CN113840476B - LED backlight module, preparation method thereof and LED display screen - Google Patents

LED backlight module, preparation method thereof and LED display screen Download PDF

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Publication number
CN113840476B
CN113840476B CN202111038528.4A CN202111038528A CN113840476B CN 113840476 B CN113840476 B CN 113840476B CN 202111038528 A CN202111038528 A CN 202111038528A CN 113840476 B CN113840476 B CN 113840476B
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China
Prior art keywords
ink
pcb
led chip
printing
ink layer
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CN113840476A (en
Inventor
巫殷伟
桑永昌
岳春波
杨宇琦
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Huizhou Shiwei New Technology Co Ltd
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Huizhou Shiwei New Technology Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The application discloses an LED backlight module and a preparation method thereof and an LED display screen, wherein the preparation method comprises the following steps: providing a PCB; printing first printing ink on the PCB; soldering an LED chip on a side of the PCB printed with the first ink; and printing second ink on the surface of the first ink while avoiding the position of the LED chip, wherein the reflectivity of the second ink is larger than that of the first ink after welding. The second printing ink is printed after the LED chips are welded, so that the problem of yellowing of the printing ink caused by welding is solved, the light reflection effect of the second printing ink on the LED chips is ensured, and the LED display effect is improved.

Description

LED backlight module, preparation method thereof and LED display screen
Technical Field
The application relates to the field of LED display, in particular to an LED backlight module, a preparation method thereof and an LED display screen.
Background
In the aspect of LED display, the main display structure is an LED backlight module, the structure of the LED backlight module comprises a PCB (printed circuit board) and an LED chip, wherein the structure for reflecting light mainly depends on white ink printed on the PCB or a reflecting sheet attached to the PCB, and light emitted by the LED chip is reflected by the PCB so as to improve the display effect of the LED backlight module.
The white ink is printed on a PCB, and an LED chip is arranged on the PCB. When preparing LED backlight unit, need solder paste in order to connect the LED chip on the PCB board with the solder paste of reflow soldering on the PCB board, then cause the white ink on the PCB board to take place the yellowing because of the high temperature, the white ink after the yellowing influences the luminance and the luminous colour of LED chip, and then influences LED display effect.
Disclosure of Invention
The embodiment of the application provides an LED backlight module, a preparation method thereof and an LED display screen, and can improve the LED display effect.
In a first aspect, an embodiment of the present application provides a method for preparing an LED backlight module, including:
providing a PCB;
printing first printing ink on a PCB;
soldering an LED chip on one side of the PCB printed with the first ink;
and (3) avoiding the position of the LED chip, and printing second ink on the surface of the first ink, wherein the reflectivity of the second ink is larger than that of the first ink after welding.
In a second aspect, an embodiment of the present application further provides a method for preparing an LED backlight module, including:
providing a PCB;
printing first ink on a PCB to form a first ink layer;
windowing is carried out on the first ink layer so as to leak out a bonding pad on the PCB;
soldering the electrodes of the LED chip to the bonding pads by solder paste;
printing second printing ink on the solder paste, wherein the reflectivity of the second printing ink is larger than that of the solder paste.
In a third aspect, embodiments of the present application further provide an LED backlight module, including:
a PCB board;
a first printing ink layer is printed on the PCB;
an LED chip is welded on one side of the PCB printed with the first ink layer;
the first ink layer is printed with the second ink layer at a position avoiding the LED chip.
In a fourth aspect, embodiments of the present application further provide another LED backlight module, including:
a PCB board;
a first printing ink layer is printed on the PCB;
an LED chip is welded on one side of the PCB printed with the first ink layer;
the PCB is provided with a bonding pad which is exposed out of the first ink layer and is welded with an electrode of the LED chip through solder paste;
the solder paste is printed with a second ink layer.
In a fifth aspect, embodiments of the present application further provide an LED display screen, where the LED display screen includes an LED backlight module provided in any embodiment of the present application.
