals. In the drawings, the thickness of some layers and regions are exaggerated for clarity of understanding and ease of description. I.e., the size and thickness of each component shown in the drawings are arbitrarily shown, but the present application is not limited thereto.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure of a backlight panel according to an embodiment of the disclosure. The backlight panel 100 includes a driving substrate 10, a plurality of light emitting devices 20 and a plurality of support members 30 bonded to the driving substrate 10. The driving substrate 10 is provided with a driving circuit for driving the light emitting device 20 to emit light, and optionally, the light emitting device 20 includes an LED chip, a mini LED chip, a Micro LED chip, or the like. The support member 30 serves to protect the light emitting device 20 from interference with the light emitting device 20 by a film on the backlight 100.
Specifically, the driving substrate 10 is provided with a plurality of binding terminals, the plurality of binding terminals includes a plurality of first binding terminals 11 and a plurality of second binding terminals 12, and each second binding terminal 12 is located between two adjacent first binding terminals 11. The light emitting device 20 is bound on the driving substrate 10 through the corresponding first binding terminal 11, wherein the first binding terminal 11 is electrically connected with the driving circuit on the driving substrate 10, and thus the driving circuit drives the light emitting device 20 to emit light through the first binding terminal 11.
The first bonding terminal 11 includes a first sub-terminal 111 and a second sub-terminal 112, and the first sub-terminal 111 and the second sub-terminal 112 are insulated from each other and respectively connected to different driving signals on the driving circuit. Accordingly, each of the light emitting devices 20 is provided with a first pole 21 and a second pole 22, the first pole 21 and the second pole 22 being insulated from each other, the first pole 21 being electrically connected to the first sub-terminal 111, and the second pole 22 being electrically connected to the second sub-terminal 112.
A plurality of the support members 30 are bound to the driving substrate 10 through the corresponding second binding terminals 12. Specifically, each of the support members 30 is provided with a third binding terminal 31 at one end near the driving substrate 10, and the third binding terminal 31 is bound to the second binding terminal 12 such that the support member 30 is bound to the driving substrate 10.
It can be appreciated that, compared with the fixing manner of attaching the support member 30 to the driving substrate 10 by adhesive bonding, the third binding terminal 31 on the support member 30 and the second binding terminal 12 on the driving substrate 10 are bound together by welding or other processes, so that the fixing manner of binding the support member 30 and the driving substrate 10 is more stable, the support member 30 can be more firmly fixed on the driving substrate 10, and the problem that the support column on the existing backlight plate 100 is easy to fall off is solved.
Further, in a direction perpendicular to the driving substrate 10, the height of the supporting member 30 is greater than or equal to the height of the light emitting device 20, so that the supporting member 30 and the light emitting device 20 form a height difference, and further the supporting member 30 supports the membrane above the backlight plate 100, so that a gap is formed between the membrane above the backlight plate 100 and the light emitting device 20, and interference between the membrane above the backlight plate 100 and the light emitting device 20 is avoided.
The height of the supporting member 30 refers to the distance between the upper surface of the supporting member 30 and the driving substrate 10, wherein the upper surface of the supporting member 30 refers to the surface of the supporting member 30 facing away from the driving substrate 10. Accordingly, the height of the light emitting device 20 refers to the distance of the upper surface of the light emitting device 20 from the driving substrate 10, wherein the upper surface of the light emitting device 20 refers to the surface of the light emitting device 20 facing away from the driving substrate 10.
Optionally, the backlight 100 further includes a reflective layer 40, where the reflective layer 40 covers the driving substrate 10, and a first opening 41 is disposed at a position corresponding to the first bonding terminal 11, and a second opening 42 is disposed at a position corresponding to the second bonding terminal 12. The reflecting layer 40 can reflect the light reflected by the film on the backlight plate 100 to the film on the backlight plate 100 again, so as to improve the utilization rate of the light emitted by the light emitting device 20.
Alternatively, the reflective layer 40 may be a reflective ink layer or incorporate SiO 2 Or TiO 2 The reflective layer 40 may be formed by coating a white oil on the driving substrate 10, for example, by using a silicone glue, an epoxy glue, or other transparent glue of the reflective material. The white oil can reflect the light emitted by the light emitting device 20 to improve the utilization rate of the light emitted by the light emitting device 20, and can also play a role in resisting welding and covering the driving circuit to reduce the metal reflection of the driving circuit.
Further, the backlight plate 100 further includes a first encapsulation layer 50, and the first encapsulation layer 50 wraps the light emitting device 20 and fills the first opening 41. The first encapsulation layer 50 can isolate air, reduce the influence of oxygen, water vapor and other factors in the air on the light emitting device 20, reduce the possibility of wetting, short-circuiting, oxidation and the like of the light emitting device 20, and facilitate the extension of the service life of the light emitting device 20.
