JP2006245080A - Light fixture - Google Patents

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JP2006245080A
JP2006245080A JP2005055311A JP2005055311A JP2006245080A JP 2006245080 A JP2006245080 A JP 2006245080A JP 2005055311 A JP2005055311 A JP 2005055311A JP 2005055311 A JP2005055311 A JP 2005055311A JP 2006245080 A JP2006245080 A JP 2006245080A
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light
color temperature
light emitting
phosphor
substrate
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Iwatomo Moriyama
厳與 森山
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light fixture capable of reducing irregularity in a luminescent color. <P>SOLUTION: The light fixture comprises a substrate 2, an insulator 4, circuit patterns 5a, 5b provided on the substrate via the insulator, a plurality of light-emitting elements 6 arranged in a matrix via the circuit patterns, a reflector 9 that is arranged on the substrate and reflects light irradiated from the plurality of light-emitting elements, a diffusion layer 11 containing a disperging agent for covering the light-emitting elements, a phosphor layer 12 containing a phosphor arranged at the upper side of the diffusion layer, and a light control body having an emission surface for emitting light entering from each light-emitting element. In the light fixture, color temperature becomes lower as a perpendicular light distribution angle becomes larger at a correlation color temperature of 5,000 K or higher. At a perpendicular light distribution angle of 0° or 60°, the correlation color temperature is within 0 to -200 K. At a correlation color temperature of less than 5,000 K, the color temperature becomes higher as the perpendicular color distribution angle becomes larger. At a perpendicular light distribution angle of 0° or 60°, the correlation color temperature is within 0 to +200 K. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は発光素子を光源とする照明装置に関する。   The present invention relates to an illumination device using a light emitting element as a light source.

従来の発光ダイオード(LED)照明装置の一例としては、LEDチップを配設するケース内に、合成樹脂を充填してLEDチップをケース内に封止する面実装タイプのものが知られている(例えば特許文献1参照)。   As an example of a conventional light emitting diode (LED) illuminating device, a surface mount type device in which a synthetic resin is filled in a case in which an LED chip is disposed and the LED chip is sealed in the case is known ( For example, see Patent Document 1).

そして、この種のLED装置により白色光を発光させる従来例の一例としては、青色発光LEDチップにより発光させた青色光と、黄色発光LEDチップにより発光させた黄色光と、を混合させるもの(以下、第1の従来技術という)が知られている。また、他の従来例としては、青色発光LEDチップの青色光と、この青色発光により黄色発光蛍光体を励起させて得た黄色光とを混色させるもの(以下、第2の従来技術という)が知られている。
特開2002−43625号公報
As an example of a conventional example in which white light is emitted by this type of LED device, a mixture of blue light emitted by a blue light emitting LED chip and yellow light emitted by a yellow light emitting LED chip (hereinafter referred to as “light emitting”). The first prior art is known). In addition, as another conventional example, there is one that mixes blue light of a blue light emitting LED chip and yellow light obtained by exciting a yellow light emitting phosphor by this blue light emission (hereinafter referred to as second prior art). Are known.
JP 2002-43625 A

しかしながら、第1の従来技術では、青色発光LEDチップと黄色発光LEDチップとの間に距離があるので、青色光と黄色光の混色を均一にすることが難しく、白色光以外の他の色になり易い。また、青色光と黄色光をそれぞれ発光する少なくとも2個のLEDチップを設置するためのスペースが必要であり、これを搭載する機器の大形化を招いている。   However, in the first prior art, since there is a distance between the blue light emitting LED chip and the yellow light emitting LED chip, it is difficult to make the mixed color of blue light and yellow light uniform, and other colors other than white light are used. Easy to be. Moreover, a space for installing at least two LED chips that respectively emit blue light and yellow light is required, which leads to an increase in the size of equipment on which the chips are mounted.

