JP2016028461A - LED light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED light-emitting device, having no non-uniformity in luminescent color, and capable of obtaining uniformly color matched luminescent color.SOLUTION: An LED light-emitting device 10 is constituted by: mounting an LED element 11 on a substrate 13 via bump electrodes 16a and 16b; pasting a phosphor plate 12 whose area is smaller than that of a light-emitting surface 11a on the light-emitting surface 11a of the mounted LED element 11 so as not to protrude from the light-emitting surface 11a; and coating a side face of the LED element 11 and a side face of the phosphor plate 12 with reflective white resin 14.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting device including a light emitting diode element, and more particularly to a light emitting device including a phosphor plate on a light emitting surface of a light emitting diode element.

  Since a light emitting diode element (hereinafter abbreviated as an LED element) is a semiconductor element, it has a long life and excellent driving characteristics, is small in size, has high luminous efficiency, and has a bright emission color. It has come to be widely used for backlights and lighting of color display devices.

Also, in recent years, a configuration of a phosphor resin-coated type LED light emitting device that coats the periphery of an LED element with a phosphor resin containing a phosphor, converts the light emission of the LED, and changes the emission color of the LED has been proposed. Has been.
Particularly in recent years, an LED light emitting device has been proposed in which the side surface of an LED element is coated with a white resin having light reflectivity and a phosphor member containing a phosphor is coated on the light emitting surface of the LED element. . (For example, Patent Document 1 and Patent Document 2)

Hereinafter, a conventional white member-covered LED light emitting device will be described with reference to FIGS. 7 shows a cross-sectional view of the main part of the LED light-emitting device disclosed in Patent Document 1, and FIG. 8 shows a cross-sectional view of the main part of the LED light-emitting device shown in Patent Document 2.
For ease of understanding, the drawings are partially simplified within the scope of the invention and the names of parts are also included in the present application.

  As shown in FIG. 7, the configuration of the LED light emitting device 100 disclosed in Patent Document 1 includes a case 103 having an opening on the light extraction side and a pair of LED elements mounted on the mounting surface of the LED element in the case 103. The LED element 101 flip-chip mounted on the wiring electrode 105a via the conductive members 106a and 106b, the light-reflective white member 104 provided around the LED element 101, and the light extraction surface of the LED 101 (light emission) It comprises a sheet-like phosphor layer 102 adhered on the surface 101a) via an adhesive.

In addition, the configuration of the LED light emitting device 200 disclosed in Patent Document 2 includes a substrate 203 provided with a pair of wiring electrodes (not shown) and a conductive member on the wiring electrodes of the substrate 203 as shown in FIG. LED element 201 flip-chip mounted via 206a and 206b, a light-reflective first white member 204 provided in the gap between the outer peripheral side surface of LED element 201 and the flip-chip mounting surface, and light extraction of LED element 201 A translucent member 202 (fluorescent member) affixed on the surface with an adhesive 207, and an outer periphery of the first white member 204 and a second white member 205 provided on the outer periphery of the translucent member 202 Has been.
In Patent Document 2, the second white member 205 is provided on the side surface of the translucent member 202 in order to reduce color unevenness and increase the luminous flux.

  In Patent Document 1 and Patent Document 2, as the role of the white member, the emitted light emitted from the side surface side of the LED element is reflected and returned to the LED element side, so that the emitted light amount emitted from the light emitting surface of the LED element. Increases the output efficiency to increase the output efficiency. The white member is composed of a coating material such as silicone resin, epoxy resin, acrylic resin, etc., in which particles such as titanium oxide, silicon dioxide, zirconium dioxide, alumina, boron nitride are mixed as a reflective filler. As a method, a dripping device or an injection device is used.

JP 2007-19096 A (FIG. 1) JP 2010-192629 A (FIG. 1)

In each of the LED light-emitting devices shown in Patent Document 1 and Patent Document 2, a white member having light reflectivity is provided on the side surface side of the LED element, and the emitted light emitted from the side surface of the LED element with this white member is emitted from the LED. The brightness of the emitted light is increased by reflecting the light toward the element side and increasing the amount of light emitted from the light emitting surface side.
In addition, a phosphor layer containing a phosphor or a transparent member (fluorescent member) is disposed on the light emitting surface of the LED element, and the phosphor is excited by the light emitted from the LED element emitted from the light emitting surface to emit light. The light emission color of the LED element and the light emission color of the phosphor are mixed, and a light emission color having a desired color tone is obtained by the mixed color tone.

