JP2012089357A - Laminated body for led lighting substrate, and led lighting using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated body for an LED lighting substrate excellent in heat radiation, with a simple structure and high productivity, and of low cost, and an LED lighting with high performance and of low cost.SOLUTION: The laminated body for the LED lighting substrate 1 is for mounting LED elements 2, and has a base material 11 made of an aluminum alloy, an insulating coated layer 12, a high reflection coated layer 13, and electrode parts 14. The electrode part 14 is formed so as to expose an electrode surface 141 which is electrically connected with a terminal 21 of each LED element 2.

Description

  The present invention relates to a laminate for an LED illumination substrate for mounting an LED element and an LED illumination using the laminate.

In recent years, LED lighting has been widely used as lighting that contributes to environmental conservation. Since there are cases where it is possible to reduce power consumption and extend the life while securing the same amount of light as that of incandescent and fluorescent lamps used in the past, energy saving, waste reduction and the number of replacement operations Can be reduced.
However, since LED lighting is more expensive than incandescent lamps and fluorescent lamps, cost reduction is required. Moreover, since the LED element used for LED illumination uses the solid semiconductor itself as a light emitter, the deterioration of the solid semiconductor leads to a decrease in the amount of light. One factor that accelerates the deterioration of a solid semiconductor is the heat generated by the LED element when it is turned on, and it is required to efficiently dissipate this heat to extend the life.

FIG. 11 shows a mounting example of an LED mounting board in LED lighting that has been used conventionally.
The LED mounting substrate 9 has a LED assembly 93 attached by a conductive adhesive tape 92 on a base material 91 made of a flat aluminum plate. The LED assembly 93 includes a base member 937 made of an aluminum alloy, and has a base-integrated laminated structure in which a plurality of layers are laminated thereon. An insulating resin layer 936 is formed on the upper surface of the base member 937 of the LED assembly 93. A white resist layer 935 and a plurality of electrode portions 934 are formed on the upper surface of the insulating resin layer 936. A plurality of LED elements 931 are arranged on the electrode 934, and are connected to the electrode 934 by soldering a terminal 932 included in the LED element 931. The electrode 934 is soldered with a conductive wire (not shown) for connection with a power supply circuit (not shown).

  Further, as a structure for improving heat dissipation, a structure in which a metal lead frame and a high thermal conductive insulating resin are integrally formed and an LED element is directly mounted on the lead frame is also disclosed (Patent Document 1). ).

JP 2010-50563 A

By the way, the structure described above has the following problems.
In the above-described method of mounting the pedestal integrated LED assembly on the base material with the conductive adhesive tape, the exposed surface area of the pedestal member included in the LED assembly is small, and therefore the heat dissipation is small. Sufficient heat dissipation performance cannot be obtained with only the members.

  Moreover, since the said base material has a comparatively large surface area, heat dissipation can be improved by transmitting the heat | fever which the said LED element emits efficiently to the said base material. However, the LED element is disposed on a pedestal member via the electrode, the highly reflective coating layer and the insulating coating layer, and the pedestal member and the base material are mounted via a conductive adhesive tape. Yes. Further, the insulating coating layer often has a thickness of about 80 μm. Thus, since many structural members exist between the said LED element and the said base material, the heat transfer efficiency in the meantime deteriorates. Therefore, the heat generated by the LED element is not easily transmitted to the base material, and the heat dissipation performance of the base material may not be used effectively.

  In the structure shown in Patent Document 1, a metal lead frame and a high thermal conductive insulating resin are integrally formed, and an LED element is directly mounted on the lead frame. Therefore, the heat generated by the LED element is efficiently transmitted to the lead frame. However, since the high thermal conductive insulating resin has lower thermal conductivity than a metal such as aluminum, the final heat dissipation performance does not reach that of the metal, and sufficient heat dissipation performance may not be obtained. Moreover, since the high thermal conductive insulating resin is expensive, it is difficult to reduce the cost.

