CN114566570B - LED lamp bead manufacturing method, LED lamp bead, display module manufacturing method and display module - Google Patents
LED lamp bead manufacturing method, LED lamp bead, display module manufacturing method and display module Download PDFInfo
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- CN114566570B CN114566570B CN202210183702.2A CN202210183702A CN114566570B CN 114566570 B CN114566570 B CN 114566570B CN 202210183702 A CN202210183702 A CN 202210183702A CN 114566570 B CN114566570 B CN 114566570B
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- 239000011324 bead Substances 0.000 title claims abstract description 70
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 238000000034 method Methods 0.000 claims abstract description 33
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 59
- 238000002844 melting Methods 0.000 claims description 19
- 230000008018 melting Effects 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000643 oven drying Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The invention discloses a method for manufacturing LED lamp beads, which is characterized in that a first LED chip and a second LED chip with different structures are arranged on the same substrate, so that the LED lamp beads with different structures can be manufactured on the same substrate; before the first LED chip is arranged on the substrate, the shielding layer covers the bonding pad which is not used for being electrically connected with the first LED chip on the substrate, the shielding layer is utilized to protect the bonding pad which is not used temporarily, the phenomenon that the bonding pad which is not used temporarily is influenced when the sputtered tin paste or bonding wires are melted when the first LED chip is electrically connected with other bonding pads on the substrate can be avoided, after the electrical connection of the first LED chip is completed, the shielding layer on the bonding pad which is not used temporarily is removed, then the second LED chip is arranged on the substrate and is electrically connected with the bonding pad which is not used temporarily, and the phenomenon that the subsequent arrangement of the second LED chip is influenced in the process of arranging the first LED chip in the prior art is avoided. In addition, the invention also discloses a manufacturing method of the LED lamp bead and the display module.
Description
Technical Field
The invention relates to the technical field of display, in particular to a manufacturing method of an LED lamp bead, the LED lamp bead, a manufacturing method of a display module and the display module.
Background
When LED chips with different structures, such as flip chip and normal chip, flip chip and vertical chip, are mounted on the same substrate, it is generally necessary to electrically connect the electrode of one LED chip (such as flip chip) with a part of the bonding pads on the substrate, and then electrically connect the electrode of another LED chip (such as normal chip) with the unused bonding pads on the substrate. However, when the LED chip is electrically connected to a part of the pads on the substrate by solder paste, wire bonding, or the like, unused pads on the substrate may be affected, for example, solder paste is sputtered onto the unused pads.
Disclosure of Invention
The invention aims to provide a method for manufacturing an LED lamp bead, which is characterized in that LED chips with different structures are fixed on the same substrate in sequence and can avoid the influence on the subsequent installation of other LED chips in the process of installing the LED chips in advance. In addition, the LED lamp bead, the display module manufacturing method and the display module are further provided.
In order to achieve the purpose, the invention provides a method for manufacturing an LED lamp bead, which comprises the following steps:
providing a first substrate, a first LED chip and a second LED chip, wherein a first positive electrode bonding pad, a first negative electrode bonding pad, a second positive electrode bonding pad and a second negative electrode bonding pad are arranged on one surface of the first substrate, the first LED chip is one of a flip chip, a normal chip and a vertical structure chip, and the second LED chip is one of the flip chip, the normal chip and the vertical structure chip different from the first LED chip;
covering shielding layers covering the second positive electrode bonding pad and the second negative electrode bonding pad on the second positive electrode bonding pad and the second negative electrode bonding pad, then placing the first LED chip on the first substrate, and enabling a positive electrode and a negative electrode of the first LED chip to be respectively and correspondingly electrically connected with the first positive electrode bonding pad and the first negative electrode bonding pad;
removing the shielding layer, then placing the second LED chip on the first substrate, and enabling the positive electrode and the negative electrode of the second LED chip to be respectively and correspondingly electrically connected with the second positive electrode bonding pad and the second negative electrode bonding pad;
and cutting the first substrate to obtain the LED lamp bead comprising at least one LED chip.