However, the configuration of the LED light emitting device shown in FIGS. 7 and 8 has the following problems. The problem will be described below with reference to FIG.
In FIG. 7, a circle indicated by an arrow A (hereinafter referred to as “circle A”) is a sheet-like phosphor layer 102 on the outer side from the light emitting surface 101a of the LED element 101 and from the light emitting surface 101a. The protruding part is shown. This is because the sheet-like phosphor layer 102 having an area larger than the area of the light emitting surface 101a of the LED element 101 is provided, and the protruding portion indicated by a circle A on the outer portion of the light emitting surface 101a of the LED element 102. The sheet-like phosphor layer 102 appears.

L1 and L2 indicated by arrows represent outgoing light emitted through the sheet-like phosphor layer 102. Although the emitted light L1 is drawn in the central region of the light emitting surface 101a in the drawing, it shows the emitted light at the portion where the light emitting surface 101a and the sheet-like phosphor layer 102 overlap, and L2 is a circle A. The emitted light which radiate | emits from the sheet-like fluorescent substance layer 102 of the part which protruded at the shown both ends is shown.
As the emitted light L1, light that is sufficiently mixed with the light emitted from the LED element 101 and the light of the phosphor of the phosphor layer 102 emitted by being excited by the light of the LED element 101 is emitted.
For example, when a blue light emitting LED element using a GaN-based semiconductor is used for the LED element 101 and a yellow light emitting YAG phosphor is used for the phosphor layer 102, the blue color of the LED element 101 is emitted from the emitted light L1. A white emission color is obtained by sufficiently mixing the emission color and the yellow emission color of the phosphor layer 102.

  On the other hand, since the sheet-like phosphor layer 102 at the portion where the circle A protrudes is out of the light emitting surface 101a and is on the white member 104, the amount of transmitted blue light from the LED element 101 is very small. . Therefore, from the emitted light L2 from the circle A part, the blue light emission color is very thin and the yellow light emission color of the phosphor layer 102 becomes noticeable. That is, a yellow ring (annular yellow light emission region) appears.

  As a result, the yellow ring emission color caused by the emitted light L2 appears outside the white light emitting region produced by the emitted light L1, and the color tone of the emitted color becomes uneven.

  This problem also occurs in the configuration of the LED light emitting device 200 of Patent Document 2 shown in FIG. A translucent member (fluorescent member) 202 in a circle indicated by an arrow A in FIG. 8 is above the first white member 204 and protrudes outward from the emission surface of the LED element 201. For this reason, the same problem as described with reference to FIG. 7 occurs.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an LED light-emitting device capable of obtaining a light-emitting color having a uniform color tone with no unevenness in the color tone of the light-emitting color.

  As means for solving the above-described problems, an LED light emitting device of the present invention includes an LED element having a bump electrode mounted on a substrate, a phosphor plate attached to the light emitting surface of the LED element, and a side surface of the LED element. In the LED light emitting device coated with a reflective white resin, the area of the phosphor plate is smaller than the area of the light emitting surface of the LED element, and the light emitting surface of the LED element is bonded to the light emitting surface via an adhesive. A phosphor plate is bonded and fixed within a frame of a size, and the reflective white resin covers up to the side surface of the phosphor plate, exposes the surface of the phosphor plate, and the surface of the phosphor plate and the The surface of the white resin is shaped to be flush with each other, and the phosphor plate with respect to the light emitting surface of the LED element, with the upper and lower surfaces and side surfaces of the phosphor plate and the light emitting surface of the LED element being smooth surfaces Pasting is translucent Translucent adhesion in which the phosphor plate is bonded and fixed to the light emitting surface of the LED element on the outer peripheral side surface of the phosphor plate at the outer peripheral edge of the light emitting surface of the LED element in the adhesive fixed state by the adhesive The inclined surface is formed by a translucent adhesive different from the agent.