  The present invention has been made in view of such problems, and has an excellent heat dissipation, a simple structure, high productivity, and an inexpensive laminate for an LED lighting substrate, and a high-performance and inexpensive LED illumination. It is something to be offered.

1st invention is the laminated body for LED lighting boards for mounting an LED element,
A flat substrate made of an aluminum alloy;
An insulating coating layer having electrical insulation formed on the surface of the substrate;
On the insulating coating layer, both a high reflection coating layer having electrical insulating properties and light reflection characteristics higher than those of the insulating coating layer, and an electrode part are printed and formed.
The electrode part is in a laminate for an LED lighting substrate, characterized in that the electrode part is formed so as to expose an electrode surface for electrical connection with a terminal included in the LED element.

2nd invention is LED lighting using the laminated body for LED lighting boards of 1st invention, Comprising:
An LED mounting board in which one or a plurality of LED elements are mounted on the laminate for the LED lighting board;
A heat dissipation member made of an aluminum alloy,
In the LED illumination, the heat radiation member and the LED mounting substrate are directly joined.

  The laminate for an LED lighting substrate in the first invention is formed by forming the insulating coating layer on the surface of the base material, and printing and forming the highly reflective coating layer and the electrode portion on the insulating coating layer. is there. Therefore, the LED element can be directly mounted on the electrode part. Therefore, the number of constituent members existing between the LED element and the base material can be reduced as compared with the structure in which the base-integrated LED assembly is mounted. Therefore, the thermal conductivity between the LED element and the base material can be improved.

  Moreover, the said base material consists of an aluminum alloy excellent in heat dissipation. Therefore, the heat generated from the LED element and transmitted to the base material can be efficiently radiated. In addition, aluminum alloy plates can be efficiently manufactured in large quantities using a continuous line, unlike castings and die-cast products. Therefore, the material cost can be significantly reduced as compared with the conventional case. Further, it is possible to reduce the weight by making use of the lightweight property of the aluminum alloy. In addition, by forming the highly reflective coating layer, when the LED element emits light, the light diffused in the direction opposite to the irradiation direction can be efficiently reflected in the irradiation direction, and the light utilization efficiency is increased. be able to.

  2nd invention is LED illumination using the said LED mounting board | substrate which mounted the LED element in the laminated body for LED lighting board | substrates mentioned above. The LED illumination has a heat radiating member made of an aluminum alloy. Aluminum alloy is an inexpensive and lightweight material as described above. Therefore, it is possible to reduce the cost and weight of the LED lighting. Moreover, this heat radiating member and the said LED mounting board are joined directly. Therefore, the heat generated by the LED element can be efficiently transmitted from the base material to the heat dissipation member, and the heat dissipation performance can be further improved. Therefore, it is possible to obtain LED lighting having high performance and long life by effectively exhibiting the characteristics of the LED element.

  As described above, according to the present invention, it is possible to provide a laminated body for an LED lighting substrate that is excellent in heat dissipation, has a simple structure, has high productivity, and is inexpensive, and high-performance and inexpensive LED lighting.

The top view of the laminated body for LED illumination substrates in Example 1. FIG. FIG. 2 is a partial enlarged cross-sectional view corresponding to the line AA in FIG. The top view of the laminated body for LED illumination substrates in Example 2. FIG. FIG. 4 is a partial enlarged cross-sectional view corresponding to the arrow BB in FIG. Sectional drawing equivalent to CC arrow of FIG. 1 which shows LED illumination in Example 3. FIG. Sectional explanatory drawing which shows the LED mounting board and heat dissipation member before caulking fixation in Example 3. FIG. Explanatory drawing which shows the 1st crimping method in Example 3. FIG. Explanatory drawing which shows the 2nd crimping method in Example 3. FIG. Explanatory drawing which shows the 3rd crimping method in Example 3. FIG. Sectional explanatory drawing which shows the LED mounting substrate and heat dissipation member after caulking fixation in Example 3. FIG. The partial cross-section expansion explanatory drawing which shows the structure of the LED mounting board | substrate in a prior art example.

