CN106163098A - A kind of LED PCB improving reflectance and preparation method thereof - Google Patents
A kind of LED PCB improving reflectance and preparation method thereof Download PDFInfo
- Publication number
- CN106163098A CN106163098A CN201610773020.1A CN201610773020A CN106163098A CN 106163098 A CN106163098 A CN 106163098A CN 201610773020 A CN201610773020 A CN 201610773020A CN 106163098 A CN106163098 A CN 106163098A
- Authority
- CN
- China
- Prior art keywords
- layer
- welding
- led
- welding resisting
- resisting layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Abstract
The invention discloses a kind of LED PCB improving reflectance and preparation method thereof, by being provided for reflecting the first welding resisting layer and second welding resisting layer of LED lamplight among LED PCB, LED PCB is made to have the structure of double reflecting layers, jointly LED lamplight is reflected by the first welding resisting layer and the second welding resisting layer, substantially increase the LED PCB reflection efficiency to LED lamplight, the luminous degree making LED disclosure satisfy that use requirement, thus improves the service efficiency of LED.
Description
Technical field
The present invention relates to a kind of LED PCB improving reflectance, be particularly well-suited to need to improve LED reflection
The use occasion of rate.
Background technology
The existing printed circuit board (PCB) for mounting LED, only carries out the most anti-welding process, therefore in print on its circuit
Only one layer of anti-solder ink layer in printed circuit board, LED only utilizes this layer of anti-solder ink layer to carry out the reflection of light source, easily goes out
Now reflect the situation of deficiency, be unfavorable for the abundant luminous of LED, thus reduce the service efficiency of LED.
Summary of the invention
For solving the problems referred to above, it is an object of the invention to provide a kind of LED PCB improving reflectance, energy
Enough raising reflection efficiencies to LED further so that the luminous degree of LED disclosure satisfy that use requirement, thus improves
The service efficiency of LED.
The present invention solves its problem and be the technical scheme is that
A kind of LED PCB improving reflectance, including dielectric layer, is arranged on dielectric layer for realizing signal biography
Defeated electrical layer, the first welding resisting layer that can be used in reflection LED lamplight and the second welding resisting layer, electrical layer includes for welding LED
The pad of lamp and the circuit being connected with pad, be provided with gap between pad, the first welding resisting layer be covered in dielectric layer with electrically
Other parts in addition to pad locations on Ceng, the second welding resisting layer is arranged on the first welding resisting layer in addition to interstitial site
Other parts.
Further, dielectric layer is aluminium base.
Further, the first welding resisting layer and the second welding resisting layer are white anti-solder ink layer.
Further, a kind of method making LED PCB improving reflectance, comprise the following steps:
A, dielectric layer is carried out copper plating treatment and etch processes, obtain printed circuit board base board；
B, at printed circuit board base board, there is the one side of pad and circuit and be coated with and enclose the first welding resisting layer, and carry out anti-welding exposure for the first time
Light and welding masking developing；
C, it is coated with on the first welding resisting layer and encloses the second welding resisting layer, and carry out the anti-welding exposure of second time and welding masking developing；
D, carry out subsequent handling process；
E, test and test, completing the making of LED PCB.
The invention has the beneficial effects as follows: a kind of LED PCB improving reflectance and preparation method thereof, except weldering
Outside dish, the first welding resisting layer covers other positions in electrical layer, pad and the gap being arranged between pad and constitutes use
In the patch portion of attachment LED, in addition to the position of patch portion, the second welding resisting layer covers other of the first welding resisting layer
Position so that LED PCB has the structure of double reflecting layers, it is possible to increase the reflection efficiency to LED so that LED
Luminous degree disclosure satisfy that use requirement, thus improve the service efficiency of LED.
Accompanying drawing explanation
The invention will be further described with example below in conjunction with the accompanying drawings.