  In the present invention, the phosphor plate attached to the light emitting surface of the LED element is smaller than the area of the light emitting surface of the LED element. As a result, the phosphor plate can be arranged in a region within the light emitting surface, and it does not protrude from the light emitting surface seen in the conventional technique. Therefore, from the emitted light emitted from the phosphor plate on the light emitting surface of the LED element, the emitted light mixed with the emitted light color of the LED element and the emitted light color of the phosphor excited by the light of the LED element is emitted. can get. That is, an emission color having a color tone in which the emission color of the LED element and the emission color of the phosphor are sufficiently mixed can be obtained.

  Further, since the white resin is also coated on the side surface of the phosphor plate, the light emitting surface of the LED element is not exposed, and all the light emitted by the LED element is transmitted through the phosphor plate. Thereby, a uniform luminescent color can be obtained and the light use efficiency can be enhanced.

  According to the present invention, a uniform light emitting color tone without color tone unevenness can be obtained, and a bright LED light emitting device with high brightness can be obtained.

It is a top view of the LED light-emitting device which concerns on 1st Embodiment of this invention. It is sectional drawing of the XX cross section in FIG. FIG. 3A is a process diagram showing a manufacturing process of the LED light emitting device shown in FIG. 2, FIG. 3A is a cross-sectional view and a plan view of the LED element flip chip mounted on a substrate, and FIG. 3B is a light emission of the LED element. FIG. 3C is a cross-sectional view and a plan view of the LED light-emitting device that is in a completed state by covering with a white resin. It is principal part sectional drawing which showed typically the LED light-emitting device in a comparative example. It is principal part sectional drawing of the LED light-emitting device which concerns on 2nd Embodiment of this invention. It is an enlarged view of the C section in FIG. It is principal part sectional drawing of the LED light-emitting device shown by patent document 1. FIG. It is principal part sectional drawing of the LED light-emitting device shown by patent document 2. FIG.

[First Embodiment]
DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. First, the LED light emitting device according to the first embodiment will be described with reference to FIGS. 1 is a plan view of the LED light emitting device according to the first embodiment, and FIG. 2 is a cross-sectional view taken along the line XX in FIG. 3 is a process diagram showing a manufacturing process of the LED light emitting device shown in FIG. 2. FIG. 3A is a cross-sectional view and a plan view of the LED element flip-chip mounted on the substrate, and FIG. 3B. Is a cross-sectional view and a plan view of a state in which a phosphor plate is pasted on the light-emitting surface of the LED element, and FIG. 3C is a cross-sectional view and a plan view of the LED light-emitting device that is in a completed state by covering with a white resin. ing.

(Description of the configuration of the LED light emitting device according to the first embodiment)
In FIG. 1, 10 represents the LED light-emitting device of 1st Embodiment. As shown in FIG. 2, the LED light emitting device 10 of the first embodiment includes a substrate 13 provided with a pair of wiring electrodes 15, an LED element 11 having bump electrodes 16a and 16b, and a light emitting surface 11a of the LED element 11. And a white resin 14 coated on the side surface of the LED element 11 and the side surface of the phosphor plate 12.

  Bump electrodes 16 a and 16 b included in the LED element 11 are flip-chip mounted on a pair of wiring electrodes 15 provided on the substrate 13, and the LED element 11 is fixed to the substrate 13 to achieve electrical conduction. The pair of wiring electrodes 15 provided on the substrate 13 and the pair of bump electrodes 16a and 16b provided on the LED element 11 constitute an anode electrode and a cathode electrode.

The LED element 11 is provided with a pair of bump electrodes 16a and 16b made of a material such as gold having good conductivity on the lower surface side in the drawing. The surface opposite to the surface on which the bump electrodes are provided, that is, the upper surface side in the figure is the light emitting surface 11a. The light emitting surface 11a is an exit surface that condenses the light emitted from the LED element 11 and emits the condensed light.
In FIG. 1, a square chain line drawn at the center indicates an outline of the outer shape of the LED element 11, and an inner side surrounded by the chain line is a light emitting surface 11 a.

  The LED element 11 of the first embodiment uses a gallium nitride compound semiconductor such as GaN, GaAlN, InGaN, etc., which emits blue light. However, the LED element 11 is not limited to a gallium nitride-based semiconductor element, and is appropriately selected according to specifications.