  The aluminum alloy mentioned above refers to various alloys mainly composed of aluminum, and includes so-called pure aluminum.

  The LED element includes at least an LED that is a light emitter, and an anode terminal and a cathode terminal that are electrically connected to the LED. The LED element may be various LED elements such as a translucent lens portion that covers the irradiation surface of the LED and a frame that also serves as a reflector on the side surface of the LED.

  Moreover, the formation order of the said highly reflective coating film layer and the said electrode part printed on the upper surface of the said insulating coating film layer is printed first, and the said electrode part is printed after that. Alternatively, the reverse order may be used. In any order, when the highly reflective coating layer and the electrode part are formed, the electrode part is formed so that at least the connection part connecting the LED element and the electrode part is exposed and adjacent. It is necessary that the electrode parts to be electrically insulated by the highly reflective coating film layer.

Moreover, it is preferable to use screen printing as a method of printing the highly reflective coating layer and the electrode part.
In this case, since the highly reflective coating film layer and the electrode part can be formed in a desired range, the above-described configuration can be easily formed.

The insulating coating layer preferably has a thickness of 5 μm to 50 μm and a dielectric breakdown voltage of 2 kV or more.
In this case, the insulation performance and thermal conductivity required for the insulating coating layer can be ensured.
In the case where the thickness of the insulating coating layer is less than 5 μm, the insulation performance becomes insufficient and insulation failure may occur.
When the thickness of the insulating coating layer exceeds 50 μm, the insulating coating layer deteriorates the thermal conductivity between the LED element and the substrate, and sufficient heat dissipation performance cannot be obtained. There is.
When the dielectric breakdown voltage is less than 2 kV, the insulation performance becomes insufficient and an insulation failure may occur.

The material of the insulating coating layer is made of at least one of polyester resin, urethane resin, polybutylene terephthalate resin, polystyrene terephthalate resin, epoxy resin, phenol resin, silicone resin, polyimide resin, and polyamideimide resin. (Claim 3).
The above-described material has a sufficiently high insulating property, and the necessary insulating performance can be obtained even when the thickness is reduced. Therefore, the thermal conductivity can be improved by reducing the thickness of the insulating coating layer while ensuring the insulating performance. Therefore, the heat dissipation performance can be further improved.

The high reflective coating layer preferably has a spectral reflectance of 95% or more in the entire wavelength region of 430 nm to 460 nm, or a total reflectance of 95% or more in the entire wavelength region. .
In this case, the light emitted from the LED element can be used effectively, and the amount of light can be increased. That is, when an LED element is mounted on the laminate for an LED lighting substrate and used as LED lighting, a part of the light emitted from the LED element diffuses, and the LED lighting substrate disposed on the side opposite to the irradiation direction Irradiated to the laminate. By reflecting this light effectively, the amount of light in the irradiation direction can be increased.
If the spectral reflectance is less than 95% or the total reflectance is less than 95%, it may be difficult to obtain an effect of increasing the amount of light.

  In addition, the highly reflective coating layer is based on at least one of polyester resin, epoxy resin, furan resin, polybutylene terephthalate resin, polystyrene terephthalate resin, and silicone resin. , 5-thiophenediyl (5-tert-butyl-1,3-benzoxazole), titanium oxide, calcium carbonate, alumina, magnesium oxide, magnesium sulfate, zinc oxide, glass, aluminum nitride, silica, zirconium oxide It contains more than seeds.

The dielectric breakdown voltage of the highly reflective coating film is preferably 2 kV or higher.
In this case, necessary electrical insulation performance can be ensured between the electrode portions and between the electrode portions and the base material. When the dielectric breakdown voltage is less than 2 kV, the insulation performance becomes insufficient and an insulation failure may occur.

Moreover, it is preferable to form either one or both of the insulating coating layer and the highly reflective coating layer on both surfaces of the substrate.
In this case, the amount of heat radiation on the surface opposite to the surface can be increased. Therefore, the heat dissipation efficiency can be further improved.

