JP2007243226A - Light source apparatus and display apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light source apparatus capable of improving light extracting efficiency from a light-emitting device. <P>SOLUTION: The light source apparatus 29 consists of a substrate 1 having a pair of electrodes 2, 3, the light-emitting device 4, and a transparent resin 7 for sealing the light-emitting device 4. A white resist layer 6 is formed on the substrate 1 so as to cover one part of the electrodes 2, 3, an opening 6A is provided on the white resist layer 6 on at least the light-emitting device 4 and its vicinity and on terminals of the electrodes 2, 3, and a white member 8 is formed on the white resist layer 6. In this light source apparatus 29, the height of the upper surface of the white resist layer 6 is made to be lower than the light-emitting surface of the light-emitting device 4. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light source device including a light emitting element such as a light emitting diode as a light source, and is suitable for an illumination light source device that obtains a surface light source of a desired color (white or other colors). The present invention also relates to a display device including a light source device that illuminates the display unit from the back side.

In recent years, as the output of light-emitting diodes has increased, the application of white LED light sources that use white light by using light-emitting diodes (LEDs) has expanded.
In particular, application to lighting for which high brightness is required, projector light sources, and backlights for large liquid crystal displays is considered. In these applications, from the features of light-emitting diodes such as low environmental impact due to mercury-free, good color reproducibility, good responsiveness, brightness variability, long life, etc. A white LED light source is expected as a white light source to replace conventional fluorescent tubes (hot cathode tubes and cold cathode tubes).

In the white LED light source described above, in order to save energy, that is, to improve efficiency, it is important not only to improve the light emission efficiency of the light emitting diode itself, but also to improve the light extraction efficiency from the chip of the light emitting diode. Is an element.
The light extraction efficiency from the light emitting diode chip is greatly influenced by the components around the light emitting diode chip.
That is, in order to improve the light extraction efficiency, it is necessary to devise constituent members around the light emitting diode chip.

  The connection between the electrode on the substrate and the light emitting diode chip can be made by arranging the light emitting diode package on the substrate, or by directly mounting the light emitting diode chip on the substrate and connecting it to the electrode with a wire, etc. Examples include a form in which the chip is sealed by covering the diode chip and forming a transparent resin (see, for example, Patent Document 1 and Patent Document 2).

Japanese Patent Laid-Open No. 10-294498 JP 61-144890 A

  However, in the configuration proposed heretofore, the light extraction efficiency from the light emitting diode chip has not been sufficiently increased.

  In order to solve the above problems, the present invention provides a light source device capable of improving the light extraction efficiency from a light emitting element, and a display device including the light source device.

  The light source device of the present invention includes a substrate having at least one pair of electrodes, one or more light emitting elements, and a transparent resin that seals the light emitting elements, and a white resist layer is formed on the substrate. The resist layer is formed so as to cover a part of the electrode, and has an opening at least on the light emitting element and its vicinity and on the terminal of the electrode, and a white or transparent member is formed on the white resist layer. The height of the upper surface of the white resist layer is lower than the light emitting surface of the light emitting element.

According to the configuration of the light source device of the present invention described above, the reflectance of the white resist layer is high because the white resist layer is formed on the substrate having at least one pair of electrodes. Thus, light can be efficiently emitted out of the transparent resin.
In addition, since the white resist layer has an opening in the light emitting element and its vicinity and on the electrode terminal, the electrode terminal and the light emitting element can be electrically connected through the opening of the white resist layer. It has become.
Furthermore, since a white or transparent member is formed on the white resist layer, the member can be formed in a predetermined shape by controlling the shape of the transparent resin at the time of manufacturing the light source device. In addition, when the light source device is used, even if light emitted from the light emitting element hits the member, the member is white or transparent, so that the member is hardly absorbed. it can.
Furthermore, since the height of the upper surface of the white resist layer is lower than the light emitting surface of the light emitting element, the light emitted from the light emitting surface (especially light emitted in the lateral direction or obliquely downward) is reflected upward to be reflected. The rate can be improved.

The display device of the present invention includes a display unit that displays an image and a light source device that illuminates the display unit from the back side, and this light source device is the configuration of the light source device of the present invention.
According to the configuration of the display device of the present invention described above, the light source device that illuminates the display unit from the back side is the configuration of the light source device of the present invention, so that light can be efficiently emitted out of the transparent resin. Therefore, it is possible to sufficiently ensure the luminance of the image displayed on the display unit.

According to the light source device of the present invention described above, light can be efficiently emitted out of the transparent resin. Further, since the transparent resin can be formed in a predetermined shape by controlling the shape at the time of manufacture, the transparent resin can be formed into a shape with little internal reflection, such as a spherical shape. It is possible to emit light efficiently.
Thus, since light can be efficiently emitted out of the transparent resin, the luminance of the emitted light can be sufficiently ensured. In addition, since the luminance of the emitted light can be sufficiently secured, it is possible to obtain the luminance equivalent to that of the conventional configuration with less energy.

Therefore, it is possible to achieve energy saving and long life such as reduction of power consumption of the light source device.
It is also possible to reduce the number of light emitting elements to save space and reduce component costs.

In addition, according to the display device of the present invention, it is possible to sufficiently secure the luminance of the image displayed on the display unit, so that it is possible to display an image with less energy than in the past.
Therefore, in the display device, it is possible to achieve energy saving such as reduction of power consumption and long life.
In addition, it is possible to reduce the number of light emitting elements to reduce the size and the cost of components.

  First, an outline of the present invention will be described prior to description of specific embodiments of the present invention.

  In a light source device having a structure in which a light emitting element chip such as a light emitting diode is used and the light emitting element chip is sealed with a transparent resin, the light extraction efficiency from the light emitting element chip to the outside is as described above. Affected by surrounding components.

As the influence of such a structural member, for example, the following elements can be considered.
(A) Transparent resin transmittance (B) Transparent resin refractive index (C) Transparent resin shape (thickness / curvature shape)
(D) Surface shape of substrate inside transparent resin (E) Reflectance of substrate surface inside transparent resin

Among these, (A) About the transmittance | permeability of sealing resin, it is so desirable that the transmittance | permeability is high.
Moreover, (B) About the refractive index of sealing resin, it is desirable for the refractive index difference with the exterior of sealing resin to be small.
In addition, the shape of the transparent resin (C) is spherical, so that reflection at the interface between the resin and the outside can be reduced.

