CN117490010A - Method for manufacturing PCB (printed circuit board) lamp board based on COB (chip on board) packaging - Google Patents
Method for manufacturing PCB (printed circuit board) lamp board based on COB (chip on board) packaging Download PDFInfo
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- CN117490010A CN117490010A CN202311296146.0A CN202311296146A CN117490010A CN 117490010 A CN117490010 A CN 117490010A CN 202311296146 A CN202311296146 A CN 202311296146A CN 117490010 A CN117490010 A CN 117490010A
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- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 238000005476 soldering Methods 0.000 claims abstract description 17
- 230000001680 brushing effect Effects 0.000 claims abstract description 8
- 230000004888 barrier function Effects 0.000 claims description 23
- 238000007747 plating Methods 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000007639 printing Methods 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000001723 curing Methods 0.000 description 9
- 239000011324 bead Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a method for manufacturing a PCB lamp panel based on COB packaging, which mainly comprises the following steps: judging the positions of all the lamp surface bonding pads on the PCB lamp panel; brushing a second ink layer on the PCB lamp panel at the position avoiding each lamp surface bonding pad; after the second ink layer is solidified, a leveling layered structure is formed on the PCB lamp panel so as to form pits at the positions of the lamp surface bonding pads; arranging the light emitting diodes on the corresponding lamp surface bonding pads, so that the light emitting diodes are supported on the layered structure leveled by the second ink layer, and pits on the PCB lamp panel are completely covered; the problem of insufficient flatness is solved on the layer assembly structure formed by mounting and supporting the light emitting diodes on the second ink layer, and each light emitting diode can be completely covered on the pit after being arranged on the lamp surface bonding pad through soldering so as to hide the lamp surface bonding pad in the pit, thereby avoiding the influence of the reflection light source of the lamp surface bonding pad on the display performance of the PCB lamp panel; and after the second ink layer is coated on the first ink layer, consistency of ink color can be ensured.
Description
Technical Field
The invention relates to the technical field of LED direct display equipment manufacturing processes, in particular to a method for manufacturing a PCB lamp panel based on COB packaging.
Background
With the development of the electronic product industry, the display module is one of the most important modules of the electronic product, and the display performance of high definition image quality and smoothness becomes a core technology for improving the quality and the use comfort of the electronic product, so that various PCB (printed circuit board) lamp panels capable of improving the display quality are obtained through research and development.
The PCB lamp panel adopting the COB packaging form in the prior art is the first choice of most of current electronic products, has the advantages of compact arrangement space of LED lamp beads, improvement of the protection performance of the PCB lamp panel, reduction of the dead lamp rate, prolonged service life and the like, and the image quality resolution of display equipment is obviously improved after the technology is adopted.
However, after the PCB lamp panel adopts the COB packaging technology, partial defects exist; when the distance between the light beads of the light emitting diodes is reduced by the technology, the arrangement quantity of the light emitting diodes is increased on the PCB, the light emitting diodes are generally supported by the soldering connection part, difficulty is caused when each light emitting diode meets the flatness requirement, particularly, the light emitting diodes are difficult to adjust to a state meeting the flatness requirement on the PCB, meanwhile, the problem that a light source is easily reflected by a light surface bonding pad in the soldering mode of the traditional light emitting diode exists, and the display performance of the PCB is further affected.
Disclosure of Invention
The invention discloses a method for manufacturing a PCB (printed Circuit Board) lamp panel based on COB (chip on Board) packaging, which aims to solve the technical problems that a second printing ink layer is coated on the PCB lamp panel to avoid a lamp surface bonding pad, a flattened layered structure is formed on the PCB lamp panel, a pit is formed at the position of the lamp surface bonding pad, and light emitting diodes are electrically connected with the lamp surface bonding pad in a mode of being carried on the layered structure, so that the technical problem that each light emitting diode cannot meet the flatness requirement is solved, meanwhile, the pit is covered after the light emitting diodes are mounted, so that the lamp surface bonding pad in the pit is hidden, and the influence of a reflection light source of the lamp surface bonding pad on the display performance of the PCB lamp panel is avoided.