In the LED lighting described above, the mounting substrate and the heat dissipation member are directly joined. As this joining method, various known joining methods can be employed. Especially, it is preferable that the said mounting board | substrate and the said heat radiating member are joined by crimping both (Claim 6).
In this case, the joint adhesion between the mounting substrate and the heat dissipation member can be enhanced, and heat generated from the LED element can be more efficiently transmitted from the LED lighting substrate laminate to the heat dissipation member. Therefore, heat can be efficiently radiated from the heat radiating member. Therefore, the characteristics of the LED element can be exhibited more effectively, and high-performance and long-life LED lighting can be obtained.

Example 1
A laminated body for an LED lighting substrate according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
As shown in FIGS. 1 and 2, the laminate 1 for an LED lighting substrate of the present example is a flat substrate 11 made of an aluminum alloy, and an insulating coating film having electrical insulation on the surface of the substrate 11. Layer 12 is formed. On the insulating coating layer 12, both the high reflection coating layer 13 and the electrode portion 14 having electrical insulating properties and light reflection characteristics higher than those of the insulating coating layer 12 are formed by printing. The electrode portion 14 is formed so as to expose the electrode surface 141 for electrical connection with the terminal 21 included in the LED element 2.

The details will be described below.
The LED lighting board laminate 1 shown in this example forms the LED mounting board 101 (FIG. 1) by mounting the LED elements 2, and forms the structural member of the LED bulb 10 (FIG. 5). As shown in FIGS. 1 and 2, the LED lighting substrate laminate 1 has a disk-shaped substrate 11 made of an aluminum alloy, and an insulating coating layer 12 is formed on both the front and back surfaces. . The insulating coating layer 12 was made of an epoxy resin and was formed by electrodeposition coating. After electrodeposition coating, the coating was baked and the coating was baked and cured. The baking treatment of the coating was performed under the conditions of heating and holding for 15 minutes at an atmospheric temperature of 190 ° C., and further heating and holding for 10 minutes at an atmospheric temperature of 260 ° C. The insulating coating layer has a thickness of 20 μm and a dielectric breakdown voltage of 4.5 kV.

As shown by a broken line in FIG. 2, an electrode portion 14 is printed on the upper surface of the insulating coating layer 12 on the surface side of the substrate 11. The electrode part 14 was formed by screen printing using a conductive paint whose binder is made of polyester resin and whose conductive filler is silver powder. After forming the electrode part 14, temporary baking was performed, and the conductive paint forming the electrode part 14 was temporarily fixed. The pre-baking process of the electrode part 14 was performed on the conditions which heat-maintain for 5 minutes at atmospheric temperature 180 degreeC. In this example, six electrode portions 14 having a substantially trapezoidal shape are formed on the inner side of the disk formed by the base material 11 at substantially the same interval in the circumferential direction.

  As shown in FIG. 2, a highly reflective coating layer 13 is printed on the upper surface of the insulating coating layer 12. The highly reflective coating layer 13 is composed of a highly reflective paint containing an unsaturated polyester resin paint and barium sulfate which is a highly reflective material. The highly reflective coating layer 13 having a thickness of 20 μm was formed by screen printing of the highly reflective paint. At this time, on the electrode surface 141 of the electrode part 14, the connection surface 142 connected to the terminal 21 of the LED element 2 is exposed, and the highly reflective coating film layer 13 is formed. After the highly reflective coating layer 13 is formed, a baking treatment is performed, and the highly reflective coating material forming the highly reflective coating layer 13 is baked and cured. The baking process of the highly reflective coating layer 13 was performed under the condition of heating and holding at an atmospheric temperature of 150 ° C. for 60 minutes. In the highly reflective coating layer 13, the total reflectance is 95% or more.