According to the technical scheme, after the LED chip is welded, the second printing ink is printed, and the second printing ink can cover the first printing ink which is subjected to yellowing through the welded LED chip, so that the second printing ink does not influence the light reflection effect, and furthermore, the light reflection rate of the second printing ink is higher than that of the first printing ink, so that light of the LED chip is reflected by the higher light reflection rate, and the display effect of the LED backlight module is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flow chart of a method for manufacturing an LED backlight module according to an embodiment of the present application.
Fig. 2 is a schematic diagram of performing inkjet printing according to an embodiment of the present application.
Fig. 3 is a front view of an LED backlight module according to an embodiment of the present application.
Fig. 4 is a flow chart of another preparation method of an LED backlight module according to an embodiment of the present application.
Fig. 5 is a front view of another LED backlight module according to an embodiment of the present application.
Fig. 6 is a schematic structural diagram of an LED display screen according to an embodiment of the present application.
Labeling and describing: 10. a PCB board; 20. a first ink layer; 30. an LED chip; 40. a second ink layer; 50. and (5) solder paste.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by a person skilled in the art without any inventive effort, are intended to be within the scope of the present application based on the embodiments herein.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1, fig. 1 is a flow chart of a method for manufacturing an LED backlight module according to an embodiment of the present disclosure. The specific flow of the preparation method of the LED backlight module provided by the embodiment of the application can be as follows:
step 101, providing a PCB.
The PCB refers to a printed circuit board, and the printed circuit board comprises a substrate, a metal coating and a circuit. Because the PCB is relatively common, specific structures, circuit principles and preparation methods of the PCB are not described in detail herein, and it can be appreciated that the PCB capable of supplying power to the LED chip can be used in the present embodiment, and a person skilled in the art can select a suitable PCB according to actual needs.
Step 102, printing first ink on a PCB.
The first ink may be any ink of any color, and is not limited herein, as long as the first ink can provide a certain thickness.
For example, the first ink may be white ink, on one hand, the cost of the white ink is low, so that the production cost can be saved, on the other hand, the covering power of the white ink is excellent, and the white ink is printed on the PCB board to assist in reflecting the light of the LED chip.
Common white inks include ordinary white ink, high hiding power Bai Mo, high temperature resistant white ink, and the like, and since the types of white ink are various, not specifically listed here, a person skilled in the art can select an appropriate white ink according to actual needs.
The printing method of the first ink on the PCB board may be a plurality of printing methods, which are commonly known as silk screen printing, but not limited to silk screen printing, and may also be ink jet printing, digital printing, etc., correspondingly, different printing methods may be selected from the first inks with different compositions, which may be specific according to actual requirements, and the present invention is not limited thereto.
Step 103, welding an LED chip on one side of the PCB printed with the first ink.
Illustratively, when the LED chip is soldered, the electrode of the LED chip is soldered to the PCB, and after the LED chip is soldered to the PCB, the light bead is directed away from the PCB, so that light emitted by the light bead can be reflected by the first ink.
In this embodiment, the number, color and arrangement of the beads in the LED chips are not limited, and the number of the LED chips is not limited, wherein the number of the LED chips may be one or more. It can be understood that, in this embodiment, only after the LED chip is soldered onto the PCB, the structure on the PCB can provide the light reflecting effect for the LED chip, and similarly, the arrangement mode of the PCB or the mounting mode of the LED chip for providing the light reflecting effect for the LED chip should not be taken as a limitation of the embodiment of the present application.
And 104, avoiding the position of the LED chip, and printing second ink on the surface of the first ink, wherein the reflectivity of the second ink is larger than that of the first ink after welding.
Illustratively, the second ink is printed on the first ink, and the first ink is dried when the second ink is printed, and the drying mode of the first ink is not limited herein, and the second ink can be self-dried or dried, only that the second ink is not printed on the LED chip, and the covering surface of the second ink includes the ink layer formed by the first ink.
Through the welding LED chip after printing first printing ink in this application embodiment, print the second printing ink after the welding LED chip, can enough avoid the second printing ink to produce the yellowing, can guarantee the light reflection effect of the ink layer that the second printing ink formed to the LED chip again. Therefore, the problems that the first ink is easy to yellow or the cost for attaching the reflecting plate is increased in the prior art are solved.