In order to solve the technical problems, the disclosed embodiments of the invention provide a method for manufacturing a PCB lamp panel based on COB packaging, which mainly comprises the following steps:
judging the positions of all the lamp surface bonding pads on the PCB lamp panel;
brushing a second ink layer on the PCB lamp panel at the position avoiding each lamp surface bonding pad;
after the second ink layer is solidified, a leveling layered structure is formed on the PCB lamp panel so as to form pits at the positions of the lamp surface bonding pads;
each light emitting diode is arranged on the corresponding lamp surface bonding pad, so that each light emitting diode is supported on the layered structure flattened by the second ink layer, and the pits on the PCB lamp board are covered.
In some embodiments, the method for determining the position of each light surface pad on the PCB light board includes:
determining the specific positions of all the lamp surface bonding pads on the PCB lamp panel in a graphical mode;
and respectively covering a layer of barrier film on each lamp surface bonding pad according to the obtained position data.
In some embodiments, the method for brushing the second ink layer on the PCB lamp panel at the position avoiding each lamp surface pad includes:
brushing a second ink layer on the PCB lamp panel in a screen printing mode;
and the second ink layer is coated on the whole PCB lamp board, and the second ink layer positioned on the lamp surface bonding pad is attached to the barrier film.
In some embodiments, after the second ink layer is cured, a leveling layered structure is formed on the PCB panel, so as to form a pit at a position of each lamp surface pad, which includes:
after the second ink layer is solidified, pits are formed on the positions of all the lamp surface bonding pads through the layered structure of the ink;
and removing the barrier film on each lamp surface bonding pad after the second ink layer is completely solidified.
In some embodiments, the method for disposing each light emitting diode on a corresponding light surface pad, such that each light emitting diode is supported on a layered structure leveled by a second ink layer, and completely covering a pit on a PCB light board includes:
the luminous part of the light emitting diode is carried on the second ink layer, and the corresponding lamp surface bonding pad is fully wrapped in the pit through the surrounding of the second ink layer and the covering of the light emitting diode;
the connecting part at the bottom of the light emitting diode is electrically connected with the corresponding lamp surface bonding pad.
In some embodiments, the light emitting diode light emitting part is an LED chip, and the connection part is a chip pad;
the size of the resin packaging layer on the LED chip is larger than that of the pit, so that the resin packaging layer is carried on the second ink layer to cover the pit;
the chip bonding pad is formed at the bottom of the LED chip and is electrically connected with the corresponding lamp surface bonding pad;
the chip bonding pad is also provided with a chip plating bonding pad in a protruding mode, and the protruding length of the chip plating bonding pad is smaller than the depth of the pit and is used for extending into the corresponding pit.
In some embodiments, the method for electrically connecting the connection portion at the bottom of the light emitting diode with the corresponding lamp surface pad includes:
injecting solder paste into the pits of the lamp surface bonding pads through solder paste printing;
the resin packaging layer of the LED chip is carried on the second ink layer corresponding to the lamp surface bonding pad, so that each chip plating bonding pad extends into the corresponding pit, and the solder paste can be fully wrapped on the chip plating bonding pad and is attached to the corresponding lamp surface bonding pad;
and (3) soldering is completed after each chip plating bonding pad is electrically connected with the corresponding lamp surface bonding pad through solder paste.
In some embodiments, the method for covering a barrier film on each lamp surface pad according to the obtained position data further includes:
the UV film is selected to be respectively covered on each lamp surface bonding pad in an adhesive mode, so that the ink is prevented from being adhered on each lamp surface bonding pad when the second ink layer is coated.
In some embodiments, after the second ink layer is cured, a leveling layered structure is formed on the PCB panel, so as to form a pit at a position of each lamp surface pad, which includes:
and curing the second ink layer by an ultraviolet curing mode.
In some embodiments, the method for removing the barrier film on each lamp surface pad after the second ink layer is completely cured includes:
the tackiness of the UV film may be gradually removed when the second ink layer is treated by UV curing.
According to the method for manufacturing the PCB lamp panel based on the COB package, which is disclosed by the invention, firstly, the setting position of the lamp surface bonding pads on the PCB lamp panel is required to be judged, the second ink layer which is used for coating and refreshing the PCB lamp panel is covered with the first ink layer on the premise of avoiding the positions of the lamp surface bonding pads, a leveling layered structure is formed after the new second ink layer is solidified, pits are formed at the positions of the lamp surface bonding pads through the thickness of the second ink layer, the light emitting diodes are supported on the second ink layer in a lap joint manner, and further, the problem that the lamp beads cannot meet the requirement of flatness after the arrangement number of the light emitting diodes is increased is effectively solved; the PCB lamp panel manufactured by the method can effectively improve the consistency of display effect, improve the display contrast, increase the display view angle of a screen, and make up the technical defects that the display equipment is easy to generate color cast and a screen is easy to flower.
