WO2013014979A1

WO2013014979A1 - Light emission device and method for manufacturing light emission device

Info

Publication number: WO2013014979A1
Application number: PCT/JP2012/058860
Authority: WO
Inventors: 雄也大西; 浩司宮田; 岩崎　良英
Original assignee: シャープ株式会社
Priority date: 2011-07-28
Filing date: 2012-04-02
Publication date: 2013-01-31
Also published as: JP2013030572A

Abstract

Provided is a light emission device that has a reduced likelihood of peeling and other problems and that is readily manufacturable. Also provided is a method for manufacturing the light emission device. A light emission device (1Aa) is provided with: a substrate (10); a reflecting layer (11Aa) formed on the substrate (10) and having a protrusion (111) protruding in an annular shape; a light-emitting element (12) provided on the reflecting layer (11Aa) within an inside region (IN) surrounded by the inner peripheral wall of the protrusion (111); a sealing material (13) for sealing the light-emitting element (12); and a repellent layer (14) having repellent properties with respect to the sealing material (13) in a state of having fluidity, the repellent layer formed at least on the top surface of the protrusion (111). At least a part of the outer edge of the sealing material (13) is positioned on the repellent layer (14).

Description

LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD

The present invention relates to a light-emitting device using a light-emitting element typified by a light-emitting diode (LED: Light Emitting Diode), and a manufacturing method thereof.

Light emitting devices using light emitting elements such as LEDs have advantages such as low power consumption, small size, high luminance, and long life, and thus have been used in various applications in recent years. For example, as an alternative to an incandescent lamp with high power consumption, it has come to be used in lighting devices.

In such a light-emitting device, the light-emitting element is sealed with a sealing material such as resin in order to protect the light-emitting element mounted on the substrate or the like, or to adjust the light emitted from the light-emitting device. A conventional sealing method of a light emitting element will be described with reference to FIG. FIG. 13 is a cross-sectional view illustrating a conventional method for sealing a light emitting element.

In the sealing method shown in FIG. 13, molds M 1 and M 2 are used to seal the light emitting element 203 provided on the reflective layer 202 formed on the substrate 201 with the sealing material 204. Specifically, the sealing material 204 is accommodated in the recess of the mold M1, the molds M1 and M2 are joined in a state where the substrate 201 is accommodated in the recess of the mold M2, and sealed by applying pressure, heat, or the like. The light emitting element 203 is sealed by curing the agent 204.

However, in the sealing method shown in FIG. 13, the molds M1 and M2 are essential. For this reason, for example, when the structure of the light emitting device is to be changed, a mold corresponding to the new structure must be manufactured each time, which requires a lot of time and cost. Therefore, the structure of the light emitting device cannot be easily changed, which is a problem.

For this problem, for example, Patent Document 1 proposes a light emitting device in which a light emitting element is sealed with a sealing material without using a mold. This light-emitting device will be described with reference to FIG. FIG. 14 is a cross-sectional view and a plan view showing an example of the structure of a conventional light emitting device. 14A is a cross-sectional view, FIG. 14B is a plan view, and the cross-section shown in FIG. 14A shows the XX cross-section shown in FIG. 14B.

As illustrated in FIG. 14, the light-emitting device 300 includes a substrate 301, a reflective layer 302 formed on the substrate 301, a light-emitting element 303 provided on the reflective layer 302, and a sealing material that seals the light-emitting element 303. 304 and a repellent layer 305 that is provided on the reflective layer 302 and has a repellent property with respect to the sealing material 304 in a fluid state. In the light emitting device 300, the annular repellent layer 305 is formed to suppress the sealing material 304 from flowing out. Therefore, the light emitting element 303 can be sealed without using a mold.

However, in the light-emitting device 300 illustrated in FIG. 14, there is a limit to the size of the sealing material 304 that can suppress the spread in the horizontal plane by the repellent layer 305, and the sealing material 304 is necessarily flat. Therefore, the light extraction efficiency is deteriorated, which is a problem. In order to efficiently extract light from the light-emitting device, the sealing material for sealing the light-emitting element must be close to a hemispherical shape.

For this problem, for example, Patent Document 2 proposes a light-emitting device in which the shape of the sealing material is close to a hemispherical shape without using a mold. This light-emitting device will be described with reference to FIG. FIG. 15 is a cross-sectional view and a plan view showing another example of the structure of the conventional light emitting device. 15A is a sectional view, FIG. 15B is a plan view, and the section shown in FIG. 15A is a YY section shown in FIG. 15B.

14, the light-emitting device 400 illustrated in FIG. 15 includes a substrate 401, a reflective layer 402, a light-emitting element 403, and a sealing material 404. However, in the light emitting device 400 illustrated in FIG. 15, a mark ink material 405 having repellency with respect to the sealing material 404 having fluidity is provided on the reflective layer 402 instead of the repellant layer 305 illustrated in FIG. 14. Thus, the shape of the sealing material 404 is controlled.

JP 2008-258296 A Japanese Patent No. 4107349

However, in the light emitting device 400 shown in FIG. 15, it is necessary to separately provide the mark ink material 405 having a different material from that of the reflective layer 402 on the reflective layer 402, so that the manufacturing method becomes complicated and the cost increases. Or a problem. Further, the reflective layer 402 and the mark ink material 405 are problematic because the bonding strength is weakened due to the different materials, and problems such as peeling may occur.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a light-emitting device that can be easily manufactured with less difficulty such as peeling, and a manufacturing method thereof.

To achieve the above object, the present invention comprises a substrate,
A reflective layer formed on the substrate and having a projecting portion projecting annularly;
A light emitting element provided in an inner region surrounded by an inner peripheral wall surface of the protruding portion;
A sealing material for sealing the light emitting element;
A repellent layer that is formed on at least the top surface of the protruding portion and has a repellent property with respect to the sealing material in a fluid state, and at least a part of an outer edge of the sealing material has the repellent property Provided is a light emitting device which is located on a layer.

Note that the reflective layer can be formed of the same material as a whole including the protruding portion.

Furthermore, in the light emitting device having the above characteristics, the surface of the repellent layer formed on the top surface of the protrusion is 20 μm or more than the surface of the reflection layer adjacent to the protrusion in the inner region. A higher value is preferable.

If comprised in this way, since the effect which suppresses the expansion in the horizontal surface of a sealing material by the combination of a protrusion part and a repellent layer will be acquired suitably, a sealing material can be easily hemispherical (or shape near this). It becomes possible to.

Furthermore, in the light emitting device having the above characteristics, it is preferable that the inner peripheral wall surface of the protruding portion is perpendicular to the surface of the reflective layer adjacent to the protruding portion in the inner region.

