JP2015146449A - light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of suppressing load applied between a light-emitting element and a substrate.SOLUTION: The light-emitting device includes: a substrate 10; a light-emitting element; and an encapsulation resin. The substrate 10 includes: a base body extendable in a first direction, and having flexibility; a plurality of wiring parts 12 disposed on the base body; groove parts 14 in which the plurality of wiring parts 12 are separately provided; and a pair of terminal parts 13 extending in the first direction at both sides of the plurality of wiring parts 12. The light-emitting element is electrically connected to the plurality of wiring parts 12. The encapsulation resin encapsulates the substrate 10 and the light-emitting element.

Description

  The present invention relates to a light emitting device including a flexible substrate and a light emitting element.

  Conventionally, a light emitting device including a light emitting element disposed on a flexible substrate and a sealing member for sealing the light emitting element has been proposed (see Patent Document 1). The light-emitting device described in Patent Document 1 can be wound during a manufacturing process or at the time of shipment, and can be used after being cut into a desired size.

JP 2005-322937 A

  However, in the light emitting device described in Patent Document 1, for example, when the light emitting device is wound, there is a problem that a load is easily applied between the sealing member for sealing the light emitting element and the substrate.

  The present invention has been made in view of the above-described situation, and an object thereof is to provide a light emitting device capable of suppressing a load applied between a sealing member for sealing a light emitting element and a substrate.

  A light emitting device according to the present invention includes a substrate, a light emitting element, and a sealing resin. The substrate includes a flexible base extending in a first direction which is a longitudinal direction, a plurality of wiring portions provided on the base, and a groove portion provided by separating the plurality of wiring portions. . The light emitting element is disposed on the substrate and is electrically connected to the plurality of wiring portions. The sealing resin seals the substrate and the light emitting element. The sealing resin is separated from a first groove portion extending in a second direction intersecting the first direction in the groove portion.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which can suppress the load concerning a sealing member and a board | substrate can be provided.

1 is a schematic plan view of a light emitting device according to a first embodiment. Enlarged plan view near the light emitting element AA sectional view of FIG. Enlarged view of FIG. The top view of the light-emitting device concerning a 2nd embodiment. The top view of the light-emitting device concerning a 3rd embodiment Enlarged plan view of the groove

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Accordingly, specific dimensions and the like should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

1. First Embodiment (Configuration of Light-Emitting Device 100)
The configuration of the light emitting device 100 according to the first embodiment will be described with reference to the drawings. FIG. 1 is a plan view showing the configuration of the light emitting device 100. 2 is an enlarged plan view of the vicinity of the light emitting element 30 in FIG. FIG. 3 is a cross-sectional view taken along the line AA of FIG.

  The light emitting device 100 includes a substrate 10, a plurality of sealing resins 20, and a plurality of light emitting elements 30. Since the light-emitting device 100 has flexibility, the light-emitting device 100 can be stored in a rolled state by a reel or the like and can be attached along a curved surface.

  The substrate 10 is a long member having flexibility. The first direction corresponds to the longitudinal direction of the substrate 10, and the second direction orthogonal to the first direction corresponds to the short direction of the substrate 10. The ratio of the length of the substrate 10 in the longitudinal direction to the lateral direction can be selected as appropriate, and can be, for example, 6: 1, 30: 1, or 100: 1. The length of the substrate 10 in the longitudinal direction can be, for example, 1150 mm, and the length of the substrate 10 in the short direction can be 15 mm. The substrate 10 includes a flexible base 11, a plurality of wiring parts 12, a pair of terminal parts 13, a groove part 14, and a reflective film 15.

  The base 11 is made of a flexible insulating material. As such a material, an insulating resin such as polyethylene terephthalate or polyimide can be preferably used, but is not limited thereto. For example, the base body 11 may be configured by coating an elongated tape-shaped copper foil or aluminum foil with an insulating resin. The thickness of the base 11 can be, for example, about 10 μm to 100 μm. The material of the substrate 11 can be appropriately selected in consideration of the mounting of the light emitting element 30, the light reflectance, the adhesion with other members, and the like. For example, when solder is used for mounting the light emitting element 30, it is preferable to use polyimide having high heat resistance. When the reflective film 15 described later is not provided on the substrate 11, a material having high light reflectance (for example, It is preferable to use a white material.

