CN113840476A - LED backlight module, preparation method thereof and LED display screen - Google Patents

LED backlight module, preparation method thereof and LED display screen Download PDF

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Publication number
CN113840476A
CN113840476A CN202111038528.4A CN202111038528A CN113840476A CN 113840476 A CN113840476 A CN 113840476A CN 202111038528 A CN202111038528 A CN 202111038528A CN 113840476 A CN113840476 A CN 113840476A
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China
Prior art keywords
ink
printing
pcb
led chip
led
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CN202111038528.4A
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Chinese (zh)
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CN113840476B (en
Inventor
巫殷伟
桑永昌
岳春波
杨宇琦
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Huizhou Shiwei New Technology Co Ltd
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Huizhou Shiwei New Technology Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The application discloses an LED backlight module, a preparation method thereof and an LED display screen, wherein the preparation method comprises the following steps: providing a PCB board; printing first ink on the PCB; welding an LED chip on one side of the PCB printed with the first ink; and printing second printing ink on the surface of the first printing ink by avoiding the position of the LED chip, wherein the reflection rate of the second printing ink is greater than that of the first printing ink after welding. The second printing ink is printed after the LED chip is welded, so that the problem of ink yellowing caused by welding is solved, the light reflection effect of the second printing ink on the LED chip is ensured, and the LED display effect is improved.

Description

LED backlight module, preparation method thereof and LED display screen
Technical Field
The application relates to the field of LED display, in particular to an LED backlight module, a preparation method thereof and an LED display screen.
Background
In the aspect of LED display, the main display structure is an LED backlight module, the LED backlight module structurally comprises a PCB (printed circuit board) and LED chips, wherein the structure for reflecting light mainly depends on white ink printed on the PCB or a reflector plate attached to the PCB, and light emitted by the LED chips is reflected by the PCB so as to improve the display effect of the LED backlight module.
The white ink is printed on a PCB, and the PCB is provided with an LED chip. When the LED backlight module is manufactured, solder paste needs to be reflowed on the PCB to connect the LED chip to the PCB, so that the white ink on the PCB is yellowed due to high temperature, and the yellowed white ink affects the brightness and color of the LED chip, thereby affecting the LED display effect.
Disclosure of Invention
The embodiment of the application provides an LED backlight module, a preparation method thereof and an LED display screen, and the LED display effect can be improved.
In a first aspect, an embodiment of the present application provides a method for manufacturing an LED backlight module, including:
providing a PCB board;
printing first ink on a PCB;
welding an LED chip on one side of the PCB printed with the first ink;
and (4) avoiding the position of the LED chip, and printing second ink on the surface of the first ink, wherein the reflection rate of the second ink is greater than that of the first ink after welding.
In a second aspect, an embodiment of the present application further provides another method for manufacturing an LED backlight module, including:
providing a PCB board;
printing first ink on a PCB to form a first ink layer;
a window is opened on the first ink layer so as to leak the bonding pad on the PCB;
welding the electrode of the LED chip to the bonding pad through solder paste;
and printing second printing ink on the solder paste, wherein the light reflection rate of the second printing ink is greater than that of the solder paste.
In a third aspect, an embodiment of the present application further provides an LED backlight module, including:
a PCB board;
a first ink layer is printed on the PCB;
the side of the PCB printed with the first ink layer is welded with an LED chip;
the first ink layer is printed with a second ink layer at a position avoiding the LED chip.
In a fourth aspect, an embodiment of the present application further provides another LED backlight module, including:
a PCB board;
a first ink layer is printed on the PCB;
the side of the PCB printed with the first ink layer is welded with an LED chip;
a bonding pad is arranged on the PCB and exposed out of the first ink layer, and the bonding pad is welded with an electrode of the LED chip through solder paste;
the second ink layer is printed on the solder paste.
In a fifth aspect, an embodiment of the present application further provides an LED display screen, where the LED display screen includes an LED backlight module provided in any embodiment of the present application.