Fig. 1 is the schematic diagram of LED PCB of the present invention；
Fig. 2 is the flow chart that the present invention makes LED PCB.
Detailed description of the invention
With reference to Fig. 1, a kind of LED PCB improving reflectance of the present invention, including dielectric layer 1, it is arranged at Jie
On matter layer 1 for realize signal transmission electrical layer 2, can be used in reflect LED lamplight the first welding resisting layer 3 and second anti-welding
Layer 4, electrical layer 2 includes the pad 21 for welding LED and the circuit 22 being connected with pad 21, is provided with between pad 21
Gap 23, the first welding resisting layer 3 is covered in other parts on dielectric layer 1 and electrical layer 2 in addition to pad 22 position, and second prevents
Layer 4 is arranged at other parts on the first welding resisting layer 3 in addition to position, gap 23, and wherein, dielectric layer 1 is aluminium base, the
One welding resisting layer 3 and the second welding resisting layer 4 are white anti-solder ink layer.Pad 21 and the gap 23 being arranged between pad 21 are constituted
For mounting the patch portion of LED, the first welding resisting layer 3 covers other positions in electrical layer 2 in addition to pad 21, the
Two welding resisting layers 4 cover other positions on the first welding resisting layer 3 in addition to patch portion position, the first welding resisting layer 3 and second
LED lamplight can be reflected by welding resisting layer 4 jointly so that LED PCB has the structure of double reflecting layers, therefore, it is possible to
Improve the reflection efficiency to LED so that the luminous degree of LED disclosure satisfy that use requirement, thus improves making of LED
Use efficiency.
With reference to Fig. 1-Fig. 2, a kind of method making LED PCB improving reflectance, comprise the following steps:
A, dielectric layer 1 is carried out copper plating treatment and etch processes, obtain printed circuit board base board；
B, at printed circuit board base board, there is the one side of pad 21 and circuit 22 and be coated with and enclose the first welding resisting layer 3, and carry out for the first time
Anti-welding exposure and welding masking developing；
C, it is coated with on the first welding resisting layer 3 and encloses the second welding resisting layer 4, and carry out the anti-welding exposure of second time and welding masking developing；
D, carry out subsequent handling process；
E, test and test, completing the making of LED PCB.Respectively by step B and the process of step C so that
Printed circuit board base board has carried out twice anti-welding exposure and welding masking developing, so that LED PCB has double reflecting layers
Structure, by the first welding resisting layer 3 and the second common reflection to LED lamplight of welding resisting layer 4, substantially increase LED printing
The circuit board reflection efficiency to LED lamplight so that the luminous degree of LED disclosure satisfy that use requirement, thus improves LED
Service efficiency.
It is above the preferably enforcement of the present invention is illustrated, but the invention is not limited in above-mentioned embodiment party
Formula, those of ordinary skill in the art also can make all equivalent variations on the premise of spirit of the present invention or replace
Changing, deformation or the replacement of these equivalents are all contained in the application claim limited range.
Claims (4)
1. the LED PCB that can improve reflectance, it is characterised in that: include dielectric layer (1), be arranged at described medium
For realizing the electrical layer (2) of signal transmission, can be used in first welding resisting layer (3) and second of reflection LED lamplight on layer (1)
Welding resisting layer (4), described electrical layer (2) includes the pad (21) for welding LED and the line being connected with described pad (21)
Road (22), is provided with gap (23) between described pad (21), described first welding resisting layer (3) be covered in described dielectric layer (1) with
Other parts in addition to described pad (22) position on electrical layer (2), described second welding resisting layer (4) is arranged at described first
Other parts in addition to described gap (23) position on welding resisting layer (3).
A kind of LED PCB improving reflectance the most according to claim 1, it is characterised in that: described medium
Layer (1) is aluminium base.
A kind of LED PCB improving reflectance the most according to claim 1, it is characterised in that: described first
Welding resisting layer (3) and described second welding resisting layer (4) are white anti-solder ink layer.