Drawings
In order to more clearly illustrate the disclosed embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a process flow diagram of a method for fabricating a PCB lamp panel based on COB packaging in accordance with the present invention;
fig. 2 is a schematic structural diagram of a PCB lamp panel according to the present invention, which is a method for manufacturing a PCB lamp panel based on COB package.
Reference numerals illustrate:
1. a PCB lamp panel; 2. a lamp face bonding pad; 3. a first ink layer; 4. a second ink layer; 5. a light emitting diode;
51. an LED chip; 52. a chip bonding pad; 53. and a chip plating pad.
Detailed Description
Embodiments of the present disclosure are described in further detail below with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the present disclosure and are not intended to limit the scope of the disclosure, which may be embodied in many different forms, not limited to the specific embodiments disclosed herein, but rather to include all technical solutions falling within the scope of the claims.
The present disclosure provides these embodiments in order to make the disclosure thorough and complete, and to fully convey the scope of the disclosure to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments should be construed as exemplary only and not limiting unless otherwise specifically stated.
In the description of the present disclosure, unless otherwise indicated, the meaning of "plurality" is greater than or equal to two; the terms "upper," "lower," "left," "right," "inner," "outer," and the like are merely used for convenience in describing the present disclosure and to simplify the description, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present disclosure. When the absolute position of the object to be described is changed, the relative positional relationship may be changed accordingly.
Furthermore, the use of the terms first, second, and the like in the present disclosure do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The "vertical" is not strictly vertical but is within the allowable error range. "parallel" is not strictly parallel but is within the tolerance of the error. The word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements.
It should also be noted that, in the description of the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the present disclosure may be understood as appropriate by those of ordinary skill in the art. When a particular device is described as being located between a first device and a second device, there may or may not be an intervening device between the particular device and either the first device or the second device.
All terms used in the present disclosure have the same meaning as those of ordinary skill in the art to which the present disclosure pertains, unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and apparatus should be considered part of the specification.
Referring specifically to fig. 1 and 2, the invention provides a method for manufacturing a PCB lamp board based on COB package, which mainly comprises the following steps:
judging the positions of all the lamp surface bonding pads 2 on the PCB lamp panel 1;
brushing a second ink layer 4 on the PCB lamp panel 1 at a position avoiding each lamp surface bonding pad 2;
after the second ink layer 4 is solidified, a leveling layered structure is formed on the PCB lamp panel 1 so as to form pits at the positions of the lamp surface bonding pads 2;
each light emitting diode 5 is arranged on the corresponding lamp surface pad 2 such that each light emitting diode 5 is supported on the flattened layered structure of the second ink layer 4, thereby covering the pit on the PCB lamp panel 1.
By adopting the method, the arrangement position of each lamp surface bonding pad 2 is judged on the incoming PCB lamp panel 1, so that the second ink layer 4 is coated on the original first ink layer 3 on the PCB lamp panel 1, when the second ink layer 4 is coated, the lamp surface bonding pad 2 on the PCB lamp panel 1 is required to be avoided, the subsequent tin soldering of the light emitting diode 5 on each lamp surface bonding pad 2 is avoided, after the second ink layer 4 is solidified, a leveling layered structure is formed on the PCB lamp panel, the welding position of each lamp surface bonding pad 2 is deepened, so that pits with the size smaller than that of the light emitting diode 4 are formed on each lamp surface bonding pad 2, and when each light emitting diode 5 is configured on the corresponding lamp surface bonding pad 2, the light emitting diode 5 is carried and supported on the layer mounting structure formed by the second ink layer 4, so that the problem that the flatness of each light emitting diode is insufficient is solved, and after each light emitting diode 5 is electrically connected with the corresponding lamp surface bonding pad 2 through tin soldering, the corresponding pit is completely covered through the light emitting diode 5, so that the reflection performance of the corresponding lamp surface bonding pad 2 is prevented from being influenced by the light emitting diode 2, and the reflection performance of the PCB is prevented from being hidden in the corresponding lamp surface bonding pad 2; and simultaneously, after the second ink layer 4 is recoated on the first ink layer 3, the consistency of ink colors of the ink can be improved.