If comprised in this way, since the effect which suppresses the expansion in the horizontal surface of a sealing material by the combination of a protrusion part and a repellent layer will be acquired suitably, a sealing material can be easily hemispherical (or shape near this). It becomes possible to. Note that “vertical” is not limited to a case where the angle is completely 90 degrees, and naturally includes a case where the angle is deviated from 90 degrees by a predetermined angle or less (substantially vertical) as long as the above effect is obtained.

Furthermore, in the light emitting device having the above characteristics, it is preferable that the repellent layer is formed on at least the inner peripheral wall surface side of the top surface of the protruding portion.

If comprised in this way, since the outer edge of a sealing material is fastened by the inner peripheral wall side of the top surface of a protrusion part, and the expansion in the horizontal surface of a sealing material is suppressed effectively, hemispherical ( Or a shape close to this).

Furthermore, in the light emitting device having the above characteristics, it is preferable that the repellent layer is formed on the entire top surface of the protruding portion.

This configuration makes it possible to fasten the outer edge of the sealing material on the top surface of the protrusion.

Furthermore, in the light emitting device having the above characteristics, it is preferable that the repellent layer is also formed on the outer peripheral wall surface of the protruding portion.

With this configuration, even if at least a part of the outer edge of the sealing material exceeds the repellent layer formed on the top surface of the protruding portion, it remains on the repellent layer formed on the outer peripheral wall surface. Therefore, the expansion of the sealing material in the horizontal plane is effectively suppressed, and the sealing material can be made hemispherical (or a shape close to this).

Furthermore, in the light emitting device having the above characteristics, the reflective layer has a pedestal in the inner region,
The thickness of the pedestal portion is greater than the thickness of the reflective layer adjacent to the pedestal portion in the inner region,
It is preferable that the light emitting element is provided immediately above the pedestal.

With this configuration, the base portion having a large thickness efficiently reflects the light emitted from the light emitting element. Therefore, the light extraction efficiency of the light emitting device can be increased. In addition, a reflection layer can be formed with the same material as a whole including a protrusion part.

Furthermore, it is preferable that the light-emitting device having the above-described characteristics is such that the reflective layer has at least one outer projecting portion projecting in an annular shape in an outer region outside the region surrounded by the outer peripheral wall surface of the projecting portion.

With this configuration, it is possible to efficiently reflect the light emitted from the light emitting element or the sealing material. In addition, a reflection layer can be formed with the same material as a whole including an outside protrusion part.

Furthermore, in the light emitting device having the above characteristics, it is preferable that the sealing material includes a phosphor.

The light-emitting device having the above characteristics further includes an inner sealing material that includes a phosphor and seals the light-emitting element,
It is preferable that the sealing material seals the light emitting element together with the inner sealing material.

When configured in this manner, a double dome structure is formed by the inner sealing material and the sealing material. Therefore, it becomes possible to extract light from the light emitting device more efficiently by using the outer sealing material as a lens.

Furthermore, the light-emitting device having the above characteristics includes an annular inner repellent layer that is formed on the reflective layer in the inner region and has repellency to the inner sealing material in a fluid state. In addition,
It is preferable that at least a part of the outer edge of the inner sealing material is located on the inner repellent layer.

Structuring in this way makes it possible to suppress the expansion of the inner sealing material in the horizontal plane and to keep the inner sealing material in an arbitrary position.

Furthermore, in the light emitting device having the above characteristics, the reflective layer has an inner protrusion that protrudes in an annular shape in the inner region,
It is preferable that the inner sealing material is located in a region surrounded by an inner peripheral wall surface of the inner protrusion.

Structuring in this way makes it possible to suppress the expansion of the inner sealing material in the horizontal plane and to keep the inner sealing material in an arbitrary position. Furthermore, it can avoid that the sealing material and an inner side sealing material harden | cure in the state including the inner side repellent layer. Therefore, it becomes possible to suppress that a crack generate | occur | produces in a sealing material and an inner side sealing material. In addition, a reflection layer can be formed with the same material as a whole including an inner side protrusion part.

Further, in the light emitting device having the above characteristics, it is preferable that the material forming the reflective layer is the same material as the white resin, metal, or the material forming the substrate.

With this configuration, light incident on the reflective layer (for example, light emitted from the light emitting element, light emitted from the phosphor included in the sealing material, light refracted or reflected by the sealing material, etc.) At least a portion can be reflected. Therefore, the intensity of light emitted from the light emitting device can be increased.

Further, the present invention provides a reflective layer forming step of forming a reflective layer having a projecting portion projecting annularly on a substrate,
A repellent layer forming step of forming a repellent layer on at least the top surface of the protrusion;
A light emitting element mounting step of providing a light emitting element in an inner region surrounded by an inner peripheral wall surface of the protruding portion;
A sealing step of sealing at least the light emitting element by injecting a sealing material into the inner region,
The repellency layer has repellency with respect to the sealing material in a state having fluidity in the sealing step,
In the sealing step, there is provided a method for manufacturing a light emitting device, wherein the sealing material is injected so that at least a part of an outer edge of the sealing material is positioned on the repellent layer.

Furthermore, the manufacturing method of the light emitting device having the above characteristics includes the reflective layer forming step,
On the substrate having a flat surface, the reflective layer having the protruding portion is formed by laminating a material constituting the reflective layer a plurality of times.
Alternatively, it is preferable to form a reflective layer having the protruding portion by forming irregularities on the substrate.

With this configuration, it is possible to easily produce a reflective layer that has a protrusion and is integrated as a whole.

According to the light emitting device having the above characteristics and the method of manufacturing the same, the protrusion forming a part of the reflective layer having a repellent layer formed on the top surface in order to cure the sealing material in a hemispherical shape (or a shape close thereto) Department is used. Therefore, it is not necessary to separately provide a protrusion having a different material from that of the reflective layer on the reflective layer, and the light emitting device can be manufactured easily and at low cost. Furthermore, since the protruding portion is a part of the reflective layer and can be firmly bonded, it is possible to make it difficult to cause problems such as peeling.

