CN112540482B - Backlight module, backlight module manufacturing method and display panel - Google Patents

Backlight module, backlight module manufacturing method and display panel Download PDF

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Publication number
CN112540482B
CN112540482B CN202011412275.8A CN202011412275A CN112540482B CN 112540482 B CN112540482 B CN 112540482B CN 202011412275 A CN202011412275 A CN 202011412275A CN 112540482 B CN112540482 B CN 112540482B
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China
Prior art keywords
driving switch
reflective
holes
light emitting
hole
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CN202011412275.8A
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Chinese (zh)
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CN112540482A (en
Inventor
彭钊
刘俊领
吴思嘉
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TCL Huaxing Photoelectric Technology Co Ltd
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TCL Huaxing Photoelectric Technology Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs

Abstract

The embodiment of the application provides a backlight module, a backlight module manufacturing method and a display panel, wherein the backlight module comprises: the LED comprises an array substrate, a light emitting diode, a driving switch, a reflective packaging adhesive and a reflective layer. The reflective layer is provided with a first through hole and a second through hole at the positions of the light emitting diode and the driving switch respectively, and the positions of the driving switch are encapsulated by adopting reflective encapsulation glue. On the one hand, the driving switch can be further reinforced, the reliability of the driving switch is improved, meanwhile, the reflectivity of the reflective packaging adhesive is higher, and light reflected at the driving switch can be reflected back, so that dark spots are prevented from being displayed. On the other hand, when the reflecting layer is attached, the first through hole and the second through hole are respectively formed in the positions of the light-emitting diode and the driving switch, so that all the light-emitting diode and the driving switch are exposed, the attaching is smoother, the attaching difficulty of the reflecting layer is reduced, and the attaching reliability of the reflecting layer is enhanced.

Description

Backlight module, backlight module manufacturing method and display panel
Technical Field
The application relates to the technical field of display, in particular to a backlight module, a backlight module manufacturing method and a display panel.
Background
The Mini-LED backlight module (BLU) is a backlight design for realizing partition control, and a single light emitting diode chip (LED chip) and a driving switch (MOS) are bonded to a BLU back plate by a Surface assembly technology (Surface MountedTechnology, SMT) process, so that the Mini-LED backlight is assembled, and the whole backlight is convex at the positions of the MOS and the LED chip.
After the backlight is finished, the module is required to be assembled, a white reflecting layer (the reflectivity is more than 95%) is generally stuck on the surface of the mini-LED BLU for improving the utilization rate of the backlight, the white reflecting layer is generally stuck manually, the minimum aperture of the cut is 3mm, and the LED is exposed at the cut, so that the LED emits light; however, since the MOS is non-luminous and the exposed MOS is prone to generate poor light shadow (mura), i.e. a dark area above, the white reflective layer covers the MOS below, so that on the whole back plate, the white reflective layer is convex at the MOS, on one hand, the difficulty of attaching the white reflective layer is increased, and on the other hand, the flatness reliability of the white reflective layer is reduced.
Disclosure of Invention
The embodiment of the application provides a backlight module, a backlight module manufacturing method and a display panel, which can realize smooth lamination of a reflecting layer and increase lamination reliability.
The application provides a backlight module, comprising:
the array substrate comprises a first surface and a second surface which are oppositely arranged;
the light emitting diodes are arranged on the first surface, a plurality of light emitting diodes are arranged, and a space is reserved between the light emitting diodes;
the driving switches are arranged on the first surface, a plurality of driving switches are arranged, a space is reserved between each driving switch and each driving switch, and a space is reserved between each driving switch and each light emitting diode;
the reflection packaging glue is used for correspondingly packaging the driving switch;
the reflecting layer is arranged on the first surface, a first through hole and a second through hole are formed in the reflecting layer, and a plurality of first through holes and a plurality of second through holes are formed in the reflecting layer, wherein the light emitting diode is correspondingly arranged in the first through hole, and the driving switch is correspondingly arranged in the second through hole.
In some embodiments, the reflective encapsulant has a reflectance of light of 80% or more.
In some embodiments, the reflective encapsulant has an encapsulant area of 3mm by 3mm or more.