  The plurality of wiring parts 12 are arranged on the main surface of the base body 11. The several wiring part 12 is comprised by metal thin films, such as copper foil and aluminum, for example. Each of the plurality of wiring portions 12 is formed in a crank shape as shown in FIG. The plurality of wiring portions 12 are arranged in a staggered pattern along the first direction. However, the several wiring part 12 is arrange | positioned so that it may mutually space apart. In the present embodiment, the plurality of wiring portions 12 are covered with a reflective film 15 and are connected to the light emitting element 30 in an opening 151 described later.

  The thickness of the wiring part 12 should just be the thickness which does not impair the flexibility of the board | substrate 10, and it is preferable that it is 8 micrometers-150 micrometers.

  The wiring portion 12 is preferably provided on the surface of the base 11 with as wide an area as possible. Thereby, heat dissipation can be improved.

  The corners of the wiring part 12 are preferably rounded. Specifically, the radius at the corner is preferably 100 μm or more in radius.

  The pair of terminal portions 13 are formed on the main surface of the base 11 so as to extend along the first direction. The pair of terminal portions 13 are disposed on both sides in the second direction of the plurality of wiring portions 12. As in the present embodiment, the load on the light emitting element 30 and the sealing resin 20 when the substrate 10 is bent by having the pair of terminal portions 13 that extend without interruption along substantially the entire base body 11 along the first direction. Can be reduced. A pair of external wirings 131 are connected to the pair of terminal portions 13. Power is supplied to the pair of terminal portions 13 from the pair of external wirings 131. The pair of external wirings 131 may be connected to a known connector (not shown) provided on the substrate 10.

  By having the pair of terminal portions 13 in addition to the wiring portion 12, the degree of freedom in arrangement of the light emitting device 30 can be increased. For example, six light emitting elements 30 arranged in the first direction and two in the second direction are connected in parallel as one block, and 12 blocks arranged in the first direction are connected to the pair of terminal portions 13. Can be connected in series. A pair of terminal part 13 should just be comprised by the positive side terminal part and the negative side terminal part, and the number of terminals which comprises each of a pair of terminal part 13 is not specifically limited. Accordingly, each of the pair of terminal portions 13 may be constituted by only one terminal or may be constituted by a plurality of terminals.

  The groove portion 14 is a portion where the plurality of wiring portions 12 and the pair of terminal portions 13 on the base 11 are not provided. That is, the groove portion 14 is formed between the plurality of wiring portions 12 that are separated from each other, or between the wiring portion 12 and the terminal portion 13 that are separated from each other. Further, the groove portion 14 may be formed between a pair of terminal portions 13 that are separated from each other. As shown in FIG. 1, the groove portion 14 is formed in a crank shape. The interval between the groove portions 14 is preferably narrower than the width of the wiring portion 12, and can be, for example, about 0.05 mm to 5 mm. The configuration of the groove 14 will be described later.

  The reflective film 15 covers the base body 11, the plurality of wiring parts 12, the pair of terminal parts 13, and the groove part 14. The reflective film 15 covers substantially the entire surface of the substrate 10 except for an opening 151 described later. The reflective film 15 is made of a material that reflects light emitted from the light emitting elements 30 and light having a wavelength converted by a wavelength conversion member described later. As such a material, an insulating white ink called a white resist in which titanium oxide is contained in a silicone resin can be preferably used, but the material is not limited thereto. As shown in FIGS. 2 and 3, the reflective film 15 has a plurality of openings 151. The opening 151 is provided to connect the light emitting element 30 to the two wiring parts 12 or the wiring part 12 and the terminal part 13.