  In the present invention, (D) the surface shape of the substrate inside the transparent resin and (E) the reflectance of the substrate surface inside the transparent resin are improved to improve the light extraction efficiency, and (C) the shape of the transparent resin. Can be made into a good shape.

  Therefore, in the present invention, a white resist layer is formed on a substrate having at least one pair of electrodes so as to cover a part of the electrodes, and at least in the light emitting element and its vicinity of the white resist layer and on the electrode terminals. The light source device is configured by providing an opening and further forming a white or transparent member on the white resist layer.

  By forming the white resist layer on the substrate having at least one pair of electrodes, the reflectance of the white resist layer is high, so the reflectance inside the transparent resin is improved and light is efficiently emitted outside the transparent resin. Can be emitted.

  In addition, since the white resist layer has an opening in the light emitting element and its vicinity and on the electrode terminal, the electrode terminal and the light emitting element can be electrically connected through the opening of the white resist layer. It has become.

  Further, since a white or transparent member is formed on the white resist layer, the member can be formed in a predetermined shape by controlling the shape of the transparent resin at the time of manufacturing the light source device. In addition, when the light source device is used, even if light emitted from the light emitting element hits the member, the member is white or transparent, so that the member is hardly absorbed. it can.

Thus, since light can be efficiently emitted out of the transparent resin, the luminance of the emitted light can be sufficiently ensured. In addition, since the luminance of the emitted light can be sufficiently secured, it is possible to obtain the luminance equivalent to that of the conventional configuration with less energy.
Therefore, it is possible to achieve energy saving and long life such as reduction of power consumption of the light source device.
Furthermore, for example, by reducing the number of light-emitting elements, it is possible to reduce the area and volume occupied by the light-emitting elements to save space and reduce component costs.

  As a material of the white resist layer, that is, a white resist, for example, a resist containing white titanium oxide, a solder resist FINEDEL DSR-330S42-13W (trade name) manufactured by Tamura Kaken Co., Ltd., or the like can be used. .

As the white member, for example, a white film by silk screen printing or a white film by mark printing can be used.
Examples of the material of the white film formed by such printing include, for example, S-100W CM29 (trade name) of thermosetting (one-component) marking ink manufactured by Taiyo Ink Manufacturing Co., Ltd., and development type marking ink. It is possible to use white mark ink material such as Photofiner PMR-6000 W30 / CA-40 G30 (trade name).
As the transparent member, for example, a transparent film in which water / oil repellent ink containing a transparent fluorine material is applied by pad printing can be used.
As a material for the transparent film formed by such printing or coating, for example, a water and oil repellent treatment agent FS-1010Z-10 (trade name) manufactured by Fluoro Technology can be used.

In the present invention, the white resist layer is formed by stacking two or more resist layers, so that the white resist layer can be formed thick and the reflectance can be improved.
When a single resist layer is formed thick, the resist layer is difficult to cure, and it takes time to cure, or it may be necessary to irradiate strong exposure light so as not to cause a development residue. Therefore, there is a limit to increasing the thickness of one resist layer.
On the other hand, by forming a thick white resist layer by stacking two or more resist layers, a sufficient thickness can be formed and each resist layer can be cured rapidly.

Further, in the present invention, when a white resist layer is formed by further laminating two resist layers, the area and position of the opening in the vicinity of the light emitting element are made different between the upper layer and the lower layer, so that each shape characteristic is It is possible to improve the reflectance.
When the area of the opening in the vicinity of the light emitting element is made larger in the upper layer than in the lower layer, the edge of the upper layer recedes from the edge of the lower layer, and the cross section becomes stepped. As a result, the shape opens upward, so that it is easy to reflect light upward.
When the area of the opening in the vicinity of the light emitting element is made smaller in the upper layer than in the lower layer, the edge of the upper layer covers the edge of the lower layer, and the corner on the surface side becomes round. Also by this, since it becomes a shape opened to the upper side, it becomes easy to reflect light upwards.
When the area of the opening in the vicinity of the light emitting element is made equal between the upper layer and the lower layer, and the position of the opening is made different between the upper layer and the lower layer, the edge of the upper layer is shifted on one side in the direction in which the position of the opening is shifted. Recedes from the edge of the lower layer, and on the other side, the edge of the upper layer covers the edge of the lower layer. Thereby, since it becomes a shape opened upward on either side, it becomes easy to reflect light upwards. Furthermore, since the area of the light emitting element that is not covered by either the upper layer or the lower layer is reduced due to the position of the opening being different between the upper layer and the lower layer, the reflectance in the vicinity of the light emitting element can be further improved. Become.
In the case of these three types of shapes, even if the positions of the two resist layers are deviated from a predetermined position to some extent, it is possible to keep the shape opened upward and to easily reflect light upward. is there.

  Similarly, in the white resist layer composed of one or more resist layers, the entire white resist layer or the opening in the vicinity of the light emitting element of each resist layer is formed as an inclined surface opened upward, It is possible to easily reflect light.

Furthermore, when the light emitting element is a bottom emission type light emitting element (the light emitting layer is below the element), the light emitting element is mounted with a gap from the electrode surface on the substrate by bump connection, and a white resist is mounted. The upper surface of the layer is disposed below the light emitting layer of the light emitting element. As a result, light emitted from the light emitting layer (particularly light emitted in the lateral direction or obliquely downward) can be reflected upward to improve the reflectance.
In this configuration, since the white resist layer enters under the light emitting layer by making the opening size of the white resist layer smaller than the outer dimension of the light emitting element, the light emitted downward from the light emitting layer is reflected upward. Further, the reflectance can be improved.
Even when the light-emitting element is a top-emitting type light-emitting element, there is light emitted from the light-emitting layer in the lateral direction or obliquely downward. Therefore, by setting the white resist layer in a similar configuration, the emitted light is directed upward. The reflectance can be improved by reflection.

  Further, the same effect can be obtained by applying this configuration to the lower layer having a stepped cross-sectional shape in which the area of the opening in the vicinity of the light emitting element in the two resist layers is larger than the lower layer. It is possible to obtain

Further, in the present invention, an identification material for recognizing the position when the light emitting element is connected to the electrode of the substrate is formed in a portion below the light emitting element of the electrode, or the substrate outside the transparent resin. By forming on the surface, the light emitted from the light emitting element can be prevented from being absorbed or scattered by the identification material, and the reflectance on the substrate surface can be improved accordingly.
In the case where the identification material is formed below the light emitting element of the electrode, the identification material is hidden in the chip of the light emitting element after the light emitting element is mounted, so that the emitted light is less likely to hit the identification material. Even when the disc is formed on the surface of the substrate outside the transparent resin, the discriminating material is far from the light emitting element, so that the emitted light is difficult to hit the discriminating material.