In some embodiments, the light emitting diodes and the driving switches are arranged in an array on the first surface, and the light emitting diodes and the driving switches are alternately arranged one by one.
In some embodiments, the light emitting diode array further comprises an optical film, wherein the optical film is arranged on one side of the reflecting layer far away from the array substrate, and the light mixing distance between the optical film and the light emitting diode is 0mm to 10mm.
The embodiment of the application provides a backlight module manufacturing method, which comprises the following steps:
providing an array substrate, wherein the array substrate comprises a first surface and a second surface which are oppositely arranged;
arranging a plurality of light emitting diodes on the first surface, wherein a space is reserved between the light emitting diodes;
a plurality of driving switches are arranged on the first surface, a space is reserved between the driving switches and the driving switches, and a space is reserved between the driving switches and the light emitting diodes;
setting reflective packaging glue on the driving switch, wherein the reflective packaging glue correspondingly packages one driving switch;
the first surface is provided with a reflecting layer, the reflecting layer is provided with a plurality of first through holes and a plurality of second through holes, wherein the light emitting diodes are correspondingly arranged in the first through holes, and the driving switches are correspondingly arranged in the second through holes.
In some embodiments, the disposing a reflective layer on the first face includes:
attaching a plurality of sub-reflecting layers to the area of the first surface, which is not covered by the light emitting diode, the driving switch and the reflective packaging adhesive;
and a plurality of sub-reflecting layers are spliced to form the reflecting layer.
In some embodiments, the disposing a reflective layer on the first face includes:
providing a reflecting layer;
a plurality of first through holes and second through holes are arranged on the reflecting layer at positions corresponding to the light emitting diodes and the driving switches;
the first surface is provided with a plurality of reflecting layers of the first through holes and the second through holes in a laminating mode.
In some embodiments, the disposing a reflective encapsulant on the drive switch includes:
a reflective packaging adhesive material is arranged on the driving switch by adopting an adhesive spraying technology;
and curing the reflective packaging adhesive material to obtain the reflective packaging adhesive.
The embodiment of the application provides a display panel, which comprises the backlight module.
The backlight module provided by the embodiment of the application comprises: the LED comprises an array substrate, a light emitting diode, a driving switch, a reflective packaging adhesive and a reflective layer. The reflective layer is provided with a first through hole and a second through hole at the positions of the light emitting diode and the driving switch respectively, and the positions of the driving switch are encapsulated by adopting reflective encapsulation glue. On the one hand, the driving switch can be further reinforced, the reliability of the driving switch is improved, meanwhile, the reflectivity of the reflective packaging adhesive is higher, and light reflected at the driving switch can be reflected back, so that dark spots are prevented from being displayed. On the other hand, when the reflecting layer is attached, the first through hole and the second through hole are respectively formed in the positions of the light-emitting diode and the driving switch, so that all the light-emitting diode and the driving switch are exposed, the attaching is smoother, the attaching difficulty of the reflecting layer is reduced, and the attaching reliability of the reflecting layer is enhanced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a first structure of a backlight module according to an embodiment of the application;
fig. 2 is a schematic diagram of a second structure of a backlight module according to an embodiment of the application;
fig. 3 is a schematic diagram of a third structure of a backlight module according to an embodiment of the application;
FIG. 4 is a schematic diagram of a first process flow of a backlight module manufacturing method according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a second process flow of a backlight module manufacturing method according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of a display panel according to an embodiment of the application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
It should be noted that, in the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, only to facilitate description of the present application and simplify the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
The embodiment of the application provides a backlight module, a backlight module manufacturing method and a display panel, and the backlight module is described in detail below.
