JP2010114218A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device for which the chromaticity of the emitted light is uniform, independently of the direction of the emitted light. <P>SOLUTION: The light-emitting device 1 is constructed by providing a package 11, in which a concave part 12 is formed in an upper surface thereof; an LED chip 14, which is mounted in a bottom surface 13 of the concave part 12 and emits the blue light; a resin member 15, with which the inside of the concave part 12 is filled and fluorescent particle 16, which emits a yellow light, when the blue light is made incident. The fluorescent particle 16 is deposited in a lower part of the resin member 15 and forms a deposit layer 16a. In the bottom surface 13 of the concave part 12, a region 13a directly below the LED chip 14 is projected with respect to a region 13b around the region 13a. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting device, and more particularly to a light emitting device in which a chip and phosphor particles are provided in a package.

  Generally, a light emitting device that emits white light includes an LED (Light Emitting Diode) chip that emits blue light and a yellow light that absorbs blue light and is complementary to blue. And a phosphor that emits light. Thereby, the blue light emitted from the LED chip and the yellow light emitted from the phosphor are emitted to the outside of the light emitting device, and these lights are mixed to become white light ( For example, see Patent Document 1.)

  However, the conventional light emitting device described in Patent Document 1 has a problem that the chromaticity of the emitted light varies depending on the emission direction.

International Publication WO2002 / 059982 (FIG. 1)

  An object of the present invention is to provide a light emitting device in which the chromaticity of emitted light is uniform regardless of the emitting direction.

  According to one aspect of the present invention, a package having a recess formed on the top surface, a chip mounted on the bottom surface of the recess and emitting light of the first wavelength, a resin member filled in the recess, And a phosphor particle that is deposited under the resin member and emits light having a second wavelength longer than the first wavelength when the light having the first wavelength is incident thereon, and the bottom surface of the recess A light emitting device is provided in which a region directly below the chip in the projection protrudes from a region around the chip.

  According to another aspect of the present invention, a package having a flat upper surface, a chip mounted on the upper surface and emitting light having a first wavelength, a resin member provided on the upper surface, and the resin member And phosphor particles that emit light having a second wavelength longer than the first wavelength when the light having the first wavelength is incident thereon, immediately below the chip on the upper surface. The light emitting device is provided in which the region protrudes from a region around the region directly below.

  According to the present invention, it is possible to realize a light emitting device in which the chromaticity of emitted light is uniform regardless of the emitting direction.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, a first embodiment of the present invention will be described.
FIG. 1 is a cross-sectional view illustrating a light emitting device according to this embodiment.
In FIG. 1, the phosphor particles are schematically drawn larger than the actual size. The same applies to other figures described later.

  As shown in FIG. 1, in the light emitting device 1 according to this embodiment, a package 11 is provided, and a recess 12 is formed on the upper surface of the package 11. The shape of the recess 12 is, for example, a mortar shape, and the side surface is inclined so as to open upward. The package 11 is configured by embedding a positive electrode and a negative electrode (both not shown) in a package body made of an insulating material, for example, white ceramic or white resin. The positive electrode and the negative electrode are exposed at the bottom surface 13 of the recess 12.

  An LED chip 14 is provided in the recess 12. The LED chip 14 is, for example, a light emitting element that emits light in a blue or blue to ultraviolet region (hereinafter collectively referred to as “blue light”), and has a rectangular plate shape, an upper surface, Light is emitted from all the lower and side surfaces. The LED chip 14 is mounted at the center of the bottom surface 13 of the recess 12, and the lower surface of the LED chip 14 is connected to a negative electrode embedded in the bottom surface 13 via a solder layer (not shown). . The upper surface of the LED chip 14 and the positive electrode are connected via a wire (not shown).

  The recess 12 is filled with a resin member 15 made of a transparent resin. The depth of the recess 12 is larger than the thickness of the LED chip 14, and the resin member 15 embeds the LED chip 14 and a wire (not shown). In addition, a large number of phosphor particles 16 are mixed in the resin member 15, and are deposited in a layered manner on the lower part of the resin member 15, that is, on the bottom surface 13 and the portions in contact with the upper and side surfaces of the LED chip 14. The phosphor particles 16 are formed of a fluorescent material that is excited when blue light emitted from the LED chip 14 is incident and emits light having a wavelength longer than the wavelength of the incident light, for example, yellow light. The resin member 15 transmits blue light emitted from the LED chip 14 and yellow light emitted from the phosphor particles 16.

