CN107768398A - Display screen - Google Patents
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- CN107768398A CN107768398A CN201711148540.4A CN201711148540A CN107768398A CN 107768398 A CN107768398 A CN 107768398A CN 201711148540 A CN201711148540 A CN 201711148540A CN 107768398 A CN107768398 A CN 107768398A
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- inverted structure
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- 238000004519 manufacturing process Methods 0.000 abstract description 20
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- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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Abstract
The invention provides a kind of display screen, including：Substrate；Pad, it is arranged on substrate；Inverted structure chip, is connected with pad, and inverted structure chip includes the first noumenon and is arranged on the first positive electrode and the first negative electrode of the first noumenon homonymy；Thin-film LED, it is connected with pad, thin-film LED includes the second body and is arranged on the second positive electrode and the second negative electrode of the relative both sides of the second body.By technical scheme provided by the invention, the problem of display screen reliability of the prior art and manufacturing cost can not be taken into account can solve the problem that.
Description
Technical field
The present invention relates to display screen technology field, in particular to a kind of display screen.
Background technology
With the development of Display Technique, LED display spacing is less and less, pixel cell density more and more higher.However, by
In the SMD techniques of LED encapsulation, pixel cell spacing is limited by packaging body, it is difficult to further reduce.Therefore, COB display screens
Arise at the historic moment, COB display screens there are two kinds of implementations, and one kind is to be welded with line using traditional red, green and blue LED chip to consolidate LED chip
Determine to circuit substrate, realize electrical connection；Another kind is directly by inverted structure chip die bond to circuit substrate, exempts bonding wire.
Both modes through SMT Surface Mounts, pixel cell spacing by LED package all without not limited the encapsulation of LED bare crystallines again.
Wherein, using traditional red, green and blue LED chip, it is necessary to weld the metal wire of more series connection, this can reduce display screen
Reliability.And using the inverted structure chip for exempting from bonding wire, then the exiting surface for needing LED chip is substrate surface, blue light and green glow
LED chip is transparent substrates, can be directly from substrate surface light extraction after flip-chip, but GaAs extinctions in the substrate of red LED chip,
Need to remove GaAs, LED luminescent layers are transferred to transparent substrates.Compared with traditional red LED chip, the processing procedure adds multiple tracks
The techniques such as photoetching, bonding, polishing, corrosion, processing procedure is complicated, and yields is relatively low, greatly increases its cost, even more than tradition
The small space distance LED display screens of SMT, are unfavorable for forming large-scale industrialized production.Therefore, display screen of the prior art exists reliable
Property with manufacturing cost can not take into account the problem of.
The content of the invention
The present invention provides a kind of display screen, can not be taken into account with solving display screen reliability of the prior art and manufacturing cost
The problem of.
In order to solve the above problems, the invention provides a kind of display screen, including：Substrate；Pad, it is arranged on substrate；
Inverted structure chip, is connected with pad, and inverted structure chip includes the first noumenon and is arranged on the first of the first noumenon homonymy just
Electrode and the first negative electrode；Thin-film LED, it is connected with pad, thin-film LED includes the second body and is arranged on second
The second positive electrode and the second negative electrode of the relative both sides of body.
Further, substrate has the front and back being oppositely arranged, inverted structure chip and the equal position of thin-film LED
In the front of substrate, the first positive electrode, the first negative electrode and the second negative electrode are towards the front of substrate.
Further, inverted structure chip and thin-film LED are arranged at intervals, and pad is multiple, the first positive electrode, the
One negative electrode, the second negative electrode are connected with a pad respectively.
Further, display screen also includes：Bonding wire, the first end of bonding wire are connected with the second positive electrode, the second end of bonding wire
It is connected with pad.
Further, display screen includes pixel cell, pixel cell include inverted structure chip, thin-film LED and
Bonding wire.
Further, in pixel cell, inverted structure chip is at least one, and pad is multiple, the second end of bonding wire
A pad is shared with the first positive electrode of at least one inverted structure chip or the first negative electrode.