Referring to fig. 1, fig. 1 is a schematic diagram of a first structure of a backlight module 10 according to an embodiment of the application. The backlight module 10 includes an array substrate 101, a light emitting diode 102, a driving switch 103, a reflective encapsulant 104, and a reflective layer 105. The array substrate 101 includes a first face 101a and a second face 101b disposed opposite to each other. The light emitting diodes 102 are disposed on the first surface 101a, the light emitting diodes 102 are disposed in plurality, and a space is provided between the light emitting diodes 102 and the light emitting diodes 102. The driving switch 103 is disposed on the first surface 101a, the driving switch 103 is provided in plurality, a space is provided between the driving switch 103 and the driving switch 103, and a space is provided between the driving switch 103 and the light emitting diode 102. The reflective encapsulation 104 encapsulates a driving switch 103 correspondingly. The reflective layer 105 is disposed on the first surface 101a, and the reflective layer 105 is provided with a first through hole 105a and a second through hole 105b, where the first through hole 105a and the second through hole 105b are provided with a plurality of light emitting diodes 102 correspondingly disposed in the first through hole 105a, and the driving switch 103 correspondingly disposed in the second through hole 105 b.
Note that, the first surface 101a may be an upper surface of the array substrate 101, and the second surface 101b may be a lower surface of the array substrate 101. Of course, the first surface 101a may be a lower surface of the array substrate 101, and the second surface 101b may be an upper surface of the array substrate 101. Without specific explanation, the default of the embodiment of the present application is that the first surface 101a is the upper surface of the array substrate 101, and the second surface 101b is the lower surface of the array substrate 101.
The driving switch 103 may be a field effect transistor (metal oxide semiconductor, MOS). The manufacturing process of the field effect transistor is simple, the input impedance is high, the driving power is low, the switching speed is high, and better backlight effect can be obtained by using the field effect transistor as the driving switch 103.
The light emitting diode 102 is one of an LED, a mini LED, or a micro LED. The LED has low power consumption, high temperature resistance and low temperature resistance and long service life. The mini LED and the micro LED can realize a more precise dynamic backlight effect, and can effectively improve the brightness and contrast of a screen and inhibit the glare phenomenon caused by the traditional large-bulb dynamic backlight in a bright-dark area of the screen.
The light emitting diodes 102 and the driving switches 103 are arranged in an array on the first surface 101a, and the light emitting diodes 102 and the driving switches 103 are alternately arranged one by one. By the arrangement method, the light emitting diodes 102 can be distributed more uniformly on the array substrate 101, so that the backlight module 10 can obtain more uniform light emitting effect, and further better display effect can be obtained. Other arrangements of the leds 102 and the driving switches 103 may be used according to the requirements of different display panels.
The reflectivity of the reflective encapsulation 104 to light is more than 80%. The reflective encapsulant 104 has a reflectance of 80%, 82%, 85%, 90%, or 95% for light. The reflectivity of the reflective packaging adhesive 104 is high, so that the light at the driving switch can be reflected back when the driving switch 104 is well packaged, and the backlight module is prevented from generating display dark spots.
Wherein, the materials used for the reflective encapsulation adhesive 104 are resin encapsulation adhesive and titanium dioxide (TiO 2 ) A mixture of particles. Specifically, the resin type packaging adhesive can be epoxy resin, phenolic resin and polyesterOne or more of a resin-like, polyurethane-like or acrylic resin. The reflectivity of the reflective encapsulant 104 can be achieved by adjusting the content of titanium dioxide particles in the mixture.
Wherein the packaging area of the reflective packaging adhesive 104 is more than 3mm×3 mm. The packaging area of the reflective packaging adhesive 104 can be adjusted according to the size of the driving switch 103, but since the minimum incision that can be made by the reflective layer 105 is 3mm, that is, the minimum cross-sectional areas of the first through hole 105a and the second through hole 105b formed by the reflective layer 105 are 3mm×3mm, the packaging area of the reflective packaging adhesive 104 is required to be more than 3mm×3mm, so as to ensure the connection between the reflective packaging adhesive 104 and the reflective layer 105, so that the reflectivity of the entire backlight module 10 is basically uniform.
Wherein the reflectance of the reflective layer 105 is 95% or more. Specifically, the reflectance of the reflective layer 105 is 95%, 96%, 97%, 98%, or 99%. The reflective layer 105 may be made of white material or other high reflectivity color material. The provision of the reflective layer 105 can improve the light utilization efficiency of the light emitting diode 102. The first through hole 105a and the second through hole 105b are arranged on the reflecting layer 105 to place the light emitting diode 102 and the driving switch 103, so that the reflecting layer 105 can be bonded more smoothly, the bonding difficulty of the reflecting layer 105 is reduced, and the bonding reliability is improved.