In FIG. 2, a phosphor plate 12 attached on the light emitting surface 11 a of the LED element 11 is obtained by mixing and curing a phosphor in a transparent resin and finishing it into a plate shape. Resins such as silicone resin, epoxy resin, and acrylic resin can be selected as the resin to be used. In the present embodiment, a YAG phosphor is used as the phosphor to obtain white light emission. The YAG phosphor is excited by the blue light emission color of the LED element 11 and emits yellow light. The yellow emission color and the blue emission color are mixed to obtain a white emission color.
However, the phosphor to be used is not particularly limited to the YAG phosphor, and is preferably selected appropriately according to the specifications.
The phosphor plate 12 may contain an ultraviolet absorber in addition to the phosphor material. An effect of preventing deterioration of the phosphor can be obtained by adding an ultraviolet absorber.

  In FIG. 1, the square solid line drawn at the center is the phosphor plate 12. The phosphor plate 12 is on the light emitting surface 11a of the LED element 11, and the size of the area is set smaller than the area of the light emitting surface 11a indicated by a chain line.

The phosphor plate 12 is pasted on the light emitting surface 11a of the LED element 11 through an adhesive using a mounting device. In order to prevent even a part of the phosphor plate 12 from protruding from the light emitting surface 11a when the phosphor plate 12 is pasted on the light emitting surface 11a, the area of the phosphor plate 12 is set smaller than the area of the light emitting surface 11a. Yes. The phosphor plate 12 is bonded and fixed so as not to protrude from the light emitting surface 11a.
Accordingly, the size of the area of the phosphor plate 12 does not protrude from the light emitting surface 11a in consideration of the pasting position accuracy in the mounting apparatus, the finished dimensional accuracy of the phosphor plate 12, the finished dimensional accuracy of the light emitting surface 11a, and the like. In addition, the brightness of the light is set in consideration of the brightness of the emitted light so that it does not become dark.
In this way, by placing the phosphor plate 12 in the light emitting surface 11a without protruding from the light emitting surface 11a, the problem of occurrence of yellow ring as seen in the prior art is eliminated.

In the first embodiment, the phosphor plate 12 used has a required thickness and a uniform thickness. Therefore, the degree of the phosphor content distribution is uniform regardless of the portion. For this reason, there is little variation in the shade of the fluorescent color of the phosphor that is excited to emit light, and a uniform fluorescent color can be obtained.
Further, since the phosphor plate 12 is a plate, its hardness is hard and does not deform in handling. Therefore, the effect that the assemblability becomes easy is produced.
Furthermore, since it is a plate, the surface can be finished to a smooth surface by grinding or the like. If the surface is smooth, the wettability with the adhesive is improved, and the effect of increasing the adhesive strength is also produced.

  The white resin 14 is made of a resin containing particles of a reflective material and has a light reflecting function. Resin such as silicone resin, epoxy resin, acrylic resin is used as the resin, and particles of reflective material such as titanium oxide, silicon dioxide, zirconium dioxide, titanium dioxide, potassium titanate, alumina, boron nitride, etc. Things are used. One or more of these reflective materials are used in combination.

As shown in FIG. 2, the white resin 14 is provided in the gap between the side surface of the LED element 11 and the side surface of the phosphor plate 12 and the flip chip mounting surface of the LED element 11.
By providing the gap on the side surface side of the LED element 11 and the flip chip mounting surface of the LED element 11, the light emitted from the LED element 11 emitted from the side surface or the mounting surface (lower surface) is returned into the element and the light emitting surface 11a The light is condensed in the direction and emitted from the light emitting surface 11a.
Further, by providing the white resin 14 also on the side surface side of the phosphor plate 12, light emission to the outside from the light emitting surface 11 a of the portion where the phosphor plate 12 is not placed is eliminated, and the phosphor plate 12. There is no light leaking outside from the side.

  In addition, the white resin 14 provided in the gap on the flip chip mounting surface of the LED element 11 not only fulfills the reflection function described above but also fulfills a heat dissipation function. That is, the heat generated by the LED element 11 is conducted to the substrate 13 through the white resin 14 to provide a heat dissipation effect. Moreover, the impact resistance effect which relieves impact property is also fulfilled, and the underfill effect with respect to the LED element 11 is produced.

