CN105118914A - White-oil ceramic substrate and oiling gluing method therefor - Google Patents
White-oil ceramic substrate and oiling gluing method therefor Download PDFInfo
- Publication number
- CN105118914A CN105118914A CN201510291478.9A CN201510291478A CN105118914A CN 105118914 A CN105118914 A CN 105118914A CN 201510291478 A CN201510291478 A CN 201510291478A CN 105118914 A CN105118914 A CN 105118914A
- Authority
- CN
- China
- Prior art keywords
- white oil
- ceramic substrate
- pad chip
- circuit
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 61
- 239000000758 substrate Substances 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims description 7
- 238000004026 adhesive bonding Methods 0.000 title abstract 2
- 239000011324 bead Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 57
- 239000013078 crystal Substances 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 3
- 239000010931 gold Substances 0.000 abstract 3
- 229910052737 gold Inorganic materials 0.000 abstract 3
- 230000021615 conjugation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention discloses a white-oil ceramic substrate, and the substrate comprises a ceramic substrate. The front surface of the substrate is provided with a circuit, a circuit positive electrode, a circuit negative electrode, and a gold way. The circuit is provided with a bonding pad chip negative electrode and a bonding pad chip positive electrode. A non-die-bonding region of the substrate is coated with at least one white-oil layer which covers the surfaces of the circuit and the gold way. The white-oil layer covers the bonding pad chip negative electrode, the bonding pad chip positive electrode and a die-bonding region between the bonding pad chip negative electrode and the bonding pad chip positive electrode. The non-die-bonding region of the substrate is coated with the thin white-oil layer which covers the surfaces of the circuit and the gold way, thereby improving the refractive index and the reflective rate, and effectively improving the brightness of a lamp bead after gluing.
Description
Technical field
The present invention relates to a kind of technical field of ceramic substrate, particularly relate to the white oil ceramic substrate that a kind of white oil layer scribbling thin layer on ceramic substrate covers the position, non-crystal bonding area such as circuit, surface, golden road.
Background technology
At present, the general all uniform spreadings in LED ceramic baseplate 1 surface of prior art have circuit 2, Jin Dao etc., then sealing after LED lamp bead die bond, as shown in Figure 1.Do not add because circuit, Jin Dao etc. are laid on ceramic base plate surface and prevent the technology such as luminous, refractive index and the reflecting rate of light during LED luminescence can be affected, and integrally can reduce the brightness of lamp pearl after sealing, affect illumination effect, decrease the brightness of light, be unfavorable for the lifting of LED lamp bead brightness.
Summary of the invention
The object of the invention is the shortcoming in order to overcome above-mentioned prior art, a kind of white oil ceramic substrate is provided, this white oil ceramic substrate brushes the white oil layer of thin layer in the non-crystal bonding area of ceramic substrate, be covered with the surface of circuit, Jin Dao, thus improve refractive index and reflecting rate, the brightness of lamp pearl effectively can be improved after sealing.
The technical solution adopted for the present invention to solve the technical problems is: a kind of white oil ceramic substrate, comprise ceramic substrate, the front of ceramic substrate is provided with circuit, circuit both positive and negative polarity, Jin Dao, circuit is provided with pad chip positive pole and pad chip negative pole, at least one deck white oil layer is scribbled in the non-crystal bonding area of ceramic substrate, white oil layer covers circuit, surface, golden road, and white oil layer does not cover pad chip positive pole and pad chip negative pole and the crystal bonding area between pad chip positive pole and pad chip negative pole.
Further, described white oil layer scribbles one deck, and thickness is 8-10 micron.This thickness is 8-10 micron is best effect, greatly can promote the brightness of lamp pearl, improve refractive index and reflecting rate.
Further, white oil layer scribbles four layers, and ground floor is surface conjunction agent, and increase conjugation and heat-sinking capability, thickness is 1 micron; The second layer is white oil, and increase reflective, thickness is 5-6 micron; Third layer is for expanding vulcanizing agent, and reduce the risk that cures, thickness is 1 micron; 4th layer is silicone protective layer, and improve brightness and prevent from scratching, increase conjugation, thickness is 1-1.5 micron.