Sectional drawing and top view which show the structure of the light-emitting device which concerns on the 1st example of 1st Embodiment of this invention. Sectional drawing which shows an example of the manufacturing method of the light-emitting device shown in FIG. Sectional drawing and the top view which show the structure of the light-emitting device which concerns on the 2nd example of 1st Embodiment of this invention. Sectional drawing and the top view which show the structure of the light-emitting device which concerns on the 3rd example of 1st Embodiment of this invention. Sectional drawing and top view which show the structure of the light-emitting device which concerns on the 1st example of 2nd Embodiment of this invention. Sectional drawing which shows an example of the manufacturing method of the light-emitting device shown in FIG. Sectional drawing and top view which show the structure of the light-emitting device which concerns on the 2nd example of 2nd Embodiment of this invention. Sectional drawing and top view which show the structure of the light-emitting device which concerns on the 3rd example of 2nd Embodiment of this invention. Sectional drawing and top view which show the structure of the light-emitting device which concerns on the 4th example of 2nd Embodiment of this invention. Sectional drawing and the top view which show the structure of the light-emitting device which concerns on the 5th example of 2nd Embodiment of this invention. Sectional drawing and top view which show the structure of the modification of the light-emitting device which concerns on embodiment of this invention. Sectional drawing and top view which show the structure of the modification of the light-emitting device which concerns on embodiment of this invention. Sectional drawing which shows the conventional sealing method of a light emitting element. Sectional drawing and top view which show an example of the structure of the conventional light-emitting device. Sectional drawing and top view which show another example of the structure of the conventional light-emitting device.

Hereinafter, as an embodiment of the present invention, the present invention is applied to a light-emitting device including a light-emitting element composed of an LED and a sealing material including a phosphor that emits fluorescence when excited by light emitted from the light-emitting element. An example of the case will be described. However, the light emitting device to which the present invention can be applied is not limited to the one having an LED as a light emitting element. For example, the present invention can be applied to a light emitting device including a light emitting element other than an LED such as a laser diode. The present invention is also applicable to a light emitting device including a sealing material that does not include a phosphor.

<< First Embodiment >>
<First example>
First, the structure of the light emitting device according to the first example of the first embodiment of the invention will be described with reference to FIG. FIG. 1 is a cross-sectional view and a plan view showing the structure of a light emitting device according to a first example of the first embodiment of the present invention. 1A is a cross-sectional view, FIG. 1B is a plan view, and the cross section shown in FIG. 1A is a cross section taken along the line AA shown in FIG. 1B.

As shown in FIG. 1, the light emitting device 1Aa includes a substrate 10 having a flat surface, a reflective layer 11Aa formed on the substrate 10, a light emitting element 12 provided on the reflective layer 11Aa, and the light emitting element 12 sealed. And a repellent layer 14 having repellency against the sealing material 13 in a fluid state.

The substrate 10 includes electrodes (not shown) for supplying power to the light emitting element 12 (for example, two electrodes of an anode electrode and a cathode electrode) and the like, and the electrode and the light emitting element 12 are not shown. It is connected by a connecting member such as a case of mounting) or a bump (in the case of flip chip mounting). In addition, the board | substrate 10 may be a printed circuit board which uses a ceramic, glass epoxy, Al, etc. as a base material, for example, may be a lead frame, a tape carrier, etc. In addition, the reflective layer 11Aa does not have to be partially formed in a portion where the connection member for connecting the light emitting element 12 and the electrode provided on the substrate 10 is provided or in the vicinity thereof.

The reflective layer 11Aa has a protruding portion 111 that protrudes in an annular shape (annular shape). The light emitting element 12 is disposed in an inner region IN surrounded by an annular (annular) inner peripheral wall surface that is an inner peripheral surface of the protruding portion 111. Reflection in the outer surface OUT, which is outside the region surrounded by the top surface of the protruding portion 111, the surface of the reflective layer 11Aa in the inner region, and the outer peripheral wall surface of the protruding portion 111. The surface of the layer 11Aa is flat.

Moreover, it is preferable that the inner peripheral wall surface of the protrusion 111 is perpendicular to the surface of the reflective layer 11Aa adjacent to the protrusion 111 in the inner region IN. With such a structure, the effect of suppressing the expansion of the sealing material 13 in the horizontal plane by the combination of the protruding portion 111 and the repellent layer can be suitably obtained. Near the shape). Note that “vertical” is not limited to a case where the angle is completely 90 degrees, and naturally includes a case where the angle is deviated from 90 degrees by a predetermined angle or less (substantially vertical) as long as the above effect is obtained.

The reflective layer 11Aa is made of, for example, a resin material (white resist) containing milky white titanium oxide, a metal material, a material constituting the substrate 10, or the like, and enters the reflective layer 11Aa (for example, the light emitting element 12 emits light). At least a part of light, light emitted from the phosphor contained in the sealing material 13, light refracted or reflected by the sealing material 13, and the like are reflected. Therefore, the intensity of the light emitted from the light emitting device 1Aa can be increased. The reflective layer 11Aa is preferably formed over the entire surface of the substrate 10.

The light emitting element 12 is, for example, a chip-like LED, and has a size of, for example, a long side of 500 μm, a short side of 290 μm, and a height of about 100 μm. In this case, for example, the overall size of the light emitting device 1Aa is about 2.8 mm in width (vertical and horizontal) and about 1.3 mm in height.

The light emitting element 12 emits blue light (specifically, for example, the peak wavelength is 450 nm). The light emitting element 12 may emit light other than blue light. For example, the light emitting element 12 may be an LED that emits ultraviolet light (specifically, for example, a peak wavelength of 390 nm to 420 nm).

In addition, the light emitting element 12 uses a fixing material such as die bond (in the case of wire bonding mounting) or underfill (in the case of flip chip mounting) as necessary, and has a main light emitting direction (light emitting surface). And fixed on the reflective layer 11Aa so as to be in the opposite direction to the substrate 10.

Sealing material 13 is a material that has fluidity during mounting and can be cured by applying heat or light thereafter. For example, it is made of an epoxy resin or a silicone resin. Specifically, the sealing material 13 seals the light emitting element 12 in a fluid state, and at least a part of the outer edge thereof is positioned on the repellent layer 14 (in other words, the sealing material 13 In the state where at least a part of the protrusions 111 and the repellent layer 14 are overcome). Thereby, since the expansion in the horizontal surface of the sealing material 13 is suppressed, it can suppress that the sealing material 13 becomes flat shape. Therefore, the sealing material 13 can be cured in a hemispherical shape (or a shape close to this).

The sealing material 13 includes a phosphor that is excited by blue light emitted from the light emitting element 12 and emits, for example, yellow fluorescence. In this case, the light emitted from the light emitting device 1Aa is white light in which blue light and yellow light are mixed. Note that the color of light emitted from the light emitting device 1Aa can be arbitrarily determined by appropriately selecting the type of light emitting element 12 or phosphor (color of emitted light).

The repellent layer 14 is formed at least on the top surface of the protruding portion 111. In addition, as long as the repellent layer 14 is formed at least on the top surface of the projecting portion 111, the other surface (for example, the reflection layer on the inner and outer wall surfaces of the projecting portion 111, the inner region IN and the outer region OUT). 11Aa surface, etc.). In particular, in order to make the shape of the sealing material 13 hemispherical (or a shape close to this), when the repellent layer 14 is formed not only on the top surface of the protruding portion 111 but also on the inner peripheral wall surface and the outer peripheral wall surface, Preferred (details will be described later).