As shown in fig. 1, the driving switch 103 and the reflective encapsulation adhesive 104 corresponding to the encapsulation driving switch 103 may be disposed in the second through hole 105b of the reflective layer 105. As shown in fig. 2, the reflective encapsulation compound 104 may be attached to the edge of the second through hole 105b of the reflective layer 105. The specific arrangement mode is not limited as long as the reflective packaging adhesive 104 and the reflective layer 105 can be ensured to be seamlessly cut, and the reflectivity of the backlight module 10 can be ensured to be basically uniform.
In the backlight module 10 provided by the embodiment of the application, the reflective layer 105 is provided with the first through hole 105a and the second through hole 105b at the light emitting diode 102 and the driving switch 103 respectively, and the driving switch 103 is encapsulated by the reflective encapsulation adhesive 104. On the one hand, the driving switch 103 can be further reinforced, the reliability of the driving switch is improved, meanwhile, the reflectivity of the reflective packaging adhesive 104 is higher, and light reflected at the driving switch 103 can be reflected back, so that dark spots are prevented from being displayed. On the other hand, when the reflective layer 105 is attached, the first through hole 105a and the second through hole 105b are respectively arranged at the light emitting diode 102 and the driving switch 103, so that all the first through hole and the second through hole are exposed, the attachment is smoother, the attaching difficulty of the reflective layer 105 is reduced, and the attaching reliability of the reflective layer 105 is enhanced.
Referring to fig. 3, fig. 3 is a schematic diagram of a second structure of the backlight module 10 according to the embodiment of the application. The backlight module 102 further includes an optical film 106 and an ink layer 107, wherein the optical film 106 is disposed on a side of the reflective layer 105 away from the array substrate 101, and a light mixing distance between the optical film 106 and the light emitting diode 102 is 0mm to 10mm. The ink layer 107 is disposed between the reflective layer 105 and the array substrate 101.
Wherein, the light mixing distance D between the optical film 106 and the LED 102 is 1mm, 2mm, 5mm, 7mm, 9mm or 10mm. The light mixing Distance D (OD) of 10mm or less can reduce the panel thickness, which is advantageous for realizing the weight reduction and the thickness reduction of the liquid crystal display device.
The ink layer 107 is made of white material or other color material with high reflectivity. The ink layer 107 can protect the array substrate 101 from other processes to scratch the array substrate 101. For example, the steel mesh prevents the array substrate 101 from being crushed when the connection layer 108 is screen-printed. In addition, the use of the white material can increase the reflectance of the ink layer 107 and improve the backlight utilization.
Referring to fig. 4, fig. 4 is a schematic diagram of a first process flow of a backlight module manufacturing method according to an embodiment of the application.
201. An array substrate is provided, and the array substrate comprises a first surface and a second surface which are oppositely arranged.
202. A plurality of light emitting diodes are arranged on the first surface, and a space is reserved between the light emitting diodes.
203. A plurality of driving switches are arranged on the first surface, a space is reserved between the driving switches and the driving switches, and a space is reserved between the driving switches and the light emitting diodes.
204. And the driving switch is provided with a reflective packaging adhesive, and the reflective packaging adhesive correspondingly packages the driving switch.
The method comprises the steps of setting a reflective packaging adhesive material on a driving switch by adopting an adhesive spraying technology, and then curing the reflective packaging adhesive material to obtain the reflective packaging adhesive. Specifically, the surface of the driving switch is firstly subjected to drying treatment, then the reflective packaging adhesive material is uniformly sprayed on the driving switch through an adhesive spraying machine, and the reflective packaging adhesive material is cured after the spraying is finished, so that the reflective packaging adhesive is obtained.
205. The first surface is provided with a reflecting layer, the reflecting layer is provided with a plurality of first through holes and a plurality of second through holes, wherein the light emitting diode is correspondingly arranged in the first through holes, and the driving switch is correspondingly arranged in the second through holes.
The light emitting diode, the driving switch and the reflective packaging adhesive can be adhered to the first surface of the substrate, and the plurality of sub-reflective layers can be spliced to form the reflective layer. The first through hole and the second through hole are formed in the area, which is not covered by the light emitting diode, the driving switch and the reflective packaging adhesive, of the reflective layer.
