CN107170769A - A kind of encapsulating structure and its method for packing of image sensing chip - Google Patents
A kind of encapsulating structure and its method for packing of image sensing chip Download PDFInfo
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- CN107170769A CN107170769A CN201710547345.2A CN201710547345A CN107170769A CN 107170769 A CN107170769 A CN 107170769A CN 201710547345 A CN201710547345 A CN 201710547345A CN 107170769 A CN107170769 A CN 107170769A
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- sensing chip
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- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000012856 packing Methods 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 103
- 239000003292 glue Substances 0.000 claims abstract description 56
- 238000005538 encapsulation Methods 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 40
- 125000006850 spacer group Chemical group 0.000 claims description 27
- 239000012780 transparent material Substances 0.000 claims description 21
- 238000005520 cutting process Methods 0.000 claims description 19
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a kind of encapsulating structure and its method for packing of image sensing chip, the encapsulating structure includes：Image sensing chip, the image sensing chip includes relative first surface and second surface, and the first surface has multiple pixels and multiple the first weld pads being connected with the pixel for being used to gather image information；The substrate of the first surface of the image sensing chip is covered, the substrate has wiring route and the contact jaw being connected with the wiring route；The wiring route is used to electrically connect with external circuit；The periphery of the image sensing chip is fixed by anisotropy conductiving glue with the substrate bonding, first weld pad is electrically connected by the anisotropy conductiving glue with the contact jaw, on the direction perpendicular to the substrate, the anisotropy conductiving glue surrounds all pixels, is not overlapped with the pixel.Technical solution of the present invention to image sensing chip when being packaged, and technique is simple, reduces cost of manufacture.
Description
Technical field
The present invention relates to image collecting device technical field, in particular, it is related to a kind of encapsulation of image sensing chip
Structure and its method for packing.
Background technology
Image sensing chip is a kind of electronic device that can be experienced extraneous light and convert thereof into electric signal.Image is passed
Sense chip generally carries out chip manufacturing using semiconductor fabrication process.After the completion of image sensing chip manufacturing, then by shadow
As sensing chip carries out a series of packaging technologies so as to form packaged encapsulating structure, for such as digital camera, number
The various electronic equipments of video camera etc..
In the prior art, when image sensing chip is packaged, to be by the weld pad of image sensing chip surface and one
The weld pad of substrate is welded to each other, and image sensing chip and the substrate surrounding are carried out into sealing fixation by viscose.
By foregoing description, it is necessary to again by glutinous after welding when prior art is packaged to image sensing chip
Glue is adhesively fixed, complex process, and cost is high.
The content of the invention
In order to solve the above problems, the invention provides a kind of encapsulating structure and its method for packing of image sensing chip,
When being packaged to image sensing chip, technique is simple, and reduces cost of manufacture.
To achieve these goals, the present invention provides following technical scheme：
A kind of encapsulating structure of image sensing chip, the encapsulating structure includes：
Image sensing chip, the image sensing chip includes relative first surface and second surface, described first
Surface has multiple pixels and multiple the first weld pads being connected with the pixel for being used to gather image information；
Cover be provided with the substrate of the first surface of the image sensing chip, the substrate wiring route and with institute
State the contact jaw of wiring route connection；The wiring route is used to electrically connect with external circuit；
The periphery of the image sensing chip is fixed by anisotropy conductiving glue with the substrate bonding, and described first
Weld pad is electrically connected by the anisotropy conductiving glue with the contact jaw, on the direction perpendicular to the substrate, described each
Anisotropy conducting resinl surrounds all pixels, and is not overlapped with the pixel.
It is preferred that, in above-mentioned encapsulating structure, the substrate includes first area and surrounds the of the first area
Two regions；The first area is transmission region；
The first surface of the image sensing chip includes：Pickup area and the non-acquired area for surrounding the pickup area
Domain；The pickup area is oppositely arranged with the first area；First weld pad is located at the non-acquired region；
Wherein, the anisotropy conductiving glue is located between the non-acquired region and the second area.
It is preferred that, in above-mentioned encapsulating structure, the substrate is transparent material.
It is preferred that, in above-mentioned encapsulating structure, the wiring route is located at the second area towards the image sensing
There is light shield layer between the surface of chip, and the wiring route and the substrate.
It is preferred that, in above-mentioned encapsulating structure, the substrate is non-transparent material；The first area is provided through institute
The window of substrate is stated, the window is used to expose all pixels.
It is preferred that, in above-mentioned encapsulating structure, in addition to the transparent cover plate being fixed on the first substrate, it is described transparent
Cover plate covers the window.
It is preferred that, in above-mentioned encapsulating structure, a side surface of the substrate towards the image sensing chip is also set up
There is the external terminal electrically connected with the wiring route, the external terminal is used to electrically connect with the external circuit.
