JPH04132275A - Light emitting diode light source - Google Patents

Light emitting diode light source

Info

Publication number
JPH04132275A
JPH04132275A JP2253406A JP25340690A JPH04132275A JP H04132275 A JPH04132275 A JP H04132275A JP 2253406 A JP2253406 A JP 2253406A JP 25340690 A JP25340690 A JP 25340690A JP H04132275 A JPH04132275 A JP H04132275A
Authority
JP
Japan
Prior art keywords
resistors
led
light source
electrode
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2253406A
Other languages
Japanese (ja)
Inventor
Kensuke Sawase
研介 澤瀬
Hiromi Ogata
緒方 弘美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2253406A priority Critical patent/JPH04132275A/en
Priority to US07/763,289 priority patent/US5150016A/en
Publication of JPH04132275A publication Critical patent/JPH04132275A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

Abstract

PURPOSE:To adjust the quantity of light with high accuracy by a small number of procedures by connecting serially-connected LED chips, one end of each of which is connected to an electrode, a plurality of resistors of different resistance values, and a plurality of fuses one end of each of which is connected to an electrode. CONSTITUTION:LED chips D1-D4 are tie-bonded on LED patterns 15 and one end of each of them is connected to the wiring patterns 15 in series by wire bonding. A probe is applied in this state to determine adjusting resistance to obtain the most suitable light output value and one or more resistors are selected from resistors R1-R6 to obtain combined resistance the closest to the adjusting resistance. An over-current is passed between a cathode electrode 3 and trim pads 8 connected to the resistors not selected and trim fuses 7 are blown to open the circuit.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明はLED光源、特にファクシミリ端末機の原稿読
取りなどに使用されるイメージセンサ用のLED光源に
関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an LED light source, and particularly to an LED light source for an image sensor used for reading a document in a facsimile terminal.

[従来の技術] 従来よりイメージセンサなどの光源にはLED(発光ダ
イオード)が用いられているが、このしEDはその製造
時、特にエピタキシャル成長時のバラツキにより個々の
先出力もばらついた特性を有するのが一般的である。そ
こで、第2図に示すように、複数個、例えば4個のLE
DDI〜D4と光量調整用の抵抗体Rとを直列に接続す
る構成として光量を調整する方法が用いられている。す
なわち、プローブを当てて実際にLEDチップに電流を
流して発光させ、LEDチップの発光量が最適となる抵
抗値ROを決定する。そして、この最適抵抗値ROに最
も近い抵抗値を有するチップ抵抗体Rを選択し、4個の
LEDチップと直列に接続するのである。
[Prior Art] LEDs (light emitting diodes) have been used as light sources for image sensors and the like, but these EDs have characteristics in which individual outputs vary due to variations during manufacturing, especially during epitaxial growth. is common. Therefore, as shown in FIG.
A method of adjusting the light amount is used in which DDI to D4 and a resistor R for adjusting the light amount are connected in series. That is, by applying a probe to the LED chip, a current is actually applied to the LED chip to cause it to emit light, and a resistance value RO that optimizes the amount of light emitted from the LED chip is determined. Then, a chip resistor R having a resistance value closest to this optimum resistance value RO is selected and connected in series with the four LED chips.

しかしながら、チップ抵抗体の抵抗値の種類は限られて
いるのでLESチップの光出力を高精度に調整するのは
極めて困難である。そこで、本願出願人は先に第3図に
示すようなLED光源を提案している。
However, since the types of resistance values of chip resistors are limited, it is extremely difficult to adjust the optical output of the LES chip with high precision. Therefore, the applicant of the present application has previously proposed an LED light source as shown in FIG.

このLED光源においては、それぞれ抵抗値の異なる抵
抗体R1〜R6を予め複数形成しておき、プローブを当
ててLEDDI〜p4に電流を流しその光出力が最適と
なる調整抵抗の値ROを決定する。そして、この調整抵
抗値ROに最も近い値が得られるように複数形成された
抵抗体R1〜R6から1又は2以上の抵抗体を選択し、
直列接続されたLEDDI−D4とワイヤでボンディン
グするものである。
In this LED light source, a plurality of resistors R1 to R6 having different resistance values are formed in advance, and a probe is applied to apply a current to LEDDI to p4 to determine the value RO of the adjustment resistor that optimizes the light output. . Then, one or more resistors are selected from the plurality of resistors R1 to R6 so as to obtain a value closest to this adjusted resistance value RO,
It is bonded to the LED DI-D4 connected in series using a wire.