  The low melting point solder paste is applied on the connection surface 142 of the electrode surface 141 of the LED lighting substrate laminate 1 configured as described above, and the two terminals 21 of the LED element 2 are connected to the two adjacent electrode portions 14. The connection surfaces 142 are arranged so as to be connected to each other. Thereafter, the substrate was heated and held at an ambient temperature of 100 ° C. for 20 seconds, and the LED element 2 and the electrode part 14 were soldered to obtain the mounting substrate 101 shown in FIG.

Next, the function and effect of this example will be described.
As shown in FIG. 2, the LED lighting substrate laminate 1 in this example forms an insulating coating layer 12 on the surface of a substrate 11, and a highly reflective coating layer 13 and an electrode portion on the insulating coating layer 12. Both of them are formed by printing. Therefore, the LED element 2 can be directly mounted on the electrode part 14. In this example, the thickness of the insulating coating layer 12 and the thickness of the highly reflective coating layer 13 are as very thin as 20 μm, respectively, so that the influence on the thermal conductivity is small. Therefore, the thermal conductivity between the LED element 2 and the base material 11 can be improved.

Moreover, the aluminum alloy which is a material of the base material 11 is excellent in heat dissipation and lightweight. Therefore, the heat generated by the LED element 2 can be effectively radiated from the base material 11, and the weight can be reduced. In addition, aluminum alloy plates can be efficiently manufactured in large quantities using a continuous line, unlike castings and die-cast products. Therefore, the material cost can be significantly reduced as compared with the conventional case. In addition, by forming the highly reflective coating layer 13, when the LED element 2 emits light, the light diffused in the direction opposite to the irradiation direction can be efficiently reflected in the irradiation direction, and the light use efficiency can be improved. Can be increased.

  The insulating coating layer 12 has a thickness of 20 μm and a dielectric breakdown voltage of 4.5 kV. Therefore, while ensuring the insulation performance required for the insulating coating film layer 12, it is possible to prevent deterioration in thermal conductivity between the LED element 2 and the substrate 11.

  The material of the insulating coating layer 12 is made of a sulfonium-containing type epoxy resin that has been reduced and rendered non-conductive. Therefore, the required insulation performance can be obtained even when the insulation is sufficiently high and the thickness is reduced. Therefore, it is possible to reduce the thickness of the insulating coating layer and improve the thermal conductivity while ensuring the insulating performance. Therefore, the heat dissipation performance can be further improved.

  The highly reflective coating film layer 13 has a total reflectance of 95% or more. Therefore, the light diffused when the LED element 2 emits light can be used effectively, and the amount of light can be increased. That is, when the LED element 2 is mounted on the LED lighting substrate laminate 1 and used as the LED illumination 10, a part of the light emitted from the LED element 2 diffuses and the LED illumination is arranged on the opposite side to the irradiation direction. Irradiation to the substrate laminate 1 side. By reflecting this light effectively, the amount of light in the irradiation direction can be increased.

Insulating coating layers 12 are formed on both surfaces of the substrate 11. Therefore, it is possible to increase the amount of heat radiation on the surface arranged on the side opposite to the surface. Therefore, the heat dissipation efficiency can be further improved.
Thus, according to this example, it is possible to provide an LED lighting substrate laminate that is excellent in heat dissipation, simple in structure, high in productivity, and inexpensive.

(Example 2)
As shown in FIGS. 3 and 4, this example is an example in which the formation order of the highly reflective coating layer 13 and the electrode portion 14 of the laminate 1 for an LED lighting substrate shown in Example 1 is changed.
In this example, the highly reflective coating film layer 13 is formed first, and the electrode part 14 is formed thereafter. The highly reflective coating layer 13 was formed on the insulating coating layer 12 in a range other than the portion where the electrode portion 14 was formed. After forming the highly reflective coating layer 13, temporary baking was performed to temporarily fix the highly reflective coating layer 13. The pre-baking treatment of the highly reflective coating film layer 13 was performed under the conditions of heating and holding for 5 minutes at an atmospheric temperature of 150 ° C. The highly reflective coating layer 13 in this example is made of a highly reflective white resist based on silicone. The highly reflective white resist has a spectral reflectance of 95% or more over the entire wavelength range of 430 nm to 460 nm.