In some embodiments, the second ink and the first ink may both be the same ink, or the light reflectance of the second ink is greater than that of the first ink, so long as the light reflectance of the second ink is greater than that of the first ink after soldering, so as to enhance the light reflectance effect.
For example, the first ink and the second ink may be white ink, i.e. a first layer of white ink is printed on the PCB before soldering, at this time, the reflectance of Bai Mo is reduced due to yellowing, and then a second layer of white ink is printed thereon, the second layer of white ink does not cause yellowing, and the reflectance of the second layer of white ink is greater than that of the first layer of white ink. Similarly, the first ink and the second ink may be both highly reflective inks, or the first ink may also be low reflective inks and the second ink may be highly reflective inks, and specific principles are not described herein, as long as the reflectance of the second ink is high.
The second ink may be any of a highly reflective ink or a white ink, and the highly reflective ink may be a highly reflective white oil or a highly reflective titanium dioxide, for example. Wherein the reflectance of the second ink may be not less than 90%.
In some embodiments, the highly reflective ink may be printed using ink jet printing or plateless digital printing. Among them, inkjet printing is a type of printing that is contactless, pressureless, and plate-free, and can be performed by inputting information stored in an electronic computer into an inkjet printer.
As shown in fig. 2, fig. 2 is a schematic diagram of performing inkjet printing according to an embodiment of the present application. The second ink is printed in an ink-jet printing mode, a uniform second ink layer can be formed on the surface of the first ink, the ink-jet printing can directly spray the joint position of the LED chip and the first ink through the spray head, so that overprinting precision is improved, blank positions between the LED chip and the first ink can be filled, a flat second ink layer is obtained, and the light reflecting effect is improved.
In addition, compared with the mode of printing only one layer of white ink in the prior art, since the silk screen printing mode is often used for printing ink in the prior art, the printing precision can be affected due to the limitation of the silk screen printing, and chromatic aberration exists at different parts after printing. By printing the second ink on the first ink in an inkjet printing manner, the problems of printing accuracy and color difference existing in the prior art can be solved. Of course, the first ink may also be printed by inkjet printing in the embodiments of the present application.
In some embodiments, at least two layers of ink may be printed on the PCB board.
Through printing at least two-layer printing ink, on the one hand can strengthen the reflection effect, on the other hand can guarantee that the thickness of printing ink layer is thick enough to with LED chip bottom parallel and level or be higher than the LED chip bottom, can avoid the LED chip bottom protruding for printing ink layer and influence reflection effect or not pleasing to the eye.
It will be appreciated that the number of times or the number of layers of printing the first ink or the second ink is not limited in the embodiments of the present application, as long as the ink layer can be ensured to have a sufficient hiding power, or the thickness of the ink layer is sufficiently thick to be flush with or higher than the bottom of the LED chip.
The present application also provides a first embodiment of printing a first ink on a PCB board, in which embodiment step 102 comprises:
1021. printing a layer of first ink on the PCB to obtain a first ink layer.
In this embodiment, the first ink may be spread on the PCB, which can save the printing process and the printing cost, for example, screen printing is adopted, and different PCBs may share one printing plate for printing, so as to save printing plates.
In this embodiment, step 103 includes:
1031. and windowing on the first ink layer to leak out the bonding pads on the PCB.
The bonding pad is an interface of a circuit in the PCB, and can be connected with the circuit in the PCB.
The first ink is windowed by exposing the pad, and the window-opening method is not limited herein.
1032. The electrodes of the LED chip are soldered to the pads by means of solder paste.
Illustratively, solder paste is soldered between the bonding pad and the electrode in a reflow soldering process at a temperature of 260 ℃ to thereby electrically connect the bonding pad and the electrode, so that electricity can be supplied between the circuit and the LED chip, and the circuit can control light emission of the LED chip.
The present application also provides a second embodiment of printing the first ink on a PCB board, in which embodiment step 102 comprises:
1022. and printing the first ink at a position avoiding the bonding pad of the PCB.