According to the technical scheme, after the LED chip is welded, the second printing ink is printed, and the second printing ink can cover the first printing ink which is yellowed by the welded LED chip, so that the light reflection effect cannot be influenced by the second printing ink, moreover, the light reflection rate of the second printing ink is higher than that of the first printing ink, the light which is reflected by the LED chip with higher light reflection rate is realized, and the display effect of the LED backlight module is further improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for manufacturing an LED backlight module according to an embodiment of the present disclosure.
Fig. 2 is a schematic diagram of performing inkjet printing according to an embodiment of the present disclosure.
Fig. 3 is a front view of an LED backlight module according to an embodiment of the present application.
Fig. 4 is a schematic flow chart of another manufacturing method of an LED backlight module according to an embodiment of the present disclosure.
Fig. 5 is a front view of another LED backlight module according to an embodiment of the present application.
Fig. 6 is a schematic structural diagram of an LED display screen provided in the embodiment of the present application.
Description of the labeling: 10. a PCB board; 20. a first ink layer; 30. an LED chip; 40. a second ink layer; 50. and (7) solder paste.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating a method for manufacturing an LED backlight module according to an embodiment of the present disclosure. The specific process of the preparation method of the LED backlight module provided by the embodiment of the application can be as follows:
step 101, providing a PCB.
The PCB refers to a printed circuit board, and the printed circuit board comprises a substrate, a metal coating and a circuit. Since the PCB is common, the specific structure, the circuit principle and the manufacturing method of the PCB are not described in detail herein, and it can be understood that the PCB capable of supplying power to the LED chip can be used in the embodiment, and those skilled in the art can select a suitable PCB according to actual needs.
Step 102, printing a first ink on the PCB.
The first ink may be any color ink, and is not limited herein, as long as the first ink can provide a certain thickness.
Illustratively, white ink can be adopted as the first ink, on one hand, production cost can be saved due to low cost of the white ink, and on the other hand, the white ink has excellent covering power and can assist in reflecting light of the LED chip when the white ink is printed on the PCB.
Common white ink comprises common white ink, high-covering power white ink, high-temperature resistant white ink and the like, and as the types of the white ink are various, the types are not listed in detail, and a person skilled in the art can select the appropriate white ink according to actual needs.
The first ink may be printed on the PCB in various manners, a common printing manner is screen printing, which is not limited to screen printing, and may also be inkjet printing, digital printing, and the like, and accordingly, different printing manners may be selected from the first inks with different components, which may be determined according to actual requirements, and are not limited herein.
And 103, welding an LED chip on the side of the PCB printed with the first ink.
Exemplarily, when the LED chip is welded, the electrode of the LED chip is welded with the PCB, and after the LED chip is welded on the PCB, the lamp bead deviates from the direction of the PCB, so that the light emitted by the lamp bead can be reflected through the first printing ink.
In this embodiment, the number, color and arrangement of the beads in the LED chip are not limited, and the number of the LED chips is also not limited, wherein the number of the LED chips may be one or more. It can be understood that, in this embodiment, it is only necessary to explain that after the LED chip is soldered to the PCB, the structure on the PCB can provide a reflective effect for the LED chip, and similarly, as long as the PCB is configured to provide a reflective effect for the LED chip or the LED chip is mounted, the configuration should not be limited by the embodiment of the present application.
And 104, avoiding the position of the LED chip, and printing second ink on the surface of the first ink, wherein the light reflection rate of the second ink is greater than that of the first ink after welding.
Illustratively, the second ink is printed on the first ink, and when the second ink is printed, the first ink is already dried, but the drying mode of the first ink is not limited here, and the first ink can be dried by self-drying or drying, and it is only required to say that the second ink is not printed on the LED chip, and the covering surface of the second ink comprises an ink layer formed by the first ink.