As such an identification material, the marking ink used for the white member described above can be used. However, it is not always necessary to use the white marking ink for the identification material, and marking inks of other colors can be used. You can use it.
In the case where the identification material is formed on the outer side than the transparent resin, when the identification material is formed on the white resist layer or the white substrate, it is easier to identify using a marking ink other than white.

  It is also possible to use the corner of the electrode in the opening of the white resist layer as an identification material. In that case as well, after mounting the light emitting element, the corners of the electrodes may be hidden by the chip of the light emitting element.

  Then, when mounting the light emitting element using the identification material, for example, the identification material is searched with a camera or the like, and the position where the light emitting element is to be mounted is confirmed.

Further, in the present invention, the light emitting element is composed of at least two kinds of light emitting elements having different emission colors including red, and the opening of the white resist layer is wide in the transparent resin for sealing the red light emitting element. With the structure in which the electrode faces the transparent resin from the opening (direct contact), a high reflectance can be obtained on the substrate surface of the red light emitting element.
This is because the metal material for electrodes has a high reflectance with respect to light having a wavelength in the vicinity of red, and the reflectance is higher than that of the white resist layer. This is because the reflectance can be increased when the electrode faces the transparent resin (direct contact).
On the other hand, in a light-emitting element whose emission color is green or blue, the white resist layer has a higher reflectance to light having a wavelength near the emission color than the electrode material, so the opening of the white resist layer has a narrow area. It is desirable to form.

Here, the wavelength dependence of the reflectance is compared between gold, silver, and copper used as a metal material for an electrode.
Gold has a high reflectivity with respect to light having a wavelength near red, and the reflectivity decreases to about 75% for light with a wavelength near green, and decreases to 40% or less for light with a wavelength near blue.
Silver has a high reflectivity for the entire visible light.
Copper has a high reflectance with respect to light having a wavelength near red, and the reflectance decreases to about 60% at a wavelength near green, and further gradually decreases from a wavelength near green to a wavelength near blue toward the short wavelength side. Reflectivity decreases. The reflectance for wavelengths near blue is about 55%, which is higher than gold.

In the present invention, a transparent water-repellent paint, for example, may be formed as a water-repellent material on the white resist layer or white member.
By providing the water repellent material composed of the water repellent paint in this manner, even when the white resist layer or the white member has insufficient water repellency, the water repellent material can be provided. Can be controlled.

The substrate on which the white resist layer is formed may be an integrated substrate for the entire light source device, but a plurality of (relatively small) substrates provided with a predetermined number of light emitting elements are arranged at regular intervals. You may comprise a light source device by.
Further, in a configuration in which a plurality of substrates are arranged, the luminance and the like in each substrate can be optimized by separately driving the light emitting elements in each substrate.

  Further, the arrangement of the light emitting elements is not particularly limited. For example, if the light emitting elements having the same emission color are arranged at a constant interval, the arrangement of the wirings and electrodes, the color distribution, and the like become uniform.

  As an embodiment of the present invention, a schematic configuration diagram of a main part of a light source device is shown in FIGS. 1A and 1B. 1A is a cross-sectional view, and FIG. 1B is a plan view.

The light source device 10 includes a pair of electrodes 2 and 3 formed on a substrate 1, and a light emitting diode chip 4 connected to the electrodes 2 and 3 is sealed with a transparent resin 7.
The light emitting diode chip 4 is disposed on one electrode 2 and is electrically connected to the electrode 2. The chip 4 and the other electrode 3 are electrically connected by a wire 5.
The transparent resin 7 is formed in a dome shape whose upper surface is a spherical surface.

In the light source device 10 of the present embodiment, in particular, the white resist layer 6 is formed on the substrate 1.
The white resist layer 6 has an opening in the vicinity of the terminal of the electrode 3 connected to the light-emitting diode chip 4 and the wire 5, and covers the electrodes 2 and 3 in a portion other than the opening.
The opening has a rectangular shape as shown in FIG. 1B. The wall surface 6 </ b> A of the opening is at a location near the terminals of the chip 4 and the electrode 3.

  Further, in the light source device 10 of the present embodiment, a white mark ink material 8 is provided around the transparent resin 7, and the shape of the transparent resin 7 is controlled by the white mark ink material 8. .

The white mark ink material 8 can be formed by a printing method such as silk screen printing, for example.
As the material of the white mark ink material 8, for example, the marking ink described above can be used.

  In addition, the material of the board | substrate 1 is not specifically limited, A normal printed circuit board etc. may be sufficient, However, By using a white board | substrate using prepreg materials, such as a glass epoxy copper clad laminated board, the reflectance of board | substrate 1 itself is used. Can be improved.

According to the light source device 10 of the above-described embodiment, the white resist layer 6 is formed on the substrate 1, and the white resist layer 6 covers the electrodes 2 and 3 except for the openings, thereby Compared with the case where 2 and 3 face the transparent resin 7 directly, the reflectance on the substrate 1 side can be increased.
Thereby, the light radiate | emitted upwards from the transparent resin 7 can be increased, and the utilization efficiency of light can be improved.

In addition, according to the light source device 10 of the present embodiment, the white mark ink material 8 is provided around the transparent resin 7, and the shape of the transparent resin 7 is controlled by the white mark ink material 8. Compared with a member such as a resin that is not white, which has been conventionally used to control the shape of the resin, light absorption by the member can be reduced, and a large amount of light emitted from the light emitting diode can be reflected.
Since the white mark ink material 8 has a reflectance equivalent to that of the white resist layer 6, the reflectance around the transparent resin 7 can be increased.

According to the light source device 10 of the present embodiment, light can be efficiently emitted out of the transparent resin 7, and thus the luminance of the emitted light can be sufficiently ensured.
In addition, since the luminance of the emitted light can be sufficiently secured, it is possible to obtain the luminance equivalent to that of the conventional configuration with less energy.
Therefore, it is possible to achieve energy saving and long life such as reduction of power consumption of the light source device 10.
Further, for example, by reducing the number of light emitting diode chips 4, it is possible to reduce the area and volume occupied by the chips 4 to save space and to reduce the component cost.