It is preferred that, in above-mentioned encapsulating structure, the external circuit has jack；
The external terminal is the grafting pin matched with the jack, and the wiring route passes through the grafting pin
The electrical connection with the external circuit is realized with the jack grafting.
It is preferred that, in above-mentioned encapsulating structure, in addition to：
It is arranged on the light source compensator that the substrate deviates from the image sensing chip-side surface.
It is preferred that, in above-mentioned encapsulating structure, first weld pad is evenly distributed in the week of the image sensing chip
Edge.
It is preferred that, in above-mentioned encapsulating structure, the first surface of the image sensing chip is additionally provided with multiple auxiliary mats
Piece, the shape of the auxiliary spacer is identical with the shape of first weld pad, and the auxiliary spacer and first weld pad are uniform
The periphery for being distributed in the image sensing chip.
It is preferred that, in above-mentioned encapsulating structure, the auxiliary spacer is located at the periphery of same rectangle with first weld pad,
Multiple first weld pads are symmetrically distributed on two relative sides of the rectangle；
Multiple auxiliary spacers are symmetrically distributed on the relative two other side of the rectangle.
It is preferred that, in above-mentioned encapsulating structure, the auxiliary spacer is located at the periphery of same rectangle with first weld pad,
On the periphery of the rectangle, first weld pad is arranged alternately setting with the auxiliary spacer.
Present invention also offers a kind of method for packing of image sensing chip, for making the encapsulation described in any of the above-described
Structure, the method for packing includes：
A sheet material is provided, institute's sheet material includes having cutting raceway groove between the encapsulation region of multiple array arrangements, adjacent package area；
The encapsulation region is provided with wiring route and the contact jaw electrically connected with the wiring route；The wiring route be used for it is outer
Portion's circuit electrical connection；
By anisotropy conductiving glue, an image sensing chip is adhesively fixed in the encapsulation region, the image is passed
Sense chip includes relative first surface and second surface, and the first surface has multiple pictures for being used to gather image information
Vegetarian refreshments and multiple the first weld pads being connected with the pixel；
Cutting separation is carried out to the sheet material along the cutting raceway groove, the encapsulation of multiple image sensing chips is formed
Structure；After cutting, the sheet material is divided into multiple substrates, and each described substrate includes an encapsulation region；
Wherein, the periphery of the image sensing chip is bonded solid by the anisotropy conductiving glue and the encapsulation region
Determine, and first weld pad is electrically connected by the anisotropy conductiving glue with the contact jaw；For being encapsulated each described
Area, on the direction perpendicular to the encapsulation region, the anisotropy conductiving glue surrounds all pixels, and with the picture
Vegetarian refreshments is not overlapped.
It is preferred that, in above-mentioned method for packing, the encapsulation region includes first area and surrounds the first area
Second area；The first area is transmission region；The first surface of the image sensing chip includes：Pickup area and bag
Enclose the non-acquired region of the pickup area；The pickup area is oppositely arranged with the first area；The first weld pad position
In the non-acquired region；
It is described by anisotropy conductiving glue, an image sensing chip is adhesively fixed in the encapsulation region to be included：
Periphery in each encapsulation region coats anisotropy conductiving glue, and is bonded on the anisotropy conductiving glue
One image sensing chip, hot-press solidifying is carried out to the anisotropy conductiving glue so that the image sensing chip leads to
Cross the anisotropy conductiving glue to fix with the substrate, and electrically connected with first weld pad；
Wherein, the anisotropy conductiving glue is located between the non-acquired region and the second area.
It is preferred that, in above-mentioned method for packing, the substrate is transparent material；
One sheet material of the offer includes：
In the light shield layer of plate surface formation predetermined pattern structure, the light shield layer of the predetermined pattern structure have with
The first area is open correspondingly, described to be open for exposing the corresponding first area；
The predetermined pattern structure light shield layer away from the sheet material a side surface formed the wiring route and
The contact jaw.
It is preferred that, in above-mentioned method for packing, the substrate is non-transparent material；
One sheet material of the offer includes：
The window through the encapsulation region is formed in the first area of each encapsulation region, the window is used to expose institute
There is the pixel.
It is preferred that, in above-mentioned method for packing, in addition to：
Transparent cover plate is fixed on each window.
It is preferred that, in above-mentioned method for packing, before being cut, in addition to：
Light source compensator is set away from the surface of the image sensing chip-side in each encapsulation region.
It is preferred that, in above-mentioned method for packing, before being cut, in addition to：
The external terminal electrically connected with the wiring route is formed on each encapsulation region, the external terminal is used for
Electrically connected with the external circuit；
Wherein, the external terminal is located at the same side of the sheet material with the image sensing chip.