According to the embodiment of the application, the LED chip is welded after the first printing ink is printed, and the second printing ink is printed after the LED chip is welded, so that yellowing of the second printing ink can be avoided, and the light reflection effect of an ink layer formed by the second printing ink on the LED chip can be ensured. Therefore, the problem that the cost of attaching the reflector plate is increased due to the fact that the first printing ink is easy to yellow in the prior art is solved.
In some embodiments, the second ink and the first ink may both be the same ink, or the second ink may have a reflectivity greater than that of the first ink, so long as the reflectivity of the second ink is greater than that of the first ink after welding, thereby improving the light reflection effect.
For example, the first ink and the second ink may be both white ink, that is, a first layer of white ink is printed on the PCB before soldering, and then the white ink has a reduced reflectance due to yellowing, and then a second layer of white ink is printed thereon, and the second layer of white ink does not yellow, and the reflectance of the second layer of white ink is greater than the reflectance of the first layer of white ink. Similarly, the first ink and the second ink may be both high-reflectivity ink, or the first ink may also be low-reflectivity ink and the second ink may be high-reflectivity ink, and specific principles are not described herein again, and it can be understood that the second ink may have a higher reflectivity.
Illustratively, the second ink may be any one of highly reflective ink or white ink, and the highly reflective ink may be highly reflective white oil or highly reflective titanium dioxide. Wherein the light reflection rate of the second ink can be not less than 90%.
In some embodiments, the means of printing the highly reflective ink may be ink jet printing or plateless digital printing. Among them, the inkjet printing is a kind of non-contact, non-pressure, non-plate printing, which can be printed by inputting information stored in an electronic computer into an inkjet printer.
As shown in fig. 2, fig. 2 is a schematic diagram of performing inkjet printing according to an embodiment of the present application. Through the mode printing second printing ink of ink-jet printing, can form even second printing ink layer on first printing ink surface, and ink-jet printing can be directly through shower nozzle spraying LED chip and first printing ink linking position, and then improved the overprinting precision, can fill the blank position between LED chip and the first printing ink, obtain smooth second printing ink layer, improve reflection of light effect.
In addition, compared with the mode of only printing one layer of white ink in the prior art, the mode of silk screen printing is commonly used in the prior art, so that the printing precision is influenced due to the limitation of the silk screen printing, and color difference exists in different parts after printing. By printing the second ink on the first ink in an ink jet printing manner, the problems of printing precision and color difference existing in the prior art can be solved. Of course, the first ink may be printed by ink-jet printing in the embodiment of the present application.
In some embodiments, at least two layers of ink may be printed on the PCB.
Through printing at least two-layer printing ink, can strengthen the reflection effect on the one hand, on the other hand can guarantee that the thickness on printing ink layer is enough thick to with LED chip bottom parallel and level or be higher than LED chip bottom, can avoid LED chip bottom to protruding and influence reflection of light effect or not pleasing to the eye for the printing ink layer.
It is understood that the number of times or the number of layers of the first ink or the second ink are printed is not limited in the embodiments of the present application, as long as the ink layer has sufficient hiding power, or the thickness of the ink layer is thick enough to be flush with or higher than the bottom of the LED chip.
The present application also provides a first embodiment of printing a first ink on a PCB, in which step 102 includes:
1021. printing a layer of first ink on the PCB to obtain a first ink layer.
In this embodiment, the PCB may be filled with the first ink, which can save the printing process and the printing cost, for example, different PCBs may share one printing plate for printing by screen printing, thereby saving the printing plate.
In this embodiment, step 103 comprises:
1031. and opening a window on the first ink layer to expose the bonding pad on the PCB.
The bonding pad is an interface of a circuit in the PCB, and the bonding pad can be connected with the circuit in the PCB.
The first ink is windowed by only exposing the pad, and the windowing manner is not limited herein.
1032. The electrodes of the LED chip are soldered to the pads by solder paste.
Solder paste is welded between the bonding pad and the electrode in a reflow soldering process at the temperature of 260 ℃, so that the bonding pad and the electrode are electrically connected, electricity can be conducted between the circuit and the LED chip, and the circuit can control the light emission of the LED chip.
