JPH10144963A - Led light source and its manufacture - Google Patents

Led light source and its manufacture

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Publication number
JPH10144963A
JPH10144963A JP8292791A JP29279196A JPH10144963A JP H10144963 A JPH10144963 A JP H10144963A JP 8292791 A JP8292791 A JP 8292791A JP 29279196 A JP29279196 A JP 29279196A JP H10144963 A JPH10144963 A JP H10144963A
Authority
JP
Japan
Prior art keywords
led
substrate
resin
light source
oil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8292791A
Other languages
Japanese (ja)
Inventor
Yukiharu Uehashi
Masami Yasumoto
幸春 上橋
正美 保本
Original Assignee
Sanyo Electric Co Ltd
Tottori Sanyo Electric Co Ltd
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Tottori Sanyo Electric Co Ltd, 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical Sanyo Electric Co Ltd
Priority to JP8292791A priority Critical patent/JPH10144963A/en
Publication of JPH10144963A publication Critical patent/JPH10144963A/en
Application status is Granted legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

PROBLEM TO BE SOLVED: To device equalization of optical property and prevention of a bonding wire from exposure by providing an oil-repellent film along the periphery of light-transmitting resin on an upper surface of a substrate. SOLUTION: An LED chip 31 is provided on an upper surface of a substrate 21. An LED light source is made by molding the LED chip 31 with light- transmitting resin 33, and is provided with an oil-repellent film 26 along the a periphery of the light-transmitting resin 33 on the upper surface of the substrate 21. For example the oil-repellent film 26 is formed of oil-repellent, mainly canting silicon or polymer of fluorine base. The LED chip 31 is bonded and fixed to a chip arranging pad 22a of a pad 22 for LED on the substrate 2 via a conductive bonding agent. Next, a bonding wire is connected by wire bonding between the LED chip 31 and the pad 22b for wire bonding. Then a predetermined volume of the light-transmitting resin 33 in a fluid state is made to drip from the upper part of the LED chip 31. Following that, the resin 33 which is prevented from expanding by the oil-repellent film 26 undergoes heat processing and is hardened.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、基板上面に配置したLEDチップを透光性樹脂によってモ−ルドしたLE BACKGROUND OF THE INVENTION The present invention motor the LED chips disposed on the substrate top surface by translucent resin - field the LE
D光源、及びその製造方法に関する。 D light source, and a manufacturing method thereof.

【0002】 [0002]

【従来の技術】光源の小型化要求に伴って、既製の樹脂モールドLEDランプに代わり、基板に直接LEDチップを配置してそれを透光性樹脂によってモ−ルドしたL With the miniaturization requirements of the prior art light source, instead of off-the-shelf resin mold LED lamp, model it was placed directly LED chip to a substrate by translucent resin - field the L
ED光源が提案され、実用化されている。 ED light source have been proposed and put into practical use.

【0003】この種のLED光源においては、LEDチップを樹脂モ−ルドするため、流動状態の樹脂を基板に直接所定量滴下させ、この流動状態の樹脂を硬化させる手法が用いられている。 [0003] In this type of LED light source, the LED chips resins mode - for field, the resin in a fluid state is directly predetermined amount dropped on the substrate, a method of curing the resin in the fluid state are used. ところが、基板上面は前記樹脂となじみが良いので、滴下された流動状態の樹脂が基板表面に沿って広がりやすく、樹脂形状を一様にできない、樹脂の厚みを厚くできないなどの問題があった。 However, since the substrate top surface of the resin and conformability good, easily spread resin dripped flow conditions along the substrate surface, can not be a resin shape uniformly, there is a problem of being unable increasing the thickness of the resin. このような点を考慮し、本願出願人は、LED用パッドの全周を囲む溝を形成し、この溝との境界部分における表面張力によって樹脂の流れを規制する手法(特願平7− Considering these points, the present applicant has a groove surrounding the entire circumference of the LED pads, techniques for regulating the flow of the resin due to surface tension at the boundary portion between the groove (Japanese Patent Application No. 7-
151823号参照)を開発し、ある程度の改善を行うことができた。 Developed a reference No. 151823), it was able to carry out some degree of improvement. しかしながら、光学特性の向上とワイヤボンド線の安定的な埋没を図るために、樹脂の高さを更に高めるべく滴下する樹脂量を多くしたところ、パッドと溝の境界部分の表面張力を越える力が作用し、樹脂の流れ出しが発生する個所が現れた。 However, in order to stably buried improve the wire bonding line of the optical properties, were much amount of resin to be dropped to further increase the height of the resin, the force exceeds the surface tension of the boundary portion of the pad and grooves acts, flow out of the resin has appeared point that occurs. そして、樹脂の流れ出しが生じた個所においては、逆に樹脂の高さが低くなり、光学特性の不均一化、ワイヤボンド線の露出の要因になることが分かった。 The flows of the resin in the point that occurred, conversely become the height of the resin is low, non-uniformity of the optical properties, was found to be a factor of the exposed wire bond line.