Next, a schematic configuration diagram of a main part of a light source device in which the light source device 10 shown in FIG. 1 is partially deformed is shown in FIGS. 2A and 2B.
In the light source device 11 shown in FIGS. 2A and 2B, the white mark ink material 8 is formed in a ring shape only around the transparent resin 7.

Also in this case, the shape of the transparent resin 7 can be controlled by the white mark ink material 8.
Further, since the white mark ink material 8 is present around the transparent resin 7, it is possible to reduce the absorption of light by the member and to reflect a large amount of light emitted from the light emitting diode.

  The portion other than the periphery of the transparent resin 7 does not have the white mark ink material 8 that contributes to the reflectance, and has a thickness of only the white resist layer 6, so that this portion is compared with the light source device 10 shown in FIG. 1. The reflectivity is slightly lower. On the other hand, the region where the white mark ink material 8 is formed is limited to the periphery of the transparent resin 7, so that the material cost related to the white mark ink material 8 can be reduced.

  The other configuration is the same as that of the light source device 10 shown in FIG.

Next, as another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
In the light source device 12 of the present embodiment, the white resist layer 6 is formed by laminating two resist layers 61 and 62.

Thus, since the white resist layer 6 is formed by stacking the two resist layers 61 and 62, it is easy to form the white resist layer 6 thick.
If a single resist layer is formed thick, it is difficult for exposure light to reach the lower part of the resist layer, so that the resist layer is difficult to cure. For this reason, it takes time for curing or it is necessary to irradiate with strong exposure light so as not to cause undeveloped residues. Therefore, there is a limit to increasing the thickness of one resist layer.
On the other hand, by forming the thick white resist layer 6 by laminating two or more resist layers 61 and 62, a sufficient thickness can be formed, and the resist layers 61 and 62 are rapidly cured. be able to.

  In the light source device 12 of the present embodiment, since the positions of the openings of the two resist layers 61 and 62 are the same, the wall surface 6A of the openings is almost integrated.

  The other configuration is the same as that of the light source device 10 shown in FIG.

Next, FIG. 4 shows a schematic configuration diagram (cross-sectional view) of a main part of the light source device in which the light source device 12 shown in FIG. 3 is partially modified.
In the light source device 13 shown in FIG. 4, the white mark ink material 8 is formed in a ring shape only around the transparent resin 7, similarly to the light source device 11 shown in FIGS. 2A and 2B.
Other configurations are the same as those of the light source device 12 shown in FIG.

Next, as still another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
In the light source device 14 of the present embodiment, the white resist layer 6 is formed by stacking two resist layers 61 and 62, and the white mark ink material 8 is formed by stacking two layers of ink materials 81 and 82. is doing.
The two layers of ink materials 81 and 82 are formed in the same plane pattern.

Since the white resist layer 6 is formed by stacking the two resist layers 61 and 62, it is easy to form the white resist layer 6 thick.
Further, since the white mark ink material 8 is formed by laminating the two layers of ink materials 81 and 82, the white mark ink material 8 can be formed thick.

Next, FIG. 6 shows a schematic configuration diagram (cross-sectional view) of a main part of the light source device in which the light source device 14 shown in FIG. 5 is partially modified.
In the light source device 15 shown in FIG. 6, the white mark ink material 8 is formed in a ring shape only around the transparent resin 7 like the light source device 11 shown in FIGS. 2A and 2B.
Other configurations are the same as those of the light source device 14 shown in FIG.

Next, as still another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
In the light source device 16 of the present embodiment, the white resist layer 6 is formed by stacking two resist layers 61 and 62, but the upper resist layer 62 of the two layers is only inside the transparent resin 7. Is formed.
The openings around the light-emitting diode chip 4 are formed at the same position in the lower resist layer 61 and the upper resist layer 62.

Inside the transparent resin 7, the white resist layer 6 is formed by laminating two resist layers 61 and 62, thereby forming the white resist layer 6 thick and increasing the reflectance of the white resist layer 6. be able to.
Since the upper resist layer 62 is not formed outside the transparent resin 7, the material cost of the upper resist layer 62 can be reduced.

Next, FIG. 8 shows a schematic configuration diagram (cross-sectional view) of the main part of the light source device in which the light source device 16 shown in FIG. 7 is partially modified.
In the light source device 17 shown in FIG. 8, as in the light source device 11 shown in FIGS. 2A and 2B, the white mark ink material 8 is formed in a ring shape only around the transparent resin 7.
Other configurations are the same as those of the light source device 16 shown in FIG.

Next, as still another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
In the light source device 18 of the present embodiment, the white resist layer 6 is formed by laminating two resist layers 61 and 62, but the upper resist layer 62 of the two layers is near the outer periphery of the transparent resin 7. Also, an opening is formed.
Although not shown, the opening near the outer periphery of the transparent resin 7 in the upper resist layer 62 is formed in a ring shape following the outer periphery of the transparent resin 7.
Further, in the present embodiment, the inner wall 8A of the white mark ink material 8 recedes to the outside from the above-described embodiments, and is more than the opening near the outer periphery of the transparent resin 7 of the upper resist layer 62. An inner wall 8A is formed outside. This is to prevent the white mark ink material 8 from protruding inward even if the positional relationship between the white resist layer 6 (61, 62) and the white mark ink material 8 is shifted from a predetermined position. It is.

  Since the upper resist layer 62 has an opening near the outer periphery of the transparent resin 7, the shape of the transparent resin 7 can be controlled not only by the white mark ink material 8 but also by this opening.

Next, FIG. 10 shows a schematic configuration diagram (cross-sectional view) of a main part of a light source device in which the light source device 18 shown in FIG. 9 is partially modified.
In the light source device 19 shown in FIG. 10, the white mark ink material 8 is formed in a ring shape only around the transparent resin 7, similarly to the light source device 11 shown in FIGS. 2A and 2B.
Other configurations are the same as those of the light source device 18 shown in FIG.

Next, as still another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
In the light source device 20 of the present embodiment, the white mark ink material 8 is also formed inside the transparent resin 7.
Although not shown, the white mark ink material 8 inside the transparent resin 7 is formed in a ring shape following the outer periphery of the transparent resin 7.