Further, pixel cell includes：First structure, including sequentially spaced inverted structure core in the first direction
Piece and thin-film LED；Second structure, including pad, the second end of bonding wire are connected with the pad in the second structure.
Further, the second structure be located at first structure perpendicular to the side of first direction, or the second structure is positioned at the
The side parallel to first direction of one structure.
Further, in pixel cell, thin-film LED is red light chips, one or both of gold-tinted chip,
Inverted structure chip is the one or more in blue chip, green glow chip, white chip.
Further, display screen also includes：Conductive layer, the first positive electrode, the first negative electrode and the second negative electrode pass through
Conductive layer is connected with pad.
Further, substrate has relative front and back, and inverted structure chip is arranged at thin-film LED
The front of substrate, display screen also include：IC devices, it is arranged on the back side of substrate, IC devices and inverted structure chip and vertical junction
Structure chip electrically connects.
Further, display screen also includes：Encapsulant, for sealing inverted structure chip and thin-film LED.
Apply the technical scheme of the present invention, inverted structure chip and vertical stratification core are set simultaneously on the substrate of display screen
Piece, the chip of different colours can be selected according to optical characteristics as inverted structure chip or thin-film LED, so by hanging down
Straight fabric chip can simplify the manufacturing process of display screen, so as to reduce manufacturing cost, can be reduced by inverted structure chip
Bonding wire quantity, so as to improve reliability.Therefore, reliability and the manufacture of display screen are can solve the problem that by technical scheme
The problem of cost can not be taken into account.
Brief description of the drawings
The Figure of description for forming the part of the application is used for providing a further understanding of the present invention, and of the invention shows
Meaning property embodiment and its illustrate be used for explain the present invention, do not form inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 shows the structural representation for the display screen that the embodiment of the present invention one provides；
Fig. 2 shows the structural representation for the display screen that the embodiment of the present invention two provides；
Fig. 3 shows the arrangement schematic diagram of the pad in the display screen in Fig. 2；
Fig. 4 shows the structural representation for the display screen that the embodiment of the present invention three provides；
Fig. 5 shows the arrangement schematic diagram of the pad in the display screen in Fig. 4；
Fig. 6 shows the structural representation for the display screen that the embodiment of the present invention four provides；
Fig. 7 shows the arrangement schematic diagram of the pad in the display screen in Fig. 6.
Wherein, above-mentioned accompanying drawing marks including the following drawings：
10th, substrate；20th, pad；30th, inverted structure chip；31st, the first noumenon；32nd, the first positive electrode；33rd, the first negative electricity
Pole；40th, thin-film LED；41st, the second body；42nd, the second positive electrode；43rd, the second negative electrode；50th, bonding wire；60th, conductive layer；
70th, IC devices；80th, encapsulant.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes.Obviously, described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Below
Description only actually at least one exemplary embodiment is illustrative, is never used as to the present invention and its application or makes
Any restrictions.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creative work premise
Lower obtained every other embodiment, belongs to the scope of protection of the invention.
As shown in figure 1, embodiments of the invention one provide a kind of display screen, the display screen include substrate 10, pad 20,
Inverted structure chip 30 and thin-film LED 40.Wherein, pad 20 is set on the substrate 10, inverted structure chip 30 and weldering
Disk 20 connects, and inverted structure chip 30 includes the first noumenon 31 and the first positive electrode 32 for being arranged on the homonymy of the first noumenon 31 and the
One negative electrode 33.Thin-film LED 40 is connected with pad 20, and thin-film LED 40 includes the second body 41 and is arranged on the
The second positive electrode 42 and the second negative electrode 43 of the relative both sides of two bodies 41.