【0004】 [0004]

【発明が解決しようとする課題】そこで本発明は、上記の点を考慮し、光学特性の均一化、ワイヤボンド線の露出防止を図ったLED光源を提供することを主な課題とする。 [0005] The present invention, considering the above points, uniformity of the optical characteristics, the main object is to provide a LED light source which aimed at exposure preventing wire bond line.

【0005】 [0005]

【課題を解決するための手段】本発明のLED光源は、 Means for Solving the Problems] LED light source of the present invention,
基板上面にLEDチップを配置し、このLEDチップを透光性樹脂によってモ−ルドしたLED光源において、 The LED chip is disposed on the upper surface of the substrate, mode the LED chip by translucent resin - in field the LED light source,
前記基板上面に前記透光性樹脂の外周縁に沿って撥油性被膜を設けたことを特徴とする。 Characterized in that a oil-repellent coating film along the outside edge of the translucent resin on the substrate top surface.

【0006】本発明のLED光源は、チップ配置用及びワイヤボンド用パッドからなるLED用パッドを基材上面に形成した基板と、前記チップ配置用パッドに配置されて前記ワイヤボンド用パッドにワイヤボンド線を介して接続されるLEDチップと、前記LEDチップをモ− [0006] LED light source of the present invention includes a substrate having an LED pad made of chip placement and pads wire bonded to the substrate top surface, said wire being disposed in the chip placement pad the wire pad bond bond an LED chip that is connected through a line, the LED chip mode -
ルドする透光性樹脂を備えるLED光源において、前記LED用パッドを囲むように前記基板上面に撥油性被膜を設けたことを特徴とする。 In the LED light source comprising a field to the light-transmitting resin, characterized in that a oil repellency coating on the substrate top surface so as to surround the pad the LED. 前記撥油性被膜はシリコン若しくはフッ素系ポリマーを主成分とする撥油剤によって形成することができる。 The oil repellency coating may be formed by oil repellent agent as a main component silicon or fluorine-based polymer.

【0007】本発明のLED光源の製造方法は、チップ配置用及びワイヤボンド用パッドからなるLED用パッドを基材上面に形成した基板を準備する工程と、該基板に前記LED用パッドを囲むように撥油性被膜を設ける工程と、前記チップ配置用パッドにLEDチップを固定して前記ワイヤボンド用パッドにワイヤボンド線を接続する工程と、前記撥油性被膜によって規定される領域内に前記LEDチップを埋めるように流動状態の樹脂を配置し、該樹脂を硬化させる工程を備えることを特徴とする。 [0007] manufacturing method of the LED light source of the present invention, so as to surround a step of preparing a substrate formed with LED pad made of chip placement and pads wire bonded to the substrate upper surface, the LED pads on the substrate the LED chip comprising the steps of providing oil repellency coating, said a step of fixing the LED chip to chip placement pad for connecting the wire bond wire to the pad for the wire bonding, within an area defined by the oil repellent coating the resin flow state is disposed so as to fill, characterized in that it comprises a step of curing the resin.

【0008】 [0008]

【発明の実施の形態】以下本発明の実施例を図1に示す線状のLED光源1に適用した場合を例にとって説明する。 The case where the embodiment of the following invention DETAILED DESCRIPTION OF THE INVENTION are applied in a linear LED light source 1 shown in FIG. 1 will be described as an example. このLED光源1は、基板2の上面に複数のLED The LED light source 1, a plurality of LED on the top surface of the substrate 2
発光部3を直線的に配置して構成している。 The light emitting portion 3 is constituted by linearly arranged.