そして、第2の従来技術では、その封止樹脂外面に対して垂直方向から見た場合、青色発光LEDチップが位置する中央部でほぼ白色光が得られるものの、その周辺部では黄色光が分布し、色むらが発生する。また、このために、封止樹脂外面に対して斜めから見た場合には、主に黄色光が発光しているように見られる。さらに、この封止樹脂外面の中央部においても、この中央部と青色発光LEDチップとの距離の方が、周辺部と青色発光LEDチップとの距離よりも近いので、その分、青色光の輝度が高く、青色光が抜けるので、白色光が青味がかって見えるという不具合もある。   In the second prior art, when viewed from the vertical direction with respect to the outer surface of the sealing resin, almost white light is obtained in the central portion where the blue light emitting LED chip is located, but yellow light is distributed in the peripheral portion. And uneven color occurs. For this reason, when viewed obliquely with respect to the outer surface of the sealing resin, it appears that mainly yellow light is emitted. Further, even in the central part of the outer surface of the sealing resin, the distance between the central part and the blue light emitting LED chip is closer than the distance between the peripheral part and the blue light emitting LED chip. The blue light is lost and the white light appears bluish.

本発明は、発光色の色むらを低減することができる照明装置を提供することを目的とする。   An object of this invention is to provide the illuminating device which can reduce the color nonuniformity of luminescent color.

請求項1の発明は、基板と、基板に配設された絶縁体と、絶縁体を介して前記基板に配設された回路パターンと、回路パターンを介してマトリクス状に配置される複数の発光素子と、前記基板に配設され、前記複数の発光素子から放射される光を反射する反射体と、発光素子を被覆する拡散剤含む拡散層と、拡散層の上側に配設された蛍光体を含む蛍光体層と、前記各発光素子から入射した光を出射する出射面を有する制光体とを具備する照明装置において、相関色温度5000K以上では、鉛直配光角が大きくなるにつれて色温度が低くなり、鉛直配光角0°ないし60°において、相関色温度が0〜−200K以内になり、相関色温度5000K未満では、鉛直配光角が大きくなるにつれて色温度が高くなり、鉛直配光角0°ないし60°において、相関色温度が0〜+200K以内になるように構成されていることを特徴とする。   The invention of claim 1 is a substrate, an insulator disposed on the substrate, a circuit pattern disposed on the substrate via the insulator, and a plurality of light emitting elements disposed in a matrix via the circuit pattern An element, a reflector disposed on the substrate and reflecting light emitted from the plurality of light emitting elements, a diffusion layer including a diffusing agent covering the light emitting element, and a phosphor disposed above the diffusion layer In a lighting device comprising a phosphor layer including a light control body having an exit surface that emits light incident from each of the light emitting elements, the color temperature increases as the vertical light distribution angle increases at a correlated color temperature of 5000 K or more. When the vertical light distribution angle is 0 ° to 60 °, the correlated color temperature is within 0 to −200K. When the correlated color temperature is less than 5000K, the color temperature increases as the vertical light distribution angle increases. Light angle 0 ° to 60 ° Oite, wherein the correlated color temperature is configured to be within 0 to + 200K.

基板の材料は、ガラスエポキシ樹脂、アルミニウムまたは窒化アルミニウム等であるが、アルミニウムを含む基板は放熱性がよく、発光素子の温度上昇を抑制して、発光効率低下や素子劣化を抑制する。絶縁体は、基板の材料として金属材料を選択した場合に必要だが、ガラスエポキシ樹脂基板の場合には必要ない。回路パターンは、銅パターンで形成され正極と負極との間に複数の発光素子としての例えば発光ダイオードが電気的にされる。また、発光素子は、前記基板上にマトリクス状に複数配設されて面光源を形成する。反射体は、白色樹脂により形成され、発光素子の周囲を取り囲むように反射面を有している。   The material of the substrate is glass epoxy resin, aluminum, aluminum nitride, or the like, but a substrate containing aluminum has good heat dissipation and suppresses a temperature increase of the light emitting element, thereby suppressing a decrease in luminous efficiency and element deterioration. The insulator is necessary when a metal material is selected as the material of the substrate, but is not necessary in the case of a glass epoxy resin substrate. The circuit pattern is formed of a copper pattern, and, for example, light emitting diodes as a plurality of light emitting elements are electrically connected between the positive electrode and the negative electrode. A plurality of light emitting elements are arranged in a matrix on the substrate to form a surface light source. The reflector is formed of a white resin and has a reflecting surface so as to surround the periphery of the light emitting element.