Compared with the prior art, the method for manufacturing the LED lamp bead provided by the invention has the advantages that the first LED chip and the second LED chip which are different in structure are arranged on the same substrate, so that the LED lamp beads with different structures can be manufactured on the same substrate; before the first LED chip is arranged on the first substrate, the shielding layer is covered on the bonding pad which is not used for being electrically connected with the first LED chip on the first substrate, the shielding layer is used for protecting the bonding pad which is not used temporarily, so that the phenomenon that the bonding pad which is not used temporarily is influenced when the sputtered tin paste or bonding wires are melted when the first LED chip is electrically connected with other bonding pads on the first substrate can be avoided, after the electric connection of the first LED chip is completed, the shielding layer on the bonding pad which is not used temporarily is removed, then the second LED chip is arranged on the first substrate and is electrically connected with the bonding pad which is not used temporarily, the phenomenon that the subsequent arrangement of the second LED chip is influenced in the process of arranging the first LED chip previously is avoided, and the quality of the manufactured LED lamp bead is ensured.
In some embodiments, the masking layer is a water-based ink layer.
In some embodiments, the covering and covering the second positive electrode pad and the second negative electrode pad on the second positive electrode pad and the second negative electrode pad includes: printing water-based ink on the second positive electrode bonding pad and the second negative electrode bonding pad to form a shielding layer covering the second positive electrode bonding pad and the second negative electrode bonding pad; curing the shielding layer; the removing the shielding layer comprises: and washing away the shielding layer by water.
In some embodiments, a part of the first positive bonding pad and a part of the second positive bonding pad are connected together to form a common bonding pad, and the shielding layer covering the second positive bonding pad and the second negative bonding pad is: covering a shielding layer covering a local area of the common bonding pad, wherein the local area is used as the second anode bonding pad.
In some embodiments, a part of the first negative pad and a part of the second negative pad are connected together to form a common pad, and the shielding layer covering the second positive pad and the second negative pad on the second positive pad and the second negative pad is: covering a shielding layer covering a local area of the common bonding pad, wherein the local area is used as the second cathode bonding pad.
In some embodiments, the first LED chip is a flip chip and the second LED chip is a face-up chip or a vertical structure chip.
In some embodiments, the first LED chip is a blue chip and/or a green chip, and the second LED chip is a red chip.
In some embodiments, the disposing the first LED chip on the first substrate and electrically connecting the positive electrode and the negative electrode of the first LED chip to the first positive pad and the first negative pad respectively includes: covering the first positive electrode bonding pad and the first negative electrode bonding pad with first solder paste; and melting the first solder paste to weld and fix the positive electrode and the negative electrode of the first LED chip with the first positive electrode bonding pad and the first negative electrode bonding pad respectively.
In order to achieve the purpose, the invention provides the LED lamp bead which is manufactured by the manufacturing method of the LED lamp bead.
To achieve the above object, the present invention provides a method for manufacturing a display module, comprising:
the LED lamp bead is manufactured by the LED lamp bead manufacturing method;
the LED lamp beads and a driving element for driving the LED lamp beads are arranged on the second substrate, and the second substrate is provided with a driving circuit electrically connected with the driving element and the LED lamp beads.
In some embodiments, the disposing the LED lamp bead and the driving element for driving the LED lamp bead on the second substrate includes: covering a second solder paste on the second substrate, and then melting the second solder paste to electrically connect one of the driving element and the LED lamp bead with the driving circuit on the second substrate; and then, covering a third solder paste on the second substrate, and then melting the third solder paste to electrically connect the other one of the driving element and the LED lamp bead with the driving circuit on the second substrate.
In some embodiments, the disposing the first LED chip on the first substrate and electrically connecting the positive electrode and the negative electrode of the first LED chip to the first positive pad and the first negative pad respectively includes: covering a first solder paste on the first positive electrode bonding pad and the first negative electrode bonding pad; melting the first solder paste to respectively and correspondingly weld and fix the positive electrode and the negative electrode of the first LED chip with the first positive electrode bonding pad and the first negative electrode bonding pad; the melting point of the second solder paste is lower than that of the first solder paste, and the melting point of the third solder paste is lower than that of the second solder paste.