Optionally, the material of the first packaging layer 50 includes one or more of transparent glue such as silicone glue, epoxy glue, OCA optical glue, and the like. For example, the first encapsulation layer 50 is formed by dispensing OCA on the light emitting device 20 through a dispensing process, where the OCA has strong water and oxygen blocking performance and good light transmittance, so that the light emitting efficiency of the light emitting device 20 can be improved while the light emitting device 20 is protected.
Optionally, the backlight plate 100 further includes a second encapsulation layer 60, where the second encapsulation layer 60 wraps the support member 30 and fills the second opening 42, so as to further strengthen the fixed connection between the support member 30 and the driving substrate 10. Specifically, the second encapsulation layer 60 wraps the supporting member 30 and covers a portion of the reflective layer 40, and fills the second opening 42 to wrap the second binding terminal 12 and the third binding terminal 31, so that the supporting member 30 has a larger contact area with the driving substrate 10 and the components on the driving substrate 10, and the reliability of the fixed connection between the supporting member 30 and the driving substrate 10 can be further enhanced. Optionally, the material of the second encapsulation layer 60 includes an adhesive material, such as white glue.
In an embodiment, please refer to fig. 1 to 9 in combination, fig. 2 is a schematic flow chart of a method for manufacturing a backlight plate according to an embodiment of the present application, fig. 3 is a schematic cross-sectional structure of a driving substrate according to an embodiment of the present application, fig. 4 is a schematic cross-sectional structure of a light emitting device manufactured on a first transfer substrate according to an embodiment of the present application, fig. 5 is a schematic cross-sectional structure of a supporting member manufactured on a second transfer substrate according to an embodiment of the present application, fig. 6 is a schematic cross-sectional structure of a reflective layer manufactured on the driving substrate of fig. 3, fig. 7 is a schematic cross-sectional structure of a light emitting device bonded on the driving substrate of fig. 6, fig. 8 is a schematic cross-sectional structure of a supporting member bonded on the driving substrate of fig. 7, and fig. 9 is a schematic cross-sectional structure of a first encapsulation layer manufactured on the light emitting device of fig. 8. The preparation method of the backlight plate comprises the following steps:
s301: providing a driving substrate 10, wherein a plurality of binding terminals are arranged on the driving substrate 10, the binding terminals comprise a plurality of first binding terminals 11 and a plurality of second binding terminals 12, and each second binding terminal 12 is positioned between two adjacent first binding terminals 11;
specifically, referring to fig. 3, the driving substrate 10 is provided with a plurality of first bonding terminals 11 and a plurality of second bonding terminals 12, and the height of the first bonding terminals 11 is equal to the height of the second bonding terminals 12. The first bonding terminal 11 includes a first sub-terminal 111 and a second sub-terminal 112, and the first sub-terminal 111 and the second sub-terminal 112 are insulated from each other.
Alternatively, the driving substrate 10 may be a glass substrate or a PCB substrate, etc., a driving circuit is disposed on the driving substrate 10, the first bonding terminal 11 is electrically connected to the driving circuit, and the first sub-terminal 111 and the second sub-terminal 112 are respectively connected to different driving signals on the driving circuit.
S302: providing a first transfer substrate 71, and preparing a plurality of light emitting devices 20 on the first transfer substrate 71;
specifically, referring to fig. 4, a plurality of the light emitting devices 20 arranged in an array are prepared on the first transfer substrate 71, and the first transfer substrate 71 includes a substrate such as a blue film. The light emitting device 20 includes an LED chip, a mini LED chip, a Micro LED chip, or the like. The light emitting device 20 is provided with a first pole 21 and a second pole 22 for binding with the first binding terminal 11 on the driving substrate 10.
S303: providing a second transfer substrate 72, and preparing a plurality of support members 30 on the second transfer substrate 72, one end of each of the support members 30 being provided with a third binding terminal 31;
specifically, referring to fig. 5, a plurality of the support members 30 arranged in an array are prepared on the second transfer substrate 72, and the second transfer substrate 72 also includes a substrate such as a blue film. The end of the supporting member 30 near the second transfer substrate 72 is provided with a third binding terminal 31 for binding with the second binding terminal 12 on the driving substrate 10. Alternatively, the shape of the support member 30 includes a cylindrical shape, a tapered shape, and the like.