Or firstly providing a reflecting layer, and then arranging a plurality of first through holes and second through holes on the reflecting layer corresponding to the positions of the light emitting diode and the driving switch. And a reflecting layer with a plurality of first through holes and second through holes is attached to the first surface. The method for setting the first through hole and the second through hole can be to dig holes in the reflecting layer, or to splice the sub-reflecting layers to form the reflecting layer and then integrally attach the reflecting layer to the first surface.
Referring to fig. 5, fig. 5 is a schematic diagram of a second process flow of a backlight module manufacturing method according to an embodiment of the application.
301. An array substrate is provided, and the array substrate comprises a first surface and a second surface which are oppositely arranged.
302. An ink layer is arranged on the first surface, and a vacancy of the light emitting diode and the driving switch is reserved on the ink layer.
The arrangement of the ink layer can protect the array substrate in the subsequent process, and the ink layer is white, so that the reflection efficiency of the light-emitting diode can be improved, and the light is utilized more.
303. A plurality of light emitting diodes are arranged on the first surface, and a space is reserved between the light emitting diodes.
A plurality of light emitting diodes are disposed on the first face using a surface mount technology (Surface Mounting Technology, SMT). Specifically, a screen printer is adopted to screen-print soldering paste on a bonding pad of a light-emitting diode required on an array substrate by using a steel screen, so as to prepare for welding the light-emitting diode. And then accurately mounting the light emitting diode on the soldering paste by adopting a chip mounter. And finally, melting the soldering paste at high temperature, and cooling to firmly weld the light-emitting diode and the array substrate together. The SMT technology is developed and mature at present, so that the SMT technology is adopted for surface assembly, and the product yield can be ensured.
304. A plurality of driving switches are arranged on the first surface, a space is reserved between the driving switches and the driving switches, and a space is reserved between the driving switches and the light emitting diodes.
A plurality of drive switches are disposed on the first side using a surface mount technology (Surface Mounting Technology, SMT). The specific steps are the same as those of the previous step, and will not be described again here.
The solder paste is made of one or more of tin (Sn), silver (Ag), copper (Cu), nickel (Ni) and gold (Au). The light-emitting diode and the driving switch are welded on the array substrate by the soldering paste, so that the light-emitting diode and the driving switch are more tightly connected with the array substrate, and are not easy to fall off, and the reliability of the backlight module is ensured.
305. And the driving switch is provided with a reflective packaging adhesive, and the reflective packaging adhesive correspondingly packages the driving switch.
306. The printing ink layer is provided with a reflecting layer, the reflecting layer is provided with a plurality of first through holes and a plurality of second through holes, wherein the light emitting diode is correspondingly arranged in the first through holes, and the driving switch is correspondingly arranged in the second through holes.
307. An optical film is arranged on one side of the reflecting layer far away from the array substrate, and the light mixing distance between the optical film and the light emitting diode is 0mm to 10mm.
The light mixing distance between the optical film and the light emitting diode can be realized by arranging a support column between the optical film and the light emitting diode, connecting frame glue with the edge of the array substrate between the optical film and the edge of the array substrate, or arranging a light guide plate between the optical film and the light emitting diode.
According to the backlight module manufacturing method provided by the embodiment of the application, the reflective layer is hollowed at the positions of the driving switch and the light emitting diode, so that the smooth lamination of the reflective layer is ensured, the lamination difficulty of the reflective layer is reduced, and the lamination reliability of the reflective layer is improved. And the driving switch is provided with the reflection packaging adhesive which is correspondingly packaged, so that the display dark spot is prevented from being generated at the driving switch, and the poor light shadow is further prevented from being generated by the backlight module. Is favorable for uniform light emission of the backlight module.
An embodiment of the present application provides a display panel 100, and fig. 6 is a schematic structural diagram of the display panel 100 in the embodiment of the present application. The display panel 100 includes the backlight module 10 and the packaging structure 20 described above, and the display panel 100 may further include other devices. The package structure 20 and other devices and their assembly in the embodiments of the present application are well known to those skilled in the art, and will not be described in detail herein.