The plurality of sealing resins 20 are arranged on the substrate 10 so as to close the openings 151 of the reflective film 15. In the present embodiment, the plurality of sealing resins 20 are arranged in a line along the first direction. Each sealing resin 20 seals the light emitting element 30. In the present embodiment, the shape of the sealing resin 20 is a hemispherical shape with the light emitting element 30 as the center, but is not limited thereto. Such a sealing resin 20 is made of a translucent resin (for example, an epoxy resin, a urea resin, a silicone resin, or the like). The sealing resin 20 may contain a light scattering material (barium sulfate, titanium oxide, aluminum oxide, silicon oxide, etc.).
Moreover, it is preferable to contain wavelength conversion members, such as the fluorescent substance which absorbs the light from the light emitting element 30, and emits the light of a different wavelength. Examples of such a wavelength conversion member include oxide-based, sulfide-based, and nitride-based phosphors. A gallium nitride-based light-emitting element that emits blue light is used as a light-emitting element, which absorbs blue light and is yellow. It is preferable to use YAG-based, LAG-based, green-emitting SiAlON-based, green-emitting SCASN, and CASN-based phosphors alone or in combination. In particular, a light-emitting device used for a display device such as a liquid crystal display or a backlight of a television is preferably used in combination of a SiAlON phosphor and a SCASN phosphor. In addition, as a lighting application, it is preferable to use a combination of a YAG-based or LAG-based phosphor and a SCASN or CASN phosphor.

  The plurality of light emitting elements 30 are disposed inside the opening 151 of the reflective film 15 on the substrate 10. That is, the plurality of light emitting elements 30 are arranged so as to be separated from the first groove portion extending in the second direction intersecting the first direction among the groove portions. Thereby, it can suppress that the some light emitting element 20 peels from the board | substrate 10. FIG. In the present embodiment, the plurality of light emitting elements 30 are arranged in a line along the first direction. The two light emitting elements 30 arranged in the center are connected to the wiring part 12 and the terminal part 13. The other light emitting elements 30 are connected to the two wiring parts 12. In the present embodiment, the light emitting element 30 is flip-chip mounted on the substrate 10 in a state where the longitudinal direction of the light emitting element 30 is arranged in parallel with the second direction. Specifically, as illustrated in FIG. 3, the light emitting element 30 includes a semiconductor structure 31, a p-side electrode 32, an n-side electrode 33, and an insulating material layer 34. The semiconductor structure 31 has an n-type layer, an active layer, and a p-type layer made of a gallium nitride-based semiconductor that are sequentially stacked on a light-transmitting sapphire substrate. The n-side electrode 33 is provided to extend to the lower part of the p-type layer through the insulating material layer 34. The p-side electrode 32 and the n-side electrode 33 are connected to the pair of wiring parts 12 via a pair of bonding members 35. As the joining member, a solder such as Sn—Ag—Cu series or Au—Sn series, or a bump of metal such as Au is preferably used. The underfill material 36 is filled between the light emitting element 30 and the substrate 10. The underfill material 36 is made of, for example, a silicone resin or an epoxy resin. The underfill material 36 preferably has light reflectivity, and specifically, white titanium oxide, silicon oxide, or the like is preferably contained. As shown in FIGS. 2 and 3, such an underfill material 36 is preferably provided on the groove portion 14, the plurality of wiring portions 12, and also on the reflective film 15. Thereby, while improving the light extraction efficiency, the part in which the light emitting element 30 is arrange | positioned can be reinforced efficiently.

  The mounting of the light emitting element 30 is not limited to flip chip mounting, and die bonding and wire bonding may be used.

(Configuration of groove 14)
Next, the structure of the groove part 14 is demonstrated, referring drawings. FIG. 4 is an enlarged view of FIG.

  The groove part 14 has a first groove part 141, a second groove part 142, and a third groove part 143.

  The 1st groove part 141 is extended | stretched along the direction which cross | intersects the 1st direction which is a longitudinal direction. In this embodiment, the 1st groove part 141 is extended | stretched along the 2nd direction which is a transversal direction. The length 141S of the first groove portion 141 is about a quarter of the width 10S of the substrate 10 in the second direction.

  The second groove portion 142 extends along a direction that intersects the first direction, which is the longitudinal direction. In the present embodiment, the second groove portion 142 extends along the second direction, which is the short direction, like the first groove portion 141. Accordingly, the first groove portion 141 and the second groove portion 142 are formed in parallel to each other. The first groove portion 141 and the second groove portion 142 are provided at different positions in the first direction. That is, the first groove portion 141 and the second groove portion 142 are not formed on a straight line in the second direction. The first groove portion 141 and the second groove portion 142 are provided at different positions in the second direction. The length 142S of the second groove portion 142 is about one-fourth of the width 10S of the substrate 10 like the first groove portion 141.