S304: transferring the plurality of light emitting devices 20 on the first transfer substrate 71 to the driving substrate 10, each of the light emitting devices 20 being bonded to the driving substrate 10 through the first bonding terminals 11;
specifically, referring to fig. 6, before the step of transferring the plurality of light emitting devices 20 on the first transfer substrate 71 onto the driving substrate 10, it further includes:
a reflective layer 40 is prepared on the driving substrate 10, the reflective layer 40 is coated on the driving substrate 10, a first opening 41 is provided at a position corresponding to the first binding terminal 11, and a second opening 42 is provided at a position corresponding to the second binding terminal 12.
Specifically, a layer of white oil is coated on the surface of the driving substrate 10 by using a coating process, the first opening 41 is formed by windowing at a position of the white oil corresponding to the first binding terminal 11, the second opening 42 is formed by windowing at a position of the white oil corresponding to the second binding terminal 12, and the reflective layer 40 is formed. The height of the reflective layer 40 is greater than the height of the first bonding terminal 11.
Of course, alternatively, the material of the reflective layer 40 may also be a reflective ink layer or incorporate SiO 2 Or TiO 2 And silica gel glue, epoxy resin glue or other transparent glue of the reflecting substances.
Further, the light emitting device 20 on the first transfer substrate 71 is transferred to the driving substrate 10 by using a transfer process such as a tape-out process or a mass transfer process, and is bonded to the first bonding terminal 11 on the driving substrate 10, so that the first electrode 21 of the light emitting device 20 is bonded to the first sub-terminal 111 of the first bonding terminal 11, and the second electrode 22 of the light emitting device 20 is bonded to the second sub-terminal 112 of the first bonding terminal 11, as shown in fig. 7.
S305: transferring the plurality of support members 30 on the second transfer substrate 72 to the driving substrate 10 includes binding the third binding terminals 31 to the second binding terminals 12 such that each of the support members 30 is bound to the driving substrate 10 through the second binding terminals 12.
Specifically, referring to fig. 8, the support member 30 on the second transfer substrate 72 is transferred to the driving substrate 10 using a transfer process such as a punch or mass transfer, and is bonded to the second bonding terminal 12 on the driving substrate 10. Specifically, the third binding terminals 31 are bound to the second binding terminals 12 such that each of the support members 30 is bound to the driving substrate 10 through the second binding terminals 12. The height of the support member 30 is greater than or equal to the height of the light emitting device 20.
It will be appreciated that after the support member 30 and the light emitting device 20 are transferred to the driving substrate 10, reflow soldering is further performed to firmly bind the support member 30 and the light emitting device 20 to the driving substrate 10.
Further, after the step of transferring the plurality of support members 30 on the second transfer substrate 72 onto the driving substrate 10, it further includes:
a first encapsulation layer 50 is prepared on the light emitting device 20, and the first encapsulation layer 50 wraps the light emitting device 20 and fills the first opening 41.
Specifically, an OCA optical paste is dispensed on the light emitting device 20 by a dispensing process to form the first encapsulation layer 50, as shown in fig. 9. The first encapsulation layer 50 wraps the light emitting device 20 and fills the first opening 41, so as to isolate air, reduce the influence of oxygen, water vapor and other factors in the air on the light emitting device 20, reduce the possibility of moisture, short circuit, oxidation and the like of the light emitting device 20, and facilitate the extension of the service life of the light emitting device 20. Meanwhile, the OCA optical adhesive has good light transmittance, and can protect the light-emitting device 20 and improve the light-emitting efficiency of the light-emitting device 20.
Of course, optionally, the material of the first packaging layer 50 may further include one or more of silicone glue, epoxy glue, and transparent glue.
Further, after the step of transferring the plurality of support members 30 on the second transfer substrate 72 onto the driving substrate 10, it further includes:
a second encapsulation layer 60 is prepared on the support member 30, the second encapsulation layer 60 encapsulating the support member 30 and filling the second openings 42.
Specifically, a glue material having adhesiveness such as white glue is dispensed on the supporting member 30 by a dispensing process to form a second encapsulation layer 60, as shown in fig. 1. The second encapsulation layer 60 wraps the support member 30 and fills the second opening 42, so as to further strengthen the fixed connection between the support member 30 and the driving substrate 10. Specifically, the second encapsulation layer 60 wraps the supporting member 30 and covers a portion of the reflective layer 40, and fills the second opening 42 to wrap the second binding terminal 12 and the third binding terminal 31, so that the supporting member 30 has a larger contact area with the driving substrate 10 and the components on the driving substrate 10, and the reliability of the fixed connection between the supporting member 30 and the driving substrate 10 can be further enhanced.