In order to achieve the above object, the present invention further provides a display module, which is manufactured by the above manufacturing method of the display module.
Drawings
Fig. 1 to 2 are schematic views illustrating a manufacturing process of a display module according to an embodiment of the invention;
fig. 3 is a three-dimensional structure diagram of an LED lamp bead according to an embodiment of the present invention;
fig. 4 is a structural diagram of the LED lamp bead shown in fig. 3 after the encapsulation layer is hidden;
fig. 5 is another angle of the structure shown in fig. 4.
Detailed Description
In order to explain the contents, structural features, objects and effects of the present invention in detail, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be understood that the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, and thus, should not be construed as limiting the scope of the present invention.
The technical scheme of the embodiment of the invention is explained in detail below with reference to the attached drawings:
referring to fig. 1 to 2, a method for manufacturing a display module according to an embodiment of the present invention includes a step of manufacturing a lamp bead, a step of installing a driving device, and a step of installing the lamp bead, where the step of manufacturing the lamp bead includes the following steps S11 to S19, the step of installing the driving device includes the following steps S21 to S23, and the step of installing the lamp bead includes the following steps S31 to S32, that is, the method for manufacturing the display module includes the following steps S11 to S19, S21 to S23, and S31 to S32.
The manufacturing steps of the lamp beads are as follows:
s11, providing a first substrate 1, a first LED chip 2 and a second LED chip 3.
The first substrate 1 has a first surface and a second surface opposite to each other, the first surface of the first substrate 1 is provided with a first positive electrode pad 11, a first negative electrode pad 12, a second positive electrode pad 13 and a second negative electrode pad 14, the second surface of the first substrate 1 is provided with a third positive electrode pad 15, a third negative electrode pad 16, a fourth positive electrode pad 17 and a fourth negative electrode pad 18, the first substrate 1 has a plurality of metalized vias 19 penetrating through the first surface and the second surface thereof, the first positive electrode pad 11 is electrically connected to the third positive electrode pad 15 through the metalized vias 19, the first negative electrode pad 12 is electrically connected to the third negative electrode pad 16 through the metalized vias 19, the second positive electrode pad 13 is electrically connected to the fourth positive electrode pad 17 through the metalized vias 19, and the second negative electrode pad 14 is electrically connected to the fourth negative electrode pad 18 through the metalized vias 19, as shown in fig. 1 (a). The first substrate 1 may be a BT board, or may be another board material on which a wiring can be arranged.
The first LED chip 2 is a flip chip, and the second LED chip 3 is a vertical structure chip. The first LED chip 2 and the second LED chip 3 each have a positive electrode and a negative electrode.
S12, covering the shielding layer 4 covering the second positive electrode pad 13 and the second negative electrode pad 14 on the second positive electrode pad 13 and the second negative electrode pad 14, as shown in fig. 1 (b).
The shielding layer 4 may be a water-soluble material layer, such as a water-based ink layer. In the embodiment that the shielding layer 4 is the water-based ink layer, the water-based ink may be printed on the second positive electrode pad 13 and the second negative electrode pad 14 by using a screen printing process, so as to form the shielding layer 4 covering the second positive electrode pad 13 and the second negative electrode pad 14, and then the shielding layer 4 is cured by oven drying or the like. When the subsequent removal is needed, the shielding layer 4 can be washed away by water washing, and the first substrate 1 or elements on the first substrate 1 cannot be damaged.
Of course, the shielding layer 4 may be a water-insoluble material layer coated on the second positive electrode pad 13 and the second negative electrode pad 14 by spraying or the like.
S13, covering the first positive electrode bonding pad 11 and the first negative electrode bonding pad 12 with first solder paste; then, the first LED chip 2 is placed on the first substrate 1, the positive electrode and the negative electrode of the first LED chip 2 are aligned to the first positive electrode pad 11 and the first negative electrode pad 12, respectively, then the first solder paste is melted, the positive electrode of the first LED chip 2 is welded and fixed to the first positive electrode pad 11, the negative electrode of the first LED chip 2 is welded and fixed to the first negative electrode pad 12, and the positive electrode and the negative electrode of the first LED chip 2 are electrically connected to the first positive electrode pad 11 and the first negative electrode pad 12, respectively, correspondingly, as shown in (c) of fig. 1.