  The third groove portion 143 is continuous with the first groove portion 141 and the second groove portion 142. The third groove portion 143 extends along a direction intersecting with each of the first groove portion 141 and the second groove portion 142. In this embodiment, the 3rd groove part 143 is extended | stretched along the 1st direction which is a longitudinal direction. Accordingly, the third groove portion 143 is orthogonal to the first groove portion 141 and the second groove portion 142, respectively. The length 143S of the third groove portion 143 is longer than the length 141S of the first groove portion 141 and the length 142S of the second groove portion 142, but is not limited thereto. The light emitting element 30 is disposed on the third groove portion 143. A sealing resin 20 that seals the light emitting element 30 is disposed on the third groove portion 143.

  The first groove portion 141 and the third groove portion 143 are coupled so as to be curved, and the second groove portion 142 and the third groove portion 143 are coupled so as to be curved. Accordingly, the first groove portion 141 and the third groove portion 143 are smoothly connected, and the second groove portion 142 and the third groove portion 143 are smoothly connected. As described above, the plurality of groove portions are connected so as to be curved and smoothly connected to each other, whereby stress concentration in a region where the plurality of groove portions are connected to each other can be suppressed. Therefore, it is possible to suppress the groove portion 14 and the wiring portion 12 from being damaged by the bending of the substrate 10.

  Here, the first groove portion 141 is separated from each of the sealing resin 20 and the light emitting element 30. Similarly, the second groove portion 142 is separated from the sealing resin 20 and the light emitting element 30. That is, in the first direction, each of the sealing resin 20 and the light emitting element 30 is disposed between the first groove portion 141 and the second groove portion 142. Accordingly, the position of the first groove portion 141 in the first direction is different from the positions of the sealing resin 20 and the light emitting element 30 in the first direction. Similarly, the position of the second groove portion 142 in the first direction is different from the positions of the sealing resin 20 and the light emitting element 30 in the first direction. Specifically, in the first direction, the second groove portion 142 and the sealing resin 20 are preferably separated from each other by 0.5 mm or more.

  Although the position of the first groove portion 141 in the second direction is different from the position of the second groove portion 142 in the second direction, the substrate 10 is bent at each of the first groove portion 141 and the second groove portion 142. Cheap. On the other hand, since the board | substrate 10 is formed long in the longitudinal direction, it is hard to bend | fold in the 3rd groove part 143 formed along the longitudinal direction.

  Since the light emitting device 100 as described above uses the substrate 10 having flexibility, it can be manufactured by a roll-to-roll method.

(Function and effect)
(1) In the light emitting device 100 according to the first embodiment, the sealing resin 20 is separated from the first groove portion 141 extending in the second direction intersecting the first direction in the groove portion 14.

  As described above, since the sealing resin 20 is separated from the first groove portion 141, when the substrate 10 is bent along the first groove portion 141, the force to bend the substrate 10 is increased. It is possible to suppress the connection with 20. In other words, by making the substrate 10 easily bend along the first groove portion 141 that is separated from the sealing resin 20, it is possible to suppress a load from being applied to the connection portion between the substrate 10 and the sealing resin 20. Therefore, it can suppress that sealing resin 20 peels from the board | substrate 10. FIG.

  (2) The position of the second groove portion 142 in the first direction is different from the positions of the sealing resin 20 and the light emitting element 30 in the first direction.

  Therefore, it is possible to further suppress the force that the substrate 10 is bent from being applied to the connection portion with the sealing resin 20.

  (3) The sealing resin 20 is provided on the third groove portion 143.

  Therefore, since the sealing resin 20 is separated from each of the first groove portion 141 and the second groove portion 142, the force that the substrate 10 is about to bend is prevented from being applied to the connection portion with the sealing resin 20. be able to.

2. Second Embodiment Next, a configuration of a light emitting device 100A according to a second embodiment will be described with reference to the drawings. The difference of the second embodiment from the first embodiment is that five light emitting elements 30 are connected to the pair of wiring portions 12. In the following, the difference will be mainly described.

  FIG. 5 is a partially enlarged plan view showing the configuration of the light emitting device 100A. As shown in FIG. 5, in the light emitting device 100A, the basic pattern formed by the first and second wiring parts 121 and 122, the groove part 14A, the five sealing resins 20, and the five light emitting elements 30 is long. It has a configuration in which a plurality of lines are connected in the direction.