  Since the white mark ink material 8 is also formed inside the transparent resin 7, the reflectance of the substrate 1 side inside the transparent resin 7 can be further increased by the white mark ink material 8 having a high reflectance.

Next, FIG. 12 shows a schematic configuration diagram (cross-sectional view) of a main part of the light source device in which the light source device 20 shown in FIG. 11 is partially modified.
In the light source device 21 shown in FIG. 12, the white mark ink material 8 is formed in a ring shape around the transparent resin 7 as in the light source device 11 shown in FIGS. 2A and 2B.
Other configurations are the same as those of the light source device 20 shown in FIG.

Next, as still another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
In the light source device 22 of the present embodiment, the white resist layer 6 is formed by laminating two resist layers 61 and 62. The white resist layer 6 is formed only outside the transparent resin 7, Instead, a white mark ink material 8 is formed inside the transparent resin 7.
The white mark ink material 8 is not formed outside the transparent resin 7.

  This embodiment is different from the above-described embodiments in that the shape of the transparent resin 7 is controlled by the inner wall 6A of the opening of the white resist layer 6.

  By forming the white mark ink material 8 inside the transparent resin 7, the reflectance on the substrate 1 side inside the transparent resin 7 can be further increased by the thick white mark ink material 8.

Next, as still another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
In the light source device 23 of the present embodiment, a white resist layer 6 is formed by laminating two resist layers 61 and 62, and the white resist layer 6 is formed outside the transparent resin 7 and inside the transparent resin 7. Each of them is formed, and an opening is provided along the outer periphery of the transparent resin 7 therebetween.
Further, the white mark ink material 8 is formed on the white resist layer 6 outside the transparent resin 7, the inner wall 8 A of the white mark ink material 8 recedes to the outside, and the outer periphery of the transparent resin 7 of the white resist layer 6. The inner wall 8A is formed outside the opening along the line.

Since the white resist layer 6 is formed by laminating two resist layers 61 and 62 inside the transparent resin 7, a white resist having a relatively high reflectivity is formed thick by the two resist layers 61 and 62. By the layer 6, the reflectance on the substrate 1 side inside the transparent resin 7 can be increased.
In the present embodiment, the shape of the transparent resin 7 is controlled by the inner wall 6A of the opening along the outer periphery of the transparent resin 7 of the white resist layer 6 and the inner wall 8A of the white mark ink material 8.

Next, FIG. 15 shows a schematic configuration diagram (cross-sectional view) of a main part of a light source device in which the light source device 23 shown in FIG. 14 is partially modified.
In the light source device 24 shown in FIG. 15, the white mark ink material 8 is formed in a ring shape around the transparent resin 7, similarly to the light source device 11 shown in FIGS. 2A and 2B.
Other configurations are the same as those of the light source device 23 shown in FIG.

Next, as still another embodiment of the present invention, schematic configuration diagrams of the main part of the light source device are shown in FIGS. 16A and 16B. 16A is a cross-sectional view, and FIG. 16B is a plan view.
In the present embodiment, a light source device is configured by including light emitting diodes of two or more colors including red R.
For example, a light source device is configured by including light emitting diodes of three colors of red R, green B, and blue G. Then, each light emitting diode chip 4 is individually sealed in a transparent resin 7.
In the present embodiment, as for the red R light emitting diode chip 4R, as shown in FIGS. 16A and 16B, the opening of the white resist layer 6 is formed in a wide area inside the transparent resin 7, The electrodes 2 and 3 face the transparent resin 7 from the wide area opening.
On the other hand, in the green G light emitting diode chip 4 (4G) and the blue B light emitting diode chip 4 (4B), as in the configuration shown in FIGS. Cover the electrodes 2 and 3.

Since the metal material of the electrodes 2 and 3 has a high reflectance with respect to light having a wavelength in the vicinity of red, and the reflectance is higher than that of the white resist layer 6, the red resisting LED has a wide opening in the white resist layer 6. By forming the electrodes 2 and 3 so as to face the transparent resin 7 in an area, the reflectance on the substrate 1 side can be increased.
Since the metal materials of the electrodes 2 and 3 have a low reflectance with respect to light having a wavelength in the vicinity of green and light having a wavelength in the vicinity of blue, and the reflectance is lower than that of the white resist layer 6, By covering the electrodes 2 and 3 with the white resist layer 6 up to the vicinity of the chip 4, the reflectance on the substrate 1 side can be increased.

  As for the green G light emitting diode chip 4 (4G) and the blue B light emitting diode chip 4 (4B), the white mark ink is placed inside the transparent resin 7 as in the configuration shown in FIGS. A material 8 may be provided to increase the reflectance on the substrate 1 side by the white mark ink material 8.

16A and 16B may be partially modified so that the white mark ink material 8 is formed in a ring shape around the transparent resin 7 as shown in a cross-sectional view in FIG. Good.
16A and 16B may be partly modified so that the shape of the transparent resin 7 is controlled by the inner wall 6A of the white resist layer 6 as shown in FIG.

Next, as still another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
In the light source device 25 of the present embodiment, the white resist layer 6 is formed by laminating two resist layers 61 and 62, and the area of the opening in the vicinity of the light emitting diode chip 4 is set to be the upper resist layer 62. Is larger than the lower resist layer 61.

  By forming the area of the opening in the vicinity of the chip 4 of the light emitting diode so that the upper resist layer 62 is larger than the lower resist layer 61, the inner wall 6B of the upper resist layer 62 is formed on the lower resist layer 61. The white resist layer 6 (61, 62) has a stepped cross section that is recessed from the inner wall 6A. Thereby, since the white resist layer 6 (61, 62) has a shape opened upward, it becomes easy to reflect light upward, and thus the utilization efficiency of emitted light can be further increased.

Next, as still another embodiment of the present invention, FIG. 19 shows a schematic configuration diagram (cross-sectional view) of a main part of the light source device.
In the light source device 26 of the present embodiment, the white resist layer 6 is formed by laminating two resist layers 61 and 62, and the area of the opening in the vicinity of the light emitting diode chip 4 is set to be the upper resist layer 62. Is smaller than the lower resist layer 61.