【0009】まず基板2の構造、並びにその製造手順について図2〜図4を参照して説明する。 [0009] First the structure of the substrate 2, and with reference to FIGS its manufacturing procedure will be described. 基板2は、ガラスエポキシ等の長尺基材21の表面に銅箔が形成されたものが用意され、それをエッチング処理することにより、複数のLED用パッド22とこれらを接続する配線パターン23を導電パターンとして備えて構成される。 Substrate 2, which copper foil is formed on the surface of the elongate base material 21 of glass epoxy or the like is prepared, by the same etching process, a wiring pattern 23 for connecting these to a plurality of LED pads 22 configured with a conductive pattern.
各LED用パッド22は、それぞれが半円形状を成すチップ配置用のパッド22aとワイヤボンド用のパッド2 Each LED pads 22, pads 22a of chip arrangement, each forming a semi-circular shape and the pad 2 for wire bonding
2bを備え、全体が円ないし楕円形状を成している。 Comprising a 2b, a whole forms a circular or elliptical shape. このLED用パッド22の周囲を凹部24が環状に囲むように、LED用パッド22とその周囲に位置する配線パターン23の間には、基材21が露出する所定幅の間隔が設けられている。 Recess 24 the periphery of the LED pads 22 so as to surround annularly, between the wiring pattern 23 positioned LED pad 22 and its periphery, the spacing having a predetermined width substrate 21 is exposed is provided .

【0010】次に、上記の基板2は、その表面の光反射性を高めるために、図3に示すように、チップ配置用のパッド22aとワイヤボンド用のパッド22bの必要部分、その他の回路素子配置に必要な部分のみを露出させ、残りの大部分を絶縁性を有する白色系のレジスト膜25によって被覆する処理が施される。 [0010] Next, the substrate 2 described above, in order to enhance the light reflectivity of the surface, as shown in FIG. 3, a necessary part of the pad 22a and the pad 22b for wire bonding for chip placement, other circuits exposing only the portions necessary for element placement, a process of coating with the resist film 25 whitish with most remaining insulating properties is applied. このレジスト膜25によって被覆されない導電パターン部分は、必要に応じてメッキ処理を施すことが望ましい。 The resist conductive pattern portion that is not covered by the membrane 25, it is desirable to perform a plating treatment if necessary.

【0011】このように基板2を準備し、次にこの基板2の表面にLED用パッド22を囲むように撥油性被膜26を形成する。 [0011] Thus providing a substrate 2, then forming the oil-repellent film 26 so as to surround the LED pads 22 on the surface of the substrate 2. 撥油性被膜26は、撥油剤の撥油性を粒状に滴下されたn−ヘキサデカンの接触角度で表す(撥水剤の撥水性を水滴の接触角度で表すのと同様)場合に、その接触角度がより大きい、すなわち撥油性の高い材料が選択して用いられる。 Oil repellency film 26, when expressed by the contact angle has been n- hexadecane dropwise oil repellency granular oil repellent (similar to represent the water repellency of the water repellent in contact angle of a water drop), its contact angle larger, i.e. high oil repellency material is selected and used. 尚、前記白色系のレジスト膜25や、導電パターンの撥油性を前記接触角度で表すと、材料にもよるが概ね10度以下であり撥油性は低い。 Incidentally, and the white resist film 25, is represented by the contact angle oil repellency of the conductive pattern, depending on the material or less roughly 10 degrees oil repellency is low. この例では、撥油性被膜26として前記接触角度が30度以上であるシリコンを主成分とする白色シリコン樹脂を用いている。 In this example, the contact angle as oil repellent film 26 using white silicone resin whose main component is silicon is at least 30 degrees. このシリコン樹脂を例えばメッシュ版を用いたスクリーン印刷によって前記導電パターン部分の厚みと略同じ30μm前後の厚みとなるように形成し、前記凹部24内に収まるように配置している。 The by screen printing using a silicone resin for example a mesh plate is formed to be substantially the same 30μm before and after the thickness and the thickness of the conductive pattern portions are arranged to fit into the recess 24. このように撥油性被膜26をメッシュ版を用いたスクリーン印刷によって形成する場合は、撥油性被膜26の幅を狭くしすぎると目詰まりの要因になりやすいので、撥油性被膜26の幅は、0.3mm以上に設定するのが好ましく、より好ましくは、0.5mm前後に設定するのがよい。 Thus if the oil repellent film 26 is formed by screen printing using a mesh plate, so prone to cause a narrowing too when clogging the width of the oil repellent film 26, the width of the oil repellency film 26, 0 is preferably set above .3Mm, more preferably, it may be set around 0.5 mm.