発光素子の放射光は当該反射面により反射される。蛍光体層は、蛍光体をシリコーン樹脂等に混入させたものであり、発光素子からの光によって可視光に変換する。また、発光素子を拡散材で覆い、この拡散材上に蛍光体層を配設する構成であってもよい。この構成は、当該拡散材により蛍光体層から放射される光を拡散し、制光体の対向部域の輝度が高くなるのを抑制し、周辺部域の輝度との輝度比を1に近づけさせるように作用する。制光体は、アクリル樹脂等によって成形され、各発光素子に光学設計されている。   The emitted light of the light emitting element is reflected by the reflecting surface. The phosphor layer is obtained by mixing a phosphor into a silicone resin or the like, and converts it into visible light by light from the light emitting element. Alternatively, the light emitting element may be covered with a diffusing material, and a phosphor layer may be disposed on the diffusing material. This configuration diffuses the light emitted from the phosphor layer by the diffusing material, suppresses the increase in the brightness of the opposed area of the light control body, and brings the brightness ratio with the brightness of the peripheral area close to 1. It works to let you. The light control body is formed of an acrylic resin or the like, and is optically designed for each light emitting element.

相関色温度5000K以上では、鉛直配光角0°ないし60°において、相関色温度が0〜−200K以内になり、相関色温度5000K未満では、鉛直配光角0°ないし60°において、相関色温度が0〜+200K以内になるので、青色発光LEDチップが位置する中央部および周辺部のいずれの部分でもほぼ白色光が得られて色むらの発生を抑制する。   When the correlated color temperature is 5000K or more, the correlated color temperature is within 0 to -200K at a vertical light distribution angle of 0 ° to 60 °. When the correlated color temperature is less than 5000K, the correlated color is at a vertical light distribution angle of 0 ° to 60 °. Since the temperature is within 0 to +200 K, almost white light is obtained at any of the central portion and the peripheral portion where the blue light emitting LED chip is located, and the occurrence of uneven color is suppressed.

請求項2の発明は、請求項1記載の照明装置において、拡散層は、樹脂に拡散剤を3ないし5質量%添加してなることを特徴とする。拡散剤の添加量ゼロ、すなわち、拡散剤の添加量無しの場合の光束を100%としとき、拡散剤の添加量が5質量%を超過すると、光束が低下し、同添加量が3質量%未満になると、色むら低減効果が低下するので上記範囲が好適である。   According to a second aspect of the present invention, in the illumination device according to the first aspect, the diffusion layer is formed by adding 3 to 5% by mass of a diffusing agent to the resin. When the addition amount of the diffusing agent is zero, that is, when the luminous flux without the addition amount of the diffusing agent is 100%, if the addition amount of the diffusing agent exceeds 5 mass%, the luminous flux decreases, and the addition amount is 3 mass%. If the ratio is less than 1, the effect of reducing color unevenness decreases, so the above range is suitable.

請求項1および2の発明では、発光素子の発光を拡散層により多方向に拡散させることにより、蛍光体層を多方向から励起して蛍光発光させ、相関色温度5000K以上では、鉛直配光角0°ないし60°において、相関色温度が0〜−200K以内になり、相関色温度5000K未満では、鉛直配光角0°ないし60°において、相関色温度が0〜+200K以内になるので、青色発光LEDチップが位置する中央部および周辺部のいずれの部分でもほぼ白色光が得られて色むらの発生を抑制することができる。   In the first and second aspects of the present invention, the light emission of the light emitting element is diffused in multiple directions by the diffusion layer, whereby the phosphor layer is excited from multiple directions to emit fluorescence, and at a correlated color temperature of 5000 K or more, the vertical light distribution angle. Since the correlated color temperature is within 0 to -200K at 0 ° to 60 °, and the correlated color temperature is less than 5000K, the correlated color temperature is within 0 to + 200K at the vertical light distribution angle of 0 ° to 60 °. Almost white light can be obtained at any of the central portion and the peripheral portion where the light emitting LED chip is located, and the occurrence of color unevenness can be suppressed.