In some embodiments, the method for determining the position of each light surface pad 2 on the PCB light board 1 includes:
determining the specific positions of all the lamp surface bonding pads 2 on the PCB lamp panel 1 in a graphical mode;
and covering a layer of barrier film on each lamp surface bonding pad 2 according to the obtained position data.
By adopting the method, the position of each lamp surface bonding pad 2 on the PCB lamp panel 1 is determined in a graphical mode, so that the area of the PCB lamp panel 1, which needs to be coated with the second ink layer, is covered with the die, the die is provided with the operation opening capable of exposing each lamp surface bonding pad 2, so that each lamp surface bonding pad 2 is covered with a layer of barrier film, and the die is taken down to coat the second ink layer 4 on the PCB lamp panel 1 after the barrier film is covered, so that the ink is prevented from entering each lamp surface bonding pad 2 through the barrier film, the area of each lamp surface bonding pad 2 is avoided when the second ink layer 4 is coated on the PCB lamp panel 1, and the purpose of forming pits on each lamp surface bonding pad 2 is achieved.
In some embodiments, the method for brushing the second ink layer 4 on the PCB board 1 avoiding the positions of the lamp surface pads 2 includes:
a second printing ink layer 4 is coated on the PCB lamp panel 1 in a screen printing mode;
the second ink layer 4 is painted on the whole PCB lamp board 1, and the second ink layer 4 on the lamp surface bonding pad 2 is attached on the barrier film.
By adopting the method, the PCB lamp panel 1 with various model sizes can be adapted to screen printing, the covering power and the adhesive force of the ink layer can be improved, so that the requirement of forming a leveling layered structure on the PCB lamp panel can be met, the screen is soft and elastic, the printing pressure degree is small, and the PCB lamp panel 1 can be better protected from being damaged in the printing process; the method adopts the whole printing of the PCB lamp panel, and as the barrier film covers each lamp surface bonding pad 2, the second ink layer 4 positioned at the position of the lamp surface bonding pad 2 is attached to the barrier film, so that the ink can not enter the lamp surface bonding pad 2 when the second ink layer 4 is coated, and the pit is not influenced to be formed on each lamp surface bonding pad 2.
In some embodiments, after the second ink layer 4 is cured, a leveling layered structure is formed on the PCB board 1, so as to form a pit at the position of each lamp surface pad 2, which includes:
after the second ink layer 4 is solidified, pits are formed on the positions of the lamp surface bonding pads 2 through the layered structure of the ink;
after the second ink layer 4 is completely cured, the barrier film on each lamp face bonding pad 2 is removed.
By adopting the method, the second ink layer 4 is cured by adopting a heat curing mode or an ultraviolet curing mode and the like to form a stable and leveled layered structure on the PCB lamp panel 1, the layered structure surrounds each lamp surface bonding pad 2 to form a pit, and after the second ink layer 4 is cured, the barrier film on each lamp surface bonding pad 2 is removed to prepare the soldering LED 5, wherein the pits for hiding the lamp surface bonding pad 2 and the leveled layered structure for carrying the LED 5 are included.
In some embodiments, the above method for disposing each light emitting diode 5 on the corresponding light surface pad 2, such that each light emitting diode 5 is supported on the layered structure flattened by the second ink layer 4, and completely covering the pit on the PCB light board 1 includes:
the light emitting part of the light emitting diode 5 is mounted on the second ink layer 4, and the corresponding lamp surface bonding pad 2 is fully wrapped in the pit through the surrounding of the second ink layer 4 and the covering of the light emitting diode 5;
the connection part at the bottom of the light emitting diode 5 is electrically connected with the corresponding lamp surface bonding pad.
By adopting the method, the light emitting diodes 5 are supported on the layered structure formed by the second ink layer 4, and as the layered structure has a leveling plane, the light emitting diodes 5 can meet the requirement of flatness in the manufacturing process when being loaded; each light emitting diode 5 is electrically connected with the corresponding lamp surface bonding pad 2 in a soldering manner, and when the light emitting diode 5 is carried on the leveling layered structure of the second ink layer 4, pits on the corresponding lamp surface bonding pad 2 can be covered, so that the lamp surface bonding pad 2 is hidden in the pits, and the influence of a lamp surface bonding pad reflection light source on the display performance of the PCB lamp panel 1 can be avoided after the soldering of the light emitting diode 5.