【0012】次に、LED発光部3の構造、並びにその製造手順について図4、図5を参照して説明する。 [0012] Next, the structure of the LED light emitting portion 3, as well as for its manufacturing procedure 4, will be described with reference to FIG. 図3 Figure 3
に示す状態の基板2を用意し、この基板2に一辺が0. Prepared substrate 2 in the state shown in, one side to the substrate 2 is 0.
3mm前後の立方体形状をしたLEDチップ31の固定とワイヤボンド配線を行う。 Performing fixed wirebond interconnection of the LED chip 31 in which the 3mm around the cubic shape. すなわち、各LED用パッド22のチップ配置用パッド22aにLEDチップ31 That, LED chip 31 to the chip placement pad 22a of each LED pads 22
を導電性接着剤を介して接着固定する。 The bonded and fixed via the conductive adhesive. 次いで各LED Then each LED
チップ31とワイヤボンド用パッド22bの間にワイヤボンド線32をワイヤボンド接続する。 The wire bonds lines 32 to wire bonds between the chip 31 and wire bond pads 22b. 図4はこの状態を示している。 Figure 4 shows this state. LEDチップ31に接続されたワイヤボンド線32の頂上部分の高さは基板2表面から0.7m The height of the top portion of the wire bond lines 32 connected to the LED chip 31 is 0.7m from the surface of the substrate 2
m前後となる。 m becomes a before and after.

【0013】引き続き図4、図5を参照して硬化時に透光性を有する樹脂33によるLEDチップ31の樹脂モールドについて説明する。 [0013] Continuing 4, it will be described resin mold LED chip 31 by a resin 33 having a light transmitting property at the time of curing with reference to FIG. 流動状態にある透光性樹脂3 Translucent resin 3 in the fluidized state
3をLEDチップ31の上から所定量滴下させると、樹脂33はその流動性によって四方に拡がっていくが、その裾野部分が環状の撥油性被膜26に達すると、撥油性被膜26によってその拡がりが阻止される。 3 When a predetermined amount is dropped from the top of the LED chip 31, the resin 33 is gradually spread in all directions by the fluidity and the tail part reaches the annular oil repellent film 26, its spread by oil repellent coating 26 It is prevented. 透光性樹脂33は、例えばエポキシ系の樹脂等を油性の溶媒に溶かされ形成されるので、撥油性被膜26と接触すると、撥油性被膜26にはじかれて撥油性被膜26と接触する面積を小さくするような力、すなわち樹脂33の表面張力を大きくする力が作用し、樹脂33の拡がりが阻止される。 Translucent resin 33 has, for example, epoxy resin or the like is dissolved in a solvent oil formation, on contact with oil repellent coating 26, the area of ​​contact is repelled by the oil repellent film 26 and oil repellent coating 26 forces, such as to reduce, or force to increase the surface tension of the resin 33 is applied, expansion of the resin 33 is prevented. その結果、撥油性被膜26によって裾野部分の拡がりが規制された樹脂33は、その拡がりが高さ方向に向けられ、厚みを厚くすることができる。 As a result, the resin 33 spreads the tail part is restricted by the oil repellency film 26 may be the spread is directed to the height direction, increasing the thickness.

【0014】従来構造における樹脂の厚みは1mm程度が限度であったのに対して、従来と同一条件下で厚さが30μ前後と極めて薄い撥油性被膜26を追加するのみで、樹脂33の厚みを最高でその4倍の4mm以上にすることができることを確認した。 [0014] While the thickness of the resin in the conventional structure is about 1mm was the limit, only conventional thickness under the same conditions to add a very thin oil repellency film 26 with front and rear 30.mu., the thickness of the resin 33 it was confirmed that it is possible to four times of 4mm or more in the highest. しかしながら、樹脂3 However, the resin 3
3の厚みを必要以上に厚くすると、逆にLED光源1の厚み増加になるので、この例では、ワイヤボンド線32 When increasing the third thickness more than necessary, since the thickness increase of the LED light source 1 in the opposite, in this example, wire bond lines 32
の頂上部分(基板2表面から0.7mm前後)を完全に埋没でき、しかもLED光源1の厚みを薄く設定できる最適範囲として、硬化後の樹脂33の厚みが1.5mm Top portion (front and rear 0.7mm from the substrate 2 surface) can completely buried and moreover as the optimum range which can be set the thickness of the LED light source 1, 1.5 mm thickness of the resin 33 after curing of the
前後になるように設定している。 It is set to be back and forth. その後、この樹脂33 Thereafter, the resin 33
は硬化のために加熱処理される。 It is heated for curing.