The display panel 100 provided by the embodiment of the application comprises a backlight module 10 and a packaging structure 20, wherein the backlight module 10 comprises an array substrate, a light emitting diode, a driving switch, a reflective packaging adhesive and a reflective layer. The reflective layer is provided with a first through hole and a second through hole at the positions of the light emitting diode and the driving switch respectively, and the positions of the driving switch are encapsulated by adopting reflective encapsulation glue. On the one hand, the driving switch can be further reinforced, the reliability of the driving switch is improved, meanwhile, the reflectivity of the reflective packaging adhesive is higher, and light reflected at the driving switch can be reflected back, so that dark spots are prevented from being displayed. On the other hand, when the reflecting layer is attached, the first through hole and the second through hole are respectively formed in the positions of the light-emitting diode and the driving switch, so that all the light-emitting diode and the driving switch are exposed, the attaching is smoother, the attaching difficulty of the reflecting layer is reduced, and the attaching reliability of the reflecting layer is enhanced.
The backlight module, the backlight module manufacturing method and the display panel provided by the embodiment of the application are described in detail, and specific examples are applied to illustrate the principles and the implementation of the application, and the description of the above examples is only used for helping to understand the application. Meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.

Claims (10)

1. A backlight module, comprising:
the array substrate comprises a first surface and a second surface which are oppositely arranged;
the light emitting diodes are arranged on the first surface, a plurality of light emitting diodes are arranged, and a space is reserved between the light emitting diodes;
the driving switches are arranged on the first surface, a plurality of driving switches are arranged, a space is reserved between each driving switch and each driving switch, and a space is reserved between each driving switch and each light emitting diode;
the reflecting layer is arranged on the first surface, a first through hole and a second through hole are formed in the reflecting layer, and a plurality of first through holes and a plurality of second through holes are formed in the reflecting layer;
the printing ink layer is arranged between the reflecting layer and the array substrate, a third through hole and a fourth through hole are formed in the printing ink layer, a plurality of third through holes are formed in the fourth through hole, the third through holes are communicated with the first through holes, the fourth through holes are communicated with the second through holes, the light emitting diodes are correspondingly arranged in the first through holes and the third through holes, and the driving switch is correspondingly arranged in the second through holes and the fourth through holes;
the reflection packaging glue is used for correspondingly packaging the driving switch; the reflective packaging glue covers the driving switch, extends and is arranged in the second through hole and is connected with the reflective layer, and the projection area of the reflective packaging glue on the array substrate is larger than the projection area of the driving switch on the array substrate.
2. The backlight module according to claim 1, wherein the reflective packaging adhesive has a reflectivity of 80% or more for light.
3. A backlight module according to claim 2, wherein the reflective packaging adhesive has a packaging area of 3mm x 3mm or more.
4. A backlight module according to claim 1, wherein the light emitting diodes and the driving switches are arranged in an array on the first surface, and the light emitting diodes and the driving switches are alternately arranged one by one.
5. A backlight module according to claim 1, further comprising an optical film disposed on a side of the reflective layer away from the array substrate, wherein a light mixing distance between the optical film and the light emitting diode is 0mm to 10mm.
6. A backlight module manufacturing method is characterized by comprising the following steps:
providing an array substrate, wherein the array substrate comprises a first surface and a second surface which are oppositely arranged;
arranging an ink layer on the first surface, and reserving a third through hole and a fourth through hole on the ink layer;
a plurality of light emitting diodes are arranged in the third through hole of the first surface, and a space is reserved between the light emitting diodes;
a plurality of driving switches are arranged in the fourth through hole of the first surface, an interval is arranged between the driving switch and the driving switch, and an interval is arranged between the driving switch and the light emitting diode;
setting a reflective packaging adhesive on the driving switch, wherein the reflective packaging adhesive correspondingly packages one driving switch, and the reflective packaging adhesive covers the driving switch;
the printing ink layer is provided with a reflecting layer, the reflecting layer is provided with a plurality of first through holes and a plurality of second through holes, the light emitting diode is correspondingly arranged in the first through holes, the driving switch is correspondingly arranged in the second through holes, the reflecting packaging glue extends into the second through holes and is connected with the reflecting layer, and the projection area of the reflecting packaging glue on the array substrate is larger than the projection area of the driving switch on the array substrate.