Further, described white oil layer covers the front and back of ceramic substrate.Due to the difference of the requirement and project organization etc. of the LED ceramic baseplate in some specific industry, the back side of ceramic substrate also scribbles white oil layer, the reflecting rate in order to promote the back side and refractive index, as some LED lamp source has the light emitting source of different angles, the light of some light emitting sources can be refracted to the basic back side of the pottery of other light emitting sources.Thus, the ceramic substrate back side also scribbles white oil layer and effectively can improve light source.
In addition, the invention still further relates to a kind of oiling glue sealing method of white oil ceramic substrate, the step of its method is:
(1) carry out preliminary treatment in the ceramic base plate surface being covered with circuit, Jin Dao, circuit both positive and negative polarity and pad chip positive pole and pad chip negative pole to clean, ensure that ceramic base plate surface is smooth, smooth and clean;
(2) white oil layer of thin layer is coated in the position, non-crystal bonding area of ceramic substrate, namely cover one deck white oil layer in circuit, surface, golden road and the null position of ceramic substrate, white oil layer does not cover pad chip positive pole and pad chip negative pole and the crystal bonding area between pad chip positive pole and pad chip negative pole; According to product needed, the white oil layer of more than three layers can be coated in the position, non-crystal bonding area of ceramic substrate;
(3) after white oil parches completely, in position, crystal bonding area welding LED lamp bead, then sealing, the oiling sealing of ceramic substrate is completed.
In sum, white oil ceramic substrate of the present invention brushes the white oil layer of thin layer in the non-crystal bonding area of ceramic substrate, is covered with the surface of circuit, Jin Dao, thus improves refractive index and reflecting rate, effectively can improve the brightness of lamp pearl after sealing.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that ceramic substrate of the prior art does not scribble white oil layer;
Fig. 2 is the schematic diagram after a kind of white oil ceramic substrate of the embodiment of the present invention 1 scribbles white oil layer.
Embodiment
Embodiment 1
A kind of white oil ceramic substrate described by the present embodiment 1, as shown in Figure 2, comprise ceramic substrate 1, the front of ceramic substrate is provided with circuit 2, circuit both positive and negative polarity 3, golden road 4, circuit is provided with pad chip positive pole 5 and pad chip negative pole 6, scribble the white oil layer 7 of thin layer in the non-crystal bonding area of ceramic substrate, thickness is 10 microns.This thickness is 10 microns is best effect, greatly can promote the brightness of lamp pearl, improve refractive index and reflecting rate.White oil layer covers circuit, surface, golden road, and white oil does not cover pad chip positive pole and pad chip negative pole and the crystal bonding area between pad chip positive pole and pad chip negative pole.
In addition, the present embodiment 1 also relates to a kind of oiling glue sealing method of white oil ceramic substrate, and the step of its method is:
(1) carry out preliminary treatment in the ceramic base plate surface being covered with circuit, Jin Dao, circuit both positive and negative polarity and pad chip positive pole and pad chip negative pole to clean, ensure that ceramic base plate surface is smooth, smooth and clean;
(2) white oil layer of thin layer is coated in the position, non-crystal bonding area of ceramic substrate, namely cover one deck white oil layer in circuit, surface, golden road and the null position of ceramic substrate, white oil layer does not cover pad chip positive pole and pad chip negative pole and the crystal bonding area between pad chip positive pole and pad chip negative pole; According to product needed, the white oil layer of more than three layers can be coated in the position, non-crystal bonding area of ceramic substrate;
(3) after white oil parches completely, in position, crystal bonding area welding LED lamp bead, then sealing, the oiling sealing of ceramic substrate is completed.