In addition, the repellent layer 14 does not necessarily have to be formed on the entire top surface of the protruding portion 111, and has a width that can sufficiently prevent the sealing material 13 from spreading in the horizontal plane. You may form only in an inner peripheral wall side.

The repellent layer 14 is made of a material having repellent properties with respect to the sealing material 13 in a fluid state. For example, the repellent layer 14 is made of a fluorine-based polymer material.

Further, the surface of the repellent layer 14 formed on the top surface of the protruding portion 111 is 20 μm or more higher than the surface of the reflective layer 11Aa adjacent to the protruding portion 111 in the inner region IN (that is, the inner region IN). Is preferably provided with a step of 20 μm or more at the boundary. If comprised in this way, since the effect which suppresses the expansion in the horizontal surface of the sealing material 13 by the combination of the protrusion part 111 and the repellent layer 14 is obtained suitably, a sealing material is easily hemispherical (or this) Close shape).

Next, a method for manufacturing the light emitting device 1Aa according to the first example of the first embodiment of the present invention will be described with reference to FIG. FIG. 2 is a cross-sectional view illustrating an example of a manufacturing method of the light-emitting device shown in FIG. The cross-sectional view shown in FIG. 2 shows the same AA cross section as the cross-sectional view shown in FIG.

First, as shown in FIG. 2A, a substrate 10 is prepared. Next, as illustrated in FIG. 2B, a reflective layer 11 Aa is formed on the substrate 10. For example, a first layer made of a material constituting the reflective layer 11Aa is formed on the entire surface of the substrate 10 (excluding the portion where the connection member is provided), and a second layer made of the material is further attached to the first layer. The reflective layer 11Aa can be formed by partially forming on one layer.

At this time, when the reflective layer 11Aa is made of a positive photosensitive material (specifically, for example, the above-described white resist), the protrusion 111 is formed after the second layer is formed on the entire surface of the first layer. The reflective layer 11 Aa may be formed by exposing the photosensitive material except for the portion. If the reflective layer 11Aa is a negative photosensitive material, on the contrary, the portion where the protrusion 111 is to be provided may be exposed. Alternatively, the reflective layer 11Aa may be formed by forming the first layer and the second layer by printing.

In any of the above-described forming methods, the reflective layer 11Aa includes the protruding portion 111 and is made of the same material as a whole. In addition, by manufacturing the reflective layer 11Aa in this way, it is possible to easily manufacture the reflective layer 11Aa that has the protruding portion 111 and is integrated as a whole. Although the case where the reflective layer 11Aa is formed by laminating the material constituting the reflective layer 11Aa twice is exemplified, the reflective layer 11Aa may be formed by laminating three or more times. However, from the viewpoint of facilitating the manufacturing method, it is preferable to form the reflective layer 11Aa by stacking twice as in the above example.

Next, as shown in FIG. 2C, the repellent layer 14 is formed at least on the top surface of the protruding portion 111. As described above, as long as the repellent layer 14 is formed at least on the top surface of the protruding portion 111, it may be formed on other portions. That is, the repellent layer 14 can be formed so as to protrude from the top surface of the protrusion 111. Therefore, the repellent layer 14 does not require strict positioning during formation and can be easily formed. The repellent layer 14 can be formed by vapor deposition, printing, transfer, or the like.

Next, as shown in FIG. 2D, the light emitting element 12 is fixed in the inner region IN and on the reflective layer 11Aa. At this time, as described above, a fixing material is used as necessary. Then, as shown in FIG. 2 (e), the sealing material 13 having fluidity is injected into the inner region IN until at least a part of the outer edge is located on the repellent layer 14. And cured by applying heat or light. Thereby, the sealing material 13 can be hardened in a hemispherical shape (or a shape close thereto). The sealing material 13 can be injected by a dispenser, printing, or the like. However, when a dispenser is used, at least the position of the nozzle is set so that the tip of the nozzle that discharges the sealing material 13 does not contact a wire or the like. It is preferable that the height is higher than the height at which a wire or the like exists.

As described above, in the light emitting device 1Aa of this example, in order to harden the sealing material 13 in a hemispherical shape (or a shape close thereto), a part of the reflective layer 11Aa having the repellent layer 14 formed on the top surface. Is used. Therefore, it is not necessary to separately provide a protrusion having a different material from that of the reflective layer 11Aa on the reflective layer 11Aa, and the light emitting device 1Aa can be manufactured easily and at low cost. Furthermore, since the protruding portion 111 is a part of the reflective layer 11Aa and can be firmly joined, it is possible to make it difficult to cause problems such as peeling.

<Second example>
Next, the structure of the light emitting device according to the second example of the first embodiment of the invention will be described with reference to FIG. FIG. 3 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the second example of the first embodiment of the present invention. 3A is a cross-sectional view, FIG. 3B is a plan view, and the cross-section shown in FIG. 3A is a cross-section taken along the line BB shown in FIG. 3B. Note that the light emitting device 1Ab of this example shown in FIG. 3 shares most of the structure, effects, manufacturing method, and the like with the light emitting device 1Aa described so far. Therefore, in the light emitting device 1Ab of the present example, with respect to the parts common to the light emitting device 1Aa described so far, the description of the light emitting device 1Aa is referred to as appropriate, and the detailed description is omitted.

Similarly to the light emitting device 1Aa according to the first example of the first embodiment, the light emitting device 1Ab of this example also includes the substrate 10, the reflective layer 11Ab, the light emitting element 12, the sealing material 13, and the repellent layer 14. . However, in the light emitting device 1Ab of this example, the structure of the reflective layer 11Ab is different from the structure of the reflective layer 11Aa of the light emitting device 1Aa according to the first example of the first embodiment.

The reflective layer 11Ab of the light emitting device 1Ab of the present example has a protrusion 112 that is similar to the protrusion 111 described above, except that the outer peripheral wall surface extends to the end of the substrate 10. FIG. 3 illustrates the case where the repellent layer 14 is partially formed not on the entire top surface of the projecting portion 112 but on the inner peripheral wall surface side. As described for the light emitting device 1Aa of the example, it may be formed on a surface other than the top surface, or may be formed on the entire top surface.

Further, the reflective layer 11Ab of the light emitting device 1Ab of the present example has a pedestal portion 113 in which the light emitting element 12 is provided immediately above in the inner region IN. The thickness of the pedestal portion 113 is larger than the thickness of the reflective layer 11Ab adjacent to the pedestal portion 113 in the inner region IN.

In the light emitting device 1Ab of this example, the projection 112 and the pedestal 113 having a large thickness efficiently reflect the light emitted from the light emitting element 12 and the sealing material 13. Therefore, the light extraction efficiency of the light emitting device 1Ab can be increased.