  Next, the electrode part 14 is formed by screen printing in the part in which the highly reflective coating layer 13 is not formed on the insulating coating layer 12. After forming the electrode part 14, the highly reflective coating film layer 13 and the electrode part 14 are baked and cured by performing a baking treatment. The baking treatment of the highly reflective coating layer 13 and the electrode portion 14 was performed under the condition of heating and holding at an atmospheric temperature of 180 ° C. for 10 minutes. Other configurations are the same as those of the first embodiment.

  In this example, the highly reflective coating layer 13 is made of a highly reflective white resist and has a spectral reflectance of 95% or more in the entire wavelength range of 430 nm to 460 nm. Therefore, the light diffused when the LED element 2 emits light can be used effectively, and the amount of light can be increased. That is, when the LED element 2 is mounted on the LED lighting substrate laminate 1 and used as the LED illumination 10, a part of the light emitted from the LED element 2 diffuses and the LED illumination is arranged on the opposite side to the irradiation direction. Irradiation to the substrate laminate 1 side. By reflecting this light effectively, the amount of light in the irradiation direction can be increased. In addition, the same effects as those of the first embodiment are obtained.

  In Example 1 and Example 2 described above, the insulating coating layer, the highly reflective coating layer, and the electrode portion were formed on the base material on the disc, but in the aluminum alloy plate before processing, the insulating coating layer After forming the layer, the highly reflective coating film layer, and the electrode portion, the desired shape can be obtained by press punching or the like.

(Example 3)
As shown in FIG. 5, the present example is an LED bulb 10 using the LED lighting substrate laminate 1 shown in the first embodiment. As shown in FIG. 1, it has the LED mounting board | substrate 101 which mounted the 5 LED element 2 in the laminated body 1 for LED lighting board | substrates, and the heat radiating member 102 which consists of aluminum alloys. The heat dissipating member 102 and the LED mounting substrate 101 are joined by caulking them.

  The LED illumination 10 shown in this example includes an LED mounting substrate 101, a heat radiating member 102, a cover 103 made of a translucent material, and a base 104 for connecting to a power supply socket such as a house. The cover 103 is disposed in the opening of the heat dissipation member 102 on the side where the LED bulb 10 emits light. The cover 103 is made of a translucent white resin for weight reduction and damage prevention. The base 104 is disposed in an opening located on the opposite side of the heat dissipation member 102 from the cover 103. The base 104 is connected to an AC-DC conversion circuit (not shown) provided inside the heat dissipation member 102 for converting an alternating current into a direct current and supplying the current to the LED element.

The heat radiating member 102 employs an aluminum alloy plate as a material. Next, the heat radiating member 102 was produced by using the above-mentioned material and forming it into a substantially conical shape shown in FIG. The heat dissipating member 102 is open at both ends in the axial direction, and only the opening end portion 105 on the large diameter side joined to the LED mounting substrate 101 has a straight shape extending straight along the axial direction.
Further, in the LED lighting board laminate 1 of this example, as shown in FIG. 6, in the stage before forming the laminated structure, the outer peripheral edge portion of the base material 11 is drawn at a substantially right angle to form a flange. A portion 112 is formed.

As shown in FIGS. 6 to 9, the LED mounting substrate 101 and the heat dissipation member 102 are joined by caulking.
First, as shown in FIG. 6, the LED mounting substrate 101 is inserted and arranged inside the opening end portion 105 of the heat dissipation member 102 so that the flange portion 112 faces outward.
Next, as shown in FIG. 7, the first press working is performed, and the upper half portion 106 of the opening end portion 105 of the heat radiating member 3 starts from the tip end portion of the flange portion 112 of the LED mounting substrate 101 in the radial direction. Molded to be slanted inward.