7. The method of claim 6, wherein disposing a reflective layer on the first surface comprises:
attaching a plurality of sub-reflecting layers to the area of the first surface, which is not covered by the light emitting diode, the driving switch and the reflective packaging adhesive;
and a plurality of sub-reflecting layers are spliced to form the reflecting layer.
8. The method of claim 6, wherein disposing a reflective layer on the first surface comprises:
providing a reflecting layer;
a plurality of first through holes and second through holes are arranged on the reflecting layer at positions corresponding to the light emitting diodes and the driving switches;
the first surface is provided with a plurality of reflecting layers of the first through holes and the second through holes in a laminating mode.
9. The method of claim 6, wherein disposing a reflective encapsulant on the driving switch comprises:
a reflective packaging adhesive material is arranged on the driving switch by adopting an adhesive spraying technology;
and curing the reflective packaging adhesive material to obtain the reflective packaging adhesive.
10. A display panel comprising a backlight module according to any one of claims 1 to 5.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113840476B (en) * 2021-09-06 2024-03-12 惠州视维新技术有限公司 LED backlight module, preparation method thereof and LED display screen
CN114994980B (en) * 2022-06-01 2024-01-26 Tcl华星光电技术有限公司 Backlight plate, preparation method thereof and display device
CN115755462A (en) * 2022-11-02 2023-03-07 苏州华星光电技术有限公司 Reflector plate, backlight module and display device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103439833A (en) * 2013-08-21 2013-12-11 深圳Tcl新技术有限公司 Backlight module and display device comprising same
CN205991445U (en) * 2016-07-29 2017-03-01 合肥惠科金扬科技有限公司 Down straight aphototropism mode set and display device
CN108983494A (en) * 2018-07-27 2018-12-11 惠州市华星光电技术有限公司 Backlight module and preparation method thereof
CN109031773A (en) * 2017-06-09 2018-12-18 群创光电股份有限公司 Display device
CN109613753A (en) * 2018-12-28 2019-04-12 厦门天马微电子有限公司 A kind of backlight module and electronic equipment
CN111051974A (en) * 2017-09-26 2020-04-21 苹果公司 Electronic device having display with direct-lit backlight unit
CN210835515U (en) * 2019-09-30 2020-06-23 深圳Tcl新技术有限公司 Supporting structure, backlight module and display device thereof
CN111505868A (en) * 2020-05-11 2020-08-07 Tcl华星光电技术有限公司 Backlight module and display panel

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120099050A1 (en) * 2009-07-09 2012-04-26 Sharp Kabushiki Kaisha Illumination device, display device, and television receiver
KR20110064747A (en) * 2009-12-08 2011-06-15 엘지디스플레이 주식회사 Backlight unit and liquid crystal display device having the same
CN109239980A (en) * 2018-11-28 2019-01-18 厦门天马微电子有限公司 Backlight assembly and display device
CN111477653B (en) * 2020-04-22 2023-08-15 京东方科技集团股份有限公司 Display panel, display device and manufacturing method of display panel

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103439833A (en) * 2013-08-21 2013-12-11 深圳Tcl新技术有限公司 Backlight module and display device comprising same
CN205991445U (en) * 2016-07-29 2017-03-01 合肥惠科金扬科技有限公司 Down straight aphototropism mode set and display device
CN109031773A (en) * 2017-06-09 2018-12-18 群创光电股份有限公司 Display device
CN111051974A (en) * 2017-09-26 2020-04-21 苹果公司 Electronic device having display with direct-lit backlight unit
CN108983494A (en) * 2018-07-27 2018-12-11 惠州市华星光电技术有限公司 Backlight module and preparation method thereof
CN109613753A (en) * 2018-12-28 2019-04-12 厦门天马微电子有限公司 A kind of backlight module and electronic equipment
CN210835515U (en) * 2019-09-30 2020-06-23 深圳Tcl新技术有限公司 Supporting structure, backlight module and display device thereof
CN111505868A (en) * 2020-05-11 2020-08-07 Tcl华星光电技术有限公司 Backlight module and display panel

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