In the light emitting device 1Ab of this example, the protrusion 112 may be the protrusion 111 (see FIG. 1) included in the light emitting device 1Aa according to the first example of the first embodiment. Further, in the light emitting device 1Ab of this example, the pedestal portion 113 may not be formed. Further, the light emitting device 1Ab of this example can be manufactured by applying the manufacturing method (see FIG. 2) of the light emitting device 1Aa according to the first example of the first embodiment. In this case, in the method for manufacturing the light emitting device 1Aa according to the first example of the first embodiment, when the protrusion 111 is formed (see FIG. 2B), the protrusion 112 and the pedestal 113 are formed by the same method. What is necessary is just to form.

<Third example>
Next, the structure of the light emitting device according to the third example of the first embodiment of the invention will be described with reference to FIG. FIG. 4 is a sectional view and a plan view showing the structure of the light emitting device according to the third example of the first embodiment of the present invention. 4A is a cross-sectional view, FIG. 4B is a plan view, and the cross section shown in FIG. 4A is a CC cross section shown in FIG. 4B. Note that the light emitting device 1Ac of this example shown in FIG. 4 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa and 1Ab described above. For this reason, in the light emitting device 1Ac of the present example, with respect to the portions common to the light emitting devices 1Aa and 1Ab described so far, the description of the light emitting devices 1Aa and 1Ab will be referred to as appropriate, and the detailed description will be omitted.

Similarly to the light emitting devices 1Aa and 1Ab according to the first example and the second example of the first embodiment, the light emitting device 1Ac of this example also has a substrate 10, a reflective layer 11Ac, a light emitting element 12, and a sealing material 13. And a repellent layer 14. However, in the light emitting device 1Ac of this example, the structure of the reflective layer 11Ab is different from the structures of the reflective layers 11Aa and 11Ab of the light emitting devices 1Aa and 1Ab according to the first and second examples of the first embodiment.

The reflection layer 11Ac of the light emitting device 1Ac of the present example includes the protrusion 111 and the pedestal 113 described above, and an outer protrusion 114 that protrudes in an annular shape in the outer region OUT. 4 illustrates the case where the outer peripheral wall surface of the outer projecting portion 114 extends to the end of the substrate 10, but the outer peripheral wall surface of the outer projecting portion 114 is formed in an annular shape in the same manner as the outer peripheral wall surface of the projecting portion 111. Also good.

In the light emitting device 1Ac of this example, the protruding outer protrusion 114 efficiently reflects the light emitted from the light emitting element 12 and the sealing material 13. Therefore, the light extraction efficiency of the light emitting device 1Ac can be increased.

In addition, in the light emitting device 1Ac of this example, the pedestal portion 113 may not be formed. The light emitting device 1Ac of this example can be manufactured by applying the method for manufacturing the light emitting device 1Aa according to the first example of the first embodiment (see FIG. 2). In this case, when the protruding portion 111 is formed in the method for manufacturing the light emitting device 1Aa according to the first example of the first embodiment (see FIG. 2B), the protruding portion 111, the pedestal portion 113, and the outer side are formed by the same method. The protrusion 114 may be formed.

<< Second Embodiment >>
<First example>
Initially, the structure of the light-emitting device which concerns on the 1st example of 2nd Embodiment of this invention is demonstrated with reference to FIG. FIG. 5 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the first example of the second embodiment of the present invention. 5A is a sectional view, FIG. 5B is a plan view, and the section shown in FIG. 5A is a DD section shown in FIG. 5B. The light emitting device 1Ba of this example shown in FIG. 5 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa to 1Ac described above. Therefore, in the light emitting device 1Ba of the present example, with respect to the portions common to 1Aa to 1Ac described so far, the description of the light emitting devices 1Aa to 1Ac is referred to as appropriate, and the detailed description is omitted.

Similarly to the light emitting devices 1Aa to 1Ac according to each example of the first embodiment, the light emitting device 1Ba of this example also includes the substrate 10, the reflective layer 11Ba having the above-described protrusion 111 (see FIG. 1), and the light emitting element 12. And a sealing material 13 and a repellent layer 14. However, the light emitting device 1Ba of this example includes an inner sealing material 131 that seals the light emitting element 12, and an inner sealing material 131 that is formed on the reflective layer 11Ba in the inner region IN and has fluidity. And an annular (annular) inner repellent layer 141 having repellent properties. The light emitting element 12 is provided in a region surrounded by the inner periphery of the inner repellent layer 141 and on the reflective layer 11Ba.

The inner sealing material 131 is described as being included in the sealing material 13 in the light emitting device 1Aa according to the first example of the first embodiment, which is excited by the light emitted from the light emitting element 12 and emits fluorescence. As well as phosphor). On the other hand, the sealing material 13 is transparent, for example, does not include a phosphor, and seals the light emitting element 12 together with the inner sealing material 131.

In addition, the inner sealing material 131 seals the light emitting element 12 in a fluid state and is cured while at least a part of the outer edge thereof is positioned on the inner repellent layer 141. Thereby, since the expansion in the horizontal surface of the inner side sealing material 131 is suppressed, it becomes possible to hold | maintain the inner side sealing material 131 in arbitrary positions.

Next, a method for manufacturing the light emitting device 1Ba according to the first example of the second embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view illustrating an example of a method for manufacturing the light-emitting device shown in FIG. Note that the cross-sectional view shown in FIG. 6 shows the same DD cross section as the cross-sectional view shown in FIG.

First, as shown in FIG. 6A, a substrate 10 is prepared. Next, as illustrated in FIG. 6B, the reflective layer 11Ba is formed on the substrate 10. In addition, about the formation method of reflection layer 11Ba, it is the same as that of light-emitting device 1Aa which concerns on the 1st example of 1st Embodiment mentioned above (refer FIG.2 (b)).

Next, as shown in FIG. 6C, the repellent layer 14 is formed at least on the top surface of the protrusion 111, and the annular inner repellent layer 141 is formed in the inner region IN. The repellent layer 14 and the inner repellent layer 141 can be formed sequentially or simultaneously by vapor deposition, printing, transfer, or the like.

Next, as shown in FIG. 6 (d), the light emitting element 12 is fixed in a region surrounded by the inner periphery of the inner repellent layer 141 and on the reflective layer 11Ba. In addition, about the fixing method of the light emitting element 12, it is the same as that of light-emitting device 1Aa which concerns on the 1st example of 1st Embodiment mentioned above (refer FIG.2 (d)).