【0015】このように樹脂33の厚みを厚くすることによって、ワイヤボンド線32を樹脂33に完全に埋没することができるようになり、露出ワイヤボンド線の断線等の問題を解消することができた。 [0015] By increasing the thickness of such a resin 33, a wire bonding line 32 to be able to be completely buried in the resin 33, it is possible to solve the problem such as disconnection of exposed wire bond lines It was. また、撥油性被膜26によって、流動状態の樹脂33の形状を互いに独立した一定の形状に保つことができ、各LED発光部3の光学特性を均一に揃えることができる。 Further, the oil repellent film 26 can be kept constant shape independent of each other the shape of the resin 33 in a fluid state, the optical characteristics of the LED light emitting portion 3 can be uniformly align. さらにまた、樹脂33と基板2の接触部分付近における気泡の発生を抑制することもできる。 Furthermore, it is also possible to suppress the generation of air bubbles in the vicinity of the contact portion of the resin 33 and the substrate 2.

【0016】上記実施例は、撥油性被膜26をLED用パッド22を囲むように環状に形成した凹部24内に配置して基板2の表面と撥油性被膜26の表面をほぼ同じ高さ(配線パターン23の存在によって基板2の表面よりも突出する部分も存在)にする場合を示したが、図6 [0016] The above examples, surface substantially the same height and arranged in a recess 24 formed in the annular surface of the substrate 2 to the oil repellent film 26 surrounding the LED pads 22 oil repellent film 26 (wiring Although some parts projecting from the surface of the substrate 2 by the presence of the pattern 23 shows a case to present), 6
に示すように、LED用パッド22を囲む撥油性被膜2 As shown in, oil repellency film 2 surrounding the LED pads 22
6を環状の凹部24の外に配置したり、図7に示すように、撥油性被膜26を環状の凹部の内、すなわちLED 6 or located outside of the recess 24 of the annular, as shown in FIG. 7, among the oil repellency film 26 of an annular recess, i.e. LED
用パッド22の外周縁部分上に配置してもよい。 It may be disposed on the outer edge portion of the use pads 22. このようにすれば、図5に示す場合に比べて撥油性被膜26によるLEDチップの光の遮光が多少増大する恐れがあるが、撥油性被膜26自体の厚みによる堰止め効果が加わって樹脂の流れ出しをより確実に阻止することができる。 By this way, there is a risk that the LED chips light shielding is slightly increased by the oil repellency film 26 as compared with the case shown in FIG. 5, the resin subjected to any damming effect oil repellent film 26 itself Thickness flows can be more reliably prevented.

【0017】また、上記実施例はメッシュ版により撥油性被膜26を形成する例を示したが、図4〜図7に示す撥油性被膜26を、メタル版等を用いて例えば図8 Further, the above embodiment shows an example of forming the oil-repellent film 26 by the mesh plates, oil repellency film 26 shown in FIGS. 4-7, for example by using a metal plate or the like FIG. 8
(a),(b)に示すように複数の撥油性被膜要素26 (A), a plurality of oil repellency film element 26 as shown in (b)
a,26bを用いて形成することもできる。 a, it can be formed by using a 26b. この場合、 in this case,
撥油性被膜26は図4に示すような切れ目のないものではなく、切れ目部分26cが存在した環状になる。 Oil repellency film 26 is not unbroken, as shown in FIG. 4, the annular cut portion 26c is present. この切れ目部分26cは、撥油性被膜26をメタル版を用いて形成する場合に、LED用パッド22に相応する部分を覆う部材を保持するための連結片が必要となり、その連結片の存在する部分によって形成される。 The cut portion 26c is, in the case of forming the oil-repellent film 26 using a metal plate, connecting piece for holding the member for covering the part corresponding to the LED pads 22 is required, to the presence of the connecting piece part It is formed by.