Embodiment 2
The present embodiment 2 changes on the basis of embodiment 1, is specially the number of plies etc. of white oil coating, is specially:
This white oil layer scribbles four layers, and ground floor is surface conjunction agent, and increase conjugation and heat-sinking capability, thickness is 1 micron; The second layer is white oil, and increase reflective, thickness is 5-6 micron; Third layer is for expanding vulcanizing agent, and reduce the risk that cures, thickness is 1 micron; 4th layer is silicone protective layer, and improve brightness and prevent from scratching, increase conjugation, thickness is 1-1.5 micron.
This white oil covers the front and back of ceramic substrate.Due to the difference of the requirement and project organization etc. of the LED ceramic baseplate in some specific industry, the back side of ceramic substrate also scribbles white oil, the reflecting rate in order to promote the back side and refractive index, as some LED lamp source has the light emitting source of different angles, the light of some light emitting sources can be refracted to the basic back side of the pottery of other light emitting sources.Thus, the ceramic substrate back side also scribbles white oil and effectively can improve light source.
The above is only preferred embodiment of the present invention, not does any pro forma restriction to structure of the present invention.Every above embodiment is done according to technical spirit of the present invention any simple modification, equivalent variations and modification, all still belong in the scope of technical scheme of the present invention.
Claims (5)
1. a white oil ceramic substrate, comprise ceramic substrate, the front of ceramic substrate is provided with circuit, circuit both positive and negative polarity, Jin Dao, circuit is provided with pad chip positive pole and pad chip negative pole, it is characterized in that, scribble at least one deck white oil layer in the non-crystal bonding area of ceramic substrate, white oil layer covers circuit, surface, golden road, and white oil layer does not cover pad chip positive pole and pad chip negative pole and the crystal bonding area between pad chip positive pole and pad chip negative pole.
2. a kind of white oil ceramic substrate according to claim 1, it is characterized in that, described white oil layer only scribbles one deck white oil, and thickness is 8-10 micron.
3. a kind of white oil ceramic substrate according to claim 1, it is characterized in that, described white oil layer scribbles four layers, and ground floor is surface conjunction agent, and thickness is 1 micron; The second layer is white oil, and thickness is 5-6 micron; Third layer is for expanding vulcanizing agent, and thickness is 1 micron; 4th layer is silicone protective layer, and thickness is 1-1.5 micron.
4. a kind of white oil ceramic substrate according to claims 1 to 3 any one, is characterized in that, described white oil layer covers the front and back of ceramic substrate.
5. the oiling glue sealing method of a kind of white oil ceramic substrate according to claim 1, it is characterized in that, described step is:
(1) carry out preliminary treatment in the ceramic base plate surface being covered with circuit, Jin Dao, circuit both positive and negative polarity and pad chip positive pole and pad chip negative pole to clean, ensure that ceramic base plate surface is smooth, smooth and clean;
(2) white oil layer of thin layer is coated in the position, non-crystal bonding area of ceramic substrate, namely cover one deck white oil layer in circuit, surface, golden road and the null position of ceramic substrate, white oil layer does not cover pad chip positive pole and pad chip negative pole and the crystal bonding area between pad chip positive pole and pad chip negative pole; According to product needed, the white oil layer of more than three layers can be coated in the position, non-crystal bonding area of ceramic substrate;
(3) after white oil layer parches completely, in position, crystal bonding area welding LED lamp bead, then sealing, the oiling sealing of ceramic substrate is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510291478.9A CN105118914A (en) | 2015-06-01 | 2015-06-01 | White-oil ceramic substrate and oiling gluing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510291478.9A CN105118914A (en) | 2015-06-01 | 2015-06-01 | White-oil ceramic substrate and oiling gluing method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105118914A true CN105118914A (en) | 2015-12-02 |