(Description of manufacturing process of LED light emitting device)
Next, the procedure of the manufacturing process of the LED light emitting device 10 having the above configuration will be described with reference to FIG. First, the LED element 11 is mounted on the substrate 13 in FIG. The LED element 11 is fixed to the pair of wiring electrodes 15 provided on the substrate 13 via the bump electrodes 16a and 16b using the mounting machine device. In the plan view, the substrate 13, the pair of wiring electrodes 15, and the light emitting surface 11a of the LED element 11 can be seen.

  Next, the phosphor plate 12 is bonded and fixed to the light emitting surface 11a of the LED element 11 with an adhesive (not shown) using FIG. The area of the phosphor plate 12 is smaller than that of the light emitting surface 11a of the LED element 11, and is bonded so that the phosphor plate 12 does not protrude from the light emitting surface 11a. In the plan view, the phosphor plate 12 fixed in the frame of the size of the light emitting surface 11a can be seen.

Next, using FIG. 3C, a resin injection device, the white resin 14 is injected into the gap on the flip chip mounting surface of the LED element 11 and injected into the side surface of the LED element 11 and the side surface of the phosphor plate 12. To do. Then, the surface of the phosphor plate 12 is exposed and the surface of the phosphor plate 12 and the surface of the white resin 14 are shaped to be flush with each other.
In the plan view, the rectangular surface of the phosphor plate 12 appears to be exposed, and the exposed light emitting surface 11a of the LED element 11 around the outer periphery of the phosphor plate 12 is covered with the white resin 14 and is not visible.

  The above manufacturing method is formed by the method of injecting the white resin 14, but the manufacturing method is not necessarily limited to the injection method, and there is no problem even if the white resin 14 is formed by other methods. Is. For example, using a large substrate, a plurality of LED elements 11 and a plurality of phosphor plates 12 are mounted on a large substrate, and the white resin 14 is a soft white resin sheet in a large sheet shape. The white resin 14 and the LED element 11 are embedded in the white resin sheet with the phosphor plate 12 as a head, and the white resin 14 is coated on the side surface of the phosphor plate 12 and the side surface of the LED element 11. There is a method of forming the LED light emitting devices 10 one by one by cutting the white resin 14 and the substrate 13 by a method such as dicing after the thermosetting treatment.

  Through the above manufacturing process, the LED light emitting device 10 according to the first embodiment can be easily formed.

(Explanation of effect)
Next, the effect by having said structure is demonstrated. Since the white resin 14 covers the gap between the side surface of the LED element 11 and the flip chip mounting surface, the light of the LED element 11 emitted from the side surface and the lower surface of the LED element 11 is returned into the LED element 11 by the white resin 14. Thus, the light is condensed toward the light emitting surface 11a side and emitted from the light emitting surface 11a.

On the light emitting surface 11a side, a phosphor plate 12 having an area smaller than the area of the light emitting surface 11a is provided on the light emitting surface 11a so as not to protrude from the light emitting surface 11a. Is covered. For this reason, the emitted light from the light emitting surface 11 a at the site where the phosphor plate 12 is present passes through the phosphor plate 12. However, the outgoing light emitted from the light emitting surface 11 a at the portion protruding from the phosphor plate 12 is reflected by the white resin 14 provided on the side surface of the phosphor plate 12 and returned to the LED element 11 again.
Accordingly, the blue light emitted from the LED element 11 emitted to the outside passes through the phosphor plate 12 and is emitted. Some of the blue light excites the phosphor to cause yellow light emission, and the remaining blue light is emitted to the outside as it is. For this reason, the phosphor plate 12 emits white light in which blue light and yellow light are mixed.
Thereby, the utilization efficiency of the light emitted from the LED element 11 is enhanced and bright white light is obtained. Further, the uneven color tone of the luminescent color is eliminated, and the occurrence of yellow ring or the like as seen in the prior art does not occur.

(Comparative example)
As a comparative example, a case where the area size of the light emitting surface 11a of the LED element 11 and the area size of the phosphor plate 12 are the same will be described with reference to FIG. FIG. 4 is a cross-sectional view schematically showing an essential part of an LED light emitting device in a comparative example. In addition, the comparative example shown in FIG. 4 represents a state in which the light emitting surface 11a and the phosphor plate 12 have the same size, and the position of the phosphor plate 12 affixed on the light emitting surface 11a is slightly shifted.