  By forming the area of the opening in the vicinity of the chip 4 of the light emitting diode so that the upper resist layer 62 is smaller than the lower resist layer 61, the edge of the upper resist layer 62 becomes the edge of the lower resist layer 61. The corners on the surface side of the inner wall 6B of the upper resist layer 62 are rounded. Thereby, since the white resist layer 6 (61, 62) has a shape opened upward, it becomes easy to reflect light upward, and thus the utilization efficiency of emitted light can be further increased.

Next, as still another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
In the light source device 27 of the present embodiment, the white resist layer 6 is formed by laminating two resist layers 61 and 62, and the area of the opening in the vicinity of the light emitting diode chip 4 is set to the upper resist layer 62. And the lower resist layer 61, and the positions of the openings are different between the upper resist layer 62 and the lower resist layer 61. The opening of the upper resist layer 62 is formed so as to be shifted to the left in the drawing from the opening of the lower resist layer 61.

  The area of the opening in the vicinity of the chip 4 of the light emitting diode is made equal between the upper resist layer 62 and the lower resist layer 61, and the upper resist layer 62 is replaced with the lower resist layer 61. In the left-right direction in the figure, the inner wall 6B of the upper resist layer 62 recedes from the inner wall 6A of the lower resist layer 61 in the left and right directions in the figure, and the upper resist on the right side. The edge of the layer 62 covers the edge of the lower resist layer 61. As a result, the white resist layer 6 (61, 62) has a shape that opens upward on either the left or right side, so that it is easy to reflect light upward, so that the utilization efficiency of the emitted light can be further increased. . Furthermore, by shifting the positions of the upper resist layer 62 and the lower resist layer 61, the area of the opening where there is no upper resist layer 62 and no lower resist layer 61 is reduced, and the use efficiency of emitted light is reduced. It can be further increased.

  In the present embodiment, the opening of the upper resist layer 62 is also formed so as to be shifted from the opening of the lower resist layer 61 in the longitudinal direction of FIG. It can be a shape.

Next, as still another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
The light source device 28 of the present embodiment is different from the configuration of the light source device 27 shown in FIG. 20 in that the inner wall 6A of the opening of the lower resist layer 61 and the inner wall 6B of the opening of the upper resist layer 62 are either Is also configured to have an inclined surface opened upward.

Thus, in order to make the inner walls 6A and 6B of the openings of the resist layers 61 and 62 into inclined surfaces, for example, when the resist layers 61 and 62 are exposed, exposure light may be irradiated obliquely.
Further, for example, the exposure mask may be a special mask that becomes thinner toward the edge of the mask (or the exposure light transmittance increases).
Furthermore, for example, after forming the resist layers 61 and 62, it is conceivable to form an inclined surface by shaving the inner wall.
Furthermore, after forming the resist layers 61 and 62 in the printing process, it is possible to form an inclined surface by deformation due to its own weight before curing.

  The inner wall 6A of the opening portion of the lower resist layer 61 and the inner wall 6B of the opening portion of the upper resist layer 62 are both inclined surfaces opened upward, so that a staircase like the light source device 27 shown in FIG. Since the light is more easily reflected upward than in the case of the cross section having a shape, the utilization efficiency of the emitted light can be further increased.

Next, as still another embodiment of the present invention, schematic configuration diagrams of the main part of the light source device are shown in FIGS. 22A and 22B. 22A shows a cross-sectional view and FIG. 22B shows a plan view.
In the light source device 29 of the present embodiment, the chip 4 of the light emitting diode is connected to the terminals of the left and right electrodes 2 and 3 by the bumps 9 provided under the chip 4.
Further, the upper surface of the white resist layer 6 is lower than the lower surface of the chip 4.
Furthermore, the dimension of the opening of the white resist layer 6 is smaller than the outer dimension of the chip 4, and the white resist layer 6 penetrates under the chip 4. The inner wall 6A of the opening of the white resist layer 6 enters the inside of the chip 4 both in the left-right direction and in the front-rear direction, as indicated by a chain line in FIG. 22B.

Since the upper surface of the white resist layer 6 is lower than the lower surface of the light emitting diode chip 4, the upper surface of the white resist layer 6 is lower than the light emitting layer of the light emitting diode. The reflectance can be improved by reflecting the light (particularly light emitted in the lateral direction or obliquely downward) upward by the white resist layer 6.
Further, since the size of the opening of the white resist layer 6 is smaller than the outer dimension of the chip 4 and the white resist layer 6 has entered under the chip, the light emitted downward from the light emitting layer is directed upward. Reflection can further improve the reflectivity.

  This embodiment is particularly suitable for a bottom-emitting LED chip that has a light-emitting layer below the element and emits a large amount of light emitted downward, but is applied to a top-emitting LED chip. Also, the effect of improving the reflectance can be obtained.

By the way, when the light emitting diode chip 4 is connected to the electrodes 2 and 3 of the substrate 1 at the time of manufacturing the light source device, an identification material for recognizing the position of the chip 4 is usually used as a place where the chip 4 is disposed. It is provided near.
In general, a mark ink material (of a color other than white) is used as the identification material. However, when such a mark ink material is used for the chip 4 of the light emitting diode, it depends on the mark ink material. There is a possibility that light emitted from the light emitting diode is absorbed or scattered.
Alternatively, the specific shape of the electrode member prepared around the light emitting element is often used as the identification material, but exposure of the electrode member more than necessary is not necessary for the light emitting element other than the red light emitting element. Invite.

Therefore, in the light source device 29 shown in FIG. 22, for example, an identification material is formed on the surface of the electrodes 2 and 3 below the light emitting diode chip 4 or on the surface of the substrate 1 outside the transparent resin 7. .
When the identification material is formed on the surface of the electrodes 2 and 3 below the light-emitting diode chip 4, the identification material is hidden by the chip 4 after mounting the chip 4, so that the emitted light is less likely to hit the identification material. .
Even when it is formed on the surface of the substrate 1 outside the transparent resin 7, the identification material is far from the chip 4, so that the emitted light hardly hits the identification material.

  When the identification material is formed on the surface of the electrodes 2 and 3 below the light-emitting diode chip 4, a mark ink material similar to the conventional one may be used as the identification material. When the pattern (corner portion or the like) is used as the identification material, it is not necessary to provide a process for forming the identification material, so that the number of processes can be reduced and the manufacturing cost of the light source device can be reduced.