Specifically, the first positive electrode pad 11 and the first negative electrode pad 12 may be covered with a first solder paste by a screen printing process or the like. The steel mesh used in the screen printing process can be an electroforming steel mesh, a nano steel mesh or the like.
Specifically, the first solder paste may be melted by laser, and in this case, the first solder paste should be a solder paste suitable for laser welding. Of course, the first solder paste may be melted by heating the first solder paste in other ways.
And S14, testing the welding reliability of the first LED chip 2, the first positive electrode bonding pad 11 and the first negative electrode bonding pad 12.
S15, the shielding layer 4 is removed, as shown in fig. 1 (d).
S16, dispensing silver paste on the first substrate 1, placing the second LED chip 3 on the first substrate 1, bonding the negative electrode of the second LED chip 3 and the second negative electrode pad 14 through the silver paste, then curing the silver paste, and fixing the negative electrode of the second LED chip 3 on the first substrate 1 and electrically connecting the negative electrode of the second LED chip 3 and the second negative electrode pad 14 through the silver paste; then, the positive electrode of the second LED chip 3 is electrically connected to the second positive electrode pad 13 by a bonding wire, as shown in fig. 1 (e).
S17, detecting the diffusion area of the silver colloid, and confirming that the silver colloid has no risk of short circuit with other elements or circuits; and, testing whether the bonding wire between the positive electrode of the second LED chip 3 and the second positive electrode pad 13 is firm.
S18, cutting the first substrate 1 along the gap between the LED chips 2 and 3 to obtain the LED lamp bead.
The LED lamp bead obtained after cutting can only comprise one LED chip or a plurality of LED chips.
And S19, under the set current and voltage conditions, lighting each LED lamp bead, and classifying according to the wavelength, brightness and the like of each LED lamp bead.
In the above embodiment, the first LED chip 2 is first mounted as a flip chip, and then the second LED chip 3 is mounted as a vertical chip, but in other embodiments, the second LED chip 3 is first mounted as a vertical chip, and then the first LED chip 2 is mounted as a flip chip.
Since the first LED chip 2 is a flip chip and the second LED chip 3 is a vertical chip in the above embodiment, the positive electrode and the negative electrode of the first LED chip 2 are aligned with the first positive electrode pad 11 and the first negative electrode pad 12, respectively, and then the solder paste is melted to electrically connect them, and for the second LED chip 3, the negative electrode and the positive electrode thereof are electrically connected with the second negative electrode pad 14 and the second positive electrode pad 13, respectively, by means of the silver paste and the bonding wires. It is understood that in the embodiment where the first LED chip 2 is a vertical structure chip and the second LED chip 3 is a flip chip, the other way around is to electrically connect the negative electrode and the positive electrode of the first LED chip 2 to the first negative electrode pad 12 and the first positive electrode pad 11 by means of silver paste and bonding wires, and to electrically connect the positive electrode and the negative electrode of the second LED chip 3 to the second positive electrode pad 13 and the second negative electrode pad 14 by means of molten solder paste. In some embodiments, it is also possible that the first LED chip 2 is a flip chip, and the second LED chip 3 is a front chip, in this case, in step S16, the positive electrode and the negative electrode of the second LED chip 3 are electrically connected to the second positive electrode pad 13 and the second negative electrode pad 14 by wire bonding respectively. In some embodiments, the first LED chip 2 may also be a front-mounted chip, and the second LED chip 3 may also be a flip chip, which is not described herein again.
In some embodiments, one, two, or all of the steps S14, S17, and S19 may be omitted, and some steps may be added, for example, before step S18, the light-emitting sides of the first LED chip 2 and the second LED chip 3 are covered with the encapsulation layer 8 (as shown in fig. 3), and before step S11, the first substrate 1 is cleaned, for example.