Pass through foregoing description, the encapsulating structure and its method for packing of image sensing chip provided in an embodiment of the present invention
In, the first weld pad of image sensing chip is directly electrically connected by anisotropy conductiving glue with the contact jaw on the substrate, together
When being adhesively fixed for the substrate and the image sensing chip can be realized by the anisotropy conductiving glue, relative to needing
Weld and viscose prior art, technical solution of the present invention to image sensing chip when being packaged, and technique is simple, and
Reduce cost of manufacture.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is a kind of schematic diagram of the encapsulating structure of image sensing chip provided in an embodiment of the present invention；
Fig. 2 is the Z in a first direction of encapsulating structure shown in Fig. 1 top view in the reverse direction；
Fig. 3 is the top view on encapsulating structure described in Fig. 1 in a first direction Z；
Fig. 4 is the schematic diagram of the encapsulating structure of another image sensing chip provided in an embodiment of the present invention；
Fig. 5 is a kind of top view of image sensing chip provided in an embodiment of the present invention；
Fig. 6 is the top view of another image sensing chip provided in an embodiment of the present invention；
Fig. 7 is the top view of another image sensing chip provided in an embodiment of the present invention；
Fig. 8-Figure 11 is a kind of schematic flow sheet of method for packing provided in an embodiment of the present invention；
Figure 12-Figure 15 is the schematic flow sheet of another method for packing provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
In order to facilitate the understanding of the purposes, features and advantages of the present invention, it is below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is further detailed explanation.
With reference to Fig. 1-Fig. 3, Fig. 1 is a kind of signal of the encapsulating structure of image sensing chip provided in an embodiment of the present invention
Figure, Fig. 2 is the Z in a first direction of encapsulating structure shown in Fig. 1 top view in the reverse direction, and Fig. 3 is encapsulating structure described in Fig. 1 the
Top view on one direction Z.
The encapsulating structure includes：Image sensing chip 11, the image sensing chip 11 include relative first surface with
And second surface, the first surface has multiple pixels 12 for being used to gather image information and multiple with the pixel
First weld pad 13 of 12 connections；Cover and set on the substrate 14 of the first surface of the image sensing chip 11, the substrate 14
There are wiring route and the contact jaw being connected with the wiring route；The wiring route is used to electrically connect with external circuit.Institute
State the first interconnection circuit that wiring route includes being used to electrically connect the pixel 12 with external circuit.External circuit is according to picture
The image information that vegetarian refreshments 12 is gathered carries out image procossing.
The periphery of the image sensing chip 11 is adhesively fixed by anisotropy conductiving glue 15 with the substrate 14, and institute
State the first weld pad 13 to electrically connect with the contact jaw by the anisotropy conductiving glue 15, in the side perpendicular to the substrate 14
Upwards, the anisotropy conductiving glue 15 surrounds all pixels 12, and is not overlapped with the pixel 12.In Fig. 1 Fig. 3
The not shown wiring route and the contact jaw.
In the embodiment of the present invention, definition is first direction Z perpendicular to the direction of the substrate 14, and first direction Z is by described
Image sensing chip 11 points to the substrate 14.Define second direction X vertical with first direction Z respectively with third direction Y, and the
Two direction X are vertical with third direction Y.Second direction X is parallel with the substrate 14 with third direction Y.
The substrate 14 includes first area A and surrounds the second area B of the first area A；The first area A
For transmission region；The first surface of the image sensing chip 11 includes：The pickup area C's and encirclement pickup area C
Non-acquired region D；The pickup area C is oppositely arranged with the first area A；First weld pad 13 is located at the non-acquired
Region D.Wherein, the anisotropy conductiving glue 15 is located between the non-acquired region D and the second area B.
On the first direction Z, the first area A is completely exposed the pickup area C.Optionally, it can set
The first area A is identical with the pickup area C.
In Fig. 1-Fig. 3 illustrated embodiments, substrate 14 is transparent material.Therefore, light can directly pass through the firstth area
Domain A incidental images are as the pickup area C of sensing chip 11.When substrate 14 is transparent material, the substrate 14 can be glass base
Plate or transparent plastic substrate.
The wiring route is located at the second area B towards the surface of the image sensing chip 11, and the wiring
There is light shield layer between circuit and the substrate 14.
The contact jaw is located at the side surface away from substrate 14 of the light shield layer.Light shield layer is arranged on the court of substrate 14
To the side of image sensing chip 11, it is to avoid friction damage light shield layer.Wiring route and the contact are blocked by light shield layer
End, it is ensured that the outward appearance of encapsulating structure does not show wiring route and the contact jaw.The light shield layer not shown in Fig. 1-Fig. 3.
Optionally, the light shield layer is black ink layer.