  The region 13 a immediately below the LED chip 14 on the bottom surface 13 of the recess 12 protrudes upward from the region 13 b around the region 13 a directly below the bottom surface 13. The protruding amount is, for example, equal to or greater than the thickness of the deposited layer 16a formed by depositing the phosphor particles 16. Thereby, parts other than the part which covers the upper surface and side surface of LED chip 14 among the deposition layers 16a are located below LED chip 14. FIG. For this reason, the thickness of the part arrange | positioned on the upper surface of LED chip 14 among the deposition layers 16a and the thickness of the part arrange | positioned on the side surface of LED chip 14 become substantially equal.

  Such a light emitting device 1 can be manufactured, for example, by the following method. That is, the package 11 in which the concave portion 12 having the above-described shape is formed. Next, the LED chip 14 is mounted on the area where the negative electrode (not shown) on the bottom surface 13 of the recess 12 is exposed, and the LED chip 14 and the positive electrode (not shown) are wire-bonded. Next, the resin liquid in which the phosphor particles 16 are dispersed in the transparent resin is filled in the recesses 12 by, for example, coating. Then, by leaving it for a certain period of time, the inside of the resin liquid is settled on the phosphor particles 16, and a deposited layer 16a composed of the phosphor particles 16 is formed below the resin liquid. Then, the resin member 15 is formed by heat-processing and thermosetting a resin liquid. Thereby, the light emitting device 1 is manufactured.

Next, the operation and effect of this embodiment will be described.
In the light emitting device 1, when power is supplied to the LED chip 14 by the positive electrode and the negative electrode, the LED chip 14 emits blue light in all directions. Of the emitted light, the downward light is blocked by the package 11, but the upward and lateral light enters the resin member 15. Part of the blue light that has entered the resin member 15 enters the phosphor particles 16 and is absorbed. Thereby, the fluorescent material forming the phosphor particles 16 is excited and emits light having a wavelength longer than that of incident light, for example, yellow light. This yellow light enters the resin member 15. On the other hand, the remainder of the light that has entered the resin member 15 does not enter the phosphor particles 16 and propagates through the resin member 15 as blue light. Yellow light and blue light propagating in the resin member 15 are emitted directly from the resin member 15 or after being reflected from the side surface of the recess 12 and then emitted from the opening of the recess 12 to the outside of the recess 12. The light is emitted outside the device 1. At this time, since the blue light emitted from the LED chip 14 and the yellow light emitted from the phosphor particles 16 are mixed, the light emitted from the light emitting device 1 becomes white.

  In this case, the color of the light emitted from the light emitting device 1 varies depending on the proportion of the light absorbed by the phosphor particles 16 in the blue light emitted from the LED chip 14. This ratio depends on the thickness of the deposited layer 16a. That is, as the deposition layer 16a is thicker, the proportion of yellow light increases and the color of the emitted light from the light emitting device 1 becomes yellow. Conversely, the thinner the deposited layer 16a, the greater the proportion of blue light, and the color of the emitted light from the light emitting device 1 becomes blue.

  In the present embodiment, since the region 13a immediately below the LED chip 14 protrudes above the surrounding region 13b on the bottom surface 13 of the recess 12 of the package 11, the LED chip 14 in the deposition layer 16a. The thickness of the portion covering the upper surface of the LED chip and the thickness of the portion covering the side surface of the LED chip 14 are substantially equal to each other. Therefore, the light emitted from the upper surface of the LED chip 14 and the light emitted from the side surface of the LED chip 14 have substantially the same mixing ratio of blue light and yellow light, and the chromaticity is substantially equal. Thereby, light with uniform chromaticity is emitted from the light emitting device 1 regardless of the emission angle. Moreover, since the light emitted from the side surface of the LED chip 14 is not excessively absorbed by the phosphor particles 16 and can be efficiently emitted to the outside of the light emitting device 1, the light emission efficiency is high.