以下、本発明の一実施の形態を図面を参照して説明する。図1は本発明の一実施形態に係る照明装置の平面図、図2は図1のII−II線断面図、図3は図2のIII部拡大図である。図に示すように照明装置1は基板2上に、複数の発光装置3,3・・・を例えば3行3列のマトリクス状に配設し、かつ一体に連成している。基板2は放熱性と剛性を有するアルミニウム(Al)やNi、ガラスエポキシ等の平板からなり、この基板2上には、電気絶縁体4を介してリードフレーム5が配設されている。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a lighting device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 1, and FIG. As shown in the figure, the lighting device 1 has a plurality of light emitting devices 3, 3... Arranged on a substrate 2 in a matrix of, for example, 3 rows and 3 columns, and are integrally connected. The substrate 2 is made of a flat plate made of aluminum (Al), Ni, glass epoxy or the like having heat dissipation and rigidity, and a lead frame 5 is disposed on the substrate 2 via an electrical insulator 4.

図3に示すようにリードフレーム5は、LED装置3毎にCuとNiの合金やAu等により、陰極側と陽極側の回路パターン(配線パターン)5a,5bを形成しており、このリードフレーム5上には、発光装置3毎に、発光素子としての青色発光LEDチップ6をそれぞれ搭載している。各青色発光LEDチップ6は、青色の光を発光する例えば窒化ガリウム(GaN)系半導体等からなる。各青色発光LEDチップ6は、その底面電極を回路パターン5a,5bの一方上に載置して電気的に接続する一方、上面電極を回路パターン5a,5bの他方にボンディングワイヤ7により接続している。   As shown in FIG. 3, the lead frame 5 has cathode and anode circuit patterns (wiring patterns) 5a and 5b formed of an alloy of Cu and Ni, Au, or the like for each LED device 3, and this lead frame. 5, a blue light emitting LED chip 6 as a light emitting element is mounted for each light emitting device 3. Each blue light emitting LED chip 6 is made of, for example, a gallium nitride (GaN) semiconductor that emits blue light. Each blue light emitting LED chip 6 has its bottom electrode placed on one of the circuit patterns 5a and 5b to be electrically connected, while its top electrode is connected to the other of the circuit patterns 5a and 5b by a bonding wire 7. Yes.

そして、基板2上には、各青色発光LEDチップ6の周囲を所要の間隔を置いて取り囲み、基板2の反対側(図2,図3では上方)に向けて漸次拡開する反射面を構成する円錐台状の凹部8をそれぞれ同心状に形成した反射体9をLED装置3毎に形成すると共に、これらを一体に形成している。反射体9は例えばPBT(ポリブチレンテレフタレート)やPPA(ポリフタルアミド)、PC(ポリカーボネート)等の合成樹脂よりなり、各凹部8は外部に開口する開口8aをそれぞれ有する。   And on the board | substrate 2, the circumference | surroundings of each blue light emission LED chip 6 are surrounded at a required space | interval, and the reflective surface which spreads gradually toward the other side (FIG. 2, FIG. 3 upper direction) of the board | substrate 2 is comprised. Each of the LED devices 3 is formed with a reflector 9 having conical conical recesses 8 formed concentrically, and these are integrally formed. The reflector 9 is made of, for example, a synthetic resin such as PBT (polybutylene terephthalate), PPA (polyphthalamide), PC (polycarbonate), and each recess 8 has an opening 8a that opens to the outside.

各凹部8は、その内部に、透光性を有するシリコーンゴムやエポキシ樹脂等の熱硬化性透明樹脂を封止樹脂10としてそれぞれ充填している。この封止樹脂10は、青色発光LEDチップ6側の拡散層11と、凹部開口8a側の蛍光体層としての黄色発光蛍光体層12の2層に形成されている。   Each recess 8 is filled with a thermosetting transparent resin such as translucent silicone rubber or epoxy resin as a sealing resin 10. The sealing resin 10 is formed in two layers: a diffusion layer 11 on the blue light emitting LED chip 6 side and a yellow light emitting phosphor layer 12 as a phosphor layer on the concave opening 8a side.