One side surface of the substrate 14 towards the image sensing chip 11 is additionally provided with to be electrically connected with the wiring route
The external terminal 16 connect, the external terminal 16 is used to electrically connect with the external circuit, to cause external circuit to be passed with image
Pixel 12 in sense chip 11 is electrically connected.On the first direction Z, it is described that the external terminal 16 is located at the correspondence of substrate 14
Second area B position, and do not overlapped with the image sensing chip 11.
In the embodiment shown in fig. 1, the external terminal 16 is tin ball.In other embodiment, external terminal 16 is also
It can be pad.When external terminal is tin ball or pad, external terminal 16 can be welded with the weld pad in external circuit, with
So that external circuit is electrically connected with wiring route.
In other embodiment, the external circuit has jack, and the external terminal 16 can also be and the jack
The grafting pin matched, now, the wiring route by the grafting of the grafting pin and the jack realize with it is described
The electrical connection of external circuit.
In order to ensure image quality of the encapsulating structure under the weaker environment of light, encapsulation knot described in the embodiment of the present invention
In structure, in addition to：It is arranged on the light source compensator 17 that the substrate 14 deviates from the side surface of image sensing chip 11 1.
On the first direction Z, the light source compensator 17 is located at the correspondence of substrate 14 second area B position.Optionally, institute
Light source compensator 17 is stated for LED component.The work of light source compensator can be controlled by external circuit.The wiring route
Also include the second interconnection circuit for being used to electrically connect the light source compensator with the external circuit.Second interconnection line
Insulated with first interconnection circuit on road.
Light source compensator 17 can be by the via through substrate 14 and substrate 14 towards the surface of image sensing chip 11
Contact jaw connection, and then be connected with external circuit, or light source compensator 17 by FPC with being located at the opposite side of substrate 14
Contact jaw is connected.
In the above-described embodiment, substrate 14 is transparent material, therefore, first area A printing opacities, and substrate 14 is being realized to shadow
As sensing chip 11 is encapsulated, while electrical connection with external circuit, the cover plate of image sensing chip 11 can also be multiplexed.
Encapsulating structure described in the embodiment of the present invention can be using as shown in figure 4, Fig. 4 is provided in an embodiment of the present invention another
In the schematic diagram of the encapsulating structure of image sensing chip, encapsulating structure shown in Fig. 4, substrate 14 is non-transparent material.Now, it is described
First area A is provided through the window K, the window K of the substrate 14 for exposing all pixels 12.Due to this
When substrate 14 be non-transparent material, so when light shield layer need not be set.
When the substrate 14 is non-transparent material, the substrate 14 can be PCB substrate or opaque plastics base
Plate or semiconductor substrate.Now, the encapsulating structure also includes：It is fixed on the transparent cover plate 18 on the first substrate 14, institute
State transparent cover plate 18 and cover the window K.The transparent cover plate 18 can be safety glass.The substrate 14 can for individual layer or
Multilayer lamination structure, corresponding first interconnection line and/or the second interconnection line can also stack knot for single or multiple lift
Structure.
When the substrate 14 is PCB substrate or opaque plastics substrate, first interconnection line and the second interconnection
When circuit is multilayer lamination structure, first interconnection line and/or the second interconnection line can include multiple layer metal line layer
With the metal plug or mistake hole connection structure for interconnecting the metallic circuit layer of adjacent layer.
When the substrate 14 is semiconductor substrate, first interconnection line and/or the second interconnection line can include
In through-hole interconnection structure through semiconductor substrate and the first surface and/or second surface positioned at semiconductor substrate with it is logical
The wiring metal line layer again of hole interconnection structure electrical connection.
The quantity of first interconnection line is multiple (>=2), and the quantity of second interconnection line is multiple (>=2
It is individual), it is mutually isolated between the first different interconnection lines and/or the second interconnection line, and mutually insulated.As needed
The electronic component being connected with external circuit sets the quantity and cabling mode of first interconnection line and the second interconnection line.
With reference to Fig. 5, Fig. 5 is a kind of top view of image sensing chip provided in an embodiment of the present invention, embodiment party shown in Fig. 5
In formula, the first weld pad 13 of image sensing chip 11 is evenly distributed in the periphery of the image sensing chip 11.First weld pad
13 are located at the non-acquired region D of image sensing chip 11.All first weld pads 13 surround pickup area C.In the embodiment, by
The peripheral position of image sensing chip 11 is evenly distributed in the first weld pad 13, it is solid when being bonded using anisotropy conductiving glue 15
When determining substrate 14 and image sensing chip 11, the surrounding of image sensing chip 11 can be caused to the pressure of anisotropy conductiving glue 15
It is more uniform, it is ensured that substrate 14 and image sensing chip 11 are adhesively fixed effect, it is to avoid because 11 pairs of image sensing chip is each
Bonding effect caused by the excessive excessive glue of local pressure or insufficient pressure caused by the pressure of anisotropy conducting resinl 15 is uneven
Poor the problems such as.