The present application also provides a second embodiment of printing a first ink on a PCB, in which step 102 includes:
1022. and printing the first ink on the position avoiding the PCB pad.
Specifically, printing part of the first ink on the PCB enables the pad of the PCB not to be printed with the first ink, and the rest positions are printed with the first ink, so that the process of opening the first ink to expose the pad is omitted, and the processing procedure and the processing time are saved.
Certainly, before the first ink is printed, the fluorine-based hydrophobic and oleophobic coating can be printed on the pad position of the PCB in advance to form a hydrophobic and oleophobic coating on the pad position, so that the first ink is prevented from adhering to the pad, and the pad is prevented from being smeared by the first ink.
In this embodiment, step 103 comprises:
step 1033, solder the electrodes of the LED chip to the pads with solder paste.
And soldering the solder paste between the bonding pad and the electrode by a reflow soldering process so as to electrify the LED chip. Compared with the prior art that the distance between the first ink layer and the LED chip is different after the window is opened, the window opening precision is low, and the problem of low window opening precision can be solved by the method of the embodiment.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
It can be understood that, when the first ink is printed, a person skilled in the art can select to print the ink and perform the soldering of the subsequent LED chip by using the method of the first embodiment in the present application according to actual needs, and can select to print the first ink and perform the soldering of the subsequent LED chip by using the method of the second embodiment in the present application. The specific embodiments are not limited to the first embodiment and the second embodiment, and the manner of the first embodiment and the second embodiment is only an example and is not used to limit the application.
In one embodiment, the step 104 includes:
and avoiding the position of the LED chip, printing second ink on the surface of the first ink, leveling the second ink, covering the surface of the solder paste, and filling the gap between the LED chip and the PCB.
Exemplarily, the solder paste, the gap is formed between the LED chip and the PCB, the ink layer thickness of the second ink is increased, the second ink can flow into the gap to cover the solder paste surface and fill the gap between the bottom of the LED chip and the PCB when the second ink is printed according to the height difference, namely, the second ink can fill the gap between the bottom of the LED chip and the PCB and can fill the gap between the solder paste and the first ink layer, so that the smooth and flat second ink layer can be obtained, the second ink layer is tightly connected with the LED chip, and the light reflecting effect can be improved.
Compared with the prior art in which a gap is reserved between the solder pastes to facilitate air entering to form bubbles, and further influence the luminous efficiency of the LED chip, the scheme of the embodiment of the application can avoid entering the bubbles, and the luminous efficiency of the LED chip is ensured.
Secondly, compare in prior art only print white ink or paste the reflector plate, and then make and leave the clearance and influence the reflection effect between LED chip and white ink layer or the reflector plate, can improve the reflection effect through second printing ink filling clearance in this application embodiment.
On the other hand, compared with the prior art that the light of the LED chip is absorbed due to the fact that the solder paste is exposed, and the light emitting efficiency is reduced, the second printing ink can be leveled on the surface of the solder paste in the embodiment of the application, the light of the LED chip cannot be absorbed, and the light emitting efficiency of the LED chip is improved.
In some embodiments, through testing the influence of the traditional single-layer white ink layer on light and the influence of the double-layer ink layer on light in the embodiments, light tools are adopted in the testing mode for modeling, and then simulation is carried out, so that the received energy results of the single-layer white ink layer at the spherical receiver are respectively 0.866watts and 0.919watts, and compared with the traditional single-layer white ink layer, the high-reflection ink layer scheme obtained by ink-jet printing can improve the light-emitting efficiency of a single LED chip by 6%. Therefore, the scheme of the embodiment of the application can improve the illumination intensity of the LED chip, and the whole light-emitting effect of the LED backlight module is improved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
Therefore, according to the preparation method of the LED backlight module, the second printing ink is printed to replace the reflecting sheet, so that the production process is simplified, and the production cost is saved. And the second printing ink does not need to be subjected to reflow soldering treatment, so that the light reflecting effect of the second printing ink layer on the LED chip can be ensured. And the second printing ink is filled at the bottom of the LED chip, so that the luminous efficiency of the LED chip is not influenced, and moreover, the second printing ink covers the solder paste, so that the light absorption of the solder paste on the LED chip can be avoided, and the light reflection effect is improved.