Specifically, a part of the first ink is printed on the PCB, so that the first ink is not printed on the bonding pad of the PCB, and the first ink is printed on the rest positions, so that the process of windowing the first ink to expose the bonding pad is omitted, and the processing program and the processing time are saved.
Of course, before printing the first ink, the fluorine-based hydrophobic and oleophobic coating can be printed on the bonding pad position of the PCB in advance so as to form a hydrophobic and oleophobic coating on the bonding pad position, so that the first ink is prevented from adhering to the bonding pad, and further the first ink can be prevented from smearing the bonding pad.
In this embodiment, step 103 includes:
step 1033, bonding the electrodes of the LED chip to the pads by solder paste.
Solder paste is welded between the bonding pad and the electrode through a reflow soldering process, so that the LED chip is electrified. Compared with the prior art in which window opening is needed, the distance between the first ink layer and the LED chip after window opening is different, so that window opening precision is low, and the problem of low window opening precision can be solved through the method of the embodiment.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
It will be appreciated that when printing the first ink, a person skilled in the art may choose to print the ink and perform the subsequent soldering of the LED chip by using the method of the first embodiment in the present application according to actual requirements, and may choose to print the first ink and perform the subsequent soldering of the LED chip by using the method of the second embodiment in the present application. The specific embodiments are not limited to the first embodiment and the second embodiment, and the manners of the first embodiment and the second embodiment are only limited to examples and are not limited to the schemes of the present application.
In one embodiment, the step 104 includes:
and (3) avoiding the position of the LED chip, printing second ink on the surface of the first ink, and covering the surface of the solder paste with the second ink after leveling and filling a gap between the LED chip and the PCB.
Illustratively, there is a gap between the solder paste, the LED chip and the PCB board, by increasing the thickness of the ink layer of the second ink, the second ink can flow into the gap to cover the surface of the solder paste and fill the gap between the bottom of the LED chip and the PCB board when printing the second ink, i.e. the second ink can fill the gap between the bottom of the LED chip and the PCB board, and can fill the gap between the solder paste and the first ink layer, and further a smooth and flat second ink layer can be obtained, and the second ink layer is tightly connected with the LED chip, so as to improve the light reflection effect.
Compared with the prior art, the air bubbles are formed by leaving gaps between solder pastes and are easy to enter, and therefore the luminous efficiency of the LED chip is affected.
Secondly, compared with the prior art that only white ink is printed or a reflecting sheet is pasted, and then a gap is reserved between the LED chip and the white ink layer or the reflecting sheet to influence the reflecting effect, the reflecting effect can be improved by filling the gap with the second ink.
On the other hand, compared with the prior art that light of the LED chip is absorbed due to the fact that solder paste is exposed, the luminous efficiency is reduced, and in the embodiment of the application, the second printing ink can be leveled on the surface of the solder paste and cannot absorb the light of the LED chip, so that the luminous efficiency of the LED chip is improved.
In some embodiments, experiments are performed on the light influence of a traditional single-layer white ink layer and the light influence of a double-layer ink layer in the embodiments of the application, the experimental mode is modeled by light tools, further simulation is performed, the receiving energy results of the single-layer white ink layer in a spherical receiver are respectively 0.866watts and 0.919watts, and compared with the traditional single-layer white ink layer, the luminous efficiency of a single LED chip can be improved by 6% by an inkjet printed high-reflection ink layer scheme. Therefore, the scheme of the embodiment of the application can improve the illumination intensity of the LED chip, and the overall luminous effect of the LED backlight module is improved.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
Therefore, the preparation method of the LED backlight module provided by the embodiment of the invention simplifies the production process and saves the production cost by printing the second printing ink instead of attaching the reflecting plate. And the second printing ink does not need to be subjected to reflow soldering treatment, so that the light reflecting effect of the second printing ink layer on the LED chip can be ensured. And the second printing ink is filled at the bottom of the LED chip, so that the luminous efficiency of the LED chip cannot be affected, and furthermore, the second printing ink is covered on the solder paste, so that the light absorption of the solder paste to the LED chip can be avoided, and the light reflection effect is improved.