Using the technical scheme of the present embodiment, inverted structure chip 30 and vertical is set simultaneously on the substrate 10 of display screen
Fabric chip 40, the chip of different colours can be selected according to optical characteristics as inverted structure chip 30 or thin-film LED
40, it can so simplify the manufacturing process of display screen by thin-film LED 40, so as to reduce manufacturing cost, pass through upside-down mounting knot
Structure chip 30 can reduce bonding wire quantity, so as to improve reliability.Therefore, can solve the problem that by the technical scheme of the present embodiment aobvious
The problem of reliability of display screen can not be taken into account with manufacturing cost.
In the present embodiment, substrate 10 has the front and back being oppositely arranged, inverted structure chip 30 and vertical stratification
Chip 40 is respectively positioned on the front of substrate 10, and the first positive electrode 32, the first negative electrode 33 and the second negative electrode 43 are towards substrate 10
Front.It is arranged such the connection that can be easy to inverted structure chip 30 and thin-film LED 40 and substrate 10 and ensures to show
The optical property of screen.
In the present embodiment, inverted structure chip 30 is arranged at intervals with thin-film LED 40, and pad 20 is multiple, and first
Positive electrode 32, the first negative electrode 33, the second negative electrode 43 are connected with a pad 20 respectively.It is arranged such and is both can guarantee that first just
Electrode 32, the first negative electrode 33, the bonding strength of the second negative electrode 43 and pad 20, and can ensure the transmission of electric current.
As shown in figure 1, display screen also includes bonding wire 50, the first end of bonding wire 50 is connected with the second positive electrode 42, bonding wire 50
The second end be connected with pad 20.Being arranged such can make thin-film LED 40 form complete path to ensure by bonding wire 50
The transmission of electric current.In the present embodiment, bonding wire 50 could be arranged to gold thread, copper cash, silver wire, aluminum steel or other alloy wires.
In this example it is shown that screen includes pixel cell, pixel cell includes inverted structure chip 30, vertical stratification core
Piece 40 and bonding wire 50.Inverted structure chip 30 and thin-film LED 40 are set simultaneously in the pixel cell of display screen, can
The chip of different colours is selected as inverted structure chip 30 or thin-film LED 40 according to optical characteristics, so by vertical
Fabric chip 40 can simplify the manufacturing process of display screen, so as to reduce manufacturing cost, can be subtracted by inverted structure chip 30
Few bonding wire quantity, so as to improve reliability.Therefore, by the technical scheme of the present embodiment can solve the problem that the reliability of display screen with
The problem of manufacturing cost can not be taken into account.In the present embodiment, pixel cell could be arranged to multiple, pass through the technology of the present embodiment
Scheme can reduce the distance between two neighboring pixel cell, so as to increase the picture element density of display screen, improve display screen
Performance.In the present embodiment, in the case of allowing in space, bonding wire 50 can be arranged to arranged side by side multiple, so can be to prevent
Only because bonding wire 50 is broken and caused by pixel cell fail, so as to improve the reliability of display screen.
The display screen that the present embodiment provides is LED display, and in pixel cell, thin-film LED 40 is feux rouges core
One or both of piece, gold-tinted chip, inverted structure chip 30 are one kind in blue chip, green glow chip, white chip
It is or a variety of.The selection of thin-film LED 40 is related to optical characteristics, and inverted structure chip 30 is also related to optical characteristics, so
The manufacturing process of display screen can be simplified by thin-film LED 40 by setting, and so as to reduce manufacturing cost, pass through upside-down mounting
Fabric chip 30 can reduce bonding wire quantity, so as to improve reliability.
In this example it is shown that screen also includes conductive layer 60, the first positive electrode 32, the first negative electrode 33 and the second negative electricity
Pole 43 is connected by conductive layer 60 with pad 20.By setting conductive layer 60 can be by the first positive electrode 32, the first negative electrode 33
It is connected securely with substrate 10 with the second negative electrode 43, so as to increase the reliability of display screen.Conductive layer 60 in the present embodiment
Can be the materials such as tin cream, gold-tin alloy, anisotropic conductive film.