With reference to Fig. 6, Fig. 6 is the top view of another image sensing chip provided in an embodiment of the present invention, is implemented shown in Fig. 6
In mode, the first surface of the image sensing chip 11 is additionally provided with multiple auxiliary spacers 19, the shape of the auxiliary spacer 19
Shape is identical with the shape of first weld pad 13, and the auxiliary spacer 19 is evenly distributed in the shadow with first weld pad 13
As the periphery of sensing chip.
The auxiliary spacer 19 is evenly distributed in the periphery of image sensing chip 11 with first weld pad 13.Using
When substrate 14 is adhesively fixed with image sensing chip 11 in anisotropy conductiving glue 15, the auxiliary spacer 19 causes image sensing core
The surrounding of piece 11 is more uniform to the pressure of anisotropy conductiving glue 15, it is ensured that substrate 14 and image sensing chip 11 are adhesively fixed effect
Really, it is to avoid because local pressure is excessive caused by image sensing chip 11 is to the pressure of anisotropy conductiving glue 15 uneven
The problems such as bonding effect is poor caused by excessive glue or insufficient pressure.The spacing of first weld pad 13 and the auxiliary spacer 19,
Spacing, the spacing of the auxiliary spacer 19 and the auxiliary spacer 19 of first weld pad 13 and first weld pad 13 are homogeneous
Together.
In Fig. 6 illustrated embodiments, the auxiliary spacer 19 is located at the periphery of same rectangle with first weld pad 13,
Multiple first weld pads 13 are symmetrically distributed on two relative sides of the rectangle；Multiple auxiliary spacers 19 are symmetrical
It is distributed on the relative two other side of the rectangle.
With reference to Fig. 7, Fig. 7 is the top view of another image sensing chip provided in an embodiment of the present invention, is implemented shown in Fig. 7
In mode, the same auxiliary spacer 19 is located at the periphery of same rectangle with first weld pad 13, and Fig. 7 and Fig. 6 differences are,
On the periphery of the rectangle, first weld pad 13 is arranged alternately setting with the auxiliary spacer 19.First weld pad 13 with
The spacing all same of the auxiliary spacer 19.
When prior art is packaged to chip, in order to obtain the chip-packaging structure of lower thickness, it is necessary to enter to chip
Row reduction processing, specifically, reduction processing can be carried out to chip by modes such as mechanical lapping or chemical etchings.But,
The mechanical strength of chip after reduction processing is weaker.
In encapsulating structure described in the embodiment of the present invention, image sensing chip 11 is away from a side surface of substrate 14 by being thinned
Processing, and after reduction processing, image sensing chip 11 is provided with enhancement layer away from a side surface of substrate 14.The enhancement layer
Mechanical strength is more than the mechanical strength of the image sensing chip 11.So, can be in prior art to the image sensing
Chip 11 carries out reduction processing by a larger margin, and increases mechanical strength by enhancement layer, is passed the image is greatly lowered
Ensure that chip-packaging structure has preferable mechanical strength while 11 thickness of sense chip.That is, institute of the embodiment of the present invention
Encapsulating structure is stated, relative to encapsulating structure of the prior art, can further increase reduction processing reduction image sensing chip
11 thickness so that the thickness of image sensing chip 11 is thinner, are compensated after reduction processing by the more preferable enhancement layer of mechanical strength
Mechanical strength, it is possible to achieve chip-packaging structure it is lightening.Optionally, the enhancement layer can be capsulation material.
By foregoing description, in encapsulating structure provided in an embodiment of the present invention, image sensing chip 11 and substrate 14
Between when being packaged, without welding procedure, directly by anisotropy conductiving glue 15 be adhesively fixed image sensing chip 11 with
Substrate 14, so that the first weld pad 13 and the wiring line on substrate 14 while image sensing chip 11 is adhesively fixed with substrate 14
Road is electrically connected, and technique is simple, low manufacture cost.And the distribution of the first weld pad 13 can also be laid out or increase auxiliary spacer 19,
So that the surrounding of image sensing chip 11 is more uniform to the pressure of anisotropy conductiving glue 15, it is ensured that substrate 14 and image sensing core
Piece 11 is adhesively fixed effect, it is to avoid the problems such as excessive glue or poor bonding effect.
Based on above-mentioned encapsulating structure embodiment, another embodiment of the present invention additionally provides a kind of method for packing, for shadow
As sensing chip is packaged, to form the encapsulating structure in above-described embodiment.The method for packing as shown in figures s-11, Fig. 8-
Figure 11 is a kind of schematic flow sheet of method for packing provided in an embodiment of the present invention.The method for packing includes：
Step S11：As shown in Figure 8 and Figure 9 there is provided a sheet material 21, institute's sheet material 21 includes the encapsulation region of multiple array arrangements
22, there is between adjacent package area 22 cutting raceway groove 20.
Fig. 8 is the top view of sheet material 21, and Fig. 9 is sectional drawings of the Fig. 8 in PP ' directions.The encapsulation region 22 includes the firstth area
The domain A and second area B for surrounding the first area A；The first area AA is transmission region.In subsequent step, cutting
Afterwards, the sheet material 21 is divided into multiple substrates 14.
The encapsulation region 22 is provided with wiring route and the contact jaw electrically connected with the wiring route；The wiring line
Road is used to electrically connect with external circuit.The wiring route and contact jaw not shown in Fig. 8.
In Fig. 8-Figure 11 illustrated embodiments, illustrated so that sheet material 21 is transparent material as an example.When the sheet material 21 is
During transparent material, the sheet material of offer one includes：The light shield layer of predetermined pattern structure is formed on the surface of sheet material 21, it is described pre-
It is open correspondingly with the first area A if the light shield layer of patterning has, it is described to be open for exposing corresponding institute
State first area A；The side surface for deviating from the sheet material in the light shield layer of the predetermined pattern structure forms the wiring route
And the contact jaw.
When forming the light shield layer of the predetermined pattern structure, the mask plate of predetermined pattern structure can be used, passes through evaporation
Technique forms the light shield layer of the predetermined pattern structure；Or, the light shield layer of the predetermined pattern structure is formed by photoetching process；
Or, the light shield layer of the predetermined pattern structure is formed by silk-screen printing technique.When forming the wiring route, silk can be passed through
Net typography forms the wiring route.
Step S12：As shown in Figure 10, by anisotropy conductiving glue 17, one is adhesively fixed in the encapsulation region 22
Image sensing chip 11.
The image sensing chip 11 includes relative first surface and second surface, and the first surface has multiple
Pixel 12 and multiple the first weld pads 13 being connected with the pixel 12 for gathering image information.
The first surface of the image sensing chip 11 includes：Acquisition zone and the non-acquired area for surrounding the pickup area
Domain；The pickup area is oppositely arranged with the first area A；First weld pad 13 is located at the non-acquired region.It is described
Image sensing chip 11 may be referred to above-mentioned encapsulating structure embodiment, will not be repeated here.
Specifically, including in the method that image sensing chip 11 is adhesively fixed in the encapsulation region 22：In each envelope
The periphery coating anisotropy conductiving glue 15 in area 22 is filled, and an image is bonded on the anisotropy conductiving glue 15 and is passed
Sense chip 11, hot-press solidifying is carried out to the anisotropy conductiving glue 15 so that the image sensing chip 11 passes through described each
Anisotropy conducting resinl 15 is fixed with the substrate 14, and is electrically connected with first weld pad 13.Wherein, the anisotropic conductive
Glue 15 is located between the non-inductive region and the second area B.Anisotropy conductiving glue 15 is in the side perpendicular to substrate 14
Upwards it is conductive, parallel on the direction of substrate 14 have electrical insulating property.
Step S13：Cutting separation is carried out along 20 pairs of the raceway groove of the cutting sheet material 21, multiple images is formed and passes
The encapsulating structure of sense chip.
As shown in figure 11, before being cut, in addition to：Formed and the wiring line on each encapsulation region 22
The external terminal 16 of road electrical connection, the external terminal 16 is used to electrically connect with the external circuit.Wherein, the external terminal
16 are located at the same side of the sheet material 21 with the image sensing chip 11.After the stabilized image sensing chip 11 of encapsulation region 22,
Before being cut, in addition to：Light Source Compensation is set away from a side surface of image sensing chip 11 in each encapsulation region 22
Device 17, light source compensator 17 is located at second area B.
After an image sensing chip 11 is adhesively fixed in the encapsulation region 22, before being cut, in addition to：To shadow
As the side surface progress reduction processing of the back side sheet material 21 of sensing chip 11, and after reduction processing, in image sensing chip 11
One side surface of back side sheet material 21 forms enhancement layer.
After cutting, the sheet material 21 is divided into multiple substrates 14, and each described substrate 14 includes an encapsulation region
22.Wherein, the periphery of the image sensing chip 11 is bonded solid by the anisotropy conductiving glue 15 and the encapsulation region 22
Determine, and first weld pad 13 is electrically connected by the anisotropy conductiving glue 15 with the contact jaw 13；For each institute
Encapsulation region 22 is stated, on the direction perpendicular to the encapsulation region, the anisotropy conductiving glue 15 surrounds all pixels
12, and do not overlapped with the pixel 12.After cutting, encapsulating structure is as shown in Figure 1.
In method for packing shown in Fig. 8-Figure 11, illustrated so that sheet material 21 is transparent material as an example, i.e., substrate 14 is dog
Material is ordered, after cutting, each substrate 14 corresponds to the position printing opacity of the pickup area of image sensing chip 11.
When sheet material 21 is non-transparent material, i.e., when substrate 14 is non-transparent material, now need each in the correspondence of sheet material 21
The pickup area position of individual image sensing chip 11 forms window, and image sensing chip 11 is subsequently adhesively fixed on encapsulation region 22
Afterwards, it is necessary to fix transparent cover plate on window.
When substrate 14 is non-transparent material, method for packing can be as shown in Figure 12-Figure 15, and Figure 12-Figure 15 is the present invention
The schematic flow sheet for another method for packing that embodiment is provided, the method for packing includes：
Step S21：As shown in figure 12 there is provided with sheet material 12, now sheet material 12 is non-transparent material.
Sheet material 21 equally includes multiple encapsulation regions 22, has cutting raceway groove 20 between encapsulation region 22, and encapsulation region 22 has the
One region A and second area B.
Now need the first area A in each encapsulation region 22 to be formed and run through the encapsulation region on Z in a first direction
22 window K, the window K is used for all pixels for exposing image sensing chip.
Step S22：As shown in figure 13, by anisotropy conductiving glue, a shadow is adhesively fixed in the encapsulation region 22
As sensing chip 11.
Step S23：As shown in figure 14, transparent cover plate 18 is fixed on each window K.
Step S24：As shown in figure 15, on each encapsulation region 22 formed electrically connected with the wiring route it is external
Terminal 16, light source compensator 17 is set in each encapsulation region 22 away from a side surface of image sensing chip 11.
Step S25：Cutting separation is carried out along 20 pairs of the raceway groove of the cutting sheet material 21, multiple images is formed and passes
The encapsulating structure of sense chip.After cutting, encapsulating structure is as shown in Figure 4.
It in method for packing described in the embodiment of the present invention, can be used for being packaged image sensing chip 11, formed above-mentioned
Encapsulating structure, when image sensing chip 11 and sheet material 21 are packaged, without welding procedure, manufacture craft is simple, and cost is low.
It should be noted that the embodiment of each in this specification is described by the way of progressive, each embodiment emphasis is said
Bright be all between the difference with other embodiment, each embodiment identical similar portion mutually referring to.For reality
For applying method for packing disclosed in example, because it is corresponding with encapsulating structure disclosed in embodiment, so description is fairly simple,
Related part illustrates referring to encapsulating structure appropriate section.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (20)
1. a kind of encapsulating structure of image sensing chip, it is characterised in that including：
Image sensing chip, the image sensing chip includes relative first surface and second surface, the first surface
With multiple pixels and multiple the first weld pads being connected with the pixel for being used to gather image information；
Cover be provided with the substrate of the first surface of the image sensing chip, the substrate wiring route and with the cloth
The contact jaw of line connection；The wiring route is used to electrically connect with external circuit；
The periphery of the image sensing chip is fixed by anisotropy conductiving glue with the substrate bonding, and first weld pad
Electrically connected by the anisotropy conductiving glue with the contact jaw, it is described each to different on the direction perpendicular to the substrate
Property conducting resinl surround all pixels, and do not overlapped with the pixel.
2. encapsulating structure according to claim 1, it is characterised in that the substrate includes first area and surrounds described
The second area of first area；The first area is transmission region；
The first surface of the image sensing chip includes：Pickup area and the non-acquired region for surrounding the pickup area；
The pickup area is oppositely arranged with the first area；First weld pad is located at the non-acquired region；
Wherein, the anisotropy conductiving glue is located between the non-acquired region and the second area.
3. encapsulating structure according to claim 2, it is characterised in that the substrate is transparent material.
4. encapsulating structure according to claim 3, it is characterised in that the wiring route is located at the second area direction
The surface of the image sensing chip, and there is light shield layer between the wiring route and the substrate.
5. encapsulating structure according to claim 2, it is characterised in that the substrate is non-transparent material；Firstth area
Domain is provided through the window of the substrate, and the window is used to expose all pixels.
6. encapsulating structure according to claim 5, it is characterised in that also transparent on the first substrate including being fixed on
Cover plate, the transparent cover plate covers the window.
7. encapsulating structure according to claim 1, it is characterised in that the substrate towards the image sensing chip one
Side surface is additionally provided with the external terminal electrically connected with the wiring route, and the external terminal is used for and external circuit electricity
Connection.
8. encapsulating structure according to claim 7, it is characterised in that the external circuit has jack；
The external terminal is the grafting pin matched with the jack, and the wiring route passes through the grafting pin and institute
State jack grafting realization and the electrical connection of the external circuit.
9. encapsulating structure according to claim 1, it is characterised in that also include：
It is arranged on the light source compensator that the substrate deviates from the image sensing chip-side surface.
10. encapsulating structure according to claim 1, it is characterised in that first weld pad is evenly distributed in the shadow
As the periphery of sensing chip.
11. encapsulating structure according to claim 1, it is characterised in that the first surface of the image sensing chip is also set
Multiple auxiliary spacers are equipped with, the shape of the auxiliary spacer is identical with the shape of first weld pad, the auxiliary spacer and institute
State the periphery that the first weld pad is evenly distributed in the image sensing chip.
12. encapsulating structure according to claim 11, it is characterised in that the auxiliary spacer is located at first weld pad
The periphery of same rectangle, multiple first weld pads are symmetrically distributed on two relative sides of the rectangle；
Multiple auxiliary spacers are symmetrically distributed on the relative two other side of the rectangle.
13. encapsulating structure according to claim 11, it is characterised in that the auxiliary spacer is located at first weld pad
The periphery of same rectangle, on the periphery of the rectangle, first weld pad is arranged alternately setting with the auxiliary spacer.
14. a kind of method for packing of image sensing chip, for making the encapsulating structure as described in claim any one of 1-13,
Characterized in that, the method for packing includes：
A sheet material is provided, institute's sheet material includes having cutting raceway groove between the encapsulation region of multiple array arrangements, adjacent package area；It is described
Encapsulation region is provided with wiring route and the contact jaw electrically connected with the wiring route；The wiring route is used for and external electrical
Road is electrically connected；
By anisotropy conductiving glue, an image sensing chip, the image sensing core are adhesively fixed in the encapsulation region
Piece includes relative first surface and second surface, and the first surface has multiple pixels for being used to gather image information
And multiple the first weld pads being connected with the pixel；
Cutting separation is carried out to the sheet material along the cutting raceway groove, the encapsulation knot of multiple image sensing chips is formed
Structure；After cutting, the sheet material is divided into multiple substrates, and each described substrate includes an encapsulation region；
Wherein, the periphery of the image sensing chip is adhesively fixed by the anisotropy conductiving glue with the encapsulation region, and
First weld pad is electrically connected by the anisotropy conductiving glue with the contact jaw；For encapsulation region each described,
On the direction of the encapsulation region, the anisotropy conductiving glue surrounds all pixels, and with the pixel
Do not overlap.
15. method for packing according to claim 14, it is characterised in that the encapsulation region includes first area and encirclement
The second area of the first area；The first area is transmission region；The first surface of the image sensing chip includes：
Pickup area and the non-acquired region for surrounding the pickup area；The pickup area is oppositely arranged with the first area；
First weld pad is located at the non-acquired region；
It is described by anisotropy conductiving glue, an image sensing chip is adhesively fixed in the encapsulation region to be included：
Periphery in each encapsulation region coats anisotropy conductiving glue, and the bonding one on the anisotropy conductiving glue
The image sensing chip, carries out hot-press solidifying so that the image sensing chip passes through institute to the anisotropy conductiving glue
State anisotropy conductiving glue to fix with the substrate, and electrically connected with first weld pad；
Wherein, the anisotropy conductiving glue is located between the non-acquired region and the second area.
16. method for packing according to claim 15, it is characterised in that the substrate is transparent material；
One sheet material of the offer includes：
In the light shield layer of plate surface formation predetermined pattern structure, the light shield layer of the predetermined pattern structure have with it is described
First area is open correspondingly, described to be open for exposing the corresponding first area；
The side surface for deviating from the sheet material in the light shield layer of the predetermined pattern structure forms the wiring route and described
Contact jaw.
17. method for packing according to claim 15, it is characterised in that the substrate is non-transparent material；
One sheet material of the offer includes：
The window through the encapsulation region is formed in the first area of each encapsulation region, the window is used to expose all institutes
State pixel.
18. method for packing according to claim 17, it is characterised in that also include：
Transparent cover plate is fixed on each window.
19. method for packing according to claim 14, it is characterised in that before being cut, in addition to：
Light source compensator is set away from the surface of the image sensing chip-side in each encapsulation region.
20. method for packing according to claim 14, it is characterised in that before being cut, in addition to：
The external terminal electrically connected with the wiring route is formed on each encapsulation region, the external terminal is used for and institute
State external circuit electrical connection；
Wherein, the external terminal is located at the same side of the sheet material with the image sensing chip.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710547345.2A CN107170769B (en) | 2017-07-06 | 2017-07-06 | Packaging structure and packaging method of image sensing chip |
| PCT/CN2018/094766 WO2019007412A1 (en) | 2017-07-06 | 2018-07-06 | Encapsulation structure of image sensing chip, and encapsulation method therefor |
| US16/612,606 US11049899B2 (en) | 2017-07-06 | 2018-07-06 | Encapsulation structure of image sensing chip, and encapsulation method therefor |
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| CN201710547345.2A CN107170769B (en) | 2017-07-06 | 2017-07-06 | Packaging structure and packaging method of image sensing chip |
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