In an embodiment, an LED backlight module is also provided. Referring to fig. 3, fig. 3 is a front view of an LED backlight module according to an embodiment of the present application.
The LED backlight module comprises: the LED chip comprises a PCB 10, a first ink layer 20, an LED chip 30 and a second ink layer 40, wherein the first ink layer 20 is printed on the surface of the PCB 10, the LED chip 30 is welded on the position, where the first ink layer 20 is printed, of the PCB 10, the LED chip 30 is electrically connected with the PCB 10, and the second ink layer 40 is printed on the first ink layer 20, where the position of the LED chip 30 is avoided.
The LED backlight module of the embodiment has a simple structure, saves production cost compared with the prior art in which the reflector plate needs to be attached, ensures the light reflection effect, and can solve the problem that the yellowing of the first printing ink affects the light-emitting effect.
In some embodiments, the first ink layer 20 may be any ink, and reference may be made to the above-mentioned scheme in the preparation method of the LED backlight module.
Of course, the number of layers of the first ink layer 20 or the second ink layer 40 in this embodiment is not limited to two, and a plurality of layers may be obtained by printing a plurality of times, and the above-described method may be referred to for specific embodiments.
In one embodiment, the PCB 10 is provided with pads exposed from the first ink layer 20, the electrodes of the LED chip 30 are soldered to the pads by the solder paste 50, and the second ink layer 40 covers the first ink layer 20 and the surface of the solder paste 50 and fills the gap between the LED chip 30 and the PCB.
Illustratively, the second ink layer 40 covers the first ink layer 20 and the surface of the solder paste 50, and fills the bottom of the LED chip 30 through the gap between the solder paste 50 and the first ink layer 20, so as to connect the LED chip 30 and the PCB board 10, and connect the solder paste 50 and the first ink layer 20.
It should be noted that, the preparation methods of the LED backlight module provided in the embodiment of the present application and the LED backlight module in the above embodiment belong to the same concept, and the LED backlight module in the embodiment can be obtained by any method in the preparation methods of the LED backlight module, and detailed implementation processes of the method are shown in the preparation method embodiment of the LED backlight module, which is not described herein.
From the above, the LED backlight module provided in the embodiment of the present application can form the flat second ink layer 40, so as to improve the light reflection efficiency of the LED chip 30, and on the other hand, the second ink layer 40 is in close contact with the LED chip 30, so as to improve the light emitting effect.
Referring to fig. 4, fig. 4 is a flowchart illustrating a method for manufacturing another LED backlight module according to an embodiment of the present disclosure. The specific flow of the preparation method of another LED backlight module provided in the embodiment of the present application may be as follows:
201. a PCB board is provided.
202. Printing first ink on the PCB to form a first ink layer.
203. And windowing on the first ink layer to leak out the bonding pads on the PCB.
204. The electrodes of the LED chip are soldered to the pads by means of solder paste.
205. Printing second printing ink on the surface of the solder paste, wherein the reflectivity of the second printing ink is larger than that of the solder paste.
In this embodiment, the second ink is printed on the surface of the solder paste, so that the solder paste is prevented from absorbing light of the LED chip, the light emitting effect of the LED chip is ensured, meanwhile, the coverage area of the second ink is reduced, and the printing cost is saved. The specific implementation of each step may refer to the above embodiments, and will not be described herein.
In some embodiments, the first ink and the second ink may be the same ink, or the reflectance of the second ink is greater than that of the first ink, which is not limited herein, and may be specifically referred to in the above embodiments, where the reflectance of the second ink is only required to be greater than that of the solder paste.
In some embodiments, the first ink and the second ink are printed in the manner mentioned in the above embodiments, for example, by silk screen printing or ink jet printing. The manner of printing the first ink may be any one of the first embodiment or the second embodiment of printing the first ink on the PCB, which is not described herein.
In some embodiments, step 205 comprises:
and printing second printing ink on the surface of the solder paste, and filling a gap between the LED chip and the PCB after the second printing ink is leveled.