Hereinafter, in order to explain the effect of this embodiment, a comparative example of this embodiment will be described.
FIG. 2 is a cross-sectional view illustrating a light emitting device according to this comparative example.
As shown in FIG. 2, in the light emitting device 101 according to this comparative example, the bottom surface 13 of the recess 12 of the package 11 is flat. For this reason, portions other than the portion covering the LED chip 14 in the deposited layer 16 a are formed at the same height as the LED chip 14. Thereby, the light emitted from the side surface of the LED chip 14 passes through the deposition layer 16a over a long distance, and most of the light is absorbed by the phosphor particles 16 and converted into yellow light. Therefore, the light emitted from the side surface of the LED chip 14 becomes yellowish light having a higher proportion of yellow light than blue light. On the other hand, light emitted from the upper surface of the LED chip 14 is mixed with blue light and yellow light at an appropriate ratio to become white light.

  As a result, the portion covering the upper surface of the LED chip 14 in the deposited layer 16a emits white light, but the portion located around the LED chip 14 emits yellow light. The non-uniformity of chromaticity due to such a position affects the uniformity of the light emitted from the light emitting device 101, and the chromaticity of the emitted light varies depending on the direction emitted from the light emitting device 101. Moreover, since the light emitted from the side surface of the LED chip 14 is excessively absorbed by the phosphor particles 16, the light emission efficiency is lowered and the light emission intensity is low.

  On the other hand, according to the present embodiment, the optical path length through which the light emitted from the LED chip 14 passes through the deposition layer 16a is substantially uniform regardless of the emission direction. The chromaticity does not vary, and the chromaticity of light emitted from the light emitting device 1 is uniform regardless of the emission direction. Moreover, the light emitted from the side surface of the LED chip 14 is not excessively absorbed by the phosphor particles 16, and the light emission efficiency is high.

Next, a second embodiment of the present invention will be described.
FIG. 3 is a cross-sectional view illustrating the light emitting device according to this embodiment.
As shown in FIG. 3, in the light emitting device 2 according to the present embodiment, in the bottom surface 13 of the recess 12 of the package 11, a region in contact with the region 13 a immediately below the surrounding region 13 b has a gentle slope. That is, the height of the area in the vicinity of the immediate area 13a in the peripheral area 13b becomes lower as the distance from the immediate area 13a increases. Other configurations in the present embodiment are the same as those in the first embodiment.

  Also according to the present embodiment, the same operations and effects as those of the first embodiment described above can be obtained. Further, according to the present embodiment, since the peripheral region 13b on the bottom surface 13 is gently inclined, when the package main body of the package 11 is molded using a mold, the mold release property is good.

Next, a third embodiment of the present invention will be described.
FIG. 4 is a cross-sectional view illustrating the light emitting device according to this embodiment.
As shown in FIG. 4, in the light emitting device 3 according to the present embodiment, the bottom surface 13 of the recess 12 is flat, and a pedestal 17 is provided on the central portion of the bottom surface 13. The shape of the base 17 is a flat plate shape, and the upper surface and the lower surface thereof are flat. The LED chip 14 is placed on the pedestal 14. The pedestal 17 is made of a conductive material such as metal. Thereby, the lower surface of the LED chip 14 is connected to the negative electrode (not shown) via the base 17. Other configurations in the present embodiment are the same as those in the first embodiment.

  Also according to the present embodiment, the same operations and effects as those of the first embodiment described above can be obtained. In addition, according to the present embodiment, the above-described light emitting device can be realized simply by attaching the pedestal 17 to an existing package.

Next, a fourth embodiment of the present invention will be described.
FIG. 5 is a plan view illustrating the light emitting device according to this embodiment.
FIG. 6 is a cross-sectional view taken along line AA ′ shown in FIG.
In order to make the drawing easier to see, the resin member and the deposited layer are not shown in FIG. Further, in FIG. 6, the wire is not shown. The same applies to other figures described later.

  As shown in FIGS. 5 and 6, the light emitting device 4 according to the present embodiment is provided with a package 31. The shape of the package 31 is, for example, a substantially rectangular parallelepiped shape in which the area of the upper surface and the lower surface is larger than the area of each side surface, and a mortar-shaped recess 32 is formed on the upper surface. When viewed from above, the outer edge of the bottom surface 33 of the recess 32 is circular, and the side surface of the recess 32 is inclined so as to go outward as it goes upward.