In the method for manufacturing the backlight plate of the embodiment, the first binding terminal 11 for binding the light emitting device 20 is manufactured on the driving substrate 10, and the second binding terminal 12 for binding the supporting member 30 is also manufactured on the driving substrate 10, and then the supporting member 30 is transferred to the driving substrate 10 by adopting the same transfer process as the light emitting device 20 is transferred, and reflow soldering is performed on one piece, so that the reliability of the fixed connection between the supporting member 30 and the driving substrate 10 is improved, and the process of attaching the supporting member 30 is reduced, thereby reducing the equipment investment, simplifying the process flow, and saving the production cost.
In an embodiment, please refer to fig. 1 to 10 in combination, fig. 10 is a schematic cross-sectional structure of a display device according to an embodiment of the present application. The display device 1000 includes a backlight module 1 and a display panel 2 disposed opposite to each other, the backlight module 1 provides backlight for the display panel 2, and the backlight module 1 includes the backlight plate 100 of one of the above embodiments.
As can be seen from the above embodiments:
in the backlight plate, the preparation method thereof and the display device provided by the application, the drive substrate of the backlight plate is provided with the first binding terminals and the second binding terminals, the light emitting device is bound on the drive substrate through the first binding terminals, one end of the support member, which is far away from the drive substrate, is provided with the third binding terminals, and the third binding terminals are bound with the second binding terminals together, so that the support member is bound on the drive substrate through the second binding terminals.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The foregoing embodiments of the present application have been described in detail, and specific examples have been employed herein to illustrate the principles and embodiments of the present application, the above embodiments being provided only to assist in understanding the technical solutions of the present application and their core ideas; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims (8)
1. A method of manufacturing a backlight, comprising:
providing a driving substrate, wherein a plurality of binding terminals are arranged on the driving substrate, the binding terminals comprise a plurality of first binding terminals and a plurality of second binding terminals, and each second binding terminal is positioned between two adjacent first binding terminals;
providing a first transfer substrate, and preparing a plurality of light emitting devices on the first transfer substrate;
providing a second transfer substrate, and preparing a plurality of support members on the second transfer substrate, wherein one end of each support member is provided with a third binding terminal;
preparing a reflecting layer on the driving substrate, wherein the reflecting layer is covered on the driving substrate, a first opening is formed in a position corresponding to the first binding terminal, and a second opening is formed in a position corresponding to the second binding terminal;
transferring a plurality of light emitting devices on the first transfer substrate to the driving substrate by adopting a piece beating or mass transfer process, wherein each light emitting device is bound on the driving substrate through the first binding terminal; and
transferring a plurality of support members on the second transfer substrate to the driving substrate by adopting a piece beating or mass transfer process so as to bind the third binding terminals on the second binding terminals, so that each support member is bound on the driving substrate through the second binding terminals;
and preparing a second packaging layer on the supporting member, wherein the second packaging layer wraps the supporting member, fills the second opening, and wraps the second binding terminal and the third binding terminal.
2. The method of manufacturing a backlight according to claim 1, further comprising, after the step of transferring the plurality of support members on the second transfer substrate onto the driving substrate:
and preparing a first packaging layer on the light-emitting device, wherein the first packaging layer wraps the light-emitting device and is filled in the first opening.
3. A backlight, characterized in that it is produced by the backlight production method according to any one of claims 1 to 2, comprising:
a driving substrate;
the plurality of binding terminals are arranged on the driving substrate and comprise a plurality of first binding terminals and a plurality of second binding terminals, and each second binding terminal is positioned between two adjacent first binding terminals;
a plurality of light emitting devices bound to the driving substrate through the first binding terminals; and
a plurality of support members bound to the driving substrate through the second binding terminals;
each supporting member is provided with a third binding terminal at one end close to the driving substrate, and the third binding terminals are bound on the second binding terminals.
4. A backlight as claimed in claim 3, wherein the height of the support member is greater than or equal to the height of the light emitting device in a direction perpendicular to the driving substrate.
5. The backlight of claim 4, further comprising a reflective layer overlying the drive substrate and having a first opening at a location corresponding to the first binding terminal and a second opening at a location corresponding to the second binding terminal.
6. A backlight as claimed in claim 5, further comprising a first encapsulation layer surrounding the light emitting device and filling the first opening.
7. A backlight as claimed in claim 5, further comprising a second encapsulation layer surrounding the support member and filling the second aperture.
8. A display device comprising a backlight module and a display panel arranged in opposition, the backlight module comprising a backlight as claimed in any one of claims 3 to 7.
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| CN202210622997.9A CN114994980B (en) | 2022-06-01 | 2022-06-01 | Backlight plate, preparation method thereof and display device |
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| CN202210622997.9A CN114994980B (en) | 2022-06-01 | 2022-06-01 | Backlight plate, preparation method thereof and display device |
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| CN114994980A (en) | 2022-09-02 |
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