Referring specifically to fig. 2, in some embodiments, the light emitting portion of the light emitting diode 5 is an LED chip 51, and the connection portion thereof is a chip pad 52; the size of the resin encapsulation layer on the LED chip 51 is larger than the size of the pit to be mounted on the second ink layer 4 to cover the pit; the chip bonding pads 52 are formed at the bottom of the LED chip 51 and are electrically connected with the corresponding lamp surface bonding pads 2; the die pad 52 is also formed with a die pad 53 protruding therefrom to a length less than the depth of the recess for extending into the corresponding recess.
By adopting the method, the light-emitting diode 5 specifically comprises the LED chip 51 and the chip bonding pad 52, wherein the LED chip is a light-emitting part of the light-emitting diode 5, and when the light-emitting secondary light 5 is assembled, the LED chip is carried and supported on the layered structure of the second ink layer 4 so as to cover the pits on the corresponding lamp surface bonding pad 2; the chip bonding pad 52 is formed at the bottom of the LED chip 51 and is used for electrically connecting with the lamp surface bonding pad 2, and is fixed on the corresponding lamp surface bonding pad 2 in a soldering manner; the method adopts the structure that the second ink layer 4 is coated on the first ink layer 3, so that the PCB lamp panel 1 is thickened, and further, the contact between the chip bonding pad 52 and the lamp surface bonding pad 2 is insufficient, and the explanation is made from the other angle, namely, pits are formed at the positions of the lamp surface bonding pads 2 on the PCB lamp panel 1 through the second ink layer 4, and the LED chips 51 are required to be carried and supported on the layered structure of the second ink layer 4 to meet the flatness requirement, so that the structure causes that the chip bonding pad 52 cannot directly contact the corresponding lamp surface bonding pad 2 to carry out soldering connection; in order to solve the above problems, the present invention adds and welds the chip plating pad 53 on the chip pad 52 to increase the soldering connection portion of the light emitting diode 5, and in order to avoid the chip plating pad 53 from affecting the mounting and supporting of the light emitting diode 5 on the second ink layer 4, the size of the welded chip plating pad 53 is set to be smaller than the depth of the pit, and the chip plating pad 53 and the lamp surface pad 2 are complemented by solder paste, so as to complete the electrical connection between each light emitting diode 5 and the corresponding lamp surface pad 2.
In some embodiments, the method for electrically connecting the connection portion at the bottom of the light emitting diode 5 with the corresponding lamp surface pad includes:
each lamp face bonding pad 2 injects solder paste into the pits thereof through solder paste printing;
the resin packaging layer of the LED chip 51 is mounted on the second ink layer 4 corresponding to the lamp surface bonding pad 2, so that each chip plating bonding pad 53 extends into the corresponding pit, and the solder paste can be fully wrapped on the chip plating bonding pad 53 and attached to the corresponding lamp surface bonding pad 2;
after each chip plating land 53 is electrically connected to the corresponding lamp face land 2 by solder paste, soldering is completed.
By adopting the method, the LED chip 51 is placed in a mode that the pad surface deviates from the blue film, and the die bonding is performed in a needling mode, when the solder paste is printed on the lamp surface pad 2, the solder paste flows into the pits and fully wraps the chip plating pad 53, so that the lamp surface pad 2 and the light emitting diode 5 are electrically connected through the cooperation of the solder paste and the chip plating pad 53, no wetting phenomenon exists in the mode, short circuits are not easy to generate, and the reliability of a soldering circuit is further improved on the premise that the LED chip 51 can be naturally placed on the second ink layer 4.
In some embodiments, the method for covering a barrier film on each lamp surface pad 2 according to the obtained position data further includes:
the UV film is selected to cover each lamp surface bonding pad 2 in an adhesive mode, so that the adhesion of the ink on each lamp surface bonding pad 2 is prevented when the second ink layer 4 is coated.