Next, as shown in FIG. 8, a second press work is performed, and molding is performed until the upper half portion 106 of the opening end portion 105 of the heat radiating member 102 faces in a direction substantially orthogonal to the axial direction.
Next, as shown in FIG. 9, a third press process is performed so that the tip portion 107 of the upper half portion 106 of the opening end portion 105 of the heat dissipation member 102 is changed to the inner peripheral surface of the flange portion 112 of the LED mounting substrate 101. It is molded so as to have a folded shape so as to approach.
As a result, the caulking process is completed, and the LED mounting substrate 101 and the heat dissipation member 102 are joined over the entire circumference. Note that the caulking process in this example is sometimes called a winding process.

  The obtained LED bulb member 1 is configured by combining parts made of two aluminum alloy plates as described above. As described above, the aluminum alloy plate is a material excellent in productivity. Therefore, the material cost can be significantly reduced as compared with the conventional case. Moreover, the light weight of the aluminum alloy plate can be utilized to reduce the weight of the LED bulb member 1 as a whole.

Further, the LED mounting substrate 101 and the heat dissipation member 102 are joined by caulking as described above. As a result, the adhesion between the LED mounting substrate 101 and the heat radiating member 102 can be enhanced, the heat generated from the LED element 2 can be efficiently transferred from the LED mounting substrate 101 to the heat radiating member 102, and the heat dissipation Heat can be efficiently radiated from the member 102. Therefore, if the LED bulb member 1 is used, it is possible to effectively exhibit the characteristics of the LED element and obtain a high-performance and long-life LED bulb.
In addition, in this example, although the LED bulb was taken as an example, it is not restricted to this, The laminated body for LED lighting board | substrates and LED illumination which were mentioned above can be used for the various illuminating devices using LED.

DESCRIPTION OF SYMBOLS 1 Laminate for LED illumination board 10 LED bulb 101 LED mounting board 102 Heat radiation member 11 Base material 12 Insulating coating layer 13 High reflection coating layer 14 Electrode part 141 Electrode surface 2 LED element

Claims (7)

A laminate for an LED lighting substrate for mounting an LED element,
A flat substrate made of an aluminum alloy;
An insulating coating layer having electrical insulation formed on the surface of the substrate;
On the insulating coating layer, both a high reflection coating layer having electrical insulation properties and light reflection characteristics higher than those of the insulating coating layer, and an electrode part are printed and formed.
The electrode portion is formed so as to expose an electrode surface for electrical connection with a terminal included in the LED element.   2. The LED lighting substrate according to claim 1, wherein the insulating coating layer has a thickness of 5 μm to 50 μm and a dielectric breakdown voltage of 2 kV or more. Laminated body.   It is a laminated body for LED lighting boards of Claim 1 or 2, Comprising: The material of the said insulating coating layer is a polyester resin, a urethane resin, a polybutylene terephthalate resin, a polystyrene terephthalate resin, an epoxy resin, a phenol resin, silicone It consists of at least 1 sort (s) among resin, a polyimide resin, and a polyamideimide resin, The laminated body for LED lighting boards characterized by the above-mentioned.   It is a laminated body for LED lighting substrates as described in any one of Claims 1-3, Comprising: The said high reflective coating-film layer has a spectral reflectance of 95% or more in the whole region of a wavelength range of 430 nm-460 nm, or A laminate for an LED lighting substrate, wherein the total reflectance in all wavelength regions is 95% or more.   It is a laminated body for LED lighting substrates as described in any one of Claims 1-4, Comprising: Either one or both of the said insulating coating film layer and the said highly reflective coating film layer were formed in both surfaces of the said base material. A laminate for an LED lighting board, characterized in that. LED lighting using the laminate for LED lighting substrate according to claim 1,
An LED mounting board in which one or a plurality of LED elements are mounted on the laminate for the LED lighting board;
A heat dissipation member made of an aluminum alloy,
LED lighting characterized in that the heat dissipating member and the LED mounting substrate are directly joined.   7. The LED illumination according to claim 6, wherein the mounting substrate and the heat dissipation member are joined by caulking them.

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