このLED光源では予め複数の抵抗体を形成しているた
め、抵抗体の組合わせ数が多くなり、このため非常に多
種類の合成抵抗値を得ることができ、チップ抵抗体を用
いる場合に比べて極めて精度よく光出力を調整すること
ができるのである。
In this LED light source, multiple resistors are formed in advance, so the number of combinations of resistors increases, and therefore a very wide variety of combined resistance values can be obtained, compared to when using chip resistors. This makes it possible to adjust the light output with extremely high precision.

[発明が解決しようとする課題] しかしながら、第3図に示されるようなLED光源を用
いた場合、高精度の光出力調整は得られるものの、調整
抵抗値に最も近い値が得られるように複数の抵抗体R1
−Reから1又は2以上のものを選択するプロセスと、
このようにして選択された1又は2以上の抵抗体とカソ
ード電極等の配線パターンとをワイヤボンディングする
工程を経なければならず、工程が煩雑化してしまうとい
う問題があった。
[Problems to be Solved by the Invention] However, when using an LED light source as shown in FIG. 3, although highly accurate light output adjustment can be obtained, multiple resistor R1
- a process of selecting one or more from Re;
It is necessary to go through a process of wire bonding one or more resistors selected in this way to a wiring pattern such as a cathode electrode, which poses a problem in that the process becomes complicated.

本発明は上記従来の課題に鑑みなされたものであり、そ
の目的は少ない工程数で高精度の光M調節が可能なLE
D光源を提供することにある。
The present invention was made in view of the above-mentioned conventional problems, and its purpose is to provide an LE that allows highly accurate light M adjustment with a small number of steps.
D. To provide a light source.

[課題を解決するための手段] 上記目的を達成するために、本発明に係るLED光源は
、一端が電極に接続される複数個の直列接vcLEDチ
ップと、前記直列接続LEDチップに接続される、互い
に異なる抵抗値を有する複数個の抵抗体と、一端が前記
複数個の抵抗体のそれぞれに接続され他端が電極に接続
される複数個のヒユーズとを有することを特徴としてい
る。
[Means for Solving the Problems] In order to achieve the above object, an LED light source according to the present invention includes a plurality of series-connected VCLED chips, one end of which is connected to an electrode, and a plurality of series-connected VCLED chips that are connected to the series-connected LED chips. , a plurality of resistors having mutually different resistance values, and a plurality of fuses having one end connected to each of the plurality of resistors and the other end connected to an electrode.

[作用] 本発明のLED光源はこのような構成を有しており、予
め異なる抵抗値を有する複数の抵抗体を形成するととも
にこれら抵抗体をヒユーズを介してLEDチップと電極
間に接続しておき、LEDチップの光量を調整する際、
所望の抵抗体以外の抵抗体に接続されるヒユーズを通電
により焼き切ることによりワイヤボンディング工程を経
ることなく最適抵抗値を得るものである。
[Function] The LED light source of the present invention has such a configuration, in which a plurality of resistors having different resistance values are formed in advance, and these resistors are connected between the LED chip and the electrode via a fuse. When adjusting the light intensity of the LED chip,
By energizing and blowing out fuses connected to resistors other than the desired resistor, an optimum resistance value can be obtained without going through a wire bonding process.

C実施例] 以下、図面を用いながら本発明に係るLED光源の好適
な実施例を説明する。
C Embodiment] Hereinafter, preferred embodiments of the LED light source according to the present invention will be described with reference to the drawings.

第1図には本実施例のLED光源の印刷回路基板の配線
パターンの一部が示されている。この印刷回路基板は帯
状のもので、印刷回路基板自体の材質としては安価で加
工性に優れたガラスエポキシか用いられているが、セラ
ミックやガラス等を用いてもよい。
FIG. 1 shows a part of the wiring pattern of the printed circuit board of the LED light source of this embodiment. This printed circuit board is in the form of a strip, and glass epoxy, which is inexpensive and has excellent workability, is used as the material for the printed circuit board itself, but ceramic, glass, etc. may also be used.

印刷回路基板上に形成される配線パターンは、アノード
電極3、カソード電極4、LED用パターン15、ワイ
ヤボンディング用パターン16、並列形成され順次段階
的に抵抗値が異なる複数個の抵抗体R1−Re及び複数
の抵抗体R1−Reのそれぞれに直列接続された複数個
のヒユーズ7から構成されている。LED用パターン1
5、ワイヤボンディング用パターン16、抵抗体5は各
ブロック毎に設けられており、LED用パターン15の
一部はアノード電極3と一体になっている。
The wiring pattern formed on the printed circuit board includes an anode electrode 3, a cathode electrode 4, an LED pattern 15, a wire bonding pattern 16, and a plurality of resistors R1-Re formed in parallel and having different resistance values in stages. and a plurality of fuses 7 connected in series to each of the plurality of resistors R1-Re. LED pattern 1
5. The wire bonding pattern 16 and the resistor 5 are provided for each block, and a part of the LED pattern 15 is integrated with the anode electrode 3.