拡散層11は、凹部8内に、アルミナ(Al)やTi、Ca、Si、Al、Y等の拡散剤を3〜5質量%(mass%)添加した封止樹脂を、青色発光LEDチップ6よりも高い位置まで注入して熱硬化させることにより形成され、蛍光体層12との境界面11aを青色発光LEDチップ6側(図3では下面側)へ凹む湾曲面に形成している。この湾曲境界面11aは、その湾曲上端と同下端との間が例えば1μm〜5μmが好ましい。 The diffusion layer 11 is a blue light emitting sealing resin obtained by adding 3 to 5 mass% (mass%) of a diffusing agent such as alumina (Al 2 O 3 ), Ti, Ca, Si, Al, or Y in the recess 8. It is formed by injecting to a position higher than the LED chip 6 and thermosetting, and the boundary surface 11a with the phosphor layer 12 is formed in a curved surface recessed to the blue light emitting LED chip 6 side (lower surface side in FIG. 3). Yes. The curved boundary surface 11a is preferably 1 μm to 5 μm, for example, between the upper end and the lower end of the curve.

また、拡散層11の封止樹脂10に添加した拡散剤の添加量が3〜5質量%であるので、光束を低下させずに白色光の色むらを低減することができる。次の表1は拡散剤の添加量による光束変化を示す。なお、拡散剤の添加量ゼロ、すなわち、拡散剤の添加量無しの場合の光束を100%とすると、拡散剤の添加量が5質量%を超過すると、光束が低下し、同添加量が3質量%未満になると、色むら低減効果が低下した。   Moreover, since the addition amount of the diffusing agent added to the sealing resin 10 of the diffusion layer 11 is 3 to 5% by mass, it is possible to reduce the color unevenness of white light without reducing the luminous flux. Table 1 below shows changes in luminous flux depending on the amount of diffusing agent added. In addition, when the addition amount of the diffusing agent is zero, that is, when the addition amount of the diffusing agent is 100%, when the addition amount of the diffusing agent exceeds 5% by mass, the light flux is decreased and the addition amount is 3 When the content was less than mass%, the effect of reducing color unevenness decreased.

黄色発光蛍光体層12は、拡散層11の熱硬化形成後、凹部8内に、LEDチップ6からの青色発光を受光して黄色に蛍光発光する黄色発光蛍光体を所要質量%添加した封止樹脂を注入して熱硬化させて構成されている。   The yellow light-emitting phosphor layer 12 is sealed by adding the required mass% of a yellow light-emitting phosphor that receives blue light from the LED chip 6 and fluoresces yellow after the thermosetting formation of the diffusion layer 11. It is configured by injecting resin and thermosetting.

次に、この照明装置1の作用を説明する。まず、各陰極側と陽極側の回路パターン5a,5b間に、外部から所定の直流電圧が印加されると、各青色発光LEDチップ6が青色発光される。この青色発光は、拡散層11により多方向へ拡散されてから黄色発光蛍光体層12内に入射し、ここで黄色蛍光体を多方向から励起して黄色に発光させると共に、この黄色と混色されて白色光になって各凹部開口8aから外部へ放射される。   Next, the effect | action of this illuminating device 1 is demonstrated. First, when a predetermined DC voltage is applied between the cathode-side and anode-side circuit patterns 5a and 5b from the outside, each blue light-emitting LED chip 6 emits blue light. This blue light emission is diffused in multiple directions by the diffusion layer 11 and then enters the yellow light emitting phosphor layer 12, where the yellow phosphor is excited from multiple directions to emit yellow light and is mixed with this yellow color. It becomes white light and is radiated to the outside from each recess opening 8a.

したがって、このLED照明装置1によれば、青色発光LEDチップ6の微小な発光を拡散層11により多方向へ拡散し、多方向から蛍光体層12の黄色蛍光体を励起させて黄色に発光させ、かつこの黄色光と青色光とを混色させて白色光を発光させるので、この白色光の色むらを低減することができる。   Therefore, according to this LED illumination device 1, minute light emission of the blue light emitting LED chip 6 is diffused in multiple directions by the diffusion layer 11, and the yellow phosphor of the phosphor layer 12 is excited from multiple directions to emit yellow light. In addition, since the yellow light and the blue light are mixed to emit white light, the color unevenness of the white light can be reduced.