  The first and second wiring parts 121 and 122 are adjacent to each other through the groove part 14A. The first wiring part 121 has four first convex parts 121a and five first concave parts 121b. The four first convex portions 121a protrude toward the second wiring portion 122 side. The five first recesses 121b are formed on both sides of each of the four first protrusions 121a.

  Further, the second wiring part 122 has five second convex parts 122a and four second concave parts 122b. The five second convex portions 122a protrude toward the first wiring portion 121 side. The four second recesses 122b are formed between the five second protrusions 122a. The four first convex portions 121a enter the four second concave portions 122b, and the five second convex portions 122a enter the five first concave portions 121b.

  The groove portion 14A includes a first groove portion 141, a second groove portion 142, five third groove portions 143, four fourth groove portions 144, and eight fifth groove portions 145. .

  The configurations of the first to third groove portions 141 to 143 are the same as those in the first embodiment.

  The four fourth groove portions 144 are arranged at positions different from the five third groove portions 143 in the second direction. In addition, the four fourth groove portions 144 are disposed between the five third groove portions 143 in the first direction. In the present embodiment, the four fourth groove portions 144 extend along the first direction and are parallel to the five third groove portions 143.

  Each of the eight fifth groove portions 145 is continuous with the third groove portion 143 and the fourth groove portion 144. That is, the third groove portion 143 and the fourth groove portion 144 are connected via the fifth groove portion 145. In the present embodiment, the fifth groove portion 145 extends along the second direction, and is parallel to the first groove portion 141 and the second groove portion 142, respectively.

  Also in the light emitting device 100A according to the second embodiment, the sealing resin 20 is separated from the first groove portion 141 and the second groove portion 142 of the groove portion 14A. Therefore, it can suppress that sealing resin 20 peels from the board | substrate 10. FIG.

3. Third Embodiment Next, a configuration of a light emitting device 100B according to a third embodiment will be described with reference to the drawings. The difference of the third embodiment from the first embodiment is that the shape of the groove portion 14 is different, that three or more terminal portions 13 are provided, and two pieces that seal the light emitting element 30 respectively. The sealing resin 20 is arranged in the second direction. In the following, the difference will be mainly described.

  FIG. 6 is a partially enlarged plan view showing the configuration of the light emitting device 100B. As shown in FIG. 6, the light emitting device 100B includes third to sixth wiring parts 123 to 126, a groove part 14B, and a groove part 14C. In FIG. 6, a part of the light emitting device 100 </ b> B is shown enlarged, but in the light emitting device 100 </ b> B, the pattern shown in FIG. 6 is repeatedly formed in the longitudinal direction.

  The groove portion 14B is formed between the third wiring portion 123 and the fourth wiring portion 124. The groove portion 14 </ b> C is formed between the fifth wiring portion 125 and the sixth wiring portion 126. Each of the groove part 14B and the groove part 14C includes a sixth groove part 146, a seventh groove part 147, and an eighth groove part 148.

  The sixth groove portion 146 extends along a direction intersecting the first direction. In the present embodiment, the sixth groove portion 146 extends along the second direction, which is the short direction.

  The seventh groove portion 147 extends along a direction intersecting the first direction. In the present embodiment, the seventh groove portion 147 extends along the second direction, which is the short direction. Further, the sixth groove portion 146 and the seventh groove portion 147 are provided at different positions in the first direction. On the other hand, the sixth groove portion 146 and the seventh groove portion 147 are provided at the same position in the second direction.

  The eighth groove portion 148 continues to the sixth groove portion 146 and the seventh groove portion 147. The eighth groove portion 148 extends along the direction intersecting with each of the sixth groove portion 146 and the seventh groove portion 147. In the present embodiment, the eighth groove portion 148 extends along the first direction which is the longitudinal direction. Accordingly, the eighth groove portion 148 is orthogonal to the sixth groove portion 146 and the seventh groove portion 147, respectively. The light emitting element 30 is disposed on the eighth groove portion 148. A sealing resin 20 that seals the light emitting element 30 is disposed on the eighth groove portion 148.

  Also in the light emitting device 100B according to the third embodiment, the sealing resin 20 is separated from the groove portion 14B and the sixth groove portion 146 and the seventh groove portion 147 of the groove portion 14C. Therefore, it can suppress that sealing resin 20 peels from the board | substrate 10. FIG.