In some embodiments, the first LED chip 2 is a blue chip and a green chip, and the second LED chip 3 is a red chip, that is, three LED beads with different light colors can be manufactured on the same first substrate 1. It is understood that in these embodiments, in step S13, the positive electrode of the blue chip and the positive electrode of the green chip are respectively welded and fixed to the different first positive electrode pads 11, and the negative electrode of the blue chip and the negative electrode of the green chip are respectively welded and fixed to the different first negative electrode pads 12, so that for the convenience of understanding, the blue chip and the green chip are respectively labeled as 2a and 2b in (d) of fig. 1.
In some embodiments where the first LED chip 2 is a blue chip and a green chip, and the second LED chip 3 is a red chip, a blue chip, a green chip, and a red chip form a pixel unit, each pixel unit corresponds to two first positive pads 11, two first negative pads 12, a second positive pad 13, and a second negative pad 14, the two first positive pads 11 and the second positive pad 13 are connected together to form a common pad 101 (as shown in fig. 4), and similarly, two third positive pads 15 and a fourth positive pad 17 form a common pad 102 (as shown in fig. 5), and the common pad 101 is electrically connected to the common pad 102. That is, the two first positive electrode pads 11 and the second positive electrode pad 13 are each a partial region of the common pad 101. In these embodiments, in step S12, the shielding layer 4 is covered only in the region of the common pad 101 that serves as the second positive electrode pad 13, and the region of the common pad 101 that serves as the first positive electrode pad 11 is not covered by the shielding layer 4.
The LED lamp bead manufactured according to an embodiment is shown in fig. 3 to 5, and includes a first substrate 1, a blue light chip 2a, a green light chip 2b, and a red light chip 3, positive electrodes of the blue light chip 2a, the green light chip 2b, and the red light chip 3 are electrically connected to a common pad 101, negative electrodes of the blue light chip 2a, the green light chip 2b, and the red light chip 3 are electrically connected to a first negative electrode pad 12a, a first negative electrode pad 12b, and a second negative electrode pad 14, the common pad 101 is electrically connected to the common pad 102, the first negative electrode pad 12a is electrically connected to a third negative electrode pad 16a, the first negative electrode pad 12b is electrically connected to the third negative electrode pad 16b, and the second negative electrode pad 14 is electrically connected to a fourth negative electrode pad 18.
In the above embodiments, the common positive electrode is used, and it is understood that in some embodiments, the common negative electrode may also be used, for example, two first negative electrode pads 12 and a second negative electrode pad 14 are connected together to form a common pad. In these common negative electrode embodiments, the shielding layer 4 is covered only in the region of the common pad serving as the second negative electrode pad 14, and the region of the common pad serving as the first negative electrode pad 12 is not covered by the shielding layer 4.
A driving element installing step:
s21, providing the second substrate 6 and the driving device 7.
The second substrate 6 has a first surface and a second surface opposite to each other, and the first surface and the second surface are both provided with a plurality of pads 61, 62, as shown in fig. 2 (a), and the second substrate 6 is disposed with a driving circuit (not shown). The second substrate 6 may be an FR4 board, or may be another board material on which a circuit can be arranged. The driving element 7 may be a driving chip or the like.
S22, covering a second solder paste on the bonding pad on the first surface of the second substrate 6; then, the driving element 7 is placed on the first surface, and the second solder paste is melted to solder-fix the electrodes of the driving element 7 to the corresponding pads on the first surface, as shown in fig. 2 (b), thereby electrically connecting the driving element 7 to the driving lines on the second substrate 6.
Specifically, the second solder paste may be coated on the pads on the first surface of the second substrate 6 by a screen printing process or the like. The steel mesh used in the screen printing process may be a stepped steel mesh or the like.
Specifically, the second solder paste may be melted by a reflow process.
And S23, testing the welding reliability of the driving element 7 and the bonding pad on the second substrate 6.
It is understood that in some embodiments, the step S23 may be omitted, and some steps may be added, for example, the second substrate 6 may be cleaned before the step S21.