すなわち、図4に示すように、相関色温度5000K以上では、鉛直配光角0°ないし60°において、相関色温度が0〜−200K以内になる。また、相関色温度5000K未満では、鉛直配光角0°ないし60°において、相関色温度が0〜+200K以内になる。この場合には、青色発光LEDチップが位置する中央部および周辺部のいずれの部分でもほぼ白色光が得られて色むらの発生を抑制することができる。   That is, as shown in FIG. 4, when the correlated color temperature is 5000 K or higher, the correlated color temperature is within 0 to -200 K at a vertical light distribution angle of 0 ° to 60 °. If the correlated color temperature is less than 5000 K, the correlated color temperature is within 0 to +200 K at a vertical light distribution angle of 0 ° to 60 °. In this case, almost white light is obtained at any of the central portion and the peripheral portion where the blue light emitting LED chip is located, and the occurrence of color unevenness can be suppressed.

次に、この照明装置1のサンプルNo.1〜5について実施した色むら低減効果の実験データを示す。なお。この実験では、発光波長が545mmの黄色蛍光体、拡散剤として日本アエロジル製のAlC、封止樹脂10として東レダウシリコーン製のJCR6140をそれぞれ使用した。 Next, the sample No. The experimental data of the uneven color reduction effect implemented about 1-5 are shown. Note that. In this experiment, a yellow phosphor having an emission wavelength of 545 mm, Al 2 O 3 C made by Nippon Aerosil as a diffusing agent, and JCR6140 made by Toray Dow Silicone as a sealing resin 10 were used.

(実験方法) (experimental method)

サンプルNo.1 …… 蛍光体のみ Sample No. 1 …… Phosphor only

蛍光体層 Phosphor layer

シリコーンゴム(JCR6140) …… 89mass% Silicone rubber (JCR6140) …… 89 mass%

黄色蛍光体 …… 10mass% Yellow phosphor: 10 mass%

赤色蛍光体 …… 1mass% Red phosphor: 1 mass%

サンプルNo.2 …… 拡散層(5mass%)+蛍光体(2層構造) Sample No. 2 ... Diffusion layer (5 mass%) + phosphor (two-layer structure)

拡散層 Diffusion layer

シリコーンゴム(JCR6140) …… 95mass% Silicone rubber (JCR6140) ...... 95 mass%

拡散剤(Al) …… 5mass% Diffusing agent (Al 2 O 3 ) 5 mass%

蛍光体層 Phosphor layer

シリコーンゴム(JCR6140) …… 78mass% Silicone rubber (JCR6140) ...... 78mass%

黄色蛍光体 …… 20mass% Yellow phosphor: 20 mass%

赤色蛍光体 …… 2mass% Red phosphor ... 2 mass%

サンプルNo.3 …… 拡散層(10mass%)+蛍光体(2層構造) Sample No. 3 …… Diffusion layer (10 mass%) + phosphor (two-layer structure)

拡散層 Diffusion layer

シリコーンゴム(JCR6140) …… 90mass% Silicone rubber (JCR6140) …… 90 mass%

拡散剤(Al) …… 10mass% Diffusing agent (Al 2 O 3 ) 10 mass%

蛍光体層 Phosphor layer

シリコーンゴム(JCR6140) …… 78mass% Silicone rubber (JCR6140) ...... 78mass%

黄色蛍光体 …… 20mass% Yellow phosphor: 20 mass%

赤色蛍光体 …… 2mass% Red phosphor ... 2 mass%

サンプルNo.4 …… 拡散層(15mass%)+蛍光体(2層構造) Sample No. 4 ... Diffusion layer (15 mass%) + phosphor (two-layer structure)