  The package 31 is provided with a package body 31a made of an insulating material, for example, white ceramic or white resin. Further, a negative electrode 31b and a positive electrode 31c are embedded in the package body 31a. The negative electrode 31b and the positive electrode 31c are insulated from each other by the package body 31a, and the upper surfaces of both electrodes are exposed at the bottom surface 33. When viewed from above, the shape of the negative electrode 31b is a combination of a sector shape whose center coincides with the center of the bottom surface 33 and whose circular arc coincides with the outer edge of the bottom surface 33, and a square disposed at the center of the bottom surface 33. . The shape of the positive electrode 31c is a U-shape arranged at a certain distance from the square portion of the negative electrode 31b in a region excluding the fan-shaped portion of the negative electrode 31b, and the outer edge thereof is the same as the outer edge of the bottom surface 33. It coincides and its inner edge extends along the square part.

  An annular groove 40 is formed on the upper surface of the square portion of the negative electrode 31b. When viewed from above, the outer edge of the groove 40 is circular and the inner edge is square. Further, the groove 40 does not penetrate the negative electrode 31 b, and therefore, the inner side of the groove 40 is a convex portion 41 protruding from the groove 40. The upper surface of the convex portion 41 is flat, and the height thereof is the height of the upper surface of the outer portion of the groove 40 in the negative electrode 31b, the height of the upper surface of the positive electrode 31c, and the negative electrode 31b and the positive electrode in the package body 31a. It is equal to the height of the upper surface of the part between 31c. The depth of the groove 40, that is, the protrusion amount of the convex portion 41 is, for example, 70 to 90 μm. The width of the portion corresponding to the convex portion 41 in the package 31 is, for example, 200 μm.

  Further, an LED chip 34 is provided in a region directly above the convex portion 41 in the concave portion 32. The groove 40 is formed around the LED chip 34 around the area immediately below the LED chip 34 on the upper surface of the negative electrode 31b. A solder layer (not shown) is provided between the LED chip 34 and the convex portion 41, and the lower surface of the LED chip 34 is connected to the upper surface of the convex portion 41 via the solder layer. The thickness of the LED chip 34 is, for example, 95 μm.

  Further, the light emitting device 4 is provided with a wire 43. One end of the wire 43 is bonded to the upper surface of the LED chip 34, and the other end of the wire 43 is bonded to the upper surface of the positive electrode 31c. Thereby, the upper surface of the LED chip 34 is connected to the positive electrode 31 c through the wire 43.

  Further, the recess 32 is filled with a resin member 35 made of a transparent resin. In addition, the LED chip 34 and the wire 43 described above are embedded in the resin member 35. A large number of phosphor particles are mixed in the resin member 35. The phosphor particles are deposited on the bottom surface 33 and the LED chip 34, that is, on the lower part of the resin member 35, thereby forming a deposited layer 36a. The thickness of the deposited layer 36a is, for example, equal to or less than the protrusion amount of the protrusion 41, and is, for example, 70 μm. The phosphor particles are excited when blue light emitted from the LED chip 34 is incident, and emit yellow light. The resin member 35 transmits blue light emitted from the LED chip 34 and yellow light emitted from the phosphor particles. In one example, the resin member 35 is formed of, for example, a silicone resin or an epoxy resin. Examples of the fluorescent material forming the phosphor particles include a silicate material or a silicate nitride material using an alkaline earth metal as a host material, or a fluorescent material obtained by activating rare earth ions in these fluorescent materials. A material which is mainly excited by visible light can be used.

  In this embodiment, since the groove 40 is formed on the upper surface of the negative electrode 31b so as to surround the LED chip 34 when viewed from above, the portion of the deposited layer 36a located in the groove 40 is the LED chip. It is located below 34. Therefore, the deposited layer 36a covers the upper surface and the side surface of the LED chip 34 with a substantially uniform thickness.

Next, the operation and effect of this embodiment will be described.
In the light emitting device 4, when a voltage is supplied from the outside, a negative potential is applied from the negative electrode 31 b to the lower surface of the LED chip 34 via the solder layer, and the LED chip 34 is connected from the positive electrode 31 c via the wire 43. A positive potential is applied to the upper surface of the LED chip 34, and the LED chip 34 emits blue light in all directions. Of the emitted light, the downward light is blocked by the negative electrode 31b, but the upward and lateral light passes through the deposition layer 36a in the thickness direction and then enters the resin member 35.