Here, in the light source device 29 shown in FIG. 22, a case where the pattern (corner portion or the like) of the electrodes 2 and 3 is used as an identification material will be described with reference to FIG. FIG. 23 is an enlarged plan view of a state in the middle of manufacturing the light source device 29, specifically, a state before the chip 4 is mounted.
The right electrode 3 is formed so as to extend to the left side under the bump 9, but the corner portion 40 on the left front side or the left back side of the electrode 3 can be used as an identification material.
Since the electrode 3 is different in color or reflectance from the substrate 1, the corner portion 40 of the electrode 3 can be easily recognized by a camera or the like.
Moreover, it is also possible to use the corner | angular part of the left electrode 2 as an identification material.
In order to use the corners of the electrodes 2 and 3 as identification materials, the corners are inside the opening (inner wall 6A) of the white resist layer 6 and are hidden by the white resist layer 6. Desirably not.

  18 to 22, the white mark ink material 8 of the transparent resin 7 is used for the light source devices 25, 26, 27, 28, and 29 shown in FIGS. You may deform | transform into the structure formed only in circumference | surroundings.

  Further, the configuration of the light source device of each embodiment shown in FIGS. 1 to 21 may be modified and connected to the left and right electrodes 2 and 3 by bumps or the like without using the wire 5. In this case, since the right and left are almost symmetrical by not using the wire 5, the positions of the inner walls of the openings of the left and right electrodes 2, 3 and the white resist layer 6 are slightly different from those shown in FIGS. It will be.

Next, as still another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
In the light source device 30 of the present embodiment, a water repellent material 41 is formed on the white mark ink material 8 formed in a ring shape around the transparent resin 7.

The water repellent material 41 is provided in order to give a good water repellent control of the shape of the transparent resin 7 when the white mark ink material 8 alone is not sufficient in water repellency.
As a material of the water repellent material 41, a water repellent paint that does not turn yellow with respect to ultraviolet rays or heat, is transparent to make use of the reflectance of the white mark ink material 8 as a base, and has a relatively low viscosity. Is suitable. Specifically, for example, a water repellent such as a silicone resin can be used for the water repellent material 41.

Next, as still another embodiment of the present invention, a schematic configuration diagram (cross-sectional view) of a main part of the light source device is shown in FIG.
In the light source device 31 of the present embodiment, a water repellent material 41 is formed outside the white mark ink material 8 formed in a ring shape around the transparent resin 7.
In this case, since the water repellent material 41 is formed outside the white mark ink material 8, the transparent resin 7 extends to the inside of the water repellent material 41.
Other configurations are the same as those of the light source device 30 shown in FIG.

  The light source device of each embodiment shown in FIGS. 1 to 25 can be used for applications such as illumination, a projector light source, and a backlight device of a color liquid crystal display device.

For example, the light source device of each of these embodiments is applied to a backlight device, and a color liquid crystal display device includes a transmissive color liquid crystal display panel and a backlight device provided on the back side of the color liquid crystal display panel. Can be configured.
When applied to a backlight device for a color liquid crystal display device, a red R light emitting diode, a green G light emitting diode, and a blue B light emitting diode are respectively sealed in a transparent resin 7, and these three colors R, A group of light emitting diodes each having a predetermined arrangement (for example, a delta arrangement arranged in a triangular shape) is formed, one by one or a predetermined number of G and B light emitting diodes. A backlight device is configured by arranging the light emitting diode groups in, for example, a matrix.

FIG. 26 shows a schematic configuration diagram (disassembled perspective view) of one embodiment of such a color liquid crystal display device.
A color liquid crystal display device 100 shown in FIG. 26 includes a transmissive color liquid crystal display panel 110 and a backlight unit 140 provided on the back side of the color liquid crystal display panel 110.

In the transmissive color liquid crystal display panel 110, two transparent substrates (TFT substrate 111 and counter electrode substrate 112) made of glass or the like are arranged to face each other, and, for example, twisted nematic (TN) liquid crystal is provided in the gap. The liquid crystal layer 113 encapsulating the liquid crystal layer 113 is provided. A thin film transistor (TFT) 116 as a switching element and a pixel electrode 117 are formed on the TFT substrate 111 in a matrix.
The thin film transistor 116 is sequentially selected by the scanning line 115 and writes the video signal supplied from the signal line 114 to the corresponding pixel electrode 117.
The counter electrode substrate 112 has a counter electrode 118 and a color filter 119 formed on the inner surface thereof.

  Although not shown, the color filter 119 is divided into segments corresponding to the respective pixels. For example, it is divided into three segments of three primary colors, a red filter, a green filter, and a blue filter.

  In this color liquid crystal display device 100, the transmissive color liquid crystal display panel 110 having such a configuration is sandwiched between two polarizing plates 131 and 132, and the backlight unit 140 irradiates white light from the back side in an active state. By driving in a matrix system, a desired full color image can be displayed.

The backlight unit 140 illuminates the color liquid crystal display panel 110 from the back side. As shown in FIG. 26, the backlight unit 140 includes a light source, a backlight device 120 that emits white light from a light irradiation surface 120 a by mixing white light emitted from the light source, and light of the backlight device 120. It is comprised from the diffusion plate 141 laminated | stacked on the output surface 120a.
The diffusing plate 141 diffuses the white light emitted from the light emitting surface 120a to make the luminance uniform in the surface emission.

The backlight device 120 is configured by arranging a light emitting diode group including light emitting diodes of three colors R, G, and B in a matrix, not shown.
As a result, each light emitting diode group emits light efficiently, so that the luminance of the image displayed on the color liquid crystal display panel 110 can be sufficiently ensured.
In addition, since the brightness of the image can be sufficiently secured, it is possible to display the image with the same brightness as that of the conventional configuration with less energy.

  In each of the embodiments described above, a light emitting diode (LED) is used as the light emitting element. However, in the present invention, the light source device may be configured using other light emitting elements. For example, a semiconductor laser or the like can be used as the light emitting element.

(Example)
Subsequently, a light source device was actually manufactured and the reflection spectral distribution was measured.
As an example, the white resist layer 6 was formed on the substrate 1 and the electrodes 2 and 3, and the thickness of the white resist layer 6 was changed to 40 μm, 30 μm, and 22.5 μm, and samples were prepared.
As a comparative example, a sample in which the white resist layer 6 was not formed was produced.