Because the LED chip is welded on the solder paste, and a gap is reserved between the solder paste and the bottom of the LED chip, when the second printing ink is printed on the solder paste, the second printing ink automatically flows into the gap and fills the bottom of the LED chip so as to fill between the bottom of the LED chip and the PCB.
In some embodiments, step 205 may further comprise:
and printing second ink on the surface of the solder paste, and covering the first ink layer and the bottom of a gap filled between the LED chip and the PCB after the second ink is leveled.
In this embodiment, the second ink may also be leveled on the first ink layer, thereby covering part or all of the first ink.
In some embodiments, at least two layers of ink may be printed on the PCB board. The number of layers of the first ink or the number of layers of the second ink are not limited here, as long as the thickness of the ink layer is sufficiently thick to be flush with or higher than the bottom of the LED chip.
By the preparation method, the second printing ink can be printed on the solder paste, so that the solder paste is prevented from absorbing light of the LED chip, and the luminous effect of the LED chip is ensured.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
It should be noted that, the preparation method of the LED backlight module provided in this embodiment and the preparation method provided in the foregoing embodiments belong to the same concept, and detailed implementation processes of the method are shown in the foregoing embodiments of the preparation method, which is not repeated herein.
Referring to fig. 5, fig. 5 is a front view of the LED backlight module provided in the embodiment of the present application. Wherein, include:
the PCB 10, the first ink layer 20, the LED chip 30 and the second ink layer 40; wherein, the PCB 10 is printed with a first ink layer 20; an LED chip 30 is soldered on the side of the PCB board 10 on which the first ink layer 20 is printed; the PCB 10 is provided with a bonding pad which is exposed out of the first ink layer 20 and is welded with an electrode of the LED chip 30 through solder paste 50; the solder paste 50 has a second ink layer 40 printed thereon.
The LED backlight module structure can replace the process of attaching the reflecting plate in the prior art, thereby saving the production cost and simplifying the process.
In some embodiments, the second ink layer 40 covers the surface of the solder paste 50 and fills the gap between the LED chip 30 and the PCB board 10.
Illustratively, the second ink layer 40 covers the surface of the solder paste 50 and fills the gap between the LED chip 30 and the PCB board 10, so as to connect the solder paste 50 and the LED chip 30.
In some embodiments, the second ink layer 40 may also cover the surface of the first ink layer 20, wherein the first ink layer 20 may be partially covered or the first ink layer 20 may be entirely covered.
Of course, the number of layers of the first ink layer 20 or the second ink layer 40 in this embodiment is not limited to two, and a plurality of layers may be obtained by printing a plurality of times, and the above-described method may be referred to for specific embodiments.
It should be noted that, the preparation methods of the LED backlight module provided in the embodiment of the present application and the LED backlight module in the above embodiment belong to the same concept, and the LED backlight module in the embodiment can be obtained by any method in the preparation methods of the LED backlight module, and detailed implementation processes of the method are shown in the preparation method embodiment of the LED backlight module, which is not described herein.
From the above, the LED backlight module provided in this embodiment can replace the process of attaching the reflective sheet in the prior art, thereby reducing the production cost, simplifying the production process, being convenient for improving the production efficiency, and guaranteeing the light emitting effect.
The embodiment of the application also provides an LED display screen, as shown in fig. 6, and fig. 6 is a schematic structural diagram of the LED display screen in the embodiment of the application. The LED display screen comprises the LED backlight module. The LED display screen can be formed by a plurality of or one LED backlight module, the LED display screen can be obtained by arranging a panel outside the LED backlight module, and the specific processing mode or specific structure of the LED display screen is not limited herein, so long as the LED display screen is obtained by applying the LED backlight module prepared by the method disclosed by the embodiment of the application, the LED display screen belongs to the protection scope claimed by the application.
The above describes in detail the preparation method, the device, the medium and the electronic equipment of the LED backlight module provided in the embodiments of the present application, and specific examples are applied to describe the principles and the embodiments of the present application, where the description of the above embodiments is only used to help understand the method and the core idea of the present application; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present application, the contents of the present specification should not be construed as limiting the present application in summary.