  At this time, since the thickness of the portion covering the upper surface of the LED chip 34 in the deposited layer 36a and the thickness of the portion covering the side surface of the LED chip 34 are substantially equal to each other, light emitted from the upper surface of the LED 34 passes through the deposited layer 36a. The length of the optical path that passes through and the length of the optical path through which the light emitted from the side surface of the LED 34 passes through the deposition layer 36a are substantially equal to each other. For this reason, for the same reason as in the first embodiment, the mixing ratio of the blue light and the yellow light is approximately equal between the light emitted from the upper surface of the LED chip 34 and the light emitted from the side surface. The chromaticity is almost equal. As a result, the emitted light of the light emitting device 3 has uniform chromaticity regardless of the emission direction. Moreover, in the light emitting device 3, since the light radiate | emitted from the side surface of the LED chip 34 is not excessively absorbed by the phosphor particles, the light emission efficiency is high.

  Further, according to the present embodiment, the thickness of the deposited layer 36a covering the LED chip 34 can be made uniform only by forming the groove 40 in the negative electrode 31b. Thereby, since the existing components can be used for the package 31a made of ceramic, the light emitting device 4 can be easily manufactured. Operations and effects other than those described above in the present embodiment are the same as those in the first embodiment described above.

Next, a modification of this embodiment will be described.
FIG. 7 is a cross-sectional view illustrating a light emitting device according to this variation.
As shown in FIG. 7, in the light emitting device 4a according to the present modification, the deposition layer 36a is provided only in the portion covering the LED chip 34 and in the groove 40, and is not provided outside. Such a deposited layer 36a can be formed by controlling the coating amount of the resin liquid. According to this modification, compared with the above-described third embodiment, it is possible to prevent light emitted from the side surface of the LED chip 34 and transmitted through the deposition layer 36a from reentering the deposition layer 36a. Configurations and operational effects other than those described above in the present modification are the same as those in the third embodiment described above.

Next, a fifth embodiment of the present invention will be described.
FIG. 8 is a cross-sectional view illustrating the light emitting device according to this embodiment.
The cross section shown in FIG. 8 corresponds to the cross section shown in FIG. 6 in the above-described fourth embodiment.

  As shown in FIG. 8, the light emitting device 5 according to this embodiment is different in the shape of the negative electrode 31b from the light emitting device 4 according to the above-described fourth embodiment (see FIG. 6). That is, in the light emitting device 5, the region other than the convex portion 41 on the upper surface of the negative electrode 31 b is positioned below the upper surface of the convex portion 41. The upper surface of the convex portion 41 corresponds to a region directly below the LED chip 34. Further, the height of the upper surface of the convex portion 41 is equal to the height of the upper surface of the positive electrode 31c and the height of the upper surface of the portion of the package body 31a between the negative electrode 31b and the positive electrode 31c. Accordingly, in the bottom surface 33 of the concave portion 32, only the region other than the convex portion 41 on the upper surface of the negative electrode 31b is recessed with respect to the other regions. Other configurations in the present embodiment are the same as those in the fourth embodiment described above.

  In the present embodiment, since the ratio of the portion located below the LED chip 34 in the deposition layer 36a is larger than in the fourth embodiment described above, the light is emitted from the side of the LED chip 34 and deposited. Of the light that has passed through the layer 36a, the proportion of light that reenters the deposition layer 36a can be reduced. Moreover, since the above-described configuration can be realized by processing only the negative electrode 31b as in the fourth embodiment, the light emitting device 5 can be easily manufactured. Operations and effects other than those described above in the present embodiment are the same as those in the above-described fourth embodiment.

Next, a modification of this embodiment will be described.
FIG. 9 is a cross-sectional view illustrating a light emitting device according to this variation.
As shown in FIG. 9, in the light emitting device 5a according to this modification, the deposition layer 36a is provided only in the region immediately above the negative electrode 31b, and is not provided in any other region. That is, the deposited layer 36a is not provided in the region directly above the positive electrode 31c and in the region directly above the portion of the package body 31 between the negative electrode 31b and the positive electrode 31c. As a result, also in this modified example, the deposited layer 36a is limitedly disposed only in the vicinity of the LED chip 34, as in the modified example of the fourth embodiment (see FIG. 7). Thereby, similarly to the modified example of the fourth embodiment described above, it is possible to prevent the light that has passed through the deposition layer 36a from reentering the deposition layer 36a.