And as shown in FIG.6 (e), the light emitting element 12 is sealed with the inner side sealing material 131. FIG. At this time, in the region surrounded by the inner periphery of the inner repellent layer 141, the inner sealing material 131 having fluidity is placed, and at least a part of the outer edge of the inner sealing material 131 is on the inner repellent layer 141. It is injected until it is in a state of being located, and is cured by applying heat or light. Thereby, the inner side sealing material 131 can be fixed and hardened in arbitrary positions. The inner sealing material 131 can be injected by a dispenser, printing, or the like. However, when a dispenser is used, the position of the nozzle is set so that the tip of the nozzle that discharges the inner sealing material 131 does not contact the wire or the like. Is preferably at least as high as a wire or the like.

Further, as shown in FIG. 6 (f), a sealing material 13 having fluidity is injected into the inner region IN. In addition, about the injection | pouring method of the sealing material 13, it is the same as that of light-emitting device 1Aa which concerns on the 1st example of 1st Embodiment mentioned above (refer FIG.2 (e)).

As described above, in the light emitting device 1Ba of this example, the double dome structure is formed by the inner sealing material 131 and the sealing material 13. Therefore, it is possible to extract light from the light emitting device 1Ba more efficiently by using the outer sealing material 13 as a lens.

<Second example>
Next, the structure of the light emitting device according to the second example of the second embodiment of the invention will be described with reference to FIG. FIG. 7 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the second example of the second embodiment of the present invention. 7A is a sectional view, FIG. 7B is a plan view, and the section shown in FIG. 7A is an EE section shown in FIG. 7B. The light emitting device 1Bb of this example shown in FIG. 7 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa to 1Ac, 1Ba described so far. Therefore, in the light emitting device 1Bb of the present example, with respect to the portions common to the light emitting devices 1Aa to 1Ac and 1Ba described so far, the detailed description will be made on the assumption that the description of the light emitting devices 1Aa to 1Ac and 1Ba is appropriately referred to. Omitted.

Similarly to the light emitting device 1Ba according to the first example of the second embodiment, the light emitting device 1Bb of this example also has the substrate 10, the reflective layer 11Bb, the light emitting element 12, the sealing material 13, and the inner sealing material 131. And a repellent layer 14 and an inner repellent layer 141. However, in the light emitting device 1Bb of this example, the structure of the reflective layer 11Bb is different from the structure of the reflective layer 11Ba of the light emitting device 1Ba according to the first example of the second embodiment.

The reflective layer 11Bb of the light emitting device 1Bb of this example has the above-described protrusion 112 and pedestal 113 (see FIG. 3). The inner repellent layer 141 is formed on the top surface of the pedestal portion 113, and the inner sealing material 131 is also formed on the pedestal portion 113. 7 illustrates the case where the inner repellent layer 141 is formed on the outer peripheral wall surface side of the pedestal 113, the inner repellent layer 141 is larger than the inner sealing material 131 to be formed. Depending on the situation, the base portion 113 may be formed at an arbitrary position on the top surface.

In the light emitting device 1Bb of this example, the light emitted from the light emitting element 12, the internal sealing material 131, and the sealing material 13 is efficiently reflected by the projecting portion 112 and the pedestal portion 113 having a large thickness. Therefore, the light extraction efficiency of the light emitting device 1Bb can be increased.

In the light emitting device 1Bb of this example, the protrusion 112 may be the protrusion 111 (see FIG. 5) included in the light emitting device 1Ba according to the first example of the second embodiment. Further, in the light emitting device 1Bb of this example, the pedestal portion 113 may not be formed. Further, the light emitting device 1Bb of this example can be manufactured by applying the method for manufacturing the light emitting device 1Ba according to the first example of the second embodiment (see FIG. 6). In this case, when the protrusion 111 is formed in the method for manufacturing the light emitting device 1Ba according to the first example of the second embodiment (see FIG. 6B), the protrusion 112 and the pedestal 113 are formed by the same method. do it.

<Third example>
Next, the structure of the light-emitting device according to the third example of the second embodiment of the present invention will be described with reference to FIG. FIG. 8 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the third example of the second embodiment of the present invention. 8A is a cross-sectional view, FIG. 8B is a plan view, and the cross-section shown in FIG. 8A is the FF cross-section shown in FIG. 8B. Note that the light emitting device 1Bc of this example shown in FIG. 8 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa to 1Ac, 1Ba, 1Bb described so far. For this reason, in the light emitting device 1Bc of this example, regarding the portions common to the light emitting devices 1Aa to 1Ac, 1Ba, and 1Bb described so far, the description of the light emitting devices 1Aa to 1Ac, 1Ba, and 1Bb is appropriately referred to. Detailed description is omitted.

Similarly to the light emitting devices 1Ba and 1Bb according to the first example and the second example of the second embodiment, the light emitting device 1Bc of this example also has the substrate 10, the reflective layer 11Bc, the light emitting element 12, and the sealing material 13. The inner sealing material 131, the repellent layer 14, and the inner repellent layer 141 are provided. However, in the light emitting device 1Bc of this example, the structure of the reflective layer 11Bc is different from the structures of the reflective layers 11Ba and 11Bb of the light emitting devices 1Ba and 1Bb according to the first example and the second example of the second embodiment.

The reflective layer 11Bc of the light emitting device 1Bc of this example includes the above-described protrusion 111, pedestal 113, and outer protrusion 114 (see FIG. 4). 8 illustrates the case where the outer peripheral wall surface of the outer protrusion 114 extends to the end portion of the substrate 10, but it may be an annular shape similarly to the outer peripheral wall surface of the protrusion 111.

In the light emitting device 1Bc of this example, the protruding outer protrusion 114 efficiently reflects the light emitted from the light emitting element 12 and the sealing material 13. Therefore, the light extraction efficiency of the light emitting device 1Bc can be increased.

In addition, in the light emitting device 1Bc of this example, the pedestal portion 113 may not be formed. The light emitting device 1Bc of this example can be manufactured by applying the method for manufacturing the light emitting device 1Ba according to the first example of the second embodiment (see FIG. 2). In this case, in the method for manufacturing the light emitting device 1Ba according to the first example of the second embodiment, when the protrusion 111 is formed (see FIG. 6B), the protrusion 111, the pedestal 113, and the The outer protrusion 114 may be formed.

<Fourth example>
Next, the structure of the light emitting device according to the fourth example of the second embodiment of the invention will be described with reference to FIG. FIG. 9 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the fourth example of the second embodiment of the present invention. 9A is a cross-sectional view, FIG. 9B is a plan view, and the cross-section shown in FIG. 9A is a GG cross-section shown in FIG. 9B. Note that the light emitting device 1Bd of this example shown in FIG. 9 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa to 1Ac and 1Ba to 1Bc described so far. For this reason, in the light emitting device 1Bd of this example, regarding the portions common to the light emitting devices 1Aa to 1Ac and 1Ba to 1Bc described so far, the description of the light emitting devices 1Aa to 1Ac and 1Ba to 1Bc is appropriately referred to. Detailed description is omitted.