【0018】この切れ目部分26cは、存在しない方が好ましいが、設ける必要がある場合はその幅を樹脂33 [0018] The cut portion 26c is preferably better not exist, the resin in width when it is necessary to provide 33
の流れ出しを阻止するに必要とされる幅以内に設定して形成する。 It flows formed by setting within width required to prevent the. この図8に示す例では、直径(長軸)が3. In the example shown in FIG. 8, the diameter (major axis) is 3.
2mm程度の環状を成す撥油性被膜26に対して、その切れ目部分26cの幅を0.3mmに設定しているが、 Against oil repellent film 26 that forms a 2mm approximately circular, while setting the width of the slit portion 26c to 0.3 mm,
被膜26で囲まれる領域内に流動状態の樹脂33を高さが3mm程度になるまで流しても、切れ目部分26cからの樹脂33の流れ出しは全く生じなかった。 Be flowed until the resin 33 height of the fluidized state in the area surrounded by the film 26 is about 3 mm, it did not occur at all flow out of the resin 33 from cut portions 26c. また、同様に、直径(長軸)が4.4mm程度の環状を成す撥油性被膜26に対して、その切れ目部分26cの幅を0. Similarly, with respect to oil repellency film 26 having a diameter (long axis) forms an annular approximately 4.4 mm, the width of the slit portion 26c 0.
5mmに設定した場合においても、切れ目部分26cからの樹脂33の流れ出しは全く生じなかった。 Even when set to 5 mm, it did not occur at all flow out of the resin 33 from cut portions 26c. また、撥油性被膜26に形成する切れ目26cは、その幅が1m Also, cut 26c is formed in the oil repellent film 26, a width of 1m
m程度以下であれば樹脂33の流れ出しを防止することができ、樹脂の流れ出しを防止する幅以内に設定されたものであれば、撥油性被膜26に複数個設けることができる。 If more than about m can be prevented outflow of resin 33, as long as it is set within the width of preventing outflow of the resin, it is possible to provide a plurality oil repellency film 26. すなわち、撥油性被膜26は、樹脂33の裾野部分の外郭形状を規定するように樹脂33の外周縁に沿って配置されていれば、分割された複数の要素を集合して環状に形成してもよいし、連続する1つの要素によって形成してもよい。 That is, oil repellency film 26 be arranged along the outer periphery of the resin 33 to define the outer shape of the foot portion of the resin 33, is formed annularly by assembling a plurality of divided elements it may be, may be formed by a single contiguous elements.

【0019】また,上記実施例は撥油性被膜26としてシリコンを主成分とする撥油剤を用いる場合を例示したが、撥油性の高い部材、すなわち上記接触角度が30度以上、好ましくは50度以上、より好ましくは70度以上の撥油剤をこれに代えて用いることもでき、例えばフッ素系ポリマ−を主成分とする撥油剤やそれに類する撥油剤を用いても同様の効果が得られる。 Further, the above embodiment has been exemplified a case of using the oil repellent containing silicon as a main component as oil repellent coating 26, high oil repellency member, that is, the contact angle is 30 degrees or more, preferably at least 50 degrees , more preferably it may be used in place of 70 degrees or more oil repellent thereto, for example, fluorine-based polymer - oil repellent as a main component and the same effect can be used oil repellent similar thereto is obtained.

【0020】また,上記実施例は線状のLED光源1を例に取ったが、これ以外の面状のLED光源等も対象とすることもでき、例えばLED発光部3を1個備えるものや、LED発光部3を複数個を備える他のLED光源にも適用することができる。 Further, the above embodiments have taken an LED light source 1 linear example, other planar LED light source such as can also be of interest, for example, Ya which comprises an LED light emitting portion 3 1 the LED light emitting portion 3 can be applied to other LED light source comprising a plurality.

【0021】 [0021]

【発明の効果】以上のように本発明によれば、薄い撥油性被膜によってモ−ルド用樹脂の形状の安定化を図ることができ、光学特性の均一なLED光源を提供することができる。 According to the present invention as described above, according to the present invention, thin by oil repellent coating mode - it is possible to stabilize the shape of the field for the resin, it is possible to provide uniform LED light source of the optical properties. 撥油性被膜によってモ−ルド用樹脂の厚みを厚くすることができ、ワイヤボンド線を樹脂に埋没してワイヤボンド線を確実に保護することができる。 Mode by oil repellent film - can increase the thickness of the shield for the resin, the wire bond lines can be buried in the resin to reliably protect the wire bonds lines.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の一実施例を示す線状LED光源の平面図である。 1 is a plan view of a linear LED light source showing an embodiment of the present invention.

【図2】同実施例の基板(導電パターン形成済)の要部を示す平面図である。 2 is a plan view showing an essential part of the substrate of the embodiment (the conductive pattern has been formed).

【図3】同実施例の基板(レジスト形成済)の要部を示す平面図である。 3 is a plan view showing an essential part of the substrate of the embodiment (resist formation already).