4. the method making the arbitrary described a kind of LED PCB improving reflectance of claim 1-3, its feature exists
In: comprise the following steps:
A, described dielectric layer (1) is carried out copper plating treatment and etch processes, obtain printed circuit board base board；
B, printed circuit board base board have described pad (21) and circuit (22) one side be coated with enclose the first described welding resisting layer
, and carry out for the first time anti-welding exposure and welding masking developing (3)；
C, it is coated with on the first welding resisting layer (3) and encloses described the second welding resisting layer (4), and carry out the anti-welding exposure of second time with anti-welding
Development；
D, carry out subsequent handling process；
E, test and test, completing the making of LED PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610773020.1A CN106163098A (en) | 2016-08-30 | 2016-08-30 | A kind of LED PCB improving reflectance and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610773020.1A CN106163098A (en) | 2016-08-30 | 2016-08-30 | A kind of LED PCB improving reflectance and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106163098A true CN106163098A (en) | 2016-11-23 |
Family
ID=57344912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610773020.1A Pending CN106163098A (en) | 2016-08-30 | 2016-08-30 | A kind of LED PCB improving reflectance and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106163098A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020253217A1 (en) * | 2019-06-19 | 2020-12-24 | 深圳市洲明科技股份有限公司 | Circuit board and display screen |
| CN113840476A (en) * | 2021-09-06 | 2021-12-24 | 惠州视维新技术有限公司 | LED backlight module, preparation method thereof and LED display screen |
| CN116685071A (en) * | 2023-06-07 | 2023-09-01 | 江苏博敏电子有限公司 | Solder resist manufacturing method for improving backlight reflectivity |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005051029A (en) * | 2003-07-28 | 2005-02-24 | Matsushita Electric Works Ltd | Method of manufacturing multilayer wiring board |
| CN102326461A (en) * | 2009-02-24 | 2012-01-18 | 日立化成工业株式会社 | Wiring board, electronic device package, and methods of production of same |
| CN104681691A (en) * | 2014-11-14 | 2015-06-03 | 易美芯光（北京）科技有限公司 | Low-light attenuation flip chip-packaging LED (light-emitting diode) integrated light source structure and preparation method thereof |
| CN206061279U (en) * | 2016-08-30 | 2017-03-29 | 江门全合精密电子有限公司 | A kind of LED PCB for improving reflectance |
-
2016
- 2016-08-30 CN CN201610773020.1A patent/CN106163098A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005051029A (en) * | 2003-07-28 | 2005-02-24 | Matsushita Electric Works Ltd | Method of manufacturing multilayer wiring board |
| CN102326461A (en) * | 2009-02-24 | 2012-01-18 | 日立化成工业株式会社 | Wiring board, electronic device package, and methods of production of same |
| CN104681691A (en) * | 2014-11-14 | 2015-06-03 | 易美芯光（北京）科技有限公司 | Low-light attenuation flip chip-packaging LED (light-emitting diode) integrated light source structure and preparation method thereof |
| CN206061279U (en) * | 2016-08-30 | 2017-03-29 | 江门全合精密电子有限公司 | A kind of LED PCB for improving reflectance |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020253217A1 (en) * | 2019-06-19 | 2020-12-24 | 深圳市洲明科技股份有限公司 | Circuit board and display screen |
| CN113840476A (en) * | 2021-09-06 | 2021-12-24 | 惠州视维新技术有限公司 | LED backlight module, preparation method thereof and LED display screen |
| CN113840476B (en) * | 2021-09-06 | 2024-03-12 | 惠州视维新技术有限公司 | LED backlight module, preparation method thereof and LED display screen |
| CN116685071A (en) * | 2023-06-07 | 2023-09-01 | 江苏博敏电子有限公司 | Solder resist manufacturing method for improving backlight reflectivity |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |
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| RJ01 | Rejection of invention patent application after publication |