Installing the lamp beads:
s31, covering a third solder paste on the bonding pad on the second surface of the second substrate 6; then, the LED lamp beads 5 are placed on the second surface, and the third solder paste is melted to solder and fix the electrodes of the LED lamp beads 5 to the corresponding pads on the second surface, as shown in fig. 2 (c), so as to electrically connect the LED lamp beads 5 to the driving circuit on the second substrate 6.
Specifically, the third solder paste may be coated on the pads on the second surface of the second substrate 6 by a screen printing process or the like. The steel mesh used in the screen printing process may be a stepped steel mesh or the like.
Specifically, the third solder paste may be melted by a reflow process.
S32, testing the welding reliability of the LED lamp beads 5 and the welding pad on the second substrate 6.
It is understood that in some embodiments, the step S32 may be omitted, and some steps may be added, for example, the second substrate 6 may be cleaned before the step S31.
It is understood that in some embodiments, steps S31-S32 may be performed after steps S21-S23 are performed in sequence. In some embodiments, after step S21 is performed, steps S31 to S32 are performed first, and then steps S22 to S23 are performed, that is, after the LED lamp bead 5 is mounted on the second substrate 6, the driving element 7 is mounted on the second substrate 6.
In some embodiments, the second solder paste has a melting point lower than the first solder paste, and the third solder paste has a melting point lower than the second solder paste. Because the melting point of the solder paste used for the three times is reduced in sequence, the device which is welded well can be prevented from being influenced and the yield is prevented from being reduced when the solder paste is melted in the following process.
In some embodiments, the melting point of the first solder paste is 380-420 degrees, the melting point of the second solder paste is 202-232 degrees, and the melting point of the third solder paste is about 175-195 degrees.
In some embodiments, the first, second and third solder pastes are ultra-fine particle powders, the first solder paste is No. 7 powder with a diameter of 2um-12um, the second solder paste is No. 5 powder with a diameter of 15um-25um, and the third solder paste is No. 6 powder with a diameter of 5um-15um.
In summary, according to the LED lamp bead manufacturing method provided by the invention, the first LED chip 2 and the second LED chip 3 with different structures are mounted on the same substrate 1, so that the LED lamp beads with different structures can be manufactured on the same substrate; before the first LED chip 2 is mounted on the first substrate 1, the shielding layer 4 is firstly covered on the pad of the first substrate 1 that is not used for electrically connecting with the first LED chip 2, the shielding layer 4 is used to protect the pad that is not used temporarily, so that the influence on the pad that is not used temporarily when the sputtered solder paste or bonding wire is melted when the first LED chip 2 is electrically connected with other pads on the first substrate 1 can be avoided, after the electrical connection of the first LED chip 2 is completed, the shielding layer 4 on the pad that is not used temporarily is removed, and then the second LED chip 3 is placed on the first substrate 1 and electrically connected with the pad that is not used temporarily, thereby avoiding the influence on the subsequent mounting of the second LED chip 3 in the process of mounting the first LED chip 2 in advance, and ensuring the quality of the manufactured LED lamp bead. Furthermore, the melting point of the solder paste used in the three previous and subsequent processes is lowered in order when manufacturing the display module, so that it is possible to prevent the solder paste from being melted in the subsequent process and affecting the previously soldered device.
The above disclosure is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, so that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims (13)
1. The manufacturing method of the LED lamp bead is characterized by comprising the following steps:
providing a first substrate, a first LED chip and a second LED chip, wherein a first positive electrode bonding pad, a first negative electrode bonding pad, a second positive electrode bonding pad and a second negative electrode bonding pad are arranged on one surface of the first substrate, the first LED chip is one of a flip chip, a normal chip and a vertical structure chip, and the second LED chip is one of the flip chip, the normal chip and the vertical structure chip different from the first LED chip;
covering shielding layers covering the second positive electrode bonding pad and the second negative electrode bonding pad on the second positive electrode bonding pad and the second negative electrode bonding pad, then placing the first LED chip on the first substrate, and enabling a positive electrode and a negative electrode of the first LED chip to be respectively and correspondingly electrically connected with the first positive electrode bonding pad and the first negative electrode bonding pad;
removing the shielding layer, then placing the second LED chip on the first substrate, and enabling a positive electrode and a negative electrode of the second LED chip to be respectively and correspondingly electrically connected with the second positive electrode bonding pad and the second negative electrode bonding pad;
and cutting the first substrate to obtain the LED lamp bead comprising at least one LED chip.