【図4】同実施例の基板(LEDチップ配置済)の要部を示す平面図である。 4 is a plan view showing an essential part of the substrate of the embodiment (LED chips already placed).

【図5】図1の要部断面図である。 5 is a fragmentary cross-sectional view of FIG.

【図6】他の実施例の要部断面図である。 6 is a fragmentary cross-sectional view of another embodiment.

【図7】さらに他の実施例の要部断面図である。 7 is a fragmentary cross-sectional view of yet another embodiment.

【図8】(a),(b)は撥油性被膜の他の構成例を示す平面図である。 8 (a), it is a plan view showing another configuration example of (b) is oleophobic coating.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 線状LED光源 2 基板 21 基材 22 LED用パッド 22a チップ配置用パッド 22b ワイヤボンド用パッド 25 レジスト膜 26 撥油性被膜 3 LED発光部 31 LEDチップ 32 ワイヤボンド線 33 透光性樹脂 1 linear LED light source 2 pad substrate 21 substrate 22 LED pads 22a chip arrangement pads 22b wirebond 25 resist film 26 oleophobic coating 3 LED light emitting unit 31 LED chip 32 wirebond wires 33 translucent resin

Claims (4)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 基板上面にLEDチップを配置し、このLEDチップを透光性樹脂によってモ−ルドしたLED 1. A LED chips disposed on the substrate top surface, mode the LED chip by translucent resin - field the LED
    光源において、前記基板上面に前記透光性樹脂の外周縁に沿って撥油性被膜を設けたことを特徴とするLED光源。 In the light source, LED light source, characterized in that along the outside edge of the translucent resin on the upper surface of the substrate provided with the oil repellent film.
  2. 【請求項2】 チップ配置用及びワイヤボンド用パッドからなるLED用パッドを基材上面に形成した基板と、 A substrate the LED pads formed on the substrate upper surface consisting of wherein chip placement and pads for wire bonding,
    前記チップ配置用パッドに配置されて前記ワイヤボンド用パッドにワイヤボンド線を介して接続されるLEDチップと、前記LEDチップをモ−ルドする透光性樹脂を備えるLED光源において、前記LED用パッドを囲むように前記基板上面に撥油性被膜を設けたことを特徴とするLED光源。 An LED chip is connected via a wire bond wire to the pad for the wire bonding is disposed on the chip placement pad, a motor the LED chip - the LED light source comprising a field to translucent resin, the LED pads LED light source, characterized in that a oil repellency coating on the substrate top surface so as to surround the.
  3. 【請求項3】 前記撥油性被膜はシリコン若しくはフッ素系ポリマーを主成分とする撥油剤によって形成したことを特徴とする請求項1ないし2記載のLED光源。 Wherein the oil repellency coatings claims 1 to 2 LED light source, wherein a formed by oil repellent agent as a main component silicon or fluorine-based polymer.
  4. 【請求項4】 チップ配置用及びワイヤボンド用パッドからなるLED用パッドを基材上面に形成した基板を準備する工程と、該基板に前記LED用パッドを囲むように撥油性被膜を設ける工程と、前記チップ配置用パッドにLEDチップを固定して前記ワイヤボンド用パッドにワイヤボンド線を接続する工程と、前記撥油性被膜によって規定される領域内に前記LEDチップを埋めるように流動状態の樹脂を配置し、該樹脂を硬化させる工程を備えることを特徴とするLED光源の製造方法。 4. A process for preparing a substrate formed with LED pad made of chip placement and pads for wire bonding on the substrate top surface, a step of providing the oleophobic coating so as to surround the LED pads on the substrate the the step of securing the LED chip to chip placement pad for connecting the wire bond wire to the pad for the wire bonding, the flow state so as to fill the LED chip within the region defined by the oil repellent coating resin was placed, the production method of the LED light source, characterized in that it comprises a step of curing the resin.
JP8292791A 1996-11-05 1996-11-05 Led light source and its manufacture Granted JPH10144963A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8292791A JPH10144963A (en) 1996-11-05 1996-11-05 Led light source and its manufacture

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Application Number Priority Date Filing Date Title
JP8292791A JPH10144963A (en) 1996-11-05 1996-11-05 Led light source and its manufacture

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JPH10144963A true JPH10144963A (en) 1998-05-29

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JP8292791A Granted JPH10144963A (en) 1996-11-05 1996-11-05 Led light source and its manufacture

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