As shown in figure 1, substrate 10 has relative front and back, inverted structure chip 30 and thin-film LED 40 are equal
Be arranged on the front of substrate 10, display screen also includes IC devices 70, and IC devices 70 are arranged on the back side of substrate 10, IC devices 70 with
Inverted structure chip 30 and thin-film LED 40 electrically connect.IC devices 70 are used to drive and control inverted structure chip 30 with hanging down
Straight fabric chip 40 lights.
In this example it is shown that screen also includes encapsulant 80, encapsulant 80 is used to seal inverted structure chip 30
With thin-film LED 40.It is close by setting encapsulant 80 to be carried out to inverted structure chip 30 and thin-film LED 40
Envelope, so as to increase the reliability of display screen.Encapsulant 80 in the present embodiment could be arranged to as transparent or black transparent material
Material, such as resin, silica gel.The one side of encapsulant 80 can protect chip and bonding wire 50, prevent bonding wire 50 to be broken, the opposing party
Face, light transmissive material can also improve the contrast of display screen.
As shown in Figures 2 and 3, embodiments of the invention two are provided in display screen, and pixel cell includes first structure and the
Two structures.Wherein, first structure includes in the first direction sequentially spaced inverted structure chip 30 and thin-film LED
40, the second structure includes pad 20, and the second end of bonding wire 50 is connected with the pad 20 in the second structure.Being arranged such to reduce
The size of pixel cell, so as to increase the picture element density of display screen, improve the performance of display screen.
Specifically, there are three row's pads 20 in first structure, wherein first row sets a pad 20, second row and the 3rd
Row sets two pads 20 respectively.And include the red light chips of a formal dress, the blue light core of a upside-down mounting in first structure
Piece and the green glow chip of a upside-down mounting.Wherein, red light chips are connected with first row pad 20, blue chip and second row pad 20
Connection, green glow chip are connected with the 3rd row's pad 20.Second structure includes a pad 20, and this pad 20 is located at first
Structure is located on first direction perpendicular to the side of first direction, i.e. this pad 20.Being arranged such can be in order to pixel cell
Manufacture, so as to reduce manufacturing cost.
As shown in Figure 4 and Figure 5, embodiments of the invention three are provided in display screen, and pixel cell includes first structure and the
Two structures.Wherein, first structure includes in the first direction sequentially spaced inverted structure chip 30 and thin-film LED
40, the second structure includes pad 20, and the second end of bonding wire 50 is connected with the pad 20 in the second structure.
Specifically, there are three row's pads 20 in first structure, wherein first row sets a pad 20, second row and the 3rd
Row sets two pads 20 respectively.And include the red light chips of a formal dress, the blue light core of a upside-down mounting in first structure
Piece and the green glow chip of a upside-down mounting.Wherein, red light chips are connected with first row pad 20, blue chip and second row pad 20
Connection, green glow chip are connected with the 3rd row's pad 20.Second structure includes a pad 20, and this pad 20 is located at first
The side parallel to first direction of structure.The spacing of two neighboring pixel cell can be reduced by being arranged such, so as to carry
The picture element density of high display screen, improve the display performance of display screen.
As shown in Figure 6 and Figure 7, embodiments of the invention four are provided in display screen, the inverted structure chip in pixel cell
30 be at least one, and pad 20 is multiple, the second end of bonding wire 50 and the first positive electrode of at least one inverted structure chip 30
32 or first negative electrode 33 share a pad 20.The quantity of pad 20 can be reduced by being arranged such, each so as to reduce
The size of pixel cell, and then the picture element density of display screen can be improved.Moreover, such a set-up mode can reduce on substrate 10
The number of openings, so as to reduce production cost.