(Other embodiments)
Although the present invention has been described according to the above-described embodiments, it should not be understood that the descriptions and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  (A) In the above embodiment, the sealing resin 20 and the light emitting element 30 are arranged on the one-side main surface of the substrate 10, but are not limited thereto. The sealing resin 20 and the light emitting element 30 may be disposed on both surfaces of the substrate 10.

  (B) In the above embodiment, the light emitting element 30 is connected to the two wiring parts 12, but is not limited thereto. The light emitting element 30 may be connected to the three wiring parts 12. In addition, the sealing resin 20 is arranged on the two wiring parts 12, but may be arranged on the three wiring parts 12.

  (C) In the above-described embodiment, the sealing member 20 and the light emitting element 30 are provided on all the wiring parts 12, but the present invention is not limited to this. The light emitting element 30 and / or the sealing member 20 may not be provided on some of the wiring parts 12.

  (D) In the above embodiment, the substrate 10 includes the three or more wiring portions 12, but it is sufficient that the substrate 10 includes at least two wiring portions 12. Therefore, the light emitting device 100 only needs to include at least one sealing resin 20 and one light emitting element 30.

  (E) In the embodiment described above, one light emitting element 30 is connected to the pair (two) of wiring sections 12, but a plurality of light emitting elements 30 are connected to the pair of wiring sections 12. It may be. Further, the light emitting element 30 may be connected to the pair of terminal portions 13.

  (F) In the above embodiment, one sealing member 20 seals one light emitting element 30, but one sealing member 20 may seal a plurality of light emitting elements 30.

  (G) In the said embodiment, although the planar shape of the wiring part 12 was illustrated in FIG.2 and FIG.4-FIG.6, the planar shape of the wiring part 12 is not restricted to this. The planar shape of the wiring part 12 can be appropriately changed according to the size of the substrate 10 and the number of necessary light emitting elements 30.

  (H) In the above-described embodiment, the groove portion 14 has the groove portions (for example, the first and second groove portions 141 and 142) extending in the second direction, but is not limited thereto. The groove part 14 should just have the groove part extended | stretched in the direction which cross | intersects a 1st direction.

  (I) In the said embodiment, although the groove part 14 was comprised by combining the several groove part formed in linear form, it is not restricted to this. At least one of the plurality of groove portions may be formed in a curved shape or a wavy shape.

  (J) Although not particularly mentioned in the above embodiment, related components such as a Zener diode may be disposed on the substrate 10 or the wiring portion 12 in addition to the above-described members. With respect to such a related component, it is possible to suppress a load applied between the related component and the substrate 10 by making the positions with respect to the wiring portion 12 and the groove portion 14 the same as the light emitting element 30 described above.

  (K) In the first embodiment, the substrate 10 includes the pair of terminal portions 13, but is not limited thereto. For example, the substrate 10 is electrically connected as six blocks of six light emitting elements 30 arranged in the first direction and three in the second direction, and 12 blocks arranged in the first direction. , 12 sets of terminal portions 13 connected to each of the 12 blocks. When such a connection method is used, dimming can be performed when the light emitting device 100 is used as a backlight for a display such as a television.

  (L) Although not particularly mentioned in the above embodiment, in the portion of the groove portion 14 that is formed in a T shape, the base body 11 is greatly bent along the groove portions at the corner portions of the plurality of wiring portions, and is formed on the substrate 100. Since there is a risk of damage, it is effective that the base 11 bends in multiple directions.

  Specifically, as shown in FIG. 7 showing the groove portion 14 in an enlarged manner, the substrate 100 includes first to third wiring portions 201 to 203 and first and second groove portions 301 and 302. The first wiring unit 201 is adjacent to the second and third wiring units 202 and 203, respectively. The second and third wiring parts 202 and 203 are adjacent to each other. The first groove portion 301 is linearly provided between the first wiring part 201 and the second and third wiring parts 202 and 203. The second groove portion 302 is linearly provided between the second wiring portion 202 and the third wiring portion 203. The second groove portion 302 is provided perpendicular to the first groove portion 301. Accordingly, the first groove portion 301 and the second groove portion 302 intersect in a T shape.