また、LED用パターン15上にはそれぞれLEDチッ
プDJ 、D2 、D3 、D4がダイボンディングさ
れる。
Furthermore, LED chips DJ, D2, D3, and D4 are die-bonded onto the LED pattern 15, respectively.

一方、抵抗体R1〜R6はシリコンチップ上に不純物を
拡散して形成され、各抵抗R1−Reはその不純物濃度
を調節することにより順次段階的に異なる抵抗値となる
ように形成されている。更に、各抵抗R1−Reには前
述したヒユーズ7と並列にトリムバッド8が形成されて
いる。
On the other hand, the resistors R1 to R6 are formed by diffusing impurities onto a silicon chip, and each of the resistors R1 to Re is formed to have a resistance value that is successively different in a stepwise manner by adjusting the impurity concentration. Furthermore, a trim pad 8 is formed in parallel with the fuse 7 described above for each resistor R1-Re.

本実施例のLED光源はこのような構成を有しており、
・LEDチップDi SD2 、D3 、D4はそれぞ
れ配線パターン15とワイヤボンディングされ直列接続
される。この状態で図示しないプローブをあて、実際に
LEDチップDISD2、D3、D4を発光させてその
光出力を測定する。そして、光出力が最適値となるよう
な調整抵抗ROを決定し、この調整抵抗ROに最も近い
合成抵抗が得られるように前記抵抗体R1〜R6の内か
ら1または2以上の抵抗を選択する。この時、抵抗体R
1〜R6の組み合わせは多数あるので、細かい抵抗値の
調整が可能である。
The LED light source of this example has such a configuration,
- The LED chips Di SD2, D3, and D4 are connected in series by wire bonding to the wiring pattern 15, respectively. In this state, a probe (not shown) is applied to actually cause the LED chips DISD2, D3, and D4 to emit light, and the light output thereof is measured. Then, an adjustment resistor RO is determined so that the optical output becomes the optimum value, and one or more resistors are selected from among the resistors R1 to R6 so as to obtain a combined resistance closest to this adjustment resistor RO. . At this time, resistor R
Since there are many combinations of 1 to R6, fine adjustment of the resistance value is possible.

そして、選択されなかった抵抗体に関しては、その抵抗
体に接続されたトリムバッドとカソード電極間に過電流
を流し、その抵抗体に直列接続されたトリムヒユーズ7
を焼き切って回路を開放する。
For the resistors not selected, an overcurrent is passed between the trim pad connected to the resistor and the cathode electrode, and the trim fuse 7 connected in series to the resistor is passed through.
burn out and open the circuit.

このように、光量調節時に抵抗体の選択とともに選択さ
れた抵抗体のみを電気的に接続することができ、ワイヤ
ボンディング工程を除去することが可能となる。
In this way, when adjusting the light amount, it is possible to select the resistor and electrically connect only the selected resistor, thereby making it possible to eliminate the wire bonding process.

所望の抵抗値が得られるようにヒユーズを焼き切った後
、LEDチップDl−D4及び抵抗体、ヒユーズを樹脂
で被覆し、さらにカバーをこの印刷回路基板に取り付け
て本実施例のLED光源が構成され、各LEDチップD
l−D4からの所望光量の光が原稿面に照射されて読取
りが行われる。
After burning out the fuse to obtain the desired resistance value, the LED chip Dl-D4, the resistor, and the fuse are covered with resin, and a cover is attached to this printed circuit board to construct the LED light source of this example. and each LED chip D
A desired amount of light from l-D4 is irradiated onto the surface of the document to perform reading.

なお、本実施例では6個の抵抗体の内から1又は2以上
のものを選択し、これらを並列に接続しているが、本発
明の抵抗体はもちろんこれに限定されるものではなく、
また選択された抵抗体を直列に接続する構成とすること
もできる。
In this example, one or more resistors are selected from among the six resistors and connected in parallel, but the resistors of the present invention are of course not limited to this.
Alternatively, selected resistors may be connected in series.

また、各ブロックのLED数も4個に限定されるもので
はなく適宜設計変更可能である。
Further, the number of LEDs in each block is not limited to four, and the design can be changed as appropriate.