Specifically, there are three row's pads 20 in pixel cell, wherein first row sets a pad 20, second row and the 3rd
Row sets two pads 20 respectively.And include the red light chips of a formal dress, the blue light core of a upside-down mounting in pixel cell
Piece and the green glow chip of a upside-down mounting.Wherein, red light chips are connected with first row pad 20, blue chip and second row pad 20
Connection, green glow chip are connected with the 3rd row's pad 20.Also, the first end of bonding wire 50 and the second positive electrode 42 of red light chips connect
Connect, the second end of bonding wire 50 is connected with a pad 20 in the 3rd row.It so can further reduce the size of pixel cell, from
And the picture element density of display screen can be improved.
Display screen provided by the invention can manufacture with the following method：
1. inverted structure chip and thin-film LED are fixed on to the corresponding positions of substrate front side using full-automatic bonder
Put.
2. using the positive pole of automatic wire bonding machine welding thin-film LED and the pad of circuit substrate.
3. IC devices are fixed on to the relevant position of substrate back using chip mounter.
4. display screen, is then placed in vacuum equipment and vacuumizes by the filling of groove front encapsulant of pair substrate, close to remove
Bubble in closure material.
5. pair display screen carries out pressing mold, and puts it into baking box and solidified.
6. it is stripped to obtain display screen finished product.
By display screen provided by the invention, the manufacture of display screen can be reduced while the picture element density of display screen is improved
Cost, and the reliability and stability of display screen can be improved.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
It should be noted that term used herein above is merely to describe embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in this manual using term "comprising" and/or " bag
Include " when, it indicates existing characteristics, step, operation, device, component and/or combinations thereof.
Unless specifically stated otherwise, the part and positioned opposite, the digital table of step otherwise illustrated in these embodiments
Do not limited the scope of the invention up to formula and numerical value.Simultaneously, it should be appreciated that for the ease of description, each portion shown in accompanying drawing
The size divided not is to be drawn according to the proportionate relationship of reality.For technology, side known to person of ordinary skill in the relevant
Method and equipment may be not discussed in detail, but in the appropriate case, the technology, method and apparatus should be considered as authorizing explanation
A part for book.In shown here and discussion all examples, any occurrence should be construed as merely exemplary, and
Not by way of limitation.Therefore, the other examples of exemplary embodiment can have different values.It should be noted that：Similar label
Similar terms is represented in following accompanying drawing with letter, therefore, once it is defined in a certain Xiang Yi accompanying drawing, then subsequent attached
It need not be further discussed in figure.
In the description of the invention, it is to be understood that the noun of locality such as " forward and backward, upper and lower, left and right ", " laterally, vertical,
Vertically, orientation or position relationship indicated by level " and " top, bottom " etc. are normally based on orientation or position shown in the drawings and closed
System, it is for only for ease of the description present invention and simplifies description, in the case where not making opposite explanation, these nouns of locality do not indicate that
There must be specific orientation with the device or element for implying meaning or with specific azimuth configuration and operation, therefore can not manage
Solve as limiting the scope of the invention；The noun of locality " inside and outside " refers to relative to inside and outside each part profile in itself.
For the ease of description, space relative terms can be used herein, as " ... on ", " ... top ",
" ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy
The spatial relation of sign.It should be appreciated that space relative terms are intended to comprising the orientation except device described in figure
Outside different azimuth in use or operation.For example, if the device in accompanying drawing is squeezed, it is described as " in other devices
It will be positioned as " under other devices or construction after the device of part or construction top " or " on other devices or construction "
Side " or " under other devices or construction ".Thus, exemplary term " ... top " can include " ... top " and
" in ... lower section " two kinds of orientation.The device can also other different modes positioning (being rotated by 90 ° or in other orientation), and
And respective explanations are made to the relative description in space used herein above.
Furthermore, it is necessary to explanation, limits parts, it is only for be easy to using the word such as " first ", " second "
Corresponding parts to be distinguished, do not have Stated otherwise such as, above-mentioned word does not have particular meaning, therefore it is not intended that to this
The limitation of invention protection domain.