By adopting the method, each lamp surface bonding pad 2 is covered by a UV film in an adhesive mode, so that the ink of the second ink layer 4 is prevented from entering the region of the lamp surface bonding pad 2 on the PCB lamp panel 1 by the UV film; the UV film selected has an adhesive surface for easy handling when covering the barrier film on the lamp face bonding pad 2, and no additional adhesive for adhering to the lamp face bonding pad 2 is required to be added on the barrier film.
In some embodiments, after the second ink layer 4 is cured, a leveling layered structure is formed on the PCB board 1, so as to form a pit at the position of each lamp surface pad 2, which includes:
the second ink layer 4 is cured by means of ultraviolet curing.
By adopting the method, the second ink layer 4 can be quickly cured by adopting the ultraviolet curing mode, the progress of the manufacturing process is accelerated, and the operation cost of ultraviolet curing is lower, so that the manufacturing cost of the ultraviolet curing ink can be reduced.
In some embodiments, the method for removing the barrier film on each lamp surface pad 2 after the second ink layer 4 is completely cured includes:
the tackiness of the UV film can be gradually eliminated when the second ink layer 4 is treated by ultraviolet curing.
By adopting the method, as the blocking film adopts the UV film, when the second printing ink layer 4 is subjected to ultraviolet curing, the viscosity of the UV film can be gradually eliminated through the irradiation of ultraviolet light beams, so that the UV film on the lamp surface bonding pad 2 is removed before the subsequent soldering of the light-emitting diode 5, unnecessary film residues are avoided when the UV film is forcedly removed, and the influence of the adhesion effect of the UV film on the normal operation of the subsequent soldering of the light-emitting diode step is avoided.
It should be noted that after the second ink layer 4 is coated, a layered structure with a thickness of 15-20um can be formed on the PCB lamp panel 1, and the modified epoxy glue mixed carbon black ink is selected as the ink in consideration of the need of improving the display performance of the PCB lamp panel 1 through the second ink 4, so that the display function of the PCB lamp panel 1 is optimized through the color contrast of the second ink layer 4, the consistency of the ink color is easy to be realized in the ink layer area on the PCB lamp panel 1, the ink color difference generated by the ink layer is effectively avoided, and the flatness of the second ink layer 4 is reduced due to ink compensation.
Thus, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concepts of the present disclosure, some details known in the art are not described. How to implement the solutions disclosed herein will be fully apparent to those skilled in the art from the above description.
Although certain specific embodiments of the present disclosure have been described in detail by way of example, it will be appreciated by those skilled in the art that the foregoing examples are for illustration only and are not intended to limit the scope of the present disclosure. It will be understood by those skilled in the art that the foregoing embodiments may be modified and equivalents substituted for elements thereof without departing from the scope and spirit of the disclosure. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict.
Claims (10)
1. A method of manufacturing a PCB lamp panel based on COB packages, comprising:
judging the positions of all the lamp surface bonding pads (2) on the PCB lamp panel (1);
brushing a second ink layer (4) on the PCB lamp panel (1) at a position avoiding each lamp surface bonding pad (2);
after the second ink layer (4) is solidified, a leveling layered structure is formed on the PCB lamp panel (1) so as to form pits at the positions of the lamp surface bonding pads (2);
each light emitting diode (5) is arranged on the corresponding lamp surface bonding pad (2) so that each light emitting diode (5) is supported on the layered structure flattened by the second ink layer (4), thereby covering the pits on the PCB lamp panel (1).
2. The method of manufacturing a PCB lamp panel based on COB package of claim 1, wherein the method of determining the location of each lamp surface pad (2) on the PCB lamp panel (1) comprises:
determining the specific positions of all the lamp surface bonding pads (2) on the PCB lamp panel (1) in a graphical mode;
and respectively covering a layer of barrier film on each lamp surface bonding pad (2) according to the obtained position data.
3. The method of manufacturing a PCB lamp panel based on COB package of claim 2, wherein the method of brushing a second ink layer (4) on the PCB lamp panel (1) avoiding the location of each lamp face pad (2) comprises:
a second printing ink layer (4) is coated on the PCB lamp panel (1) in a screen printing mode;
and the second ink layer (4) is painted on the whole PCB lamp panel (1), and the second ink layer (4) positioned on the lamp surface bonding pad (2) is attached to the barrier film.