拡散層 Diffusion layer

シリコーンゴム(JCR6140) …… 85mass% Silicone rubber (JCR6140) ...... 85mass%

拡散剤(Al) …… 15mass% Diffusing agent (Al 2 O 3 ) 15 mass%

蛍光体層 Phosphor layer

シリコーンゴム(JCR6140) …… 78mass% Silicone rubber (JCR6140) ...... 78mass%

黄色蛍光体 …… 20mass% Yellow phosphor: 20 mass%

赤色蛍光体 …… 2mass% Red phosphor ... 2 mass%

サンプルNo.5 …… 拡散剤混合蛍光体 Sample No. 5 ...... Diffusing agent mixed phosphor

シリコーンゴム(JCR6140) …… 80mass% Silicone rubber (JCR6140) ...... 80mass%

拡散剤(Al) …… 20mass% Diffusing agent (Al 2 O 3 ) 20 mass%

シリコーンゴム(JCR6140) …… 78mass% Silicone rubber (JCR6140) ...... 78mass%

黄色蛍光体 …… 20mass%赤色蛍光体 Yellow phosphor: 20 mass% red phosphor

赤色蛍光体 …… 2mass% Red phosphor ... 2 mass%

(実験結果) (Experimental result)

1.サンプルNo.1のように拡散層11を削除して、蛍光体層12のみを有する1層構造の場合と、サンプルNo.5のように同じく拡散層11を削除して蛍光体層12に拡散剤を添加した1層構造の場合、凹部開口8aから外部に放射される白色光は、その周縁部に黄色光が分布し、色むらの低減効果は得られなかった。   1. Sample No. In the case of a one-layer structure in which the diffusion layer 11 is deleted as shown in FIG. Similarly, in the case of a single layer structure in which the diffusion layer 11 is deleted and a diffusing agent is added to the phosphor layer 12 as in 5, the white light radiated to the outside from the recess opening 8a is distributed in the peripheral portion of the yellow light. The effect of reducing color unevenness was not obtained.

2.サンプルNo.3,No.4のように拡散剤の添加量が10質量%(mass%)、または15質量%の各拡散層11と、蛍光体層12の2層構造の場合は、拡散剤の添加量が多いために、これら拡散層11の粘度が高くなり、拡散層11の塗りむらが発生する。このために、凹部開口8aから外部へ放射される白色光は、その周縁部に黄色光が分布し、色むらの低減効果は得られなかった。   2. Sample No. 3, No. In the case of the two-layer structure of each of the diffusion layers 11 and the phosphor layer 12 in which the addition amount of the diffusion agent is 10% by mass (mass%) or 15% by mass as in 4, the addition amount of the diffusion agent is large. The viscosity of the diffusion layer 11 increases, and uneven coating of the diffusion layer 11 occurs. For this reason, the white light radiated to the outside from the recess opening 8a has yellow light distributed around the periphery thereof, and the effect of reducing the color unevenness cannot be obtained.

3.サンプルNo.2のように拡散剤の添加量が5質量%の拡散層11と、蛍光体の添加量が20質量%の蛍光体層12の2層構造の場合、凹部開口8aから外部へ放射される白色光の周縁部には黄色光の分布が殆ど見られず、白色光の色むら低減効果が得られた。   3. Sample No. In the case of the two-layer structure of the diffusion layer 11 in which the addition amount of the diffusing agent is 5% by mass and the phosphor layer 12 in which the addition amount of the phosphor is 20% by mass as shown in FIG. Almost no yellow light distribution was observed at the peripheral edge of the light, and the effect of reducing the color unevenness of the white light was obtained.

なお、拡散層11の拡散剤の添加率を5質量%よりも多くすると、青色発光LEDチップ6等の発光がNi製等の基板2に吸収される光量が増加するので、凹部開口8aから外部に放射される白色光の光束が低下する。   If the addition ratio of the diffusing agent in the diffusion layer 11 is more than 5% by mass, the amount of light emitted from the blue light emitting LED chip 6 and the like is absorbed by the substrate 2 made of Ni or the like. The luminous flux of white light radiated on the screen is reduced.

そこで、この基板2の受光面に、白色塗料等の反射材を塗布して反射面に形成することにより、光束低下を防止または抑制するように構成してもよい。   In view of this, the light receiving surface of the substrate 2 may be coated with a reflective material such as a white paint to form the reflective surface, thereby preventing or suppressing a decrease in luminous flux.