Next, a sixth embodiment of the present invention will be described.
FIG. 10 is a cross-sectional view illustrating the light emitting device according to this embodiment.
Note that the cross section shown in FIG. 10 corresponds to the cross section shown in FIG. 6 in the above-described fourth embodiment.

  As shown in FIG. 10, the light emitting device 6 according to the present embodiment is different in the shapes of the package body 31a and the positive electrode 31c from the light emitting device 5 according to the fifth embodiment (see FIG. 8). ing. That is, in the light emitting device 6, the upper surface of the portion between the negative electrode 31b and the positive electrode 31c in the package body 31a and the upper surface of the positive electrode 31c are the same as the region other than the convex portion 41 on the upper surface of the negative electrode 31b. It is at height. Therefore, the region other than the convex portion 41 on the bottom surface 33 of the concave portion 32 is located below the upper surface of the convex portion 41, and the convex portion 41 protrudes from the surrounding region. The upper surface of the convex portion 41 corresponds to a region directly below the LED chip 34. Other configurations in the present embodiment are the same as those in the fifth embodiment described above.

  In the present embodiment, as compared with the fourth and fifth embodiments described above, all the portions other than the portion covering the LED chip 34 in the deposition layer 36a are located below the LED chip 34. It is possible to further reduce the proportion of the light that is emitted from the side of 34 and passes through the deposition layer 36a and reenters the deposition layer 36a. Operations and effects other than those described above in the present embodiment are the same as those in the fourth embodiment described above.

Hereinafter, the effect of this embodiment will be described based on experimental examples.
FIG. 11A is a plan view showing the measurement direction of chromaticity, FIG. 11B is a cross-sectional view showing the measurement direction of chromaticity, and FIG. 11C is a schematic chromaticity diagram.
FIGS. 12A and 12B are graphs illustrating the influence of the emission angle on the chromaticity of the emitted light, with the emission angle on the horizontal axis and the chromaticity Cx on the vertical axis. ) Shows the case of Φ0, (b) shows the case of Φ90,
FIGS. 13A and 13B are graphs illustrating the influence of the emission angle on the chromaticity of the emitted light, with the emission angle on the horizontal axis and the chromaticity Cy on the vertical axis. ) Shows the case of Φ0, and (b) shows the case of Φ90.

  In this experimental example, as shown in FIGS. 11A and 11B, in two directions Φ0 and Φ90 orthogonal to each other among the directions parallel to the upper surface of the light emitting device 6, the upper surface of the light emitting device 6 and the LED The chromaticities Cx and Cy of the emitted light were measured in the emission direction V with the intersection D with the center axis C of the chip 34 as a base point. At this time, an angle formed by the emission direction V and the central axis C was defined as an emission angle θ.

  Moreover, the light emitting device 6 which concerns on this embodiment, and the light emitting device which concerns on a comparative example were used for evaluation object. In the light emitting device according to the comparative example, the bottom surface 33 of the recess 32 is flat compared to the light emitting device 6 according to the present embodiment. In any light emitting device, the content of the phosphor particles in the resin member 35 was adjusted so that the chromaticity Cx and Cy of the emitted light was 0.31 in the emission direction where the emission angle was 0 °. . As shown in FIG. 11C, when the emitted light is white, the chromaticities Cx and Cy of the emitted light are each about 0.31. On the other hand, when the emitted light is yellow, the chromaticities Cx and Cy are both greater than 0.31.

  As shown in FIGS. 12A and 12B and FIGS. 13A and 13B, in the light emitting device according to the comparative example, the emission angle θ is around 0 ° in both directions of Φ0 and Φ90. In this case, the chromaticity Cx and Cy of the outgoing light is about 0.31, and the outgoing light is white. However, when the absolute value of the outgoing angle θ is increased, the chromaticity Cx and Cy are increased and the outgoing light is increased. Became close to yellow. Thus, the chromaticity of the outgoing light varies depending on the outgoing direction.