4. A method of manufacturing a PCB lamp panel based on COB encapsulation as claimed in claim 3, wherein the method of forming a flattened layered structure on the PCB lamp panel (1) after curing the second ink layer (4) to form a pit at the location of each lamp face pad (2) comprises:
after the second ink layer (4) is solidified, pits are formed on the positions of the lamp surface bonding pads (2) through the layered structure of the ink;
and after the second ink layer (4) is completely cured, removing the barrier film on each lamp surface bonding pad (2).
5. The method of manufacturing a PCB lamp panel based on COB encapsulation of claim 4, wherein the method of arranging each light emitting diode (5) on a corresponding lamp face pad (2) such that each light emitting diode (5) is supported on a layered structure planarized by the second ink layer (4) and completely covers the pit on the PCB lamp panel (1) comprises:
the light emitting part of the light emitting diode (5) is mounted on the second ink layer (4), and the corresponding lamp surface bonding pad (2) is fully wrapped in the pit through the surrounding of the second ink layer (4) and the covering of the light emitting diode (5);
the connecting part at the bottom of the light emitting diode (5) is electrically connected with the corresponding lamp surface bonding pad.
6. The method of manufacturing a PCB lamp panel based on a COB package as claimed in claim 5, wherein,
the light emitting part of the light emitting diode (5) is an LED chip (51), and the connecting part of the light emitting part is a chip bonding pad (52);
the size of the resin packaging layer on the LED chip (51) is larger than that of the pit, so that the resin packaging layer is carried on the second ink layer (4) to cover the pit;
the chip bonding pad (52) is formed at the bottom of the LED chip (51) and is electrically connected with the corresponding lamp surface bonding pad (2);
the chip bonding pad (52) is also provided with a chip plating bonding pad (53) in a protruding mode, and the protruding length of the chip plating bonding pad is smaller than the depth of the pit and is used for extending into the corresponding pit.
7. The method of manufacturing a PCB lamp panel based on COB package of claim 6, wherein the method of electrically connecting the connection portion of the bottom of the light emitting diode (5) with the corresponding lamp surface pad includes:
each lamp surface bonding pad (2) is used for injecting solder paste into the pits of the lamp surface bonding pad through solder paste printing;
the resin packaging layer of the LED chip (51) is carried on the second printing ink layer (4) corresponding to the lamp surface bonding pad (2) so that each chip plating bonding pad (53) extends into the corresponding pit, and the solder paste can be fully wrapped on the chip plating bonding pad (53) and is attached to the corresponding lamp surface bonding pad (2);
after each chip plating pad (53) is electrically connected with the corresponding lamp surface pad (2) through solder paste, soldering is completed.
8. The method for manufacturing a PCB lamp panel based on COB package of claim 4, wherein the method for covering each lamp surface pad (2) with a barrier film according to the obtained position data, respectively, further comprises:
the UV film is selected to be respectively covered on each lamp surface bonding pad (2) in an adhesive mode, so that the adhesion of the printing ink on each lamp surface bonding pad (2) is blocked when the second printing ink layer (4) is coated.
9. The method of manufacturing a PCB lamp panel based on COB encapsulation of claim 8, wherein the second ink layer (4) after curing forms a flattened layered structure on the PCB lamp panel (1) to form a pit at the location of each lamp face pad (2), comprising:
the second ink layer (4) is cured by means of ultraviolet curing.
10. The method for manufacturing a PCB lamp panel based on COB encapsulation of claim 9, wherein the method for removing the barrier film on each lamp face pad (2) after the second ink layer (4) is completely cured comprises:
when the second ink layer (4) is treated by ultraviolet curing, the tackiness of the UV film can be gradually eliminated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311296146.0A CN117490010A (en) | 2023-10-09 | 2023-10-09 | Method for manufacturing PCB (printed circuit board) lamp board based on COB (chip on board) packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311296146.0A CN117490010A (en) | 2023-10-09 | 2023-10-09 | Method for manufacturing PCB (printed circuit board) lamp board based on COB (chip on board) packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117490010A true CN117490010A (en) | 2024-02-02 |
Family
ID=89683753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311296146.0A Pending CN117490010A (en) | 2023-10-09 | 2023-10-09 | Method for manufacturing PCB (printed circuit board) lamp board based on COB (chip on board) packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117490010A (en) |
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2023
- 2023-10-09 CN CN202311296146.0A patent/CN117490010A/en active Pending
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