Claims (9)

1. The preparation method of the LED backlight module is characterized by comprising the following steps:
providing a PCB;
printing first printing ink on the PCB;
soldering an LED chip on a side of the PCB on which the first ink is printed, specifically, soldering an electrode of the LED chip to a pad of the PCB by solder paste;
and (3) avoiding the position of the LED chip, printing second ink on the surface of the first ink, specifically, avoiding the position of the LED chip, printing the second ink on the surface of the first ink, and covering the surface of the solder paste with the second ink after leveling and filling the bottom of a gap between the LED chip and the PCB so as to connect the LED chip, the PCB, the solder paste and the first ink layer, wherein the ink layer formed by the first ink and the second ink is higher than the bottom of the LED chip, and the reflectivity of the second ink is larger than that of the first ink after welding.
2. The method of claim 1, wherein printing the first ink on the PCB comprises:
printing a layer of first ink on the PCB to obtain a first ink layer;
before the electrode of the LED chip is welded to the bonding pad through solder paste, the method comprises the following steps:
and windowing on the first ink layer to leak out the bonding pads on the PCB.
3. The method of claim 1, wherein printing the first ink on the PCB comprises:
and printing the first ink at a position avoiding the PCB bonding pad.
4. The method for manufacturing an LED backlight module according to claim 3, wherein before the first ink is printed on the PCB, the method further comprises:
and printing a hydrophobic and oleophobic coating on the bonding pad, wherein the hydrophobic and oleophobic coating is used for preventing the first ink from adhering to the bonding pad.
5. The method of claim 4, wherein the second ink is printed by inkjet printing.
6. The preparation method of the LED backlight module is characterized by comprising the following steps:
providing a PCB;
printing first ink on the PCB to form a first ink layer;
windowing is carried out on the first ink layer so as to leak out a bonding pad on the PCB;
soldering the electrode of the LED chip to the bonding pad through solder paste;
printing second ink on the surface of the solder paste, specifically, printing second ink on the surface of the solder paste, and covering the first ink layer and filling the bottom of a gap between the LED chip and the PCB after the second ink is leveled so as to connect the LED chip, the PCB, the solder paste and the first ink layer, wherein the ink layer formed by the first ink layer and the second ink layer is higher than the bottom of the LED chip, and the reflectivity of the second ink is higher than that of the first ink after welding.
7. An LED backlight module, comprising:
a PCB board;
a first printing ink layer is printed on the PCB;
an LED chip is welded on one side of the PCB printed with the first ink layer, specifically, a bonding pad is arranged on the PCB, the bonding pad is exposed out of the first ink layer, and the bonding pad is welded with an electrode of the LED chip through solder paste;
the LED chip is characterized in that a second ink layer is printed on the position, which is avoided by the first ink layer, of the LED chip, the second ink layer covers the surface of the first ink layer and the surface of the solder paste, and fills the bottom of a gap between the LED chip and the PCB so as to connect the LED chip, the PCB, the solder paste and the first ink layer, the ink layer formed by the first ink layer and the second ink layer is higher than the bottom of the LED chip, and the reflectivity of the second ink layer is higher than that of the first ink side after welding.
8. An LED backlight module, comprising:
a PCB board;
a first printing ink layer is printed on the PCB;
an LED chip is welded on one side of the PCB printed with the first ink layer;
the PCB is provided with a bonding pad which is exposed out of the first ink layer and is welded with the electrode of the LED chip through solder paste;
the LED module is characterized in that a second ink layer is printed on the solder paste, the second ink layer covers the surface of the solder paste and the surface of the first ink layer, and fills the bottom of a gap between the LED chip and the PCB so as to connect the LED chip, the PCB, the solder paste and the first ink layer, the second ink layer covers the first ink, the ink layer formed by the first ink and the second ink is flush with the bottom of the LED chip, and the reflectivity of the second ink layer is larger than that of the first ink side after welding.
9. An LED display screen, characterized in that the LED display screen comprises an LED backlight module according to any one of claims 7 to 8.
CN202111038528.4A 2021-09-06 2021-09-06 LED backlight module, preparation method thereof and LED display screen Active CN113840476B (en)

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