  On the other hand, in the light emitting device according to the present embodiment, the chromaticity Cx and Cy of the emitted light is about 0.310 to 0.315 regardless of the emission angle in any direction of Φ0 and Φ90. It was white. That is, the chromaticity of the emitted light is uniform regardless of the emission direction. Thus, according to the present embodiment, the chromaticity of the emitted light can be made uniform in the emission direction as compared with the comparative example.

Next, a seventh embodiment of the present invention will be described.
FIG. 14 is a cross-sectional view illustrating a light emitting device according to this embodiment.
As shown in FIG. 14, in the light emitting device 7 according to this embodiment, the package 51 has a substrate shape. That is, the upper surface 52 of the package 51 is not formed with a large recess 12 (see FIG. 1) that accommodates the entire LED chip as in the first embodiment, and is generally flat. However, an annular groove 53 is formed on the upper surface 52.

  An LED chip 54 is mounted inside the groove 53 on the upper surface 52. As a result, the region 52 a immediately below the LED chip 54 on the upper surface 52 protrudes from the region 52 b around the region 52 a directly below, that is, the bottom surface of the groove 53. The LED chip 54 is a chip that emits blue light, for example.

  Further, a resin member 55 is provided on the upper surface 52 of the package 51 so as to cover the LED device 54 and the groove 53. The resin member 55 is raised on the upper surface 52, and its shape is, for example, a part of a sphere, and is hemispherical, for example. The phosphor particles 56 are deposited on the lower part of the resin member 55, that is, on the part in contact with the upper surface 52 of the package 51 and the LED chip 54, thereby forming a deposited layer 56a. The phosphor particles 56, for example, absorb blue light and emit yellow light, similarly to the phosphor particles 16 in the first embodiment described above. Further, the thickness of the deposited layer 56a is, for example, equal to or less than the depth of the groove 53.

  Also in this embodiment, the region 52a immediately below the LED chip 54 protrudes from the surrounding region 52b, and the LED chip 54 is disposed above the deposited layer 56a provided on the region 52b. The light emitted from the side surface of the chip 54 is not excessively absorbed by the phosphor particles 56. Moreover, according to this embodiment, the lens effect which condenses emitted light can be acquired by the hemispherical resin member 55. Configurations and operational effects other than those described above in the present embodiment are the same as those in the first embodiment.

Next, an eighth embodiment of the present invention will be described.
FIG. 15 is a cross-sectional view illustrating a light emitting device according to this embodiment.
As shown in FIG. 15, in the light emitting device 8 according to this embodiment, the shape of the package 51 is different from that in the seventh embodiment. That is, in the light emitting device 8, only the region 52 a directly below the LED chip 54 protrudes on the upper surface 52 of the package 51. That is, the region other than the direct region 52a on the upper surface 52 is located below the direct region 52a. According to this embodiment, compared with the above-mentioned seventh embodiment, the light that has exited from the side surface of the LED chip 54 and passed through the deposition layer 56a is more reliably suppressed from re-entering the deposition layer 56a. it can. Configurations and operational effects other than those described above in the present embodiment are the same as those in the seventh embodiment described above.

  While the present invention has been described with reference to the embodiments, the present invention is not limited to these embodiments. Those in which those skilled in the art appropriately added, deleted, or changed the design of the above-described embodiments are also included in the scope of the present invention as long as they have the gist of the present invention. For example, in each of the embodiments described above, the LED chip emits blue light, and the phosphor particles absorb a part of the blue light to emit yellow light, and the blue light and the yellow light are emitted. Although the example which obtains white light by mixing was shown, the present invention is not limited to this, and the emitted light of the LED chip and the emitted light of the phosphor particles may be any color. Further, the light emitted from the light emitting device is not limited to white, and may be, for example, a light emitting device that emits green or red light. Further, the chip is not limited to the LED chip. The present invention is a light emitting device in which a chip that emits light of a first wavelength is provided, and phosphor particles that are emitted by converting the light emitted from the chip into light of a second wavelength are deposited in layers. If applicable, it is applicable. Note that the second wavelength is usually longer than the first wavelength due to the Stokes shift.