For each of these samples, the reflection spectral distribution on the electrodes (wirings) 2 and 3 was measured. In the sample of the comparative example, the reflection spectral distribution on the outside of the electrodes (wirings) 2 and 3 was also measured.
The measurement results are shown in FIG. FIG. 27 also shows the reflection spectrum of Cu used for the wiring material as a reference.

From FIG. 27, each example in which the white resist layer 6 is formed on the electrodes (wirings) 2 and 3 has a reflection spectral distribution having almost the same tendency, and a high reflectance is obtained in a wide wavelength range of visible light. It has been. It can also be seen that the reflectance gradually increases as the thickness of the white resist layer 6 is increased to 22.5 μm, 30 μm, and 40 μm. Note that the reflectance is considered to be saturated when the thickness reaches a certain level.
On the other hand, in the comparative example, the wavelength dependency is small on the outside of the electrodes (wirings) 2 and 3, and the reflectance is 60 to 65%. On the electrodes (wirings) 2 and 3, the reflectance at the short wavelength side is as low as about 53%, and the reflectance gradually increases as the wavelength becomes longer, which is almost the same as the reflection spectrum of Cu used for the wiring material. A similar trend is shown.

  That is, by adopting the configuration of each embodiment in which the white resist layer 6 is formed on the electrodes (wirings) 2 and 3, high reflectance can be obtained in a wide wavelength range of visible light, and light extraction efficiency can be increased. Can do.

  The present invention is not limited to the above-described embodiment, and various other configurations can be taken without departing from the gist of the present invention.

It is a schematic block diagram of the principal part of embodiment of the light source device of this invention. A, B It is a schematic block diagram of the principal part of the form which deform | transformed the form of FIG. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of the form which deform | transformed the form of FIG. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of the form which deform | transformed the form of FIG. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of the form which deform | transformed the form of FIG. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of the form which deform | transformed the form of FIG. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of the form which deform | transformed the form of FIG. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of the form which deform | transformed the form of FIG. It is a schematic block diagram of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of the form which deform | transformed the form of FIG. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is a schematic block diagram of the principal part of embodiment of the light source device of this invention. FIG. 23 is an enlarged plan view of a state in the middle of manufacturing the light source device of FIG. 22. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is sectional drawing of the principal part of embodiment of the light source device of this invention. It is a schematic block diagram (disassembled perspective view) of one form of the color liquid crystal display device provided with the light source device as a backlight light source. It is a figure which shows the reflective spectral distribution of the Example and comparative example of a light source device.

Explanation of symbols

  1 substrate, 2 and 3 electrodes, 4 (light emitting diode) chip, 5 wires, 6 white resist layer, 7 transparent resin, 8, 81, 82 white mark ink material, 9 bump, 10, 11, 12, 13, 14 , 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31 Light source device, 41 Water repellent material, 61, 62 Resist layer, 100 colors Liquid crystal display

Claims (21)

A substrate having at least one pair of electrodes, one or more light emitting elements, and a transparent resin for sealing the light emitting elements,
A white resist layer is formed on the substrate;
The white resist layer is formed so as to cover a part of the electrode, and has an opening at least on the light emitting element and its vicinity, and on the terminal of the electrode,
A white or transparent member is formed on the white resist layer,
The light source device, wherein a height of an upper surface of the white resist layer is lower than a light emitting surface of the light emitting element.   The light source device according to claim 1, wherein an area of the opening in the white resist layer near the light emitting element is smaller than an area of the light emitting element.   The light source device according to claim 1, wherein the white or transparent member is made of white printing ink.   The light source device according to claim 1, wherein the white or transparent member has water repellency.   The light source device according to claim 1, wherein a water-repellent paint is formed on the white resist layer or on the white or transparent member.   The light source device according to claim 1, wherein the opening portion of the white resist layer is an inclined surface having an upper side opened.   The light source device according to claim 1, wherein the white resist layer is formed by stacking two or more resist layers.   The white resist layer is formed by stacking two resist layers, and the area of the opening in the vicinity of the upper light emitting element is larger than the area of the opening in the vicinity of the lower light emitting element in the two resist layers. The light source device according to claim 1.   The white resist layer is formed by stacking two resist layers, and the area of the opening in the vicinity of the upper light emitting element is smaller than the area of the opening in the vicinity of the lower light emitting element in the two resist layers. The light source device according to claim 1.   The white resist layer is formed by stacking two resist layers, and among the two resist layers, an area of an opening in the vicinity of the upper light emitting element and an area of an opening in the vicinity of the lower light emitting element are 2. The light source device according to claim 1, wherein the light source device is substantially equal and the position of the opening is different between the upper layer and the lower layer.   The light source device according to claim 8, wherein the lower layer is thinner than the upper layer.   The light source device according to claim 8, wherein the lower layer has an inclined surface with the upper side opened in the opening near the light emitting element.   The light source device according to claim 9, wherein the upper layer has an inclined surface in which the opening in the vicinity of the light emitting element is open on the upper side.   11. The light source device according to claim 10, wherein the upper layer and the lower layer are both inclined surfaces in which the opening in the vicinity of the light emitting element is open on the upper side.   The light source device according to claim 8, wherein a height of an upper surface of the lower layer is lower than a light emitting surface of the light emitting element.   The light source device according to claim 15, wherein an area of the opening in the vicinity of the light emitting element of the lower layer is smaller than an area of the light emitting element.   The light source device according to claim 7, wherein, of the two resist layers, the upper resist layer is provided only at a lower portion of the transparent resin and around the transparent resin.   The light source device according to claim 1, wherein at least an electrode side surface of the substrate is white.   The identification material for recognizing a position when connecting the said light emitting element to the said electrode of the said board | substrate is formed in the part under the said light emitting element of the said electrode. Light source device.   The identification material for recognizing a position when connecting the said light emitting element to the said electrode of the said board | substrate is formed in the surface of the said board | substrate outside the said transparent resin. Light source device. A display for displaying an image;
A light source device that illuminates the display unit from the back side;
The light source device includes a substrate having at least one pair of electrodes, one or more light emitting elements, and a transparent resin that seals the light emitting elements, and a white resist layer is formed on the substrate, and the white resist The layer is formed so as to cover a part of the electrode, and has an opening at least on the light emitting element and its vicinity, and on the terminal of the electrode, and the transparent resin is formed on the white resist layer. A display device, wherein a white or transparent member for controlling a shape is formed, and a height of an upper surface of the white resist layer is lower than a light emitting surface of the light emitting element.

Images