[発明の効果コ 以上説明したように、本発明に係るLED光源によれば
、光量調整後のワイヤボンディング工程を不要として光
量の高精度な微調整が可能となり、低コスト化を図るこ
とができる効果がある。
[Effects of the Invention] As explained above, according to the LED light source according to the present invention, the wire bonding process after adjusting the light amount is not required, making it possible to finely adjust the light amount with high accuracy, and reducing costs. effective.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係るLED光源の一実施例の回路構成
図、 第2図乃至第3図は従来のLED光源の説明図である。 3 ・・・ カソード電極 4 ・・・ アノード電極 R1−R6・・・抵抗体 7 ・・・ ヒユーズ 8 ・・・ トリムパッド
FIG. 1 is a circuit configuration diagram of an embodiment of an LED light source according to the present invention, and FIGS. 2 and 3 are explanatory diagrams of a conventional LED light source. 3... Cathode electrode 4... Anode electrode R1-R6... Resistor 7... Fuse 8... Trim pad

Claims (1)

【特許請求の範囲】 一端が電極に接続される複数個の直列接続LEDチップ
と、 前記直列接続LEDチップに接続される、互いに異なる
抵抗値を有する複数個の抵抗体と、一端が前記複数個の
抵抗体のそれぞれに接続され他端が電極に接続される複
数個のヒューズと、を有することを特徴とするLED光
源。
[Scope of Claims] A plurality of series-connected LED chips having one end connected to an electrode; a plurality of resistors having mutually different resistance values connected to the series-connected LED chips; and one end connected to the plurality of resistors. A plurality of fuses connected to each of the resistors and having the other end connected to an electrode.
JP2253406A 1990-09-21 1990-09-21 Light emitting diode light source Pending JPH04132275A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2253406A JPH04132275A (en) 1990-09-21 1990-09-21 Light emitting diode light source
US07/763,289 US5150016A (en) 1990-09-21 1991-09-20 LED light source with easily adjustable luminous energy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2253406A JPH04132275A (en) 1990-09-21 1990-09-21 Light emitting diode light source

Publications (1)

Publication Number Publication Date
JPH04132275A true JPH04132275A (en) 1992-05-06

Family

ID=17250941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2253406A Pending JPH04132275A (en) 1990-09-21 1990-09-21 Light emitting diode light source

Country Status (1)

Country Link
JP (1) JPH04132275A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11312826A (en) * 1998-03-11 1999-11-09 Mannesmann Vdo Ag Light-emitting diode
JP2006269756A (en) * 2005-03-24 2006-10-05 Fujikura Ltd Light emitting element unit and its production process, display, illuminator, and traffic signal
WO2008012958A1 (en) * 2006-07-24 2008-01-31 Sharp Kabushiki Kaisha Back light device, and display device using same
US7570147B2 (en) 2001-08-31 2009-08-04 Osram Opto Semiconductors Gmbh Fuse component comprising an optical indicator
US20100309649A1 (en) * 2009-06-09 2010-12-09 Epistar Corporation Photoelectronic device having a variable resistor structure
JP2015146449A (en) * 2015-04-03 2015-08-13 日亜化学工業株式会社 light-emitting device
AT517122B1 (en) * 2015-05-08 2018-12-15 Zkw Group Gmbh Method for symmetrizing the branches of a lighting device for vehicles

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529850A (en) * 1975-07-15 1977-01-25 Oki Electric Ind Co Ltd Semiifixed electron variable resistor
JPS6348954A (en) * 1986-08-18 1988-03-01 Fuji Electric Co Ltd Luminaire to reading object of linear image sensor
JPH02159747A (en) * 1988-12-14 1990-06-19 Yokogawa Electric Corp Ic having built-in adjusting circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529850A (en) * 1975-07-15 1977-01-25 Oki Electric Ind Co Ltd Semiifixed electron variable resistor
JPS6348954A (en) * 1986-08-18 1988-03-01 Fuji Electric Co Ltd Luminaire to reading object of linear image sensor
JPH02159747A (en) * 1988-12-14 1990-06-19 Yokogawa Electric Corp Ic having built-in adjusting circuit

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11312826A (en) * 1998-03-11 1999-11-09 Mannesmann Vdo Ag Light-emitting diode
EP0942474A3 (en) * 1998-03-11 2002-06-05 Siemens Aktiengesellschaft Light emitting diode
US7570147B2 (en) 2001-08-31 2009-08-04 Osram Opto Semiconductors Gmbh Fuse component comprising an optical indicator
JP2006269756A (en) * 2005-03-24 2006-10-05 Fujikura Ltd Light emitting element unit and its production process, display, illuminator, and traffic signal
WO2008012958A1 (en) * 2006-07-24 2008-01-31 Sharp Kabushiki Kaisha Back light device, and display device using same
US20100309649A1 (en) * 2009-06-09 2010-12-09 Epistar Corporation Photoelectronic device having a variable resistor structure
JP2015146449A (en) * 2015-04-03 2015-08-13 日亜化学工業株式会社 light-emitting device
AT517122B1 (en) * 2015-05-08 2018-12-15 Zkw Group Gmbh Method for symmetrizing the branches of a lighting device for vehicles

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