In one embodiment, an LED backlight module is also provided. Referring to fig. 3, fig. 3 is a front view of an LED backlight module according to an embodiment of the present disclosure.
The LED backlight module comprises: the LED printing ink comprises a PCB (printed circuit board) 10, a first ink layer 20, an LED chip 30 and a second ink layer 40, wherein the first ink layer 20 is printed on the surface of the PCB 10, the LED chip 30 is welded on the position of the PCB 10 printed with the first ink layer 20, the LED chip 30 is electrically connected with the PCB 10, and the second ink layer 40 is printed on the first ink layer 20 avoiding the position of the LED chip 30.
The LED backlight module of this embodiment simple structure, and compare in prior art and need paste the reflector plate, saved manufacturing cost, and guaranteed reflection of light effect, moreover, can solve the problem that first printing ink yellow stain influences luminous effect.
In some embodiments, the first ink layer 20 may be any one of the inks, and the method may specifically refer to the scheme mentioned in the above method for preparing the LED backlight module.
Of course, the number of layers of the first ink layer 20 or the second ink layer 40 in this embodiment is not limited to two, and multiple layers can be obtained by multiple printing, and the above method can be referred to for specific embodiments.
In an embodiment, a bonding pad is disposed on the PCB 10, the bonding pad is exposed from the first ink layer 20, an electrode of the LED chip 30 is soldered to the bonding pad through a solder paste 50, and the second ink layer 40 covers the first ink layer 20 and the surface of the solder paste 50 and fills a gap between the LED chip 30 and the PCB.
Illustratively, the second ink layer 40 covers the surfaces of the first ink layer 20 and the solder paste 50, and is filled in the bottom of the LED chip 30 through a gap between the solder paste 50 and the first ink layer 20, so as to connect the LED chip 30 and the PCB board 10, and connect the solder paste 50 and the first ink layer 20.
It should be noted that the LED backlight module provided in the embodiment of the present application and the method for manufacturing the LED backlight module in the foregoing embodiments belong to the same concept, and the LED backlight module in the embodiment can be obtained by any method in the method for manufacturing the LED backlight module.
Therefore, the LED backlight module provided in the embodiment of the present application can form the second ink layer 40 that is smooth, and improve the light reflection efficiency of the LED chip 30, and on the other hand, the second ink layer 40 is in close contact with the LED chip 30, and can improve the light emitting effect.
Referring to fig. 4, fig. 4 is a schematic flow chart illustrating a manufacturing method of another LED backlight module according to an embodiment of the present disclosure. The specific process of the preparation method of another LED backlight module provided in the embodiment of the present application may be as follows:
201. a PCB board is provided.
202. Printing first ink on the PCB to form a first ink layer.
203. And opening a window on the first ink layer to expose the bonding pad on the PCB.
204. The electrodes of the LED chip are soldered to the pads by solder paste.
205. And printing second printing ink on the surface of the solder paste, wherein the light reflection rate of the second printing ink is greater than that of the solder paste.
In this embodiment, the second ink is printed only on the surface of the solder paste, so that the solder paste is ensured not to absorb the light of the LED chip, the light emitting effect of the LED chip is ensured, meanwhile, the coverage area of the second ink is reduced, and the printing cost is saved. The detailed implementation of each step can refer to the above embodiments, and is not described herein again.
In some embodiments, the first ink and the second ink may be the same ink, or the light reflectivity of the second ink is greater than that of the first ink, which is not limited herein, and in the manner mentioned in the above embodiments, in this embodiment, it is only required that the light reflectivity of the second ink is greater than that of the solder paste.