Similarly to the light emitting devices 1Ba to 1Bc according to the first to third examples of the second embodiment, the light emitting device 1Bd of this example also includes the substrate 10, the reflective layer 11Bd, the light emitting element 12, the sealing material 13, and the like. The inner sealing material 131 and the repellent layer 14 are provided. However, in the light emitting device 1Bd of this example, the structure of the reflective layer 11Bd is different from the structure of the reflective layers 11Ba to 11Bc of the light emitting devices 1Ba to 1Bc according to the first to third examples of the second embodiment. Further, the light emitting device 1Bd of this example does not include the inner repellent layer 141.

The reflective layer 11Bd of the light emitting device 1Bd of the present example has the protrusion 112 (see FIG. 3) described above. Further, the reflective layer 11Bd of the light emitting device 1Bd of the present example includes an inner protrusion 115 that protrudes in an annular shape within the inner region IN. The light emitting element 12 is provided in a region surrounded by the inner peripheral wall surface of the inner protrusion 115 and on the reflective layer 11Bd.

The inner sealing material 131 seals the light emitting element 12 in a fluid state and is cured while being positioned in a region surrounded by the inner peripheral wall surface of the inner protruding portion 115. Thereby, since the expansion in the horizontal surface of the inner side sealing material 131 is suppressed, it becomes possible to hold | maintain the inner side sealing material 131 in arbitrary positions.

In the light emitting device 1 Bd of this example, the inner projecting portion 115 is used to suppress the inner sealing material 131 from spreading in the horizontal plane. Therefore, the inner sealing material 131 can be made hemispherical (or a shape close to this). Furthermore, in the light emitting device 1 Bd of this example, it is possible to avoid the sealing material 13 and the inner sealing material 131 from being cured while including the inner repellent layer 141. Therefore, it is possible to suppress the occurrence of cracks in the sealing material 13 and the inner sealing material 131.

In the light emitting device 1Bd of this example, the above-described protrusion 111 (see FIG. 5) may be employed instead of the protrusion 112. Further, the inner repellent layer 141 may be formed on at least the top surface of the inner protrusion 115 so that at least a part of the outer edge of the inner sealing material 131 is located on the inner repellent layer 141. In addition, the light emitting device 1Bd of this example can be manufactured by applying the method of manufacturing the light emitting device 1Ba according to the first example of the second embodiment (see FIG. 6). In this case, in the method for manufacturing the light emitting device 1Ba according to the first example of the second embodiment, when the protrusion 111 is formed (see FIG. 6B), the protrusion 112 and the inner protrusion 115 are formed by the same method. May be formed.

<Fifth example>
Next, the structure of the light emitting device according to the fifth example of the second embodiment of the invention will be described with reference to FIG. FIG. 10 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the fifth example of the second embodiment of the present invention. 10A is a cross-sectional view, FIG. 10B is a plan view, and the cross section shown in FIG. 10A shows the HH cross section shown in FIG. 10B. Note that the light emitting device 1Be of this example shown in FIG. 10 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa to 1Ac and 1Ba to 1Bd described so far. Therefore, in the light emitting device 1Be of the present example, for the portions common to the light emitting devices 1Aa to 1Ac and 1Ba to 1Bd described so far, the description of the light emitting devices 1Aa to 1Ac and 1Ba to 1Bd is referred to as appropriate. Detailed description is omitted.

The light emitting device 1Be of this example is similar to the light emitting devices 1Ba to 1Bd according to the first to fourth examples of the second embodiment, and the substrate 10, the reflective layer 11Be, the light emitting element 12, the sealing material 13, and the like. The inner sealing material 131 and the repellent layer 14 are provided. However, in the light emitting device 1Bd of this example, the structure of the reflective layer 11Bd is different from the structure of the reflective layers 11Ba to 11Bd of the light emitting devices 1Ba to 1Bd according to the first to fourth examples of the second embodiment. Further, the light emitting device 1Be of this example does not include the inner repellent layer 141.

The reflective layer 11Be of the light emitting device 1Be of the present example includes the above-described protrusion 111 and the outer protrusion 114 (see FIG. 4), and the above-described inner protrusion 115 (see FIG. 9). 10 illustrates the case where the outer peripheral wall surface of the outer protrusion 114 extends to the end portion of the substrate 10, but it may be an annular shape like the outer peripheral wall surface of the protrusion 111.

In the light emitting device 1Be of this example, the protruding outer protruding portion 114 efficiently reflects the light emitted from the light emitting element 12 and the sealing material 13. Therefore, the light extraction efficiency of the light emitting device 1Be can be increased.

<Modification>
[1] Although the case where the sealing material 13 is hemispherical has been illustrated, the sealing material 13 is not limited to a hemispherical shape. The case where the sealing material 13 is not hemispherical will be described with reference to FIG. FIG. 11 is a cross-sectional view and a plan view showing a structure of a modification of the light emitting device according to the embodiment of the present invention. 11A is a cross-sectional view, FIG. 11B is a plan view, and the cross section shown in FIG. 11A shows the II cross section shown in FIG. 11B.

11A and 11B, the sealing material 13C included in the light emitting device 1C has a rectangular shape with rounded corners when viewed from above. Even if the sealing material 13C has such a shape, the light extraction efficiency can be increased as compared with the flat shape. In addition, the sealing material 13C having such a shape can be easily manufactured by making the shape of the protrusion 111C in a top view into a rectangular shape having an annular shape and rounded four corners.

[2] Although the case where the outer edge of the sealing material 13 is located on the repellent layer 14 formed on the top surface of the protruding portion 111 is illustrated, the outer edge of the sealing material 13 exceeds the repellent layer 14. May be. The case where the outer edge of the sealing material 13 exceeds the repellent layer 14 will be described with reference to FIG. FIG. 12 is a cross-sectional view and a plan view showing the structure of a modification of the light emitting device according to the embodiment of the present invention. 12A is a cross-sectional view, FIG. 12B is a plan view, and the cross-section shown in FIG. 12A is a JJ cross-section shown in FIG. 12B.

12A and 12B, the repellent layer 14D included in the light emitting device 1D is formed not only on the top surface of the protruding portion 111 but also on the outer peripheral wall surface of the protruding portion 111. The repellent layer 14D may be formed not only on the outer peripheral wall surface of the protruding portion 111 but also on the inner peripheral wall surface.

When the repellent layer 14D is formed in this way, even if at least a part of the outer edge of the sealing material 13D exceeds the repellent layer 14D formed on the top surface of the protrusion 111, it is formed on the outer peripheral wall surface. The repellency layer 14D thus stays. Therefore, the expansion of the sealing material 13D in the horizontal plane is effectively suppressed, and the sealing material 13D can be made hemispherical (or a shape close to this).