  Here, the first wiring part 201 has a protruding part 201 </ b> A that protrudes into the first groove part 301. The protruding portion 201A is formed toward the second groove portion 302 in plan view. In the example illustrated in FIG. 7, the planar shape of the protrusion 201 </ b> A is a semicircular shape, but may be a triangular shape or a trapezoidal shape. Thus, in the region where the first groove portion 301 and the second groove portion 302 intersect, the groove is formed so as to be branched in a Y shape by the protruding portion 201A. Thereby, it is suppressed that the base 11 is strongly bent along the first groove portion 301 or the second groove portion 302.

  Further, as shown in FIG. 7, the minimum interval Wmin1 between the protruding portion 201A and the second wiring portion 202 and the groove width W1 of the first groove portion 301 are equal. The minimum interval Wmin2 between the protruding portion 201A and the third wiring portion 203 and the groove width W1 of the first groove portion 301 are equal. The minimum interval Wmin1 and the minimum interval Wmin2 are equivalent. As described above, by providing the protruding portion 201A, the groove width between the first to third wiring portions 201 to 203 can be made equal or the difference in width can be reduced, and the base 11 can be bent greatly. Can be suppressed.

  Moreover, it is preferable that the groove width W1 of the 2nd groove part 302 is widened, so that it approaches the protrusion part 201A. Thereby, both side walls of the second groove portion 302 are formed in a curved shape, and the second groove portion 302 is smoothly connected to the first groove portion 301.

  In the above description, the groove portion is provided between the plurality of wiring portions. However, the groove portion may be provided between the pair of terminal portions and one or more wiring portions.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

DESCRIPTION OF SYMBOLS 100,100A, 100B ... Light-emitting device 10 ... Board | substrate 11 ... Base | substrate 12 ... Wiring part 13 ... Terminal part 14, 14A, 14B ... Groove part 141-148 ... 1st thru | or 8th groove part 15 ... Reflective film 20 ... Sealing resin 30 ... Light emitting device

Claims (17)

A flexible base extending in a first direction which is a longitudinal direction; a plurality of wiring portions provided on the base; a groove portion provided by separating the plurality of wiring portions; and the plurality of wiring portions A substrate having a pair of terminal portions extending in the first direction on both sides of the substrate,
A light emitting element disposed on the substrate and electrically connected to the plurality of wiring portions;
A sealing resin for sealing the substrate and the light emitting element;
A light emitting device comprising: The sealing resin is separated from a first groove portion extending in a second direction intersecting the first direction in the groove portion,
The light emitting device according to claim 1. The sealing resin and the first groove portion are provided at different positions in the first direction.
The light emitting device according to claim 2. The groove part includes a first groove part, a second groove part extending in the second direction, and a third groove part connecting the first groove part and the second groove part,
The sealing resin is provided on the third groove portion.
The light emitting device according to claim 3. The first groove portion and the second groove portion are easier to bend in the second direction than the third groove portion.
The light emitting device according to claim 4. The light emitting element is spaced apart from a first groove portion extending in a second direction intersecting the first direction in the groove.
The light emitting device according to any one of claims 1 to 5. The substrate has a reflective film disposed on the plurality of wiring portions,
The reflective film has an opening in which the light emitting element is disposed,
The opening is covered with the sealing resin,
The light-emitting device according to claim 1. The base is made of polyimide,
The reflective film is made of a silicone resin.
The light emitting device according to claim 7. The light emitting element is flip-chip mounted on the substrate.
The light-emitting device according to claim 1. The longitudinal direction of the light emitting element is arranged to be parallel to the second direction.
The light emitting device according to claim 9. The underfill material is filled between the light emitting element and the substrate.
The light emitting device according to claim 9 or 10. The underfill material is provided on the groove part, the plurality of wiring parts, and the reflective film.
The light emitting device according to claim 11. The underfill material has light reflectivity,
The light emitting device according to claim 11 or 12. The corner of the wiring part is rounded,
The light-emitting device according to claim 1. The substrate has a thickness of 10 μm to 100 μm,
The wiring portion has a thickness of 8 μm to 150 μm.
The light-emitting device according to claim 1. The sealing resin contains a wavelength conversion member,
The light-emitting device according to claim 1. The plurality of wiring portions include first to third wiring portions;
The first wiring part is adjacent to each of the second and third wiring parts,
The second and third wiring portions are adjacent to each other;
Two groove portions are provided between each of the first to third wiring portions,
The first wiring portion has a protruding portion that protrudes into the groove portion in a region where the groove portions intersect.
The light emitting device according to any one of claims 1 to 16.