Family
ID=54666856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510291478.9A Pending CN105118914A (en) | 2015-06-01 | 2015-06-01 | White-oil ceramic substrate and oiling gluing method therefor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105118914A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473952A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | Circuit LED support and LED |
| CN110473953A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | LED lamp panel |
| CN114566570A (en) * | 2022-02-25 | 2022-05-31 | 东莞市中麒光电技术有限公司 | LED lamp bead manufacturing method, LED lamp bead, display module manufacturing method and display module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202817017U (en) * | 2012-08-22 | 2013-03-20 | 广州市鸿利光电股份有限公司 | Substrate and light source module |
| CN103474564A (en) * | 2013-09-11 | 2013-12-25 | 深圳市通普科技有限公司 | COB packaging structure and COB packaging method |
| CN204362413U (en) * | 2015-01-06 | 2015-05-27 | 惠州奔达电子有限公司 | A kind of super thick white oil layer LED circuit board |
| CN204792906U (en) * | 2015-06-01 | 2015-11-18 | 广东聚科照明股份有限公司 | White oil ceramic substrate |
-
2015
- 2015-06-01 CN CN201510291478.9A patent/CN105118914A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202817017U (en) * | 2012-08-22 | 2013-03-20 | 广州市鸿利光电股份有限公司 | Substrate and light source module |
| CN103474564A (en) * | 2013-09-11 | 2013-12-25 | 深圳市通普科技有限公司 | COB packaging structure and COB packaging method |
| CN204362413U (en) * | 2015-01-06 | 2015-05-27 | 惠州奔达电子有限公司 | A kind of super thick white oil layer LED circuit board |
| CN204792906U (en) * | 2015-06-01 | 2015-11-18 | 广东聚科照明股份有限公司 | White oil ceramic substrate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473952A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | Circuit LED support and LED |
| CN110473953A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | LED lamp panel |
| CN114566570A (en) * | 2022-02-25 | 2022-05-31 | 东莞市中麒光电技术有限公司 | LED lamp bead manufacturing method, LED lamp bead, display module manufacturing method and display module |
| CN114566570B (en) * | 2022-02-25 | 2023-01-03 | 东莞市中麒光电技术有限公司 | LED lamp bead manufacturing method, LED lamp bead, display module manufacturing method and display module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012243822A (en) | Led light-emitting device and manufacturing method thereof | |
| CN208045002U (en) | High contrast integration packaging display module structure | |
| CN103872224A (en) | Novel LED (Light Emitting Diode) illuminating element | |
| CN105118914A (en) | White-oil ceramic substrate and oiling gluing method therefor | |
| CN205248309U (en) | One -way high luminous flux white light device | |
| CN204792906U (en) | White oil ceramic substrate | |
| CN103855147A (en) | LED lamp filament and lamp | |
| JP2015164234A (en) | LED light-emitting device and manufacturing method thereof | |
| TWI689111B (en) | Quantum dot film and its manufacturing method | |
| US9929309B2 (en) | Light-emitting diode package and method of manufacturing the same | |
| WO2016127673A1 (en) | Three-dimensional luminous led point light source and illuminating device | |
| TWI513048B (en) | Led light emitting device | |
| CN206401357U (en) | Gao Se areas centrality white-light LED encapsulation | |
| CN204271077U (en) | All-round smooth LED light source | |
| CN204497261U (en) | LED encapsulation structure | |
| CN204632807U (en) | A kind of wafer-level package LED | |
| TW201544856A (en) | Front light guide module and electrophoresis display device having the same | |
| CN2922136Y (en) | LED package structure | |
| CN206582738U (en) | A kind of integral LED car lamp of distance-light | |
| CN204102898U (en) | All-round smooth LED light source | |
| CN207877639U (en) | The filling special adhesive tapes of durable type LED | |
| CN209418540U (en) | A kind of novel instruction type LED light sources encapsulating structure | |
| CN104070733B (en) | glass panel structure with laser film | |
| CN218671675U (en) | Packaged LED lamp bead, backlight module and electronic equipment | |
| CN206546828U (en) | A kind of structure improved LED chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151202 |
|
| RJ01 | Rejection of invention patent application after publication |