Claims (12)
- A kind of 1. display screen, it is characterised in that including：Substrate (10)；Pad (20), it is arranged on the substrate (10)；Inverted structure chip (30), it is connected with the pad (20), the inverted structure chip (30) includes the first noumenon (31) With the first positive electrode (32) and the first negative electrode (33) for being arranged on the first noumenon (31) homonymy；Thin-film LED (40), it is connected with the pad (20), the thin-film LED (40) includes the second body (41) The second positive electrode (42) of the both sides relative with second body (41) is arranged on and the second negative electrode (43).
- 2. display screen according to claim 1, it is characterised in that the substrate (10) has the front being oppositely arranged and the back of the body Face, the inverted structure chip (30) and the thin-film LED (40) are respectively positioned on the front of the substrate (10), and described the One positive electrode (32), first negative electrode (33) and second negative electrode (43) are towards the front of the substrate (10).
- 3. display screen according to claim 1, it is characterised in that the inverted structure chip (30) and the vertical stratification Chip (40) is arranged at intervals, and the pad (20) is multiple, first positive electrode (32), first negative electrode (33), institute The second negative electrode (43) is stated to be connected with a pad (20) respectively.
- 4. display screen according to claim 1, it is characterised in that the display screen also includes：Bonding wire (50), the first end of the bonding wire (50) are connected with second positive electrode (42), and the second of the bonding wire (50) End is connected with the pad (20).
- 5. display screen according to claim 4, it is characterised in that the display screen includes pixel cell, the pixel list Member includes the inverted structure chip (30), the thin-film LED (40) and the bonding wire (50).
- 6. display screen according to claim 5, it is characterised in that in the pixel cell, the inverted structure chip (30) to be at least one, the pad (20) is multiple, the second end and at least one inverted structure of the bonding wire (50) First positive electrode (32) of chip (30) or first negative electrode (33) share a pad (20).
- 7. display screen according to claim 5, it is characterised in that the pixel cell includes：First structure, including the sequentially spaced inverted structure chip (30) and the vertical stratification core in the first direction Piece (40)；Second structure, including the pad (20), the second end and the pad in second structure of the bonding wire (50) (20) connect.
- 8. display screen according to claim 7, it is characterised in that second structure is located at the vertical of the first structure In the side of the first direction, or second structure be located at the first structure parallel to the one of the first direction Side.
- 9. display screen according to claim 5, it is characterised in that in the pixel cell, the thin-film LED (40) it is one or both of red light chips, gold-tinted chip, the inverted structure chip (30) is blue chip, green glow core One or more in piece, white chip.
- 10. display screen according to claim 1, it is characterised in that the display screen also includes：Conductive layer (60), first positive electrode (32), first negative electrode (33) and second negative electrode (43) are logical The conductive layer (60) is crossed to be connected with the pad (20).
- 11. display screen according to claim 1, it is characterised in that the substrate (10) has relative front and back, The inverted structure chip (30) is arranged at the front of the substrate (10), the display with the thin-film LED (40) Screen also includes：IC devices (70), it is arranged on the back side of the substrate (10), the IC devices (70) and the inverted structure chip (30) Electrically connected with the thin-film LED (40).
- 12. display screen according to claim 1, it is characterised in that the display screen also includes：Encapsulant (80), for sealing the inverted structure chip (30) and the thin-film LED (40).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711148540.4A CN107768398A (en) | 2017-11-17 | 2017-11-17 | Display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711148540.4A CN107768398A (en) | 2017-11-17 | 2017-11-17 | Display screen |
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| Publication Number | Publication Date |
|---|---|
| CN107768398A true CN107768398A (en) | 2018-03-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711148540.4A Pending CN107768398A (en) | 2017-11-17 | 2017-11-17 | Display screen |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114566570A (en) * | 2022-02-25 | 2022-05-31 | 东莞市中麒光电技术有限公司 | LED lamp bead manufacturing method, LED lamp bead, display module manufacturing method and display module |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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