[3] The case where the reflective layers 11Aa to 11Ac, 11Ba to 11Be, 11C, and 11D are formed on the substrate 10 having a flat surface has been exemplified. You may form the reflection layer which has an inner side protrusion part, a base part, etc. In this case, for example, the recess may be formed by performing etching, counterbore, or the like on the substrate except for a portion where the protruding portion, the outer protruding portion, the inner protruding portion, and the pedestal portion are to be formed. Further, for example, the protrusion may be formed by providing a dam agent on a portion on the substrate where the protrusion, the outer protrusion, and the inner protrusion are to be formed.

[4] Although the case where one light emitting device 1Aa to 1Ac, 1Ba to 1Be, 1C, and 1D includes one light emitting element 12 is illustrated, one light emitting device may include a plurality of light emitting elements. Also in this case, the

protrusions

111 and 112, the inner protrusion 115, the repellent layer 14, the inner repellent layer 141, and the like are formed as described above in accordance with the position where the sealant 13 and the inner sealant 131 are formed. do it. In this case, the color (wavelength) of light emitted from the plurality of light emitting elements 12 may be the same or different. In addition, one sealing material 13 and the inner sealing material 131 may have a structure for sealing one light emitting element, or may have a structure for sealing a plurality of light emitting elements together.

[5] In the light emitting devices 1Aa to 1Ac according to the respective examples of the first embodiment, the case where the sealing material 13 includes a phosphor is illustrated, but the sealing material 13 may not include the phosphor. Further, in the light emitting devices 1Ba to 1Be according to the respective examples of the second embodiment, the case where the inner sealing material 131 has a phosphor is illustrated. However, instead of the inner sealing material 131, the sealing material 13 replaces the phosphor. Both the sealing material 13 and the inner sealing material 131 may have phosphors (for example, phosphors having different colors (wavelengths) of emitted fluorescence).

[6] It is preferable to selectively use a water-repellent material as the material constituting the repellent layer 14 or the inner repellent layer 141. If it is a water-repellent material, suitable repellency can be exhibited also with respect to resin materials, such as an epoxy and silicone which can comprise the sealing material 13 and the inner side sealing material 131. FIG.

[7] The illustrated light emitting devices 1Aa to 1Ac, 1Ba to 1Be, 1C, and 1D can be implemented by combining a part or all of them as appropriate as long as there is no contradiction. In addition, the light emitting devices 1Aa to 1Ac, 1Ba to 1Be, 1C, and 1D can be implemented with various modifications.

The light emitting device and the manufacturing method thereof according to the present invention can be suitably used for a light emitting device mounted on a lighting device or the like.

1Aa to 1Ac, 1Ba to 1Be, 1C, 1D: Light emitting device 10: Substrate 11Aa to 11Ac, 11Ba to 11Be, 11C, 11D: Reflective layer 111, 112: Protruding part 113: Base part 114: Outer projecting part 115: Inward projecting part Part 12:

Light emitting element

13, 13C, 13D: Sealing material 131:

Inner sealing material

14, 14C, 14D: Repellent layer 141: Inner repellent layer IN: Inner region OUT: Outer region

Claims

A substrate,
A reflective layer formed on the substrate and having a projecting portion projecting annularly;
A light emitting element provided in an inner region surrounded by an inner peripheral wall surface of the protruding portion;
A sealing material for sealing the light emitting element;
A repellent layer that is formed on at least the top surface of the protruding portion and has a repellent property with respect to the sealing material in a fluid state, and at least a part of an outer edge of the sealing material has the repellent property A light-emitting device which is located on a layer.
2. The surface of the repellent layer formed on the top surface of the protrusion is 20 μm or more higher than the surface of the reflective layer adjacent to the protrusion in the inner region. The light emitting device according to 1.
The light emitting device according to claim 1, wherein the inner peripheral wall surface of the protruding portion is perpendicular to a surface of the reflective layer adjacent to the protruding portion in the inner region. .
4. The light emitting device according to claim 1, wherein the repellent layer is formed on at least the inner peripheral wall surface side of the top surface of the protruding portion.
5. The light emitting device according to claim 4, wherein the repellent layer is formed on the entire top surface of the protruding portion.
6. The light emitting device according to claim 5, wherein the repellent layer is also formed on an outer peripheral wall surface of the protruding portion.
The reflective layer has a pedestal in the inner region;
The thickness of the pedestal portion is greater than the thickness of the reflective layer adjacent to the pedestal portion in the inner region,
The light emitting device according to any one of claims 1 to 6, wherein the light emitting element is provided immediately above the pedestal portion.
8. The reflecting layer according to claim 1, wherein the reflecting layer has at least one outer protruding portion that protrudes in an annular shape in an outer region that is outside a region surrounded by the outer peripheral wall surface of the protruding portion. The light emitting device according to item.
The light emitting device according to any one of claims 1 to 8, wherein the sealing material contains a phosphor.
The light emitting device according to any one of claims 1 to 8, wherein the sealing material does not contain a phosphor.
An inner sealing material that includes a phosphor and seals the light emitting element;
The light emitting device according to any one of claims 1 to 10, wherein the sealing material seals the light emitting element together with the inner sealing material.
An annular inner repellent layer formed on the reflective layer in the inner region and having repellent properties with respect to the inner sealing material in a fluid state;
The light emitting device according to claim 11, wherein at least a part of an outer edge of the inner sealing material is located on the inner repellent layer.
The reflective layer has an inner protrusion protruding annularly in the inner region;
The light emitting device according to claim 11, wherein the inner sealing material is located in a region surrounded by an inner peripheral wall surface of the inner protrusion.
The light emitting device according to any one of claims 1 to 13, wherein the material forming the reflective layer is a white resin, metal, or the same material as the material forming the substrate.
A reflective layer forming step of forming a reflective layer having a projecting portion projecting annularly on a substrate;
A repellent layer forming step of forming a repellent layer on at least the top surface of the protrusion;
A light emitting element mounting step of providing a light emitting element in an inner region surrounded by an inner peripheral wall surface of the protruding portion;
A sealing step of sealing at least the light emitting element by injecting a sealing material into the inner region,
The repellency layer has repellency with respect to the sealing material in a state having fluidity in the sealing step,
In the sealing step, the sealing material is injected so that at least a part of an outer edge of the sealing material is positioned on the repellent layer.
In the reflective layer forming step,
On the substrate having a flat surface, the reflective layer having the protruding portion is formed by laminating a material constituting the reflective layer a plurality of times.
The method for manufacturing a light-emitting device according to claim 15, wherein the reflective layer having the protruding portion is formed by forming irregularities on the substrate.