4, m represents the width of the light emitting surface 11a of the LED element 11 and the width of the white resin 14, and the light emitting surface 11a and the phosphor plate 12 have the same width m, that is, the same size area. Yes. n represents the amount of protrusion when the phosphor plate 12 protrudes from the light emitting surface 11a and is bonded thereto. This represents the amount of positional deviation caused by the accuracy error of the mounting apparatus when the phosphor plate 12 is bonded onto the light emitting surface 11a.
Many mechanical devices have considerable accuracy errors. n is the amount of displacement of the phosphor plate 12 caused by the accuracy error of the machine.

An arrow A portion indicated by an ellipse indicates a portion where the phosphor plate 12 protrudes from the light emitting surface 11a by an amount of n dimensions on the right side in the drawing. On the other hand, an arrow B portion indicated by an ellipse indicates an exposed portion of the light emitting surface 11a generated because the phosphor plate 12 is displaced by n dimensions.
Since the side surface of the LED element 11 and the side surface of the phosphor plate 12 are covered with the white resin 14, the white resin 14 exists on the lower surface side of the phosphor plate 12 (arrow A portion) that protrudes from the light emitting surface 11a. The exposed portion (arrow B portion) of the light emitting surface 11a is covered with the white resin 14.

L1 represents the emitted light from the phosphor plate 12 at the portion where the light emitting surface 11a and the phosphor plate 12 overlap, and L2 represents the emitted light from the phosphor plate 12 at the portion protruding from the light emitting surface 11a.
From the emitted light L1, since the phosphor plate 12 and the light emitting surface 11a are overlapped with each other, a white light emitting color obtained by sufficiently mixing the blue light emitting color of the LED element 11 and the yellow light emitting color of the phosphor plate 12 is obtained. It is done. On the other hand, from the emitted light L2 from the phosphor plate 12 protruding from the arrow A portion, the amount of blue light transmitted from the LED element 11 is very small, so the blue emission color is very thin and the yellow of the phosphor plate 12 The luminescent color becomes noticeable. Therefore, as a whole, white light emission color and yellow light emission color appear, and the light emission color unevenness appears.

  If the area of the phosphor plate 12 and the area of the light emitting surface 11a of the LED element 11 are the same, the problem shown in the comparative example may occur due to a mechanical accuracy error of the mounting apparatus. In the LED light emitting device 10 according to the first embodiment, the area of the phosphor plate 12 is made smaller than the area of the light emitting surface 11a of the LED element 11, and the phosphor plate 12 is fixed so as not to protrude from the light emitting surface 11a. Thus, the problem shown in the comparative example is prevented from occurring.

[Second Embodiment]
Next, an LED light emitting device according to a second embodiment will be described with reference to FIGS. FIG. 5 shows a cross-sectional view of a main part of an LED light emitting device according to the second embodiment of the present invention, and FIG. 6 shows an enlarged view of a portion C in FIG. In addition, the component which makes the same specification as the component of the LED light-emitting device of 1st Embodiment mentioned above attaches | subjects and demonstrates the same code | symbol.

  In FIG. 5, 20 represents the LED light-emitting device of 2nd Embodiment. Here, the LED light emitting device 20 of the second embodiment differs from the configuration of the LED light emitting device 20 of the second embodiment and the configuration of the LED light emitting device 10 of the first embodiment shown in FIG. An inclined surface 27a (see FIG. 6) is formed on the outer peripheral side surface of the phosphor plate 12 at the outer peripheral edge of the light emitting surface 11a of the LED element 11, and the outer side of the inclined surface 27a is white resin. 14 to cover the structure.

That is, the translucent adhesive 27 is a translucent adhesive used for bonding the light emitting surface 11 a of the LED element 11 and the phosphor plate 12, but is transparent to the light emitting surface 11 a of the LED element 11 and the phosphor plate 12. As shown in FIG. 6, when the light-sensitive adhesive 27 is bonded and fixed, the light-transmitting adhesive is applied on the side surface of the phosphor plate 12 and the light emitting surface 11 a protruding from the phosphor plate 12 as shown in FIG. 6. In this configuration, the shape of an inclined surface 27a having a divergent shape composed of 27 is formed.
Hereinafter, the description of the LED light emitting device 20 of the second embodiment will be limited only to the description of the translucent adhesive 27 having a different configuration, and description of common components will be omitted.