1 is a cross-sectional view illustrating a light emitting device according to a first embodiment of the invention. It is sectional drawing which illustrates the light-emitting device which concerns on the comparative example of 1st Embodiment. It is sectional drawing which illustrates the light-emitting device which concerns on the 2nd Embodiment of this invention. It is sectional drawing which illustrates the light-emitting device which concerns on the 3rd Embodiment of this invention. It is a top view which illustrates the light-emitting device which concerns on the 4th Embodiment of this invention. It is sectional drawing by the A-A 'line shown in FIG. It is sectional drawing which illustrates the light-emitting device which concerns on the modification of 4th Embodiment. It is sectional drawing which illustrates the light-emitting device which concerns on the 5th Embodiment of this invention. It is sectional drawing which illustrates the light-emitting device which concerns on the modification of 5th Embodiment. It is sectional drawing which illustrates the light-emitting device which concerns on the 6th Embodiment of this invention. (A) is a top view which shows the measurement direction of chromaticity, (b) is sectional drawing which shows the measurement direction of chromaticity, (c) is a typical chromaticity diagram. (A) and (b) are graphs illustrating the influence of the emission angle on the chromaticity of the emitted light, with the emission angle on the horizontal axis and the chromaticity Cx on the vertical axis. The case of Φ0 is shown, and (b) shows the case of Φ90. (A) and (b) are graphs illustrating the influence of the emission angle on the chromaticity of the emitted light, with the emission angle on the horizontal axis and the chromaticity Cy on the vertical axis. The case of Φ0 is shown, and (b) shows the case of Φ90. It is sectional drawing which illustrates the light-emitting device which concerns on the 7th Embodiment of this invention. It is sectional drawing which illustrates the light-emitting device which concerns on the 8th Embodiment of this invention.

Explanation of symbols

1, 2, 3, 4, 4a, 5, 5a, 6, 7, 8, 101 Light-emitting device, 11 package, 12 recess, 13 bottom surface, 13a area directly below, 13b area around, 14 LED chip, 15 resin member, 16 phosphor particles, 16a deposition layer, 17 pedestal, 31 package, 31a package body, 31b negative electrode, 31c positive electrode, 32 recess, 33 bottom surface, 34 LED chip, 35 resin member, 36a deposition layer, 40 groove, 41 convex Part, 43 wire, 51 package, 52 upper surface, 52a immediately below region, 52b surrounding region, 53 groove, 54 LED chip, 55 resin member, 56 phosphor particle, 56a deposition layer, C central axis, D intersection, V emission direction

Claims (7)

A package having a recess formed on the upper surface;
A chip mounted on the bottom surface of the recess and emitting light of a first wavelength;
A resin member filled in the recess;
Phosphor particles deposited on the lower part of the resin member and emitting light having a second wavelength longer than the first wavelength when the light having the first wavelength is incident;
With
The light emitting device characterized in that a region directly below the chip on the bottom surface of the recess protrudes from a region around the region directly below. A wire further connected at one end to the top surface of the chip;
The package is
An insulating package body;
A first electrode provided in a region including a region directly below the chip on the bottom surface of the recess, and connected to a lower surface of the chip;
A second electrode provided in a region spaced from the first electrode on the bottom surface of the recess and connected to the other end of the wire;
Have
The light emitting device according to claim 1, wherein a groove is formed in a peripheral region immediately below the chip on the upper surface of the first electrode. A wire further connected at one end to the top surface of the chip;
The package is
An insulating package body;
A first electrode provided in a region including a region directly below the chip on the bottom surface of the recess, and connected to a lower surface of the chip;
A second electrode provided in a region spaced from the first electrode on the bottom surface of the recess and connected to the other end of the wire;
Have
2. The light emitting device according to claim 1, wherein a region other than a region directly below the chip is located below the region directly below the upper surface of the first electrode.   2. The light emitting device according to claim 1, wherein a region other than a region directly below the chip on a bottom surface of the recess is located below the region directly below. A package with a flat top surface;
A chip mounted on the upper surface and emitting light of a first wavelength;
A resin member provided on the upper surface;
Phosphor particles deposited on the lower part of the resin member and emitting light having a second wavelength longer than the first wavelength when the light having the first wavelength is incident;
With
The area directly below the chip on the upper surface protrudes from the area around the area directly below the light emitting device.   6. The height of the region immediately below the region directly below the region directly below is equal to or greater than the thickness of the deposited layer made of the phosphor particles. The light emitting device according to 1.   The light emitting device according to claim 1, wherein the chip is a light emitting diode.

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