本発明に係る実施形態に係るLED照明装置の平面図。The top view of the LED lighting apparatus which concerns on embodiment which concerns on this invention. 同じく、図1のII−II線断面図。Similarly, the II-II sectional view taken on the line of FIG. 同じく、図2のIII部拡大図。Similarly, the III part enlarged view of FIG. 同じく、鉛直配光角における相関色温度を示す図。Similarly, the figure which shows the correlation color temperature in the vertical light distribution angle.

符号の説明Explanation of symbols

2 基板、4 絶縁体、5a,5b 回路パターン、6 発光素子、9 反射体、11 拡散層、12 蛍光体層。   2 substrate, 4 insulator, 5a, 5b circuit pattern, 6 light emitting element, 9 reflector, 11 diffusion layer, 12 phosphor layer.

Claims (2)

基板と、基板に配設された絶縁体と、絶縁体を介して前記基板に配設された回路パターンと、回路パターンを介してマトリクス状に配置される複数の発光素子と、前記基板に配設され、前記複数の発光素子から放射される光を反射する反射体と、発光素子を被覆する拡散剤含む拡散層と、拡散層の上側に配設された蛍光体を含む蛍光体層と、前記各発光素子から入射した光を出射する出射面を有する制光体とを具備する照明装置において、
相関色温度5000K以上では、鉛直配光角が大きくなるにつれて色温度が低くなり、鉛直配光角0°ないし60°において、相関色温度が0〜−200K以内になり、相関色温度5000K未満では、鉛直配光角が大きくなるにつれて色温度が高くなり、鉛直配光角0°ないし60°において、相関色温度が0〜+200K以内になるように構成されていることを特徴とする照明装置。
A substrate, an insulator disposed on the substrate, a circuit pattern disposed on the substrate via the insulator, a plurality of light emitting elements disposed in a matrix via the circuit pattern, and the substrate. A reflector that reflects light emitted from the plurality of light emitting elements, a diffusion layer that includes a diffusing agent that covers the light emitting elements, and a phosphor layer that includes a phosphor disposed above the diffusion layer; In a lighting device comprising a light control body having an exit surface that emits light incident from each of the light emitting elements,
At a correlated color temperature of 5000 K or higher, the color temperature decreases as the vertical light distribution angle increases. At a vertical light distribution angle of 0 ° to 60 °, the correlated color temperature is within 0 to −200 K, and below the correlated color temperature of 5000 K. The illumination device is configured such that the color temperature increases as the vertical light distribution angle increases, and the correlated color temperature is within 0 to +200 K at a vertical light distribution angle of 0 ° to 60 °.
拡散層は、樹脂に拡散剤を3ないし5質量%添加してなることを特徴とする請求項1記載の照明装置。   The lighting device according to claim 1, wherein the diffusion layer is formed by adding 3 to 5 mass% of a diffusing agent to the resin.
JP2005055311A 2005-03-01 2005-03-01 Light fixture Pending JP2006245080A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008211174A (en) * 2006-12-15 2008-09-11 Avago Technologies Ecbu Ip (Singapore) Pte Ltd Led light source provided with flexible reflector
JP2011249852A (en) * 2011-09-02 2011-12-08 Mitsubishi Rayon Co Ltd Light source device
WO2014136677A1 (en) * 2013-03-04 2014-09-12 信越化学工業株式会社 Turn signal for vehicle
JP2016146356A (en) * 2013-03-04 2016-08-12 信越化学工業株式会社 Direction indicator for vehicle

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008211174A (en) * 2006-12-15 2008-09-11 Avago Technologies Ecbu Ip (Singapore) Pte Ltd Led light source provided with flexible reflector
JP2011249852A (en) * 2011-09-02 2011-12-08 Mitsubishi Rayon Co Ltd Light source device
WO2014136677A1 (en) * 2013-03-04 2014-09-12 信越化学工業株式会社 Turn signal for vehicle
JP2014197527A (en) * 2013-03-04 2014-10-16 信越化学工業株式会社 Vehicle direction indicator
JP2016146356A (en) * 2013-03-04 2016-08-12 信越化学工業株式会社 Direction indicator for vehicle
US10288260B2 (en) 2013-03-04 2019-05-14 Shin-Etsu Chemical Co., Ltd. Turn signal for vehicle

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