In some embodiments, the first and second inks are printed using the same methods as described in the previous embodiments, such as screen printing or ink jet printing. The method for printing the first ink may adopt any one of the first embodiment or the second embodiment of printing the first ink on the PCB, and details are not repeated herein.
In some embodiments, step 205 comprises:
and printing second ink on the surface of the solder paste, and filling the second ink into a gap between the LED chip and the PCB after the second ink is leveled.
Because the LED chip is welded on the solder paste, and a gap is reserved between the solder paste and the bottom of the LED chip, when the second ink is printed on the solder paste, the second ink automatically flows into the gap and is filled at the bottom of the LED chip so as to be filled between the bottom of the LED chip and the PCB.
In some embodiments, step 205 may further comprise:
and printing second ink on the surface of the solder paste, and covering the first ink layer and the bottom of the gap filled between the LED chip and the PCB after the second ink is leveled.
In this embodiment, the second ink may also flow on the first ink layer, thereby covering a portion or all of the first ink.
In some embodiments, at least two layers of ink may be printed on the PCB. The number of layers of the first ink or the second ink to be printed is not limited herein, as long as the thickness of the ink layer is thick enough to be flush with or higher than the bottom of the LED chip.
By the preparation method, the second printing ink can be printed on the solder paste, and the solder paste is prevented from absorbing light of the LED chip, so that the light emitting effect of the LED chip is ensured.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
It should be noted that the preparation method of the LED backlight module provided in this embodiment and the preparation method provided in the foregoing embodiment belong to the same concept, and specific implementation processes thereof are described in the foregoing embodiment of the preparation method, and are not described herein again.
Referring to fig. 5, fig. 5 is a front view of the LED backlight module according to the embodiment of the present application. Wherein, include:
the PCB comprises a PCB 10, a first ink layer 20, an LED chip 30 and a second ink layer 40; wherein, the first ink layer 20 is printed on the PCB 10; an LED chip 30 is welded on one side of the PCB 10 printed with the first ink layer 20; a bonding pad is arranged on the PCB 10, exposed out of the first ink layer 20, and welded with an electrode of the LED chip 30 through solder paste 50; the second ink layer 40 is printed on the solder paste 50.
The LED backlight module structure can replace the process of attaching the reflector plate in the prior art, thereby saving the production cost and simplifying the process.
In some embodiments, the second ink layer 40 covers the surface of the solder paste 50 and fills the gap between the LED chip 30 and the PCB board 10.
Illustratively, the second ink layer 40 covers the surface of the solder paste 50 and fills the gap between the LED chip 30 and the PCB board 10, so as to connect the solder paste 50 and the LED chip 30.
In some embodiments, the second ink layer 40 can further cover the surface of the first ink layer 20, wherein the second ink layer can partially cover the first ink layer 20, or can completely cover the first ink layer 20.
Of course, the number of layers of the first ink layer 20 or the second ink layer 40 in this embodiment is not limited to two, and multiple layers can be obtained by multiple printing, and the above method can be referred to for specific embodiments.
It should be noted that the LED backlight module provided in the embodiment of the present application and the method for manufacturing the LED backlight module in the foregoing embodiments belong to the same concept, and the LED backlight module in the embodiment can be obtained by any method in the method for manufacturing the LED backlight module.
Therefore, the LED backlight module provided by the embodiment can replace the process of attaching the reflector plate in the prior art, the production cost is reduced, the production process is simplified, the production efficiency is convenient to improve, and the light-emitting effect is ensured.
An embodiment of the present application further provides an LED display screen, as shown in fig. 6, fig. 6 is a schematic structural diagram of the LED display screen in the embodiment of the present application. The LED display screen comprises the LED backlight module. The LED display screen may be composed of a plurality of or one LED backlight module, and the LED display screen may be obtained by disposing a panel outside the LED backlight module, and the specific processing manner or specific structure of the LED display screen is not limited herein, and as long as the LED backlight module prepared by the method of the embodiment of the present application is applied to obtain the LED display screen, the LED display screen belongs to the protection scope claimed in the present application.