2. The method for manufacturing an LED lamp bead according to claim 1, wherein the shielding layer is a water-based ink layer.
3. The method for manufacturing the LED lamp bead according to claim 2, wherein the step of covering the second anode pad and the second cathode pad with the shielding layer comprises the steps of:
printing water-based ink on the second anode bonding pad and the second cathode bonding pad to form a shielding layer covering the second anode bonding pad and the second cathode bonding pad;
curing the shielding layer;
the removing the shielding layer comprises: and washing away the shielding layer by water.
4. The method for manufacturing an LED lamp bead according to claim 1, wherein a portion of the first positive electrode bonding pad and a portion of the second positive electrode bonding pad are connected together to form a common bonding pad,
the shielding layer covering the second anode pad and the second cathode pad is characterized in that: covering a shielding layer covering a local area of the common bonding pad, wherein the local area is used as the second anode bonding pad.
5. The method for manufacturing LED lamp beads according to claim 1, wherein a part of the first negative electrode bonding pad and a part of the second negative electrode bonding pad are connected together to form a common bonding pad,
the shielding layer covering the second anode pad and the second cathode pad is characterized in that: covering a shielding layer covering a local area of the common bonding pad, wherein the local area is used as the second cathode bonding pad.
6. The method for manufacturing an LED lamp bead according to any one of claims 1 to 5, wherein the first LED chip is a flip chip, and the second LED chip is a front-mounted chip or a vertical structure chip.
7. The method for manufacturing an LED lamp bead according to claim 6, wherein the first LED chip is a blue chip and/or a green chip, and the second LED chip is a red chip.
8. The method for manufacturing an LED lamp bead according to claim 6, wherein the step of placing the first LED chip on the first substrate and electrically connecting the positive electrode and the negative electrode of the first LED chip to the first positive bonding pad and the first negative bonding pad respectively comprises:
covering a first solder paste on the first positive electrode bonding pad and the first negative electrode bonding pad;
and melting the first solder paste to weld and fix the positive electrode and the negative electrode of the first LED chip with the first positive electrode bonding pad and the first negative electrode bonding pad respectively.
9. An LED lamp bead, characterized in that the LED lamp bead is manufactured by the method for manufacturing the LED lamp bead according to any one of claims 1-8.
10. A method of manufacturing a display module, comprising:
manufacturing the LED lamp bead by using the LED lamp bead manufacturing method according to any one of claims 1 to 7;
the LED lamp beads and the driving elements used for driving the LED lamp beads are arranged on the second substrate, and the second substrate is provided with driving circuits electrically connected with the driving elements and the LED lamp beads.
11. The method for manufacturing a display module according to claim 10, wherein the disposing the LED lamp bead and the driving element for driving the LED lamp bead on the second substrate comprises:
covering a second solder paste on the second substrate, and then melting the second solder paste to electrically connect one of the driving element and the LED lamp bead with the driving circuit on the second substrate; then, the user can use the device to perform the operation,
and covering a third tin paste on the second substrate, and then melting the third tin paste to electrically connect the other one of the driving element and the LED lamp bead with the driving circuit on the second substrate.
12. The method for manufacturing a display module according to claim 11, wherein the step of placing the first LED chip on the first substrate and electrically connecting the positive electrode and the negative electrode of the first LED chip to the first positive electrode pad and the first negative electrode pad respectively comprises:
covering a first solder paste on the first positive electrode bonding pad and the first negative electrode bonding pad;
melting the first solder paste to respectively and correspondingly weld and fix the positive electrode and the negative electrode of the first LED chip with the first positive electrode bonding pad and the first negative electrode bonding pad;
the melting point of the second solder paste is lower than that of the first solder paste, and the melting point of the third solder paste is lower than that of the second solder paste.
13. A display module, characterized in that it is manufactured using a display module manufacturing method according to any one of claims 10-12.
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