In the second embodiment, the translucent adhesive 27 is made of a transparent resin adhesive, and a resin adhesive such as a silicone resin, an epoxy resin, or an acrylic resin is selected as the resin adhesive.
Further, in order to form a shape having a widening inclined surface 27a, the light emitting surface 11a of the LED element 11 and the outer surface of the phosphor plate 12 and the translucent adhesive 27 are improved in wettability, The surface tension of the adhesive is kept low.
Moreover, the application amount of the adhesive is not too small, and is too large so that it does not protrude outward from the light emitting surface 11a.

  The phosphor plate 12 can finish the upper and lower surfaces and the side surfaces to a smooth surface by grinding or the like. Similarly, the light emitting surface 11a made of sapphire glass of the LED element 11 can also be finished to a smooth surface by grinding. As described above, when the adhesive surface is a smooth surface, the wettability with the translucent adhesive 17 is improved, and the divergent inclined surface 17 a can be easily formed by the translucent adhesive 17.

Next, the effect obtained by providing the translucent adhesive 27 having a shape having a diverging inclined surface 27a on the side surface of the phosphor plate 12 will be described.
In FIG. 6, an arrow line indicated by L <b> 11 is light emitted from the LED element 11, and is emitted from the light emitting surface 11 a at a position off the phosphor plate 12, and the inclined surface 27 a of the translucent adhesive 27. Is emitted from the inclined surface 27a, passes through the phosphor plate 12, and exits to the outside.
The white resin 14 covers the side surface of the permeable adhesive 27 that forms the inclined surface 27a. Therefore, the light L11 transmitted through the transmissive adhesive 27 and incident on the inclined surface 27a is reflected by the white resin 14 coated on the inclined surface 27a, and is again transmitted through the transmissive adhesive 27 and the phosphor plate 12. Is incident on.
Therefore, the light incident on the transparent adhesive 27 provided on the side surface of the phosphor plate 12 is reflected by the inclined surface 27a, enters the phosphor plate 12, passes through the phosphor plate 12, and is emitted to the outside.

  With such a configuration, the light emitted from the light emitting surface 11a at a position away from the phosphor plate 12 is incident on the phosphor plate 12 by reflection from the inclined surface 27a of the translucent adhesive 27 to the outside. Exit. Therefore, the amount of light that is emitted from the light emitting surface 11a at a position off the phosphor plate 12 and returned to the LED element 11 again is reduced. Therefore, since the amount of light passing through the phosphor plate 12 effectively increases, the effect of increasing the brightness is produced.

  In addition, in this embodiment, although the translucent adhesive agent 27 was comprised with the transparent resin adhesive agent, it does not specifically limit to a transparent resin. Depending on the specifications, there is no problem even if the resin adhesive is colored and has translucency.

10, 20 LED light emitting device 11 LED element 11a Light emitting surface 12 Phosphor plate 13 Substrate 14 White resin 15 Wiring electrodes 16a, 16b Bump electrode 27 Translucent adhesive 27a Inclined surface

Claims (1)

In an LED light emitting device in which an LED element having a bump electrode is mounted on a substrate, a phosphor plate is attached to the light emitting surface of the LED element, and a side surface of the LED element is coated with a reflective white resin, The area is smaller than the area of the light emitting surface of the LED element, and the phosphor plate is bonded and fixed to the light emitting surface of the LED element through an adhesive within a frame having the size of the light emitting surface. The white resin covers up to the side surface of the phosphor plate, exposes the surface of the phosphor plate and is shaped to be flush with the surface of the phosphor plate and the surface of the white resin, The upper and lower surfaces and side surfaces of the phosphor plate and the light emitting surface of the LED element are smooth surfaces, and the phosphor plate is attached to the light emitting surface of the LED element in an adhesively fixed state with a translucent adhesive. The outer edge of the surface An inclined surface is formed on the outer peripheral side surface of the phosphor plate by a translucent adhesive different from the translucent adhesive in which the phosphor plate is bonded and fixed to the light emitting surface of the LED element. LED light emitting device.

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