The method, the device, the medium and the electronic device for manufacturing the LED backlight module provided by the embodiment of the present application are introduced in detail, and a specific example is applied to illustrate the principle and the implementation manner of the present application, and the description of the embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (13)

1. A preparation method of an LED backlight module is characterized by comprising the following steps:
providing a PCB board;
printing first ink on the PCB;
welding an LED chip on one side of the PCB printed with the first ink;
and printing second printing ink on the surface of the first printing ink by avoiding the position of the LED chip, wherein the reflection rate of the second printing ink is greater than that of the first printing ink after welding.
2. The method of claim 1, wherein the printing the first ink on the PCB comprises:
printing a layer of first ink on the PCB to obtain a first ink layer;
the welding LED chip on the PCB board side printed with the first printing ink comprises:
windowing the first ink layer to leak out the bonding pad on the PCB;
and welding the electrode of the LED chip to the bonding pad through solder paste.
3. The method of claim 1, wherein the printing the first ink on the PCB comprises:
printing the first ink on a position avoiding the PCB pad;
the welding LED chip on the PCB board side printed with the first printing ink comprises:
and welding the electrode of the LED chip to the bonding pad through solder paste.
4. The method for manufacturing an LED backlight module according to claim 3, wherein before printing the first ink on the PCB, the method further comprises:
printing a hydrophobic and oleophobic coating on the pad position, wherein the hydrophobic and oleophobic coating is used for preventing the first ink from adhering to the pad.
5. The method for manufacturing an LED backlight module according to claim 2 or 3, wherein the step of printing the second ink on the surface of the first ink while avoiding the position of the LED chip comprises:
and avoiding the position of the LED chip, printing the second ink on the surface of the first ink, leveling the second ink, covering the surface of the solder paste, and filling the gap between the LED chip and the PCB.
6. The method for manufacturing an LED backlight module according to claim 5, wherein the second ink is printed by ink-jet printing.
7. A preparation method of an LED backlight module is characterized by comprising the following steps:
providing a PCB board;
printing first ink on the PCB to form a first ink layer;
windowing the first ink layer to leak out the bonding pad on the PCB;
soldering the electrodes of the LED chip to the pads by solder paste;
and printing second printing ink on the surface of the solder paste, wherein the light reflection rate of the second printing ink is greater than that of the solder paste.
8. The method for manufacturing an LED backlight module according to claim 7, wherein the printing the second ink on the solder paste surface comprises:
and printing second ink on the surface of the solder paste, and after the second ink is leveled, covering the first ink layer and filling a gap between the LED chip and the PCB.
9. An LED backlight module, characterized in that, LED backlight module includes:
a PCB board;
a first ink layer is printed on the PCB;
an LED chip is welded on one side of the PCB where the first ink layer is printed;
and a second ink layer is printed on the position where the first ink layer avoids the LED chip.
10. The LED backlight module of claim 9, wherein a bonding pad is disposed on the PCB, the bonding pad is exposed to the first ink layer and is soldered to the electrode of the LED chip by solder paste, and the second ink layer covers the first ink layer and the solder paste and fills a gap between the LED chip and the PCB.
11. An LED backlight module, characterized in that, LED backlight module includes:
a PCB board;
a first ink layer is printed on the PCB;
an LED chip is welded on one side of the PCB where the first ink layer is printed;
a bonding pad is arranged on the PCB and exposed out of the first ink layer, and the bonding pad is welded with the electrode of the LED chip through solder paste;
and a second ink layer is printed on the solder paste.
12. The LED backlight module of claim 11, wherein the second ink layer covers the solder paste and the first ink layer and fills a gap between the LED chip and the PCB.
13. An LED display screen, characterized in that the LED display screen comprises the LED backlight module according to any one of claims 9 to 12.
CN202111038528.4A 2021-09-06 2021-09-06 LED backlight module, preparation method thereof and